JP2002204060A5 - - Google Patents

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Publication number
JP2002204060A5
JP2002204060A5 JP2001000117A JP2001000117A JP2002204060A5 JP 2002204060 A5 JP2002204060 A5 JP 2002204060A5 JP 2001000117 A JP2001000117 A JP 2001000117A JP 2001000117 A JP2001000117 A JP 2001000117A JP 2002204060 A5 JP2002204060 A5 JP 2002204060A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001000117A
Other languages
Japanese (ja)
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JP2002204060A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001000117A priority Critical patent/JP2002204060A/ja
Priority claimed from JP2001000117A external-priority patent/JP2002204060A/ja
Publication of JP2002204060A publication Critical patent/JP2002204060A/ja
Publication of JP2002204060A5 publication Critical patent/JP2002204060A5/ja
Pending legal-status Critical Current

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JP2001000117A 2001-01-04 2001-01-04 はんだ付け方法およびフローはんだ付け装置 Pending JP2002204060A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001000117A JP2002204060A (ja) 2001-01-04 2001-01-04 はんだ付け方法およびフローはんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001000117A JP2002204060A (ja) 2001-01-04 2001-01-04 はんだ付け方法およびフローはんだ付け装置

Publications (2)

Publication Number Publication Date
JP2002204060A JP2002204060A (ja) 2002-07-19
JP2002204060A5 true JP2002204060A5 (cg-RX-API-DMAC7.html) 2008-01-24

Family

ID=18868993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001000117A Pending JP2002204060A (ja) 2001-01-04 2001-01-04 はんだ付け方法およびフローはんだ付け装置

Country Status (1)

Country Link
JP (1) JP2002204060A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3867768B2 (ja) 2001-03-16 2007-01-10 セイコーエプソン株式会社 ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置
JP2002290027A (ja) 2001-03-28 2002-10-04 Seiko Epson Corp 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置
JP2014112597A (ja) * 2012-12-05 2014-06-19 Mitsubishi Electric Corp リフローはんだ付け方法およびリフロー炉
CN116782528A (zh) * 2021-11-23 2023-09-19 刘洋 一种复合铝基led印制电路板及其制备工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01154865A (ja) * 1987-12-10 1989-06-16 Tamura Seisakusho Co Ltd はんだ付け装置
JPH09307221A (ja) * 1996-05-15 1997-11-28 Omron Corp フローハンダ装置及び実装基板のハンダ付け方法
JP2000124593A (ja) * 1998-10-21 2000-04-28 Matsushita Electric Ind Co Ltd リフロー装置およびリフロー方法

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