JP2002274077A5 - - Google Patents
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- Publication number
- JP2002274077A5 JP2002274077A5 JP2001395028A JP2001395028A JP2002274077A5 JP 2002274077 A5 JP2002274077 A5 JP 2002274077A5 JP 2001395028 A JP2001395028 A JP 2001395028A JP 2001395028 A JP2001395028 A JP 2001395028A JP 2002274077 A5 JP2002274077 A5 JP 2002274077A5
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- forming body
- pattern forming
- photocatalyst
- functional layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002346 layers by function Substances 0.000 claims 24
- 239000011941 photocatalyst Substances 0.000 claims 22
- 239000010410 layer Substances 0.000 claims 15
- 238000000034 method Methods 0.000 claims 15
- 238000004519 manufacturing process Methods 0.000 claims 11
- 239000000126 substance Substances 0.000 claims 11
- 229920001296 polysiloxane Polymers 0.000 claims 8
- 230000007261 regionalization Effects 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 230000015572 biosynthetic process Effects 0.000 claims 4
- 238000010030 laminating Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 4
- 125000000962 organic group Chemical group 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 3
- 230000007062 hydrolysis Effects 0.000 claims 3
- 238000006460 hydrolysis reaction Methods 0.000 claims 3
- -1 γ-mercaptopropyl Chemical group 0.000 claims 2
- MBNRBJNIYVXSQV-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propane-1-thiol Chemical compound CCO[Si](C)(OCC)CCCS MBNRBJNIYVXSQV-UHFFFAOYSA-N 0.000 claims 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 claims 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical group CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 claims 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical group CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 claims 1
- WALYBSCHCQWCPC-UHFFFAOYSA-N 3-[tris[(2-methylpropan-2-yl)oxy]silyl]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC[Si](OC(C)(C)C)(OC(C)(C)C)OC(C)(C)C WALYBSCHCQWCPC-UHFFFAOYSA-N 0.000 claims 1
- CJUFQURUUZMUOG-UHFFFAOYSA-N 3-tri(propan-2-yloxy)silylpropane-1-thiol Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)CCCS CJUFQURUUZMUOG-UHFFFAOYSA-N 0.000 claims 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 claims 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 claims 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims 1
- 239000005046 Chlorosilane Substances 0.000 claims 1
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 150000001343 alkyl silanes Chemical class 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- UWMGVIKSCFGFDR-UHFFFAOYSA-N benzyl(dibromo)silane Chemical compound Br[SiH](Br)CC1=CC=CC=C1 UWMGVIKSCFGFDR-UHFFFAOYSA-N 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 claims 1
- LIQOCGKQCFXKLF-UHFFFAOYSA-N dibromo(dimethyl)silane Chemical compound C[Si](C)(Br)Br LIQOCGKQCFXKLF-UHFFFAOYSA-N 0.000 claims 1
- DBUGVTOEUNNUHR-UHFFFAOYSA-N dibromo(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Br)(Br)C1=CC=CC=C1 DBUGVTOEUNNUHR-UHFFFAOYSA-N 0.000 claims 1
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 claims 1
- GNEPOXWQWFSSOU-UHFFFAOYSA-N dichloro-methyl-phenylsilane Chemical compound C[Si](Cl)(Cl)C1=CC=CC=C1 GNEPOXWQWFSSOU-UHFFFAOYSA-N 0.000 claims 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 claims 1
- VGWJKDPTLUDSJT-UHFFFAOYSA-N diethyl dimethyl silicate Chemical compound CCO[Si](OC)(OC)OCC VGWJKDPTLUDSJT-UHFFFAOYSA-N 0.000 claims 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims 1
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 claims 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 claims 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 claims 1
- 125000003709 fluoroalkyl group Chemical group 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- VPLNCHFJAOKWBT-UHFFFAOYSA-N phenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C1=CC=CC=C1 VPLNCHFJAOKWBT-UHFFFAOYSA-N 0.000 claims 1
- 239000005054 phenyltrichlorosilane Substances 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- MQVCTPXBBSKLFS-UHFFFAOYSA-N tri(propan-2-yloxy)-propylsilane Chemical compound CCC[Si](OC(C)C)(OC(C)C)OC(C)C MQVCTPXBBSKLFS-UHFFFAOYSA-N 0.000 claims 1
- HPTIEXHGTPSFDC-UHFFFAOYSA-N tribromo(phenyl)silane Chemical compound Br[Si](Br)(Br)C1=CC=CC=C1 HPTIEXHGTPSFDC-UHFFFAOYSA-N 0.000 claims 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical group Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 claims 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 claims 1
- KGOOITCIBGXHJO-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]-phenylsilane Chemical compound CC(C)(C)O[Si](OC(C)(C)C)(OC(C)(C)C)C1=CC=CC=C1 KGOOITCIBGXHJO-UHFFFAOYSA-N 0.000 claims 1
- QCKKBOHAYRLMQP-UHFFFAOYSA-N tris[(2-methylpropan-2-yl)oxy]silane Chemical compound CC(C)(C)O[SiH](OC(C)(C)C)OC(C)(C)C QCKKBOHAYRLMQP-UHFFFAOYSA-N 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001395028A JP2002274077A (ja) | 1997-08-08 | 2001-12-26 | パターン形成体およびパターン形成方法 |
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21484597 | 1997-08-08 | ||
| JP30029597 | 1997-10-31 | ||
| JP31304197 | 1997-11-14 | ||
| JP10-85955 | 1998-03-31 | ||
| JP8629398 | 1998-03-31 | ||
| JP10-86293 | 1998-03-31 | ||
| JP9-300295 | 1998-03-31 | ||
| JP8595598 | 1998-03-31 | ||
| JP9-214845 | 1998-03-31 | ||
| JP9-313041 | 1998-03-31 | ||
| JP2001395028A JP2002274077A (ja) | 1997-08-08 | 2001-12-26 | パターン形成体およびパターン形成方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16539298A Division JP3384544B2 (ja) | 1997-08-08 | 1998-06-12 | パターン形成体およびパターン形成方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004044381A Division JP4413035B2 (ja) | 1997-08-08 | 2004-02-20 | パターン形成体およびパターン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002274077A JP2002274077A (ja) | 2002-09-25 |
| JP2002274077A5 true JP2002274077A5 (https=) | 2005-01-27 |
Family
ID=27551667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001395028A Pending JP2002274077A (ja) | 1997-08-08 | 2001-12-26 | パターン形成体およびパターン形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002274077A (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004279196A (ja) | 2003-03-14 | 2004-10-07 | Dainippon Printing Co Ltd | バイオマイクロアレイ用基板およびバイオマイクロアレイ |
| JP4554913B2 (ja) * | 2003-11-14 | 2010-09-29 | 大日本印刷株式会社 | パターニング用基板および細胞培養基板 |
| JP4826092B2 (ja) * | 2004-01-28 | 2011-11-30 | 大日本印刷株式会社 | パターニング用基板および細胞培養基板 |
| JP4862261B2 (ja) * | 2004-01-28 | 2012-01-25 | 大日本印刷株式会社 | パターニング用基板および細胞培養基板 |
| JP4742599B2 (ja) * | 2004-01-28 | 2011-08-10 | 大日本印刷株式会社 | パターニング用基板および細胞培養基板 |
| JP4742598B2 (ja) * | 2004-01-28 | 2011-08-10 | 大日本印刷株式会社 | パターニング用基板および細胞培養基板 |
| JP4797396B2 (ja) * | 2004-02-19 | 2011-10-19 | 大日本印刷株式会社 | 細胞培養基板の製造方法 |
| US7919305B2 (en) | 2004-02-19 | 2011-04-05 | Dai Nippon Printing Co., Ltd. | Method for manufacturing cell culture substrate |
| WO2005085414A1 (ja) * | 2004-03-10 | 2005-09-15 | Dai Nippon Printing Co., Ltd. | 血管細胞培養用パターニング基板 |
| JP4456393B2 (ja) | 2004-03-26 | 2010-04-28 | 大日本印刷株式会社 | 細胞培養基板の製造方法および細胞培養基板製造装置 |
| JP4560324B2 (ja) * | 2004-04-07 | 2010-10-13 | 大日本印刷株式会社 | パターン形成体の製造方法 |
| US9249386B2 (en) | 2005-06-06 | 2016-02-02 | Dai Nippon Printing Co., Ltd. | Substrate for cell transfer |
| JP5104538B2 (ja) * | 2008-05-16 | 2012-12-19 | 大日本印刷株式会社 | 有機エレクトロルミネッセンス素子用基板および有機エレクトロルミネッセンス素子ならびにそれらの製造方法 |
| JP5149083B2 (ja) | 2008-06-16 | 2013-02-20 | 富士フイルム株式会社 | パターン形成方法、並びに基板加工方法、モールド構造体の複製方法、及びモールド構造体 |
| JP7585726B2 (ja) | 2020-11-16 | 2024-11-19 | 東レ株式会社 | ドライオフセット印刷用印刷版 |
-
2001
- 2001-12-26 JP JP2001395028A patent/JP2002274077A/ja active Pending
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