JP3482877B2 - Electronic component manufacturing method and component automatic mounting device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component having a package structure in which a cap material having a lower opening is adhered on a case substrate, and the manufacturing of the electronic component and applying flux to the component. The present invention relates to an automatic component mounting device used for mounting on a substrate or the like.

[0002]

2. Description of the Related Art Conventionally, a hollow package structure in which a piezoelectric vibration element is housed has been widely used in a piezoelectric resonance component. As such a package structure, one having a case substrate and a cap member having an opening opened downward is known. Here, the piezoelectric vibrating element is fixed to the upper surface of the case and is sealed in the package structure.

In manufacturing the piezoelectric resonance component having the package structure as described above, after preparing a structure in which the piezoelectric vibrating element is fixed on the case substrate, the cap material may be bonded to the case substrate using an adhesive. is necessary.

An example of a method of manufacturing an electronic component having a hollow package structure as described above is disclosed in Japanese Patent Laid-Open No. 9-266262. As shown in FIG. 6, in this manufacturing method, the cap member 52 is conveyed using the transfer device 51. The transfer device 51 is configured to be movable by a drive source (not shown), and a suction nozzle 53 is attached to the lower surface of the transfer device 51. The suction nozzle 53 is provided to suck and hold the cap material 52.

The cap member 52 supplied to a component supply unit (not shown) is suction-held by the suction nozzle 53 of the transfer device 51. Next, the transfer device 51 is moved from the component supply unit onto the circular table 54. Round table 5
An adhesive 55 is applied on the surface 4 so as to have a uniform thickness.

By lowering the suction nozzle 53 of the transfer device 51, the adhesive 55 comes into contact with the opening end surface of the cap member 52, and the adhesive 55 is applied to the opening end surface. Next, the suction nozzle 52 is raised, and the transfer device 51 is further moved from the circular table 54 to above the case substrate 57. Next, the suction nozzle 53 is lowered and the cap member 52 is
Is placed on the upper surface of the base substrate 57 and adhered to the case substrate 57.

Further, Japanese Laid-Open Patent Publication No. 64-66998 discloses a similar component automatic mounting machine. Here, many components are arranged in the component supply unit. The component arranged in the component supply unit is suction-held by the suction holder. The suction holder is transported from the component supply unit to the bonding stage. At the bonding stage, the adhesive is spread and spread on the upper surface. On the bonding stage, the suction holder is lowered, the lower surface of the component is brought into contact with the adhesive, and the adhesive is applied. After that, the suction holder is raised and is further transported to above the substrate. Next, the suction holder is lowered, and the components held by the suction holder are bonded onto the substrate.

[0008]

[Patent Document 1] Japanese Patent Laid-Open No. 9-26626
In each of the component automatic mounting machines described in Japanese Patent Application Laid-Open No. 2-62 and Japanese Patent Application Laid-Open No. 64-66998, in any case, a component such as a cap material is bonded from the component supply unit using a transfer machine or a suction holder. It is transported to the stage, the adhesive is applied to the lower surface of the component on the bonding stage, and then the component transfer machine and suction head are moved again from the bonding stage to the case substrate or circuit board and transported to the substrate. It was installed.

Therefore, the transfer machine and the suction holder had to be moved among the three parts, that is, the component supply section, the bonding stage and the case substrate. Therefore, the structure for moving the transfer machine and the suction holder is complicated and expensive. In addition, the structure for moving the transfer machine and the suction holder must be large.

Further, it takes some time to reliably apply the adhesive to the lower surface of the component. That is, by contacting the lower surface of the component with the adhesive for a certain period of time, a desired amount of the adhesive can be reliably transferred to the lower surface of the component. However, the speed of the component mounting process has been hindered by the time required to bring the adhesive into contact with the lower surface of the component as described above.

In order to increase the speed, it may be possible to shorten the time for which the lower surface of the component is brought into contact with the adhesive, but in that case, the adhesive application amount varies and the component is stably bonded to the substrate. Will be difficult.

An object of the present invention is a method of manufacturing an electronic component having a package structure in which a cap material having an opening at the bottom is adhered on a case substrate, which is complicated, large, and expensive. (EN) Provided is a method of manufacturing an electronic component including a step capable of moving a component by a relatively simple mechanism without needing it and enabling a cap material to be bonded onto a case substrate in a shorter time. To do.

Another object of the invention is a component automatic mounting apparatus which is suitable for the manufacturing method of the electronic component, when such a glue layer or flux component, mounted on board, speed steps And an automatic component mounting apparatus that does not require a complicated and expensive component moving mechanism.

[0014]

According to a first aspect of the present invention, there is provided a method of manufacturing an electronic component having a package structure in which a cap material having an opening opened downward is bonded onto a case substrate. A step of preparing a cap material and a case in which an electronic component element is fixed to the upper surface, and the cap material is conveyed by a first conveying member and placed on an adhesive stage having an adhesive layer formed on the upper surface. And a step of applying an adhesive to the opening end surface, a step of transporting the adhesive-coated cap material onto the case substrate using the second transport member, and adhering and fixing the adhesive to the case substrate , The adhesive stay
Is mounted on the bonding stage.
The cap material is removed by rotating the bonding stage.
From the position where it was initially placed, the second transfer member
The cap material is moved to a position where the cap material is gripped .

[0015]

According to the second aspect of the present invention, a metal cap made of metal is used as the cap member. According to a third aspect of the invention, the adhesive or flux is applied to the component, a component automatic mounting apparatus for mounting the base plate, and a component supply unit having a plurality of components are disposed, the component placement adhesive or off on the outer surface of the component by being location
Adhesive layer or flap on top so that the Lux is applied.
A first stage for transporting a component from a component supply unit to a bonding stage and placing the component on the adhesive layer or the flux layer of the bonding stage, and the bonding stage on which the Lux layer is formed.
A conveying member, from said adhesive stage conveys the parts group Saitama, and a second conveying member for mounting the components on a substrate by placing the components on the upper surface of the base plate, the adhesive stays
It is designed to be rotatable and placed by the first transport member.
The assembled component to the position where it is gripped by the second transport member.
In characterized that you have configured to be rotated.

[0017]

According to a fourth aspect of the present invention, the component supply unit is configured to supply a plurality of components in a state where the plurality of components are aligned and arranged, and the first conveying member is aligned. Further, a group of parts can be simultaneously placed on the bonding stage while maintaining this aligned state.

[0019]

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION The details of the electronic component manufacturing method and component automatic mounting apparatus according to the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an automatic component mounting apparatus according to an embodiment of the present invention. The automatic component mounting device 1
It has a chassis 2. On the upper surface of the chassis 2, the component supply unit 3, the bonding stage 4, and the plurality of case substrates 5 are arranged at a predetermined interval. Further, on the upper surface of the chassis 2, a transfer device 7 for transferring a component from the component supply unit 3 onto the bonding stage 4 is provided. The transport device 7 is
It has a guide rail 7a and a first transport member 7b configured to be movable along the guide rail 7a. The first conveying member 7b is configured so that the lower surface thereof can adsorb and hold a component.

A second transfer device 8 is provided to transfer the components from the bonding stage 4 onto the case substrate 5. The second transfer device 8 includes a guide rail 8a and a slider 8 configured to be movable along the guide rail 8a.
b and. The slider 8b is configured to be capable of reciprocating between the upper side of the bonding stage 4 and the upper side of the case substrate 5. The second carrying member 8c is attached to the lower surface of the slider 8b. 2nd conveyance member 8c
Is configured to be able to hold the component on its lower surface by suction.

However, the first and second conveying members 7b, 8
Each of c may be configured to be able to hold the component by a method other than the suction holding. In the present embodiment, a metal cap having an opening at the bottom is used as a component attached to the case substrate 5 by the component automatic mounting apparatus 1. An electronic component formed by fixing the metal cap to the case substrate 5 is shown in a sectional view in FIG. The electronic component 11 is a piezoelectric resonance component and has an adhesive 12a,
The piezoelectric resonance element 13 is joined via 12b. A metal cap 14 is fixed to the case substrate 5 via an insulating adhesive 15 so as to seal the piezoelectric resonance element 13.

Although the piezoelectric resonance element 13 is not shown in FIG. 1, the above-mentioned piezoelectric resonance element 13 is actually fixed on the case substrate 5. Further, in FIG. 1, a plurality of case substrates 5 are arranged in a matrix.

Next, referring to FIG. 3 and FIG. 4 in addition to FIG. 1, a method of manufacturing an electronic component according to an embodiment of the present invention will be described. To obtain the electronic component 11 shown in FIG.
In advance, the plurality of case substrates 5 having the piezoelectric resonance elements 13 fixed to the upper surface are arranged in a matrix in the automatic component mounting apparatus 1. Next, the metal cap 14 as a component is supplied to the component supply unit 3. This component supply can be performed by successively introducing the metal cap 14 as a component into the recess 3a of the component supply unit 3 using a component drive mechanism (not shown).

However, the parts feeder 15 shown in FIG. 4 is preferably used. Parts feeder 15
Has a supply plate 16 and a guide plate 17. The supply plate 16 has a rectangular plate shape. A plurality of recesses 16a are formed on the upper surface of the supply plate 16 at predetermined intervals. Each recess 16a is opened on the upper surface of the supply plate 16 toward the one end edge 16b side. The recess 16a has a planar shape into which the metal cap 14 can enter, and the depth thereof is shallower than the height of the metal cap 14.

On the other hand, the guide plate 17 includes the recesses 16
It is arranged to accommodate the metal cap 14 in a. An elongated groove 17a is formed on the upper surface of the guide plate 17. The width of the groove 17a is equal to or slightly wider than the width of the metal cap 14. Therefore, at the end portion of the guide plate 17 on the side not shown, the randomly supplied metal caps 14 can be sequentially supplied by applying mechanical vibration to the groove 17a of the guide plate 17. The metal cap 14 supplied to the groove 17a is pushed out into the recess 16a of the supply plate 16 and stored in the recess 16a, as shown in FIG. Next, when the guide plate 17 is moved along the edge 16b of the supply plate 16, the metal cap 14 is similarly supplied to the other recesses 16a.

In this way, the metal caps 14 are housed in the plurality of recesses 16a of the supply plate 16, respectively. On the other hand, the recesses 16a are arranged at a predetermined interval. Therefore, by accommodating the metal caps 14 in the recesses 16a, the plurality of metal caps 14 are aligned at a predetermined interval.

In the present embodiment, the plurality of metal caps 14 are supplied in the component supply section 3 as described above in a state of being aligned at a predetermined interval. In the initial state, the first transport member 7b is located above the component supply unit 3 and is lowered toward the supply plate 16 arranged in the component supply unit 3. Then, the plurality of metal caps 14 are suction-held on the lower surface of the first transport member 7b while maintaining the aligned state. Next, the first transport member 7b is moved upward, and further moved to a position above the bonding stage 4 along the guide rail 7a. Then, the transport member 7b is lowered. By releasing the suction of the metal cap 14, the metal cap 14 is brought into contact with the adhesive layer 4 a provided on the upper surface of the adhesion stage 4. In this case, as shown in FIG. 3, the plurality of metal caps 14 are placed on the adhesive layer 4a in an aligned state. This position is called the first position A.

Next, the bonding stage 4 is rotated 180 ° clockwise or counterclockwise. In this way, the plurality of metal caps 14 placed on the adhesive layer 4a are moved to the second position B side shown in FIG. Next, the second transport member 8c descends from above the second position B, and the metal cap 14 having the adhesive applied to the lower surface of the second transport member 8c is sucked and held.

Thereafter, the second carrying member 8c is raised and moved to a position above the portion where the plurality of case substrates 5 are arranged together with the slider 8b. Then, the second transport member 8c is lowered. By releasing the suction, the metal cap 14 having the lower opening end face coated with the adhesive is placed on each case substrate 5 and bonded. Preferably, in addition to releasing the suction of the second transport member 8c, the metal cap 14 is attached to the case substrate 5 by the lower surface of the second transport member 8c.
You may press to the side.

After the metal cap 14 is bonded to the case substrate 5, the second carrying member 8c is raised and moved again to the initial state, that is, above the bonding stage 4.
On the other hand, also for the first transport member 7b, the bonding stage 4
After the metal cap 14 is placed on the adhesive layer 4a, the metal cap 14 is moved to above the component supply unit 3 again.

In the present embodiment, both the first transport member 7b and the second transport member 8b need only be reciprocally driven between two positions. Therefore, it is not necessary to move between three or more positions as in the conventional automatic component mounting machine, and therefore a simple and small-sized transport mechanism can be used.

Moreover, the metal cap 14 is attached to the component supply unit 3
From the adhesive stage 4 to the case substrate 5 are independently performed. Therefore, even if the time until the adhesive is stably and sufficiently transferred to the opening end face after the lower opening end face of the metal cap 14 is brought into contact with the adhesive layer 4a is secured, the entire process time is shortened. be able to. That is, if new metal caps are sequentially supplied onto the adhesive layer 4a of the bonding stage 4 by the time the second transport member 8c sucks and holds the metal cap 14 to which the adhesive has been applied, the adhesive layer Even if the time required for transfer is sufficiently secured, the metal cap 14 to which the adhesive is sequentially applied can be adhered onto the case substrate 5 without stopping the operation of the second transport member 8c.

In the conventional automatic component mounting machine, a single conveying member conveys a component such as a metal cap from the component supplying section and stops the conveying member while the component is in contact with the adhesive layer on the bonding stage. Without it, the time required for transferring the adhesive could not be secured. On the contrary,
In this embodiment, the adhesive is applied to the lower opening end face of the metal cap 14 after the metal cap 14 is placed on the adhesive layer 4a by the first transport member 7b and then moved to the second position B. It can be secured in the process. Therefore, it is not necessary to stop the second transport member 8c for the time until the adhesive is sufficiently transferred to the metal cap 14.

Further, since the adhesive layer 4a has sufficient viscosity, even if the adhesive stage 4 is rotated clockwise or counterclockwise as described above, the viscosity causes the metal caps 14 to be initially aligned and arranged. It is difficult to shift from the state where it was done. Therefore, at the second position B, the plurality of metal caps 14 are held by the second transport member 8c while being aligned with the supply plate 16. Therefore, the plurality of metal caps 14 can be bonded to the plurality of case substrates 5 arranged in a matrix with the plurality of metal caps 14 aligned. Therefore, the plurality of metal caps 14 can be bonded to the plurality of case substrates 5 while positioning them efficiently and reliably.

As described above, in order to keep the metal cap 14 aligned, the adhesive layer 4a needs to have a certain degree of viscosity.
The viscosity of the adhesive layer 4a cannot be uniquely determined because it depends on the rotation speed of the bonding stage 4 and the material and shape of the parts to which the bonding is applied. However,
Normally, when obtaining the electronic component 11 shown in FIG.
Viscosity at -40 ° C is 1,000 to 400,000c
Ps of about ps is preferably used.

In FIG. 5, a metal cap 14 is attached to the adhesive layer 4a.
It is a figure which shows the relationship between the mounting time after mounting and, and the adhesive amount to be transferred. As is clear from FIG. 5, the time at which the transfer amount is stable and the transfer when the adhesive C having a viscosity of 10,000 cps at 25 ° C. and the adhesive D having a viscosity of 30,000 cps are used. You can see that the amount is different. Further, in any case, it is found that it takes at least about 0.2 seconds until the transfer amount stabilizes.

Therefore, in the bonding stage 4, when the metal cap 14 is rotationally moved from the first position A to the second position B, it takes at least 0.2 seconds to move from the first position to the second position. Therefore, it is understood that a sufficient amount of adhesive can be applied to the open end surface of the metal cap 14.

The rotation speed of the adhesion stage may be appropriately selected in consideration of the time during which the transfer amount of the adhesive is stabilized in this way. However, the transfer amount of the adhesive is not uniquely determined because it varies depending on the viscosity of the adhesive used, the shape and material of the target component, and the like.

Further, the adhesive used is not particularly limited, and may be an epoxy adhesive, a silicone adhesive or the like. Further, as the mechanism for driving the first and second transport members 7b and 8c, those having an appropriate structure can be used as long as they can reciprocate between two points as described above, and are not particularly limited. Not something.

The mechanism for rotating the bonding stage 4 is not particularly limited, but a method of controlling the rotation speed by a stepping motor is preferable. In this case, the stop position viscosity of the metal cap 14 can be secured with a position accuracy of about ± 0.2 mm.

In order to improve the accuracy of the stop position,
An appropriate image sensor is used to confirm that the metal cap 14 is present at the first position A and the second position B, the position of the metal cap 14 is confirmed, and the metal cap 14 is conveyed according to the output of the image sensor. The members 7b and 8c may be driven.

In the above embodiment, as shown in FIG. 2, the case substrate 5 on which the piezoelectric resonance element 13 is fixed is used. However, the electronic component manufacturing method and component automatic mounting according to the present invention are used. The mounting machine can be used for general electronic components in which a package structure is composed of a substrate and a cap material. For example, in the package structure, the piezoelectric resonance element 13
Instead of this, other electronic component elements such as a piezoelectric filter element and a thermistor element may be housed. Further, the part to which the adhesive is applied according to the present invention is not limited to the metal cap material 14, and may be a cap material made of ceramics. Further, it is not limited to the cap-shaped one, and it can be used for the purpose of applying an adhesive to the outer surface of a component having various other shapes such as a flat plate and adhering it to a substrate or the like.

In addition, the automatic component mounting machine according to the present invention is
As described above, the present invention is not limited to the use for manufacturing a single electronic component 11, but is also used for applying an adhesive or flux to the outer surface of an already obtained electronic component and mounting it on a printed circuit board or the like. be able to.

[0046]

According to the first aspect of the invention, when the cap material is adhered onto the case substrate, the cap material is placed on the adhesion stage by using the first conveying member,
Adhesive is applied to the open end faces. Further, the cap member coated with the adhesive is transported by the second transport member onto the case substrate, and is fixed to the case substrate by adhesion. That is, the first step is to transfer the cap material to the bonding stage and the second step is to transfer the cap material coated with the adhesive onto the case substrate.
Independently using the second transport member.

Therefore, since the first and second conveying members can be constructed by using the conveying member that reciprocates between two points, the conveying device can be simplified and downsized. at the same time,
The cost of the transport device can be reduced.

Further, when the adhesive is transferred to the opening end surface of the cap material, it is necessary to bring the cap material into contact with the adhesive for a certain time in order to make the adhesive application amount, that is, the adhesive transfer amount constant. . In the present invention, since the first and second conveying members are independently driven, after the cap member is placed on the bonding stage using the first conveying member, the cap member is kept until the adhesive transfer amount becomes stable. It is not necessary to stop the transportation and the bonding operation of the cap material to which the adhesive is applied to the case substrate even if is left mounted. Therefore, the entire process of adhering the cap material to the case substrate can be shortened, and the work can be speeded up.

Therefore, the productivity can be improved in the manufacture of an electronic component having a package structure in which a cap material is adhered onto the case substrate, and the necessary transporting device can be simplified. It becomes possible to efficiently and inexpensively manufacture an electronic component in which the material is stably joined to the case substrate.

[0050] Further, by rotating the bonding stage, since the cap member is placed on an adhesive stage it is moved from the first mounting position to a position for gripping the cap member by the second transport member, By simply controlling the rotation speed of the bonding stage, the adhesive can be stably transferred to the lower opening end surface of the cap material. Therefore, it is possible to easily provide an electronic component in which the cap member is stably joined to the case substrate.

According to the second aspect of the present invention, since the cap member is composed of the metal cap, the metal cap can be stably joined to the case substrate by using an adhesive, and thus the electromagnetic shielding property is excellent. It is possible to provide the electronic parts.

In the automatic component mounting apparatus according to the third aspect of the invention, the first transport member is used to transport the component between the component supply section and the bonding stage.
The second conveying member is used in the adhesion stage to carry the parts group Saitama. Therefore, the first and second conveying members can be configured by a simple conveying device that can be reciprocally driven between two points, so that downsizing and cost reduction of the entire device can be achieved.

In addition, like the invention described in claim 1,
Since the operations by the first and second conveying members can be independently performed, after the adhesive or the flux is applied to the outer surface of the component or the like, the component or the like is placed on the adhesion stage until the application amount of the adhesive or the flux becomes stable. Even if it is on the second
It is not necessary to stop the operation of the transport member. Therefore,
It is possible to reduce the variation in the transfer amount of the adhesive or flux against the part products, it is possible to shorten the entire bonding process of the parts and assemblies board.

[0054] Further, by rotating the bonding stage, components placed on the adhesive stage by the first transfer member is configured to be moved to a position to be gripped by the second transport member Therefore, by controlling the rotation speed of the bonding stage, it is possible to stably control the transfer amount of the adhesive or the like to the component or the like.

According to a fourth aspect of the present invention, the component supply unit is configured to supply a plurality of components in a state where the plurality of components are aligned and arranged, and the first conveying member is a group of aligned components. Since the parts can be simultaneously placed on the bonding stage while maintaining the aligned state, it is possible to apply the adhesive or the flux to the plurality of parts at the same time. Moreover, the adhesive layer provided on the bonding stage
Alternatively , due to the viscosity of the flux layer , even if the bonding stage is moved, the plurality of parts are moved while maintaining the aligned state. Therefore, the group of components in the aligned state can be held by the second transport member and adhered to the substrate or the like.

[0056]

[Brief description of drawings]

FIG. 1 is a schematic perspective view for explaining an automatic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view for explaining an electronic component obtained according to an embodiment of the present invention.

FIG. 3 is a schematic perspective view for explaining a method for manufacturing an electronic component according to the present invention.

FIG. 4 is a perspective view for explaining a parts feeder preferably used to form a parts supply unit.

FIG. 5 shows a relationship between an adhesive transfer amount and a component mounting time.

FIG. 6 is a partial sectional front view for explaining an example of a conventional automatic component mounting machine.

[Explanation of symbols]

1 ... Automatic component mounting device 3 ... Parts supply unit 4 ... Bonding stage 4a ... Adhesive layer 5 ... Case substrate 7b ... 1st conveyance member 8c ... Second transport member 11 ... Electronic components 14 ... Metal cap as a component

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masato Higaku, 26-20 Tenjin, Tenjin, Nagaokakyo City, Kyoto Prefecture Murata Manufacturing Co., Ltd. (56) Reference JP-A-63-48378 (JP, A) (58) ) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 23/02 H01L 21/50 H01L 23/10 H05K 13/00

Claims (4)

(57) [Claims] 1. A method of manufacturing an electronic component having a package structure in which a cap member having an opening opened downward is adhered on a case substrate, wherein the cap member and the electronic component element are fixed on an upper surface. A step of preparing a case, a step of transporting the cap material by the first transport member, placing the cap material on an adhesive stage having an adhesive layer formed on an upper surface, and applying an adhesive to the opening end surface; agent cap material applied, using the second conveying member is conveyed onto the case substrate, and a step of bonding and fixing the upper case substrate, and the adhesive stage rotatable
The cap material placed on the bonding stage.
By rotating the wearing stage, the
The cap material is gripped by the second conveying member from the opened position.
It characterized Rukoto move the capping member to a position, a method of manufacturing an electronic component. 2. The method of manufacturing an electronic component according to claim 1, wherein the cap member is a metal cap made of metal. Wherein an adhesive is applied or flux component, a component automatic mounting apparatus for mounting the base plate, and a component supply unit having a plurality of components are arranged, that the component is placed Adhesive on the outer surface of the component
Or an adhesive layer on top so that flux is applied
Alternatively, an adhesion stage having a flux layer formed thereon, a first conveyance member for conveying the component from the component supply unit to the adhesion stage and placing the component on the adhesive layer or the flux layer of the adhesion stage, and the adhesion. conveying the parts group Saitama from the stage, and a second conveying member for mounting the components on a substrate by placing the parts on a base plate <br/> surface, the adhesion stage rotatable
The parts placed by the first transport member are
Can be rotated to a position gripped by the second transport member
Characterized that you have been configured, the component automatic mounting apparatus. 4. The component supply unit is configured to supply a plurality of components in a state in which the plurality of components are aligned and arranged, and the first transport member simultaneously adheres a group of aligned components. The automatic component mounting apparatus according to claim 3 , which is configured to be mounted on the stage while maintaining the aligned state.