JP2002286574A - 圧力センサ - Google Patents
圧力センサInfo
- Publication number
- JP2002286574A JP2002286574A JP2001089051A JP2001089051A JP2002286574A JP 2002286574 A JP2002286574 A JP 2002286574A JP 2001089051 A JP2001089051 A JP 2001089051A JP 2001089051 A JP2001089051 A JP 2001089051A JP 2002286574 A JP2002286574 A JP 2002286574A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- main body
- sensor module
- pressure sensor
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005260 corrosion Methods 0.000 claims abstract description 35
- 230000007797 corrosion Effects 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 11
- 238000005192 partition Methods 0.000 claims abstract description 11
- 238000001514 detection method Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 238000011109 contamination Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 239000007789 gas Substances 0.000 description 22
- 239000004065 semiconductor Substances 0.000 description 21
- 238000012545 processing Methods 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 4
- 230000006837 decompression Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229960001730 nitrous oxide Drugs 0.000 description 1
- 235000013842 nitrous oxide Nutrition 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001089051A JP2002286574A (ja) | 2001-03-27 | 2001-03-27 | 圧力センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001089051A JP2002286574A (ja) | 2001-03-27 | 2001-03-27 | 圧力センサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002286574A true JP2002286574A (ja) | 2002-10-03 |
| JP2002286574A5 JP2002286574A5 (enExample) | 2004-09-02 |
Family
ID=18944041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001089051A Pending JP2002286574A (ja) | 2001-03-27 | 2001-03-27 | 圧力センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002286574A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007139453A (ja) * | 2005-11-15 | 2007-06-07 | Denso Corp | 圧力センサ |
| KR101289096B1 (ko) | 2011-11-14 | 2013-07-23 | 재단법인 포항산업과학연구원 | 고온 압력센서장치 및 그 제조방법 |
| CN105547569A (zh) * | 2015-12-30 | 2016-05-04 | 黄福春 | 一种高温绝压传感器 |
| CN106679854A (zh) * | 2016-11-29 | 2017-05-17 | 中国电子科技集团公司第四十八研究所 | 一种绝压压力传感器及其制备方法 |
| JP2021162557A (ja) * | 2020-04-03 | 2021-10-11 | アズビル株式会社 | 圧力センサ素子および圧力センサ |
-
2001
- 2001-03-27 JP JP2001089051A patent/JP2002286574A/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007139453A (ja) * | 2005-11-15 | 2007-06-07 | Denso Corp | 圧力センサ |
| KR101289096B1 (ko) | 2011-11-14 | 2013-07-23 | 재단법인 포항산업과학연구원 | 고온 압력센서장치 및 그 제조방법 |
| CN105547569A (zh) * | 2015-12-30 | 2016-05-04 | 黄福春 | 一种高温绝压传感器 |
| CN106679854A (zh) * | 2016-11-29 | 2017-05-17 | 中国电子科技集团公司第四十八研究所 | 一种绝压压力传感器及其制备方法 |
| CN106679854B (zh) * | 2016-11-29 | 2020-02-07 | 中国电子科技集团公司第四十八研究所 | 一种绝压压力传感器及其制备方法 |
| JP2021162557A (ja) * | 2020-04-03 | 2021-10-11 | アズビル株式会社 | 圧力センサ素子および圧力センサ |
| JP7736425B2 (ja) | 2020-04-03 | 2025-09-09 | アズビル株式会社 | 圧力センサ素子および圧力センサ |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050308 |
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| A131 | Notification of reasons for refusal |
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