JP2002310965A5 - - Google Patents

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Publication number
JP2002310965A5
JP2002310965A5 JP2002017997A JP2002017997A JP2002310965A5 JP 2002310965 A5 JP2002310965 A5 JP 2002310965A5 JP 2002017997 A JP2002017997 A JP 2002017997A JP 2002017997 A JP2002017997 A JP 2002017997A JP 2002310965 A5 JP2002310965 A5 JP 2002310965A5
Authority
JP
Japan
Prior art keywords
flange
top surface
longitudinal member
thermal resistor
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002017997A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002310965A (ja
JP4181776B2 (ja
Filing date
Publication date
Priority claimed from US09/769,320 external-priority patent/US6523998B1/en
Application filed filed Critical
Publication of JP2002310965A publication Critical patent/JP2002310965A/ja
Publication of JP2002310965A5 publication Critical patent/JP2002310965A5/ja
Application granted granted Critical
Publication of JP4181776B2 publication Critical patent/JP4181776B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2002017997A 2001-01-26 2002-01-28 分散配置された熱抵抗器を有する熱分析アセンブリ、および、種々の冷却装置を取り付けるための一体化フランジ Expired - Lifetime JP4181776B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/769,320 US6523998B1 (en) 2001-01-26 2001-01-26 Thermal analysis assembly with distributed resistance and integral flange for mounting various cooling devices
US09/769,320 2001-01-26

Publications (3)

Publication Number Publication Date
JP2002310965A JP2002310965A (ja) 2002-10-23
JP2002310965A5 true JP2002310965A5 (enExample) 2005-11-04
JP4181776B2 JP4181776B2 (ja) 2008-11-19

Family

ID=25085106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002017997A Expired - Lifetime JP4181776B2 (ja) 2001-01-26 2002-01-28 分散配置された熱抵抗器を有する熱分析アセンブリ、および、種々の冷却装置を取り付けるための一体化フランジ

Country Status (3)

Country Link
US (1) US6523998B1 (enExample)
EP (1) EP1227317B1 (enExample)
JP (1) JP4181776B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003025528A2 (en) * 2001-09-18 2003-03-27 Energetic Geonomics Corporation A high throughput energy array
JP4116526B2 (ja) * 2003-11-18 2008-07-09 エスアイアイ・ナノテクノロジー株式会社 第二のヒーターを備えた示差走査熱量計
US7125163B2 (en) * 2003-11-24 2006-10-24 The Boeing Company Simple high accuracy high energy calorimeter
US7371006B2 (en) * 2004-02-10 2008-05-13 Perkinelmer Las, Inc. Differential scanning calorimeter (DSC) with temperature controlled furnace
US7481575B2 (en) * 2005-05-05 2009-01-27 Leco Corporation Calorimeter
JP4868305B2 (ja) * 2006-01-27 2012-02-01 エスアイアイ・ナノテクノロジー株式会社 示差走査熱量計
US8087821B2 (en) * 2007-06-06 2012-01-03 Waters Technologies Corporation Infrared heated differential scanning calorimeter
DE112008001462B4 (de) * 2007-06-06 2015-06-03 Waters Technologies Corp. Thermisches Messsystem und Verfahren zum Durchführen einer thermischen Analyse, wobei ein variabler thermischer Widerstand verwendet wird
FR2917163B1 (fr) * 2007-06-06 2015-10-23 Waters Investments Ltd Calorimetre a balayage differentiel a chauffage infrarouge
US8418480B2 (en) * 2008-12-18 2013-04-16 Waters Technologies Corporation Cooling system using positive displacement cryogenic liquid pump
JP5283535B2 (ja) * 2009-02-20 2013-09-04 株式会社日立ハイテクサイエンス 示差走査熱量計
EP2325628B1 (de) * 2009-11-23 2013-06-26 Mettler-Toledo AG Thermoanalysevorrichtung
CN103542946B (zh) * 2012-07-12 2016-03-09 中国石油天然气股份有限公司 一种温度检测组件
JP5551811B2 (ja) * 2013-05-24 2014-07-16 株式会社日立ハイテクサイエンス 示差走査熱量計
JP6841425B2 (ja) * 2017-05-26 2021-03-10 株式会社リガク 熱分析装置
US10755200B2 (en) 2017-09-22 2020-08-25 International Business Machines Corporation Automated control of circumferential variability of blast furnace
AT524363B1 (de) 2020-10-30 2022-06-15 Anton Paar Gmbh Messgerät mit elektrothermischem Wandler zum Einstellen eines thermischen Widerstandes, und Betriebsverfahren
AT526978B1 (de) * 2023-03-09 2025-10-15 Anton Paar Gmbh Kühlvorrichtung für ein Messgerät, und additives Herstellungsverfahren

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US3339398A (en) 1964-03-30 1967-09-05 Chevron Res High sensitivity differential thermal analysis apparatus and method
US3456490A (en) 1967-04-21 1969-07-22 Tracor Differential thermal analysis
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US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US3813937A (en) * 1972-06-16 1974-06-04 J Fletcher Heat flow calorimeter
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JPH0765974B2 (ja) 1988-10-26 1995-07-19 セイコー電子工業株式会社 熱分析装置の加熱炉部冷却装置
US5224538A (en) * 1991-11-01 1993-07-06 Jacoby John H Dimpled heat transfer surface and method of making same
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US5711604A (en) * 1993-12-14 1998-01-27 Seiko Instruments Inc. Method for measuring the coefficient of heat conductivity of a sample
US5509733A (en) * 1993-12-21 1996-04-23 Ta Instruments, Inc. Infrared heated differential thermal analyzer
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EP0762045B1 (en) * 1995-09-07 2003-12-03 The Perkin-Elmer Corporation Thermal insulating container for liquified gas
US5876118A (en) 1995-12-08 1999-03-02 The Perkin-Elmer Corporation Calorimeter having rapid cooling of a heating vessel therein
JPH1054813A (ja) 1996-08-08 1998-02-24 Shimadzu Corp 示差走査熱量測定装置
JPH10132770A (ja) 1996-10-31 1998-05-22 Shimadzu Corp 熱分析装置
JPH10246577A (ja) 1997-03-03 1998-09-14 Rigaku Corp 加熱炉の冷却方法及び装置
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US20020163781A1 (en) * 2001-05-01 2002-11-07 Ericsson Inc. Integrated cooling of a printed circuit board structure

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