JP2002226822A - 光線活性化型接着フィルムを用いた基材接着方法 - Google Patents

光線活性化型接着フィルムを用いた基材接着方法

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Publication number
JP2002226822A
JP2002226822A JP2001022030A JP2001022030A JP2002226822A JP 2002226822 A JP2002226822 A JP 2002226822A JP 2001022030 A JP2001022030 A JP 2001022030A JP 2001022030 A JP2001022030 A JP 2001022030A JP 2002226822 A JP2002226822 A JP 2002226822A
Authority
JP
Japan
Prior art keywords
light
adhesive film
substrate
activated
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001022030A
Other languages
English (en)
Japanese (ja)
Inventor
Hiroaki Yamaguchi
裕顕 山口
Satoru Kitamura
哲 北村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2001022030A priority Critical patent/JP2002226822A/ja
Priority to PCT/US2002/002540 priority patent/WO2002061010A2/fr
Priority to EP02713494A priority patent/EP1358291B1/fr
Priority to CNB028042344A priority patent/CN1252204C/zh
Priority to DE60205456T priority patent/DE60205456T2/de
Priority to US10/250,709 priority patent/US20040094264A1/en
Priority to KR1020037009985A priority patent/KR100842131B1/ko
Priority to AT02713494T priority patent/ATE301696T1/de
Priority to AU2002245342A priority patent/AU2002245342A1/en
Publication of JP2002226822A publication Critical patent/JP2002226822A/ja
Priority to HK04102380A priority patent/HK1061406A1/xx
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2001022030A 2001-01-30 2001-01-30 光線活性化型接着フィルムを用いた基材接着方法 Pending JP2002226822A (ja)

Priority Applications (10)

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JP2001022030A JP2002226822A (ja) 2001-01-30 2001-01-30 光線活性化型接着フィルムを用いた基材接着方法
US10/250,709 US20040094264A1 (en) 2001-01-30 2002-01-29 Method for adhering substrates using light activatable adhesive film
EP02713494A EP1358291B1 (fr) 2001-01-30 2002-01-29 Procede d'adhesion de substrats au moyen d'un film adhesif photo-activable
CNB028042344A CN1252204C (zh) 2001-01-30 2002-01-29 使用可光活化胶粘膜粘合基材的方法
DE60205456T DE60205456T2 (de) 2001-01-30 2002-01-29 Verfahren zum kleben von substraten unter verwendung einer lichtaktivierbaren klebstofffolie
PCT/US2002/002540 WO2002061010A2 (fr) 2001-01-30 2002-01-29 Procede d'adhesion de substrats au moyen d'un film adhesif photo-activable
KR1020037009985A KR100842131B1 (ko) 2001-01-30 2002-01-29 광선 활성화형 접착 필름을 사용한 기재의 접착 방법
AT02713494T ATE301696T1 (de) 2001-01-30 2002-01-29 Verfahren zum kleben von substraten unter verwendung einer lichtaktivierbaren klebstofffolie
AU2002245342A AU2002245342A1 (en) 2001-01-30 2002-01-29 Method for adhering substrates using light activatable adhesive film
HK04102380A HK1061406A1 (en) 2001-01-30 2004-03-31 Method for adhering substrates using light activatable adhesive film

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JP (1) JP2002226822A (fr)
KR (1) KR100842131B1 (fr)
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AT (1) ATE301696T1 (fr)
AU (1) AU2002245342A1 (fr)
DE (1) DE60205456T2 (fr)
HK (1) HK1061406A1 (fr)
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Cited By (7)

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JP2007221034A (ja) * 2006-02-20 2007-08-30 Fujitsu Ltd フィルム貼り付け方法、フィルム貼り付け装置および半導体装置の製造方法
KR100874302B1 (ko) 2005-02-18 2008-12-18 도요 잉키 세이조 가부시끼가이샤 전자파 차폐성 접착필름, 그 제조방법 및 피착체의 전자파차폐방법
JP2011096253A (ja) * 2009-10-30 2011-05-12 Intel Corp 認証されたウィルス対策エージェントにメモリをスキャンするための直接アクセスを提供する方法及び装置
JPWO2011111784A1 (ja) * 2010-03-12 2013-06-27 日立化成株式会社 接着材リール
JP2016500832A (ja) * 2013-03-28 2016-01-14 エルジー・ケム・リミテッド 両面型偏光板の製造方法およびこれから製造された両面型偏光板
JP2017139436A (ja) * 2016-02-04 2017-08-10 毅嘉科技股▲ふん▼有限公司 回路基板構造およびその製造方法
JP2020041045A (ja) * 2018-09-10 2020-03-19 デクセリアルズ株式会社 接着剤組成物

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US6955739B2 (en) 2001-06-19 2005-10-18 3M Innovative Properties Company Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
DE102007033214B4 (de) * 2006-08-29 2017-09-14 Robert Bosch Gmbh Verfahren zur Herstellung eines Elektromotors
TWI408169B (zh) 2009-04-10 2013-09-11 Saint Gobain Performance Plast 聲阻尼組合物
WO2010118359A2 (fr) 2009-04-10 2010-10-14 Saint-Gobain Performance Plastics Corporation Composition d'amortissement acoustique présentant des particules élastomères
US8986489B2 (en) * 2009-09-24 2015-03-24 Upm Raflatac Oy Method for attaching labels to items
EP2867022B1 (fr) * 2012-05-30 2018-12-12 Exatec, LLC. Ensemble en matière plastique, procédés de fabrication et d'utilisation associés et articles le comprenant
WO2014047932A1 (fr) * 2012-09-29 2014-04-03 3M Innovative Properties Company Composition adhésive et ruban adhésif
CN109315067B (zh) * 2016-07-04 2019-12-24 株式会社铃木 转印方法以及安装方法
DE102017001696A1 (de) * 2017-02-22 2018-08-23 Lohmann Gmbh & Co. Kg UV-aktivierbares strukturelles Haftklebeband
CN110358484A (zh) * 2019-07-23 2019-10-22 深圳市华星光电技术有限公司 导电胶及其制备方法
DE102022105737A1 (de) 2022-03-11 2023-09-14 Tesa Se Aushärtbare Klebemasse mit verbesserter Stanzbarkeit und verbesserten Schockeigenschaften

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04150974A (ja) * 1990-10-09 1992-05-25 Three Bond Co Ltd 粘着層の形成方法
JPH08146436A (ja) * 1994-11-16 1996-06-07 Ushio Inc 液晶パネルの貼り合わせ方法および装置
JPH1160899A (ja) * 1997-08-19 1999-03-05 Minnesota Mining & Mfg Co <3M> 導電性エポキシ樹脂組成物、異方性導電接着フィルムおよび電気的接続方法
JPH11181391A (ja) * 1997-12-22 1999-07-06 Nippon Kayaku Co Ltd 接着剤組成物、接着体、接着方法及び光ディスクの製造方法
JP2000017242A (ja) * 1998-06-29 2000-01-18 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物、熱圧着性フィルムおよびホットメルト接着剤組成物を用いた接着方法
JP2001007128A (ja) * 1999-04-22 2001-01-12 Sharp Corp 基板間の接続方法及び基板間接続装置

Cited By (11)

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KR100874302B1 (ko) 2005-02-18 2008-12-18 도요 잉키 세이조 가부시끼가이샤 전자파 차폐성 접착필름, 그 제조방법 및 피착체의 전자파차폐방법
JP2007221034A (ja) * 2006-02-20 2007-08-30 Fujitsu Ltd フィルム貼り付け方法、フィルム貼り付け装置および半導体装置の製造方法
JP4514722B2 (ja) * 2006-02-20 2010-07-28 富士通セミコンダクター株式会社 フィルム貼り付け方法、フィルム貼り付け装置および半導体装置の製造方法
JP2011096253A (ja) * 2009-10-30 2011-05-12 Intel Corp 認証されたウィルス対策エージェントにメモリをスキャンするための直接アクセスを提供する方法及び装置
JPWO2011111784A1 (ja) * 2010-03-12 2013-06-27 日立化成株式会社 接着材リール
JP2014037544A (ja) * 2010-03-12 2014-02-27 Hitachi Chemical Co Ltd 接着材リール
JP2016500832A (ja) * 2013-03-28 2016-01-14 エルジー・ケム・リミテッド 両面型偏光板の製造方法およびこれから製造された両面型偏光板
US9726799B2 (en) 2013-03-28 2017-08-08 Lg Chem, Ltd. Method of manufacturing double-sided polarizing plate and double-sided polarizing plate manufactured using the same
JP2017139436A (ja) * 2016-02-04 2017-08-10 毅嘉科技股▲ふん▼有限公司 回路基板構造およびその製造方法
JP2020041045A (ja) * 2018-09-10 2020-03-19 デクセリアルズ株式会社 接着剤組成物
JP7273283B2 (ja) 2018-09-10 2023-05-15 デクセリアルズ株式会社 接着剤組成物

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EP1358291A2 (fr) 2003-11-05
KR100842131B1 (ko) 2008-06-27
ATE301696T1 (de) 2005-08-15
WO2002061010A2 (fr) 2002-08-08
WO2002061010A8 (fr) 2003-12-24
AU2002245342A1 (en) 2002-08-12
CN1505672A (zh) 2004-06-16
WO2002061010A3 (fr) 2002-12-19
DE60205456D1 (de) 2005-09-15
DE60205456T2 (de) 2006-06-01
KR20040030498A (ko) 2004-04-09
EP1358291B1 (fr) 2005-08-10
HK1061406A1 (en) 2004-09-17
CN1252204C (zh) 2006-04-19

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