JP2002232197A5 - - Google Patents

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Publication number
JP2002232197A5
JP2002232197A5 JP2001029616A JP2001029616A JP2002232197A5 JP 2002232197 A5 JP2002232197 A5 JP 2002232197A5 JP 2001029616 A JP2001029616 A JP 2001029616A JP 2001029616 A JP2001029616 A JP 2001029616A JP 2002232197 A5 JP2002232197 A5 JP 2002232197A5
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Japan
Prior art keywords
flexible substrate
base plate
electronic component
adhesive layer
component mounting
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Pending
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JP2001029616A
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Japanese (ja)
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JP2002232197A (en
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Priority to JP2001029616A priority Critical patent/JP2002232197A/en
Priority claimed from JP2001029616A external-priority patent/JP2002232197A/en
Publication of JP2002232197A publication Critical patent/JP2002232197A/en
Publication of JP2002232197A5 publication Critical patent/JP2002232197A5/ja
Pending legal-status Critical Current

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Claims (19)

フレキシブル基板に電子部品を実装する電子部品実装方法において、基材板の表面に形成された粘着層上にフレキシブル基板を剥離自在に粘着させ、当該フレキシブル基板上に電子部品を実装することを特徴とする電子部品実装方法。In the electronic component mounting method for mounting an electronic component on a flexible substrate, and characterized in that the flexible substrate is adhered to releasably on the pressure-sensitive adhesive layer formed on the surface of the substrate plate, mounting an electronic component on the flexible substrate Electronic component mounting method. 前記基材板の厚さは、０．１ｍｍから４ｍｍの範囲で選ばれることを特徴とする請求項１に記載の電子部品実装方法。 2. The electronic component mounting method according to claim 1 , wherein a thickness of the base plate is selected in a range of 0.1 mm to 4 mm . 基板の搬送系を備えたクリーム半田塗布装置に基材板を供給してフレキシブル基板上にクリーム半田を塗布することを特徴とする請求項１に記載の電子部品実装方法。2. The electronic component mounting method according to claim 1 , wherein the base plate is supplied to a cream solder application device having a substrate transport system to apply the cream solder on the flexible substrate. 基板の搬送系を備えた部品装着装置に基材板を供給してフレキシブル基板上に電子部品を装着することを特徴とする請求項１に記載の電子部品実装方法。The electronic component mounting method according to claim 1 , wherein a base plate is supplied to a component mounting apparatus having a substrate transport system to mount the electronic component on the flexible substrate. 基板の搬送系を備えたリフロー装置に基材板を供給してフレキシブル基板上のクリーム半田を溶解させて再凝固させることを特徴とする請求項１に記載の電子部品実装方法。2. The electronic component mounting method according to claim 1 , wherein a base plate is supplied to a reflow apparatus provided with a substrate transport system, and the cream solder on the flexible substrate is dissolved and re-solidified. 前記粘着層は前記基材板とは第１の強度で粘着され、前記フレキシブル基板に対しては第１の強度より小さな第２の強度で粘着されることを特徴とする請求項１に記載の電子部品実装方法。2. The adhesive layer according to claim 1, wherein the adhesive layer is adhered to the base plate with a first strength, and is adhered to the flexible substrate with a second strength smaller than the first strength. Electronic component mounting method. 前記粘着層は、前記粘着されるフレキシブル基板より大きいことを特徴とする請求項１に記載の電子部品実装方法。The electronic component mounting method according to claim 1, wherein the adhesive layer is larger than the flexible substrate to be adhered. 前記粘着層は、前記基材板上に平坦に形成されることを特徴とする請求項１に記載の電子部品実装装置。The electronic component mounting apparatus according to claim 1, wherein the adhesive layer is formed flat on the base plate. 前記基材板には、前記フレキシブル基板の位置決めに用いられる位置規制穴が設けられることを特徴とする請求項１に記載の電子部品実装方法。The electronic component mounting method according to claim 1, wherein the base plate is provided with a position restricting hole used for positioning the flexible substrate. 前記基材板には、前記粘着されたフレキシブル基板上の位置の特定に用いられる位置規制穴が設けられていることを特徴とする請求項１に記載の電子部品実装方法。2. The electronic component mounting method according to claim 1, wherein the base plate is provided with a position restricting hole used for specifying a position on the adhered flexible substrate. フレキシブル基板に電子部品を実装する際に、当該フレキシブル基板を着脱自在に保持するフレキシブル基板保持具であって、When mounting an electronic component on a flexible substrate, a flexible substrate holder that detachably holds the flexible substrate,
所定の表面粗さおよび所定の平面度で規定される主平面を有する基材板と、A base plate having a main plane defined by a predetermined surface roughness and a predetermined flatness;
所定の単位粘着度を有する粘着性材によって、前記主平面上に所定の形状および所定の厚みに形成される粘着層とを備え、An adhesive layer having a predetermined shape and a predetermined thickness on the main plane, with an adhesive material having a predetermined unit adhesiveness,
前記粘着層と前記基板材との間の粘着力は、当該粘着層と前記フレキシブル基板との間の粘着力より小さいことを特徴とするフレキシブル基板保持具。The flexible substrate holder, wherein an adhesive force between the adhesive layer and the substrate material is smaller than an adhesive force between the adhesive layer and the flexible substrate. 前記粘着層の形状は、前記フレキシブル基板の形状より大きいことを特徴とする請求項１１に記載のフレキシブル基板保持具。The flexible substrate holder according to claim 11, wherein a shape of the adhesive layer is larger than a shape of the flexible substrate. 前記粘着層の平面度は、前記基材板の主平面の平面度と概ね同一であり、前記フレキシブル基板は当該粘着層に当該主平面の平面度と概ね同一の平面度で保持されることを特徴とする請求項１１に記載のフレキシブル基板保持具。The flatness of the adhesive layer is substantially the same as the flatness of the main plane of the base plate, and the flexible substrate is held by the adhesive layer with the same flatness as the flatness of the main plane. The flexible substrate holder according to claim 11, wherein the holder is a flexible substrate holder. 前記基材板は、所定厚さを有する平板状に形成され、当該所定厚さは０．１ｍｍから４ｍｍの範囲で選ばれることを特徴とする請求項１１に記載のフレキシブル基板保持具。The flexible substrate holder according to claim 11, wherein the base plate is formed in a flat plate shape having a predetermined thickness, and the predetermined thickness is selected in a range of 0.1 mm to 4 mm. 前記基材板は、耐熱性材質で構成されることを特徴とする請求項１１に記載のフレキシブル基板保持具。The flexible substrate holder according to claim 11, wherein the base plate is made of a heat resistant material. 前記耐熱性材質は、ガラスエポキシ樹脂、フェノール紙、およびセラミックを含む材料グループから選択されることを特徴とする請求項１５に記載のフレキシブル基板保持具。The flexible substrate holder according to claim 15, wherein the heat resistant material is selected from a material group including glass epoxy resin, phenol paper, and ceramic. 前記基材板には、フレキシブル基板の位置決めに用いられる位置規制穴が設けられることを特徴とする請求項１１記載のフレキシブル基板保持具。The flexible substrate holder according to claim 11, wherein the base plate is provided with a position restricting hole used for positioning of the flexible substrate. 前記基材板には、粘着されたフレキシブル基板上の位置の特定に用いられる位置規制穴が設けられていることを特徴とする請求項１１に記載のフレキシブルThe flexible base plate according to claim 11, wherein the base plate is provided with a position restricting hole used for specifying a position on the adhered flexible substrate. 基板保持具。Board holder. 前記電子部品実装方法は、
前記粘着層の表面に前記フレキシブル基板を押しつけるステップと、
前記フレキシブル基板を前記粘着層を介して前記基材板に密着固定させるステップと、
前記フレキシブル基板を所定の平面度で前記基材板と一体化させるステップと、
前記基材板の表面に前記電子部品を実装するステップとを備え、前記基材板と一体化されたフレキシブル基板の表面から突出するものが無いことを特徴とする、電子部品実装方法。 The electronic component mounting method includes :
Pressing the flexible substrate against the surface of the adhesive layer;
A step of closely fixing the flexible substrate to the base plate via the adhesive layer;
Integrating the flexible substrate with the base plate with a predetermined flatness;
Mounting the electronic component on the surface of the base plate, and nothing projecting from the surface of the flexible substrate integrated with the base plate.
JP2001029616A 2001-02-06 2001-02-06 Electronic component mounting method Pending JP2002232197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001029616A JP2002232197A (en) 2001-02-06 2001-02-06 Electronic component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001029616A JP2002232197A (en) 2001-02-06 2001-02-06 Electronic component mounting method

Publications (2)

Publication Number Publication Date
JP2002232197A JP2002232197A (en) 2002-08-16
JP2002232197A5 true JP2002232197A5 (en) 2005-02-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001029616A Pending JP2002232197A (en) 2001-02-06 2001-02-06 Electronic component mounting method

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7105221B2 (en) 2001-07-19 2006-09-12 Toray Industries, Inc. Circuit board, laminated member for circuit board, and method for making laminated member for circuit board
TWI356658B (en) * 2003-01-23 2012-01-11 Toray Industries Members for circuit board, method and device for m
US7077908B2 (en) * 2003-05-30 2006-07-18 Matsushita Electric Industrial Co., Ltd. Substrate holder
JP2005129921A (en) * 2003-10-01 2005-05-19 Shin Etsu Polymer Co Ltd Sheets for fixed jig
US7517419B2 (en) 2004-04-16 2009-04-14 Panasonic Corporation Substrate support jig, circuit board production apparatus, and method of producing circuit board
JP2006203118A (en) * 2005-01-24 2006-08-03 Sumitomo Bakelite Co Ltd Flexible printed wiring board
TW200846250A (en) * 2007-05-18 2008-12-01 Pyroswift Folding Co Ltd Manufacture method of tag-typed integrated soft circuit board and a structure thereof
US8234780B2 (en) 2008-02-27 2012-08-07 Universal Instruments Corporation Substrate carrier system
CN101951730A (en) * 2010-10-11 2011-01-19 卓盈微电子（昆山）有限公司 Supporting board for single flexible circuit board
JP6696128B2 (en) * 2015-08-25 2020-05-20 大日本印刷株式会社 Manufacturing method of component mounting thin film wiring substrate

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