JP2002178180A - レーザ加工装置及びレーザ加工方法 - Google Patents
レーザ加工装置及びレーザ加工方法Info
- Publication number
- JP2002178180A JP2002178180A JP2000374502A JP2000374502A JP2002178180A JP 2002178180 A JP2002178180 A JP 2002178180A JP 2000374502 A JP2000374502 A JP 2000374502A JP 2000374502 A JP2000374502 A JP 2000374502A JP 2002178180 A JP2002178180 A JP 2002178180A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- workpiece
- hole
- auxiliary
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract description 11
- 238000003754 machining Methods 0.000 title abstract 2
- 239000011347 resin Substances 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000000919 ceramic Substances 0.000 claims abstract description 45
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000003672 processing method Methods 0.000 claims description 14
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 4
- 239000001569 carbon dioxide Substances 0.000 claims description 4
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 2
- 229920013716 polyethylene resin Polymers 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 10
- 230000008018 melting Effects 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 5
- 238000005553 drilling Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 12
- 230000008016 vaporization Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012768 molten material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000011364 vaporized material Substances 0.000 description 3
- 239000002360 explosive Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000374502A JP2002178180A (ja) | 2000-12-08 | 2000-12-08 | レーザ加工装置及びレーザ加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000374502A JP2002178180A (ja) | 2000-12-08 | 2000-12-08 | レーザ加工装置及びレーザ加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002178180A true JP2002178180A (ja) | 2002-06-25 |
| JP2002178180A5 JP2002178180A5 (enrdf_load_stackoverflow) | 2005-10-27 |
Family
ID=18843682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000374502A Pending JP2002178180A (ja) | 2000-12-08 | 2000-12-08 | レーザ加工装置及びレーザ加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002178180A (enrdf_load_stackoverflow) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004142138A (ja) * | 2002-10-22 | 2004-05-20 | Matsushita Electric Ind Co Ltd | セラミックグリーンシートの穴加工方法 |
| JP2004306136A (ja) * | 2003-03-24 | 2004-11-04 | Tdk Corp | セラミック素子の製造方法 |
| JP2006205544A (ja) * | 2005-01-28 | 2006-08-10 | Kyocera Corp | グリーンシートの加工方法 |
| JP2006270086A (ja) * | 2005-02-25 | 2006-10-05 | Kyocera Corp | 複合グリーンシートの加工方法 |
| JP2008288403A (ja) * | 2007-05-18 | 2008-11-27 | Ngk Spark Plug Co Ltd | セラミック基板の製造方法 |
| US7537667B2 (en) * | 2005-02-25 | 2009-05-26 | Kyocera Corporation | Method of processing composite green sheet |
| JP2009234074A (ja) * | 2008-03-27 | 2009-10-15 | Kyocera Corp | セラミックグリーンシートのレーザー加工方法 |
| CN115156740A (zh) * | 2022-07-29 | 2022-10-11 | 上海泽丰半导体科技有限公司 | 一种生瓷片激光打孔方法 |
| CN118543996A (zh) * | 2024-05-30 | 2024-08-27 | 中南大学 | 一种基于三明治结构的陶瓷材料高品质激光打孔方法 |
-
2000
- 2000-12-08 JP JP2000374502A patent/JP2002178180A/ja active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004142138A (ja) * | 2002-10-22 | 2004-05-20 | Matsushita Electric Ind Co Ltd | セラミックグリーンシートの穴加工方法 |
| JP2004306136A (ja) * | 2003-03-24 | 2004-11-04 | Tdk Corp | セラミック素子の製造方法 |
| JP2006205544A (ja) * | 2005-01-28 | 2006-08-10 | Kyocera Corp | グリーンシートの加工方法 |
| JP2006270086A (ja) * | 2005-02-25 | 2006-10-05 | Kyocera Corp | 複合グリーンシートの加工方法 |
| US7537667B2 (en) * | 2005-02-25 | 2009-05-26 | Kyocera Corporation | Method of processing composite green sheet |
| JP2008288403A (ja) * | 2007-05-18 | 2008-11-27 | Ngk Spark Plug Co Ltd | セラミック基板の製造方法 |
| JP2009234074A (ja) * | 2008-03-27 | 2009-10-15 | Kyocera Corp | セラミックグリーンシートのレーザー加工方法 |
| CN115156740A (zh) * | 2022-07-29 | 2022-10-11 | 上海泽丰半导体科技有限公司 | 一种生瓷片激光打孔方法 |
| CN118543996A (zh) * | 2024-05-30 | 2024-08-27 | 中南大学 | 一种基于三明治结构的陶瓷材料高品质激光打孔方法 |
| CN118543996B (zh) * | 2024-05-30 | 2025-06-24 | 中南大学 | 一种基于三明治结构的陶瓷材料高品质激光打孔方法 |
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Legal Events
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