JP3266080B2 - Parts automatic mounting machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic component mounting machine for mounting components such as electronic components and members constituting the electronic components on a substrate, and more particularly, to a bonding agent such as a solder paste or an adhesive. To a component automatic mounting machine for attaching a component to the bottom surface of a component and mounting the component on a substrate.

[0002]

2. Description of the Related Art When mounting electronic components and members constituting the electronic components on a substrate using a bonding agent such as a solder paste or an adhesive, various component mounting machines have conventionally been used. In a general conventional component mounting machine, the bonding agent is put into a container such as a syringe, the bonding agent is dropped on a surface of a substrate on which the component is mounted from a nozzle mounted on the container, and the component is mounted on the dropped bonding agent. The method of placing and joining is adopted.

However, in this method, the bonding agent adheres only to the lower surface of the component, that is, only a part of the bonding surface, and a sufficient bonding strength may not be obtained. Therefore, an automatic component mounting machine capable of solving the above-mentioned problem is disclosed in Japanese Patent Application Laid-Open No. 64-669.
No. 98 is disclosed. The component automatic mounting machine described in this prior art includes a component suction holder movable by a motor, a component supply unit, a circuit board installation unit, and an adhesive storage container provided in a movable range of the component suction holder. Have.

In this apparatus, after a component is sucked and held by a component suction holder from a component supply unit, the component suction holder 51 is moved as shown in FIG.
The component 52 is lowered into 3 and an adhesive is applied to the bottom surface of the component 52. In this case, as shown in FIG.
Of the adhesive 54 is adhered to the bottom surface. Alternatively, as shown in FIG. 5C, the adhesives 54a and 54b adhere non-uniformly depending on the surface tension of the adhesive. Therefore, a structure is provided in which the rotating roller is brought into contact with the adhesive applied surface of the component 52 to scrape off the adhesive on the lower surface of the component 52 and make the thickness uniform.

[0005]

As described above, in the automatic component mounting machine described in JP-A-64-66998,
Since the component 52 is immersed in the adhesive storage container 53 and the adhesive 54 is applied to the bottom surface of the component 52 in an amount larger than the required amount, a sufficient amount of adhesive can be applied, but a scraping mechanism having a rotating roller It was necessary to scrape off the adhesive adhered by using the method and flatten it. That is, there is a problem that a scraping mechanism is required, the structure of the automatic component mounting machine becomes more complicated, and the number of steps increases.

[0006] In addition, depending on the dispersion of the parts, the applied portion of the adhesive varies, and in particular, the adhesive adheres not only to the bottom surface but also to the side surfaces of the parts. There was also a problem that the adhesive strength varied.

Further, the adhesive scraped off by the scraping mechanism adheres to the roller of the scraping mechanism, and as the amount of adhesive adhered to the roller increases, the amount and state of scraping the adhesive vary, and It tends to be difficult to make the thickness of the adhesive layer on the bottom surface uniform. In addition, complicated maintenance work for removing the adhesive adhered to the scraping mechanism was also required. Furthermore, since the adhesive has a structure in which an adhesive in a necessary amount or more is adhered to the component and scraped off, the consumption of the adhesive increases, which hinders cost reduction.

[0008] An object of the present invention is to reduce the variation in the amount of the bonding agent applied due to the variation in the components, and to stably apply the bonding agent to a uniform thickness on the components without incurring complicated structures and processes. Accordingly, it is an object of the present invention to provide an automatic component mounting machine capable of efficiently and stably mounting components on a substrate.

[0009]

According to the first aspect of the present invention, there is provided a component supply unit to which components are supplied, a bonding agent application unit for applying a bonding agent to a bottom surface of the components, and the components are mounted. A board mounting portion on which the board is disposed, and a component holding member capable of attaching and detaching the component, wherein the component holding member holds the component present in the component supply portion, and a bonding agent In a component automatic mounting machine in which the component holding member can be moved so that the component provided with the bonding agent can be mounted on the substrate, the bonding agent application section has a bonding agent layer formed on the upper surface. And a squeegee provided so as to be able to be moved on the stage in order to equalize the thickness of the bonding agent layer, and the component holding member holding the component is lowered at the bonding agent application section. Parts through the adhesive layer A driving device that moves the component holding member up and down so that the component holding member holding the component is lifted up and the bonding agent is applied to the lower surface of the component after being brought into contact with the upper surface of the component. Features.

In the automatic component mounting machine according to the present invention,
As described in claim 2, as the component holding member,
Preferably, a suction head is used, and the component is sucked to the lower surface of the suction head.

The components mounted on the substrate by the automatic component mounting machine according to the present invention are not particularly limited, but a cap material having an opening opened downward may be used as described in claim 3. The package including the cap material and the substrate can be suitably used for an application to be bonded to a substrate, and is suitably used for an electronic component having a sealed package structure such as a piezoelectric resonance component or a piezoelectric filter device.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a non-limiting embodiment of an automatic component mounting machine according to the present invention will be described with reference to the drawings.

FIG. 3 is a perspective view showing the entire structure of an automatic component mounting machine according to one embodiment of the present invention. The automatic component mounting machine 1 has a gantry 2. Above the gantry 2, a suction head support member 3 is arranged. A plurality of component suction heads 4 as component holding members are supported by the suction head support member 3 so as to be vertically movable by a drive device (not shown). Each of the component suction heads 4 is configured to be sucked by a vacuum suction source (not shown) so as to be able to suck a chip-type electronic component described later on its lower surface.

Further, the suction head supporting member 3 is a
It is movable along a guide rail 5 extending along the direction. This guide rail 5 is fixed to a slider 6. That is, the suction head support member 3 is connected to the slider 6 so that the suction head support member 3 can move in the arrow Y direction on the guide rail 5.

On the other hand, a pair of guide rails 7 and 8 are provided on the upper surface of the gantry 2 in a direction indicated by an arrow X in FIG. 3, that is, a direction orthogonal to the Y direction. The slider 6 moves along arrow X along guide rails 7 and 8.
It is possible to move in the direction.

Therefore, each component suction head 4 can be moved in the Y direction by moving the suction head support member 3 along the guide rail 5, and by moving the slider 6 in the arrow X direction. , X direction. That is, each component suction head 4 is
The upper surface of the gantry 2 is movable in the X and Y directions.

A drive source (not shown) is connected to the suction head supporting member 3 and a drive source (not shown) is connected to the slider 6 to enable the movement in the X and Y directions. . As a driving device for moving these driving sources and the component suction head 4 up and down, for example, an arbitrary reciprocating driving source such as a hydraulic cylinder or an air cylinder, or a reciprocating driving force to a rotary driving source such as a motor is used. Such as a combination of coupling mechanisms that convert to force,
Any structure can be used.

In the area between the guide rails 7 and 8 on the upper surface of the gantry 2, a component supply unit 9 is formed near the ends 7a and 8a of the guide rails 7 and 8. In the automatic component mounting machine 1 of the present embodiment, the cap material 33 of the piezoelectric resonance device 31 shown in FIG. 4 is joined to the substrate 32 by using a bonding agent 15B made of a solder paste. Therefore, a large number of cap materials 33 are arranged in a matrix in the component supply unit 9. The cap member 33 is made of, for example, a metal such as stainless steel or aluminum, has an opening that opens downward, and has a substantially rectangular planar shape as a whole.

In a region between the component supply section 9 and the guide rail 7, a bonding agent application section 12 is formed slightly in the X direction from the component supply section 9. As shown in FIG.
The bonding agent application section 12 has a stage 13 and a squeegee 14. On the stage 13, a bonding agent layer 15 made of a solder paste is formed. The thickness of the bonding agent layer 15 is made uniform by moving the squeegee 14 to flatten the supplied bonding agent 15A.

That is, the squeegee 14 has its tip 14
a is arranged at a predetermined distance from the upper surface 13a of the stage 13, and is configured to be able to reciprocate in the direction of arrow A shown in the figure.

The reciprocating drive of the squeegee 14 is performed by connecting the squeegee 14 to a reciprocating drive source provided in the automatic component mounting machine 1. Note that, instead of the squeegee 14, the stage 13 may be driven to reciprocate in the direction of arrow A.

The height of the squeegee 14 is also adjustable. By adjusting the height of the squeegee 14, the distance between the upper surface 13a of the stage 13 and the tip 14a of the squeegee 14 is adjusted. The thickness of the bonding agent layer 15 can be adjusted according to the supplied component.

In FIG. 3, a board mounting portion 18 is provided substantially at the center of the upper surface of the gantry 2. Although not shown in FIG. 3, bonding agents 37 a and 37 are provided on the substrate mounting portion 18 on the substrate 32 of the piezoelectric resonance device 31 shown in FIG. 4.
Many structures to which the piezoelectric resonators 36 are fixed via “b” are arranged.

The cap material 33 to which the bonding agent has been applied in the bonding agent application section 12 is bonded to the substrate 32 in the substrate installation section 18. In the automatic component mounting machine 1, a drive source for sucking and releasing components by the suction head 4 and a drive source for driving the suction head 4 in the vertical direction and the X and Y directions are controlled. The control device 20 is configured in the gantry 2.

Next, referring to FIG. 1 and FIG. 2, a cap material 33 as a component is
2 will be described. First, each component suction head 4 is moved above the component supply unit 11. This movement is performed by moving the suction head supporting member 3 and the slider 6 along the guide rail 5 and the guide rails 7, 8, respectively. In a state where the component suction head 4 is disposed immediately above the cap material 33 disposed in the component supply unit 9, the component suction head 4 is lowered to suck and hold the cap material 33 on the lower surface of the component suction head 4.

Thereafter, the component suction head 4 holding the cap member 33 is moved above the bonding agent application section 12.
This movement is also performed by moving the suction head support member 3 and the slider 6.

In the bonding agent application section 12, as described above, the bonding agent layer 15 shown in FIG. 1 is formed so as to have a uniform thickness and to have a flat upper surface.
When applying the bonding agent to the cap material 33, the component suction head 4 holding the cap material 33 is lowered. As shown in FIG. 2A, the lower surface 33a of the cap material 33 penetrates the bonding agent layer 15 and the stage 1
3 is carried out so as to be in contact with the upper surface 13a. Thereafter, the component suction head 4 is raised to obtain the cap material 33 to which the bonding agent 15B has been applied.

In this case, as shown in FIG. 2B, the bonding agent 15B not only adheres to the uniform thickness on the lower surface 33a of the cap material 33, but also extends from the lower surface 33a to the side surface. The height of the existing bonding agent 15B is also made uniform. That is, the cap material 33 is dropped on the bonding material layer 15 formed to a uniform thickness, and the cap material 33 is lowered so that the bonding material layer 15 penetrates the bonding material layer 15 until its lower surface 33a contacts the upper surface 13a of the stage 13. Therefore, in the pulled up cap material 33, a uniform amount of the bonding agent 15B is applied to the lower surface 33a and the periphery thereof.

Next, the cap material 33 to which the bonding agent 15B has been applied is moved from above the bonding agent application section to above the substrate setting section 18 while holding the component suction head 4. This movement is also performed by driving the suction head support member 3 and the slider 6.

After positioning the component suction head 4 at a predetermined position above the substrate 32, the component suction head 4
And by stopping the suction, the bonding agent 1
The cap material 33 coated with 5B is mounted at a predetermined position on the substrate 32.

As described above, since the bonding agent 15B is uniformly applied to the lower surface of the cap material 33 in the circumferential direction, the cap material 33 can be stably and firmly bonded to the substrate 32 without variation. .

In addition, the cap material 33 is removed from the bonding agent layer 15.
It is not necessary to scrape the bonding agent using a roller or the like after pulling up, so in the automatic component mounting machine 1, the mechanism for applying the required amount of the bonding agent to the cap material 33 is simplified, and the number of processes is reduced. Can also be reduced.

Further, in the automatic component mounting machine 1, the cap material 33 shown in FIG. 4 is mounted on the substrate 32. However, the automatic component mounting machine according to the present invention employs a chip type electronic component such as a multilayer capacitor. It can also be used for mounting on a printed circuit board. That is, the component in the present invention may be a part of an electronic component such as the cap material 33 or a component itself such as a multilayer capacitor that constitutes one electronic component. . Also,
The board on which the components according to the present invention are mounted may be a board constituting an electronic component case board like the board 32, or may be a printed circuit board on which the electronic components are mounted.

[0034]

In the automatic component mounting machine according to the first aspect of the present invention, the component present in the component supply section is held by the component holding member, and the component holding member moves to the bonding agent application section, and the bonding agent is removed. In the application part, the bonding agent layer is flattened by the squeegee, and has a uniform film thickness, so that the component holding member is lowered so that the lower surface of the component penetrates the bonding agent layer and abuts on the upper surface of the stage, Then, by raising the component holding member, the bonding agent is applied to the lower surface of the component and its vicinity. In this case, since the bonding agent layer has a uniform thickness and the bonding agent is applied to the lower surface of the component as described above, the bonding agent is uniformly and stably applied to the lower surface of the component and its vicinity. be able to.

Further, in the automatic component mounting machine described in the above-mentioned prior art, it is necessary to apply a bonding agent of a necessary amount or more to the lower surface of the component and then flatten it using a scraping mechanism such as a roller. On the other hand, in the automatic component mounting machine according to the present invention, such a scraping mechanism is not required since the bonding agent is applied to the lower surface of the component and its vicinity in a uniform thickness. Therefore, the structure of the operation can be simplified, and the number of steps can be reduced. Further, since it is not necessary to apply and scrape a bonding agent in an amount larger than a required amount, the amount of the bonding agent used can be reduced.

Therefore, when a large number of components are fixed on a substrate using a bonding agent, by using the automatic component mounting machine according to the present invention, the components can be reliably fixed without being greatly affected by variations in the components themselves. And it can be stably mounted on the substrate.

In addition, by adjusting the distance between the squeegee and the upper surface of the stage, it is possible to easily and precisely adjust the amount of the bonding agent to be applied to the component. Therefore, it is possible to apply an optimum amount of the bonding agent uniformly and with high precision according to various components.

According to the second aspect of the present invention, the component holding member has a suction head, and the component is held on the lower surface of the suction head by suction. Therefore, it is possible to move between the component supply unit, the bonding agent application unit, and the substrate installation unit by a simple operation such as suction by the suction head and detachment by stopping the component, and without damaging the component.

[Brief description of the drawings]

FIG. 1 is a side view for explaining a bonding agent application section in an automatic component mounting machine according to one embodiment of the present invention.

FIGS. 2A and 2B are side views for explaining a process of applying a bonding agent to a component in a bonding agent application section illustrated in FIG. 1;

FIG. 3 is a perspective view showing an embodiment of an automatic component mounting machine according to the present invention.

FIG. 4 is a sectional view showing a piezoelectric resonance component suitably obtained by using the component automatic mounting machine according to the present invention.

FIGS. 5A to 5C are schematic cross-sectional views for explaining a step of applying a bonding agent to a component in a conventional automatic component mounting machine.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Component automatic mounting machine 3 ... Suction head support member 4 ... Component suction head as component holding member 5 ... Guide rail 6 ... Slider 7, 8 ... Guide rail 9 ... Component supply part 12 ... Bonding agent application part 13 ... Stage 13a … Stage upper surface 14… Squeegee 15… Bonding agent layer 15A… Bonding agent 15B… Bonding agent 31… Piezoelectric resonance component 32… Substrate 33… Capping material as component 33a… Capping material bottom

Continuation of the front page (56) References JP-A-2-81448 (JP, A) JP-A-59-43596 (JP, A) JP-A-56-37698 (JP, A) JP-A-64-66998 (JP, A) , A) JP-A-8-224663 (JP, A) JP-A-3-109335 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04 H05K 3/34 505

Claims (3)

(57) [Claims] A component supply unit to which the component is supplied; a bonding agent application unit for applying a bonding agent to a bottom surface of the component; a board mounting unit on which a board on which the component is mounted is arranged; A detachable component holding member, wherein the component holding member holds a component present in a component supply unit, applies a bonding agent to a bottom surface of the component in a bonding agent application unit, and mounts the component provided with the bonding agent on a substrate. In a component automatic mounting machine in which the component holding member can be moved so that the component holding member can be mounted thereon, the bonding agent application section makes the thickness of the bonding agent layer uniform with a stage having a bonding agent layer formed on an upper surface. A squeegee provided so as to be able to be moved on the stage in order to move the component holding member holding the component down at the bonding agent application section, so that the component penetrates the bonding agent layer and the upper surface of the stage After being abutted, hold the parts Is increased component holding members as bonding agent to the component lower surface is applied, and further comprising a driving device that allows moving the component holding member up and down, component automatic mounting machine. 2. The automatic component mounting machine according to claim 1, wherein the component holding member has a suction head capable of sucking the component by vacuum suction, and the component is sucked and held on a lower surface of the suction head. . 3. The automatic component mounting machine according to claim 1, wherein the component is a cap material for an electronic component having an opening that opens downward.