JP2002141656A5 - - Google Patents

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Publication number
JP2002141656A5
JP2002141656A5 JP2000332749A JP2000332749A JP2002141656A5 JP 2002141656 A5 JP2002141656 A5 JP 2002141656A5 JP 2000332749 A JP2000332749 A JP 2000332749A JP 2000332749 A JP2000332749 A JP 2000332749A JP 2002141656 A5 JP2002141656 A5 JP 2002141656A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000332749A
Other languages
Japanese (ja)
Other versions
JP4577974B2 (ja
JP2002141656A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000332749A priority Critical patent/JP4577974B2/ja
Priority claimed from JP2000332749A external-priority patent/JP4577974B2/ja
Publication of JP2002141656A publication Critical patent/JP2002141656A/ja
Publication of JP2002141656A5 publication Critical patent/JP2002141656A5/ja
Application granted granted Critical
Publication of JP4577974B2 publication Critical patent/JP4577974B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000332749A 2000-10-31 2000-10-31 フローはんだ付け方法および装置 Expired - Fee Related JP4577974B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000332749A JP4577974B2 (ja) 2000-10-31 2000-10-31 フローはんだ付け方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000332749A JP4577974B2 (ja) 2000-10-31 2000-10-31 フローはんだ付け方法および装置

Publications (3)

Publication Number Publication Date
JP2002141656A JP2002141656A (ja) 2002-05-17
JP2002141656A5 true JP2002141656A5 (cg-RX-API-DMAC7.html) 2007-11-01
JP4577974B2 JP4577974B2 (ja) 2010-11-10

Family

ID=18808917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000332749A Expired - Fee Related JP4577974B2 (ja) 2000-10-31 2000-10-31 フローはんだ付け方法および装置

Country Status (1)

Country Link
JP (1) JP4577974B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051671A (ja) * 2001-06-01 2003-02-21 Nec Corp 実装構造体の製造方法および実装構造体
WO2013089568A1 (en) 2011-12-12 2013-06-20 Iif Spółka Akcyjna Method of making payment transaction via cellular telephone system and telecommunication system for conducting payment transactions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3224185B2 (ja) * 1994-09-29 2001-10-29 富士通株式会社 はんだ合金及びはんだ粉末及びはんだペースト及びプリント配線板及び電子部品及びはんだ付け方法及びはんだ付け装置
JP3414263B2 (ja) * 1998-06-04 2003-06-09 株式会社日立製作所 電子回路基板の製造方法
JP2000244108A (ja) * 1999-02-22 2000-09-08 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置

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