JP2002204060A - はんだ付け方法およびフローはんだ付け装置 - Google Patents

はんだ付け方法およびフローはんだ付け装置

Info

Publication number
JP2002204060A
JP2002204060A JP2001000117A JP2001000117A JP2002204060A JP 2002204060 A JP2002204060 A JP 2002204060A JP 2001000117 A JP2001000117 A JP 2001000117A JP 2001000117 A JP2001000117 A JP 2001000117A JP 2002204060 A JP2002204060 A JP 2002204060A
Authority
JP
Japan
Prior art keywords
substrate
solder material
heating means
heating
jet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001000117A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002204060A5 (cg-RX-API-DMAC7.html
Inventor
Kenichiro Suetsugu
憲一郎 末次
Hideki Yokoyama
秀樹 横山
Kenji Hara
健次 原
Mikiya Nakada
幹也 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001000117A priority Critical patent/JP2002204060A/ja
Publication of JP2002204060A publication Critical patent/JP2002204060A/ja
Publication of JP2002204060A5 publication Critical patent/JP2002204060A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2001000117A 2001-01-04 2001-01-04 はんだ付け方法およびフローはんだ付け装置 Pending JP2002204060A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001000117A JP2002204060A (ja) 2001-01-04 2001-01-04 はんだ付け方法およびフローはんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001000117A JP2002204060A (ja) 2001-01-04 2001-01-04 はんだ付け方法およびフローはんだ付け装置

Publications (2)

Publication Number Publication Date
JP2002204060A true JP2002204060A (ja) 2002-07-19
JP2002204060A5 JP2002204060A5 (cg-RX-API-DMAC7.html) 2008-01-24

Family

ID=18868993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001000117A Pending JP2002204060A (ja) 2001-01-04 2001-01-04 はんだ付け方法およびフローはんだ付け装置

Country Status (1)

Country Link
JP (1) JP2002204060A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6730173B2 (en) 2001-03-28 2004-05-04 Seiko Epson Corporation Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module
US6732907B2 (en) 2001-03-16 2004-05-11 Seiko Epson Corporation Soldering method, soldering device, and method and device of fabricating electronic circuit module
JP2014112597A (ja) * 2012-12-05 2014-06-19 Mitsubishi Electric Corp リフローはんだ付け方法およびリフロー炉
CN116782528A (zh) * 2021-11-23 2023-09-19 刘洋 一种复合铝基led印制电路板及其制备工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01154865A (ja) * 1987-12-10 1989-06-16 Tamura Seisakusho Co Ltd はんだ付け装置
JPH09307221A (ja) * 1996-05-15 1997-11-28 Omron Corp フローハンダ装置及び実装基板のハンダ付け方法
JP2000124593A (ja) * 1998-10-21 2000-04-28 Matsushita Electric Ind Co Ltd リフロー装置およびリフロー方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01154865A (ja) * 1987-12-10 1989-06-16 Tamura Seisakusho Co Ltd はんだ付け装置
JPH09307221A (ja) * 1996-05-15 1997-11-28 Omron Corp フローハンダ装置及び実装基板のハンダ付け方法
JP2000124593A (ja) * 1998-10-21 2000-04-28 Matsushita Electric Ind Co Ltd リフロー装置およびリフロー方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6732907B2 (en) 2001-03-16 2004-05-11 Seiko Epson Corporation Soldering method, soldering device, and method and device of fabricating electronic circuit module
US6730173B2 (en) 2001-03-28 2004-05-04 Seiko Epson Corporation Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module
JP2014112597A (ja) * 2012-12-05 2014-06-19 Mitsubishi Electric Corp リフローはんだ付け方法およびリフロー炉
CN116782528A (zh) * 2021-11-23 2023-09-19 刘洋 一种复合铝基led印制电路板及其制备工艺

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