JP2002176131A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JP2002176131A
JP2002176131A JP2000373669A JP2000373669A JP2002176131A JP 2002176131 A JP2002176131 A JP 2002176131A JP 2000373669 A JP2000373669 A JP 2000373669A JP 2000373669 A JP2000373669 A JP 2000373669A JP 2002176131 A JP2002176131 A JP 2002176131A
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
leads
gap
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000373669A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002176131A5 (enExample
Inventor
Akihiko Kameoka
昭彦 亀岡
Fujio Ito
富士夫 伊藤
Hiromichi Suzuki
博通 鈴木
Takashi Konno
貴史 今野
Ryoichi Ota
亮一 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Hitachi Solutions Technology Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Hitachi Ltd
Hitachi ULSI Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd, Hitachi Ltd, Hitachi ULSI Systems Co Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP2000373669A priority Critical patent/JP2002176131A/ja
Publication of JP2002176131A publication Critical patent/JP2002176131A/ja
Publication of JP2002176131A5 publication Critical patent/JP2002176131A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2000373669A 2000-12-08 2000-12-08 半導体装置の製造方法 Pending JP2002176131A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000373669A JP2002176131A (ja) 2000-12-08 2000-12-08 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000373669A JP2002176131A (ja) 2000-12-08 2000-12-08 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2002176131A true JP2002176131A (ja) 2002-06-21
JP2002176131A5 JP2002176131A5 (enExample) 2008-01-24

Family

ID=18842996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000373669A Pending JP2002176131A (ja) 2000-12-08 2000-12-08 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2002176131A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140000484A1 (en) * 2012-06-28 2014-01-02 Kronos International, Inc. Composite Pigments Comprising Titanium Dioxide and Carbonate and Method for Producing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529527A (ja) * 1991-08-09 1993-02-05 Hitachi Ltd 半導体装置
JPH09312375A (ja) * 1996-03-18 1997-12-02 Hitachi Ltd リードフレーム、半導体装置及び半導体装置の製造方法
JP2000003981A (ja) * 1998-06-12 2000-01-07 Hitachi Ltd 半導体装置およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529527A (ja) * 1991-08-09 1993-02-05 Hitachi Ltd 半導体装置
JPH09312375A (ja) * 1996-03-18 1997-12-02 Hitachi Ltd リードフレーム、半導体装置及び半導体装置の製造方法
JP2000003981A (ja) * 1998-06-12 2000-01-07 Hitachi Ltd 半導体装置およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140000484A1 (en) * 2012-06-28 2014-01-02 Kronos International, Inc. Composite Pigments Comprising Titanium Dioxide and Carbonate and Method for Producing
US8858701B2 (en) * 2012-06-28 2014-10-14 Kronos International, Inc. Composite pigments comprising titanium dioxide and carbonate and method for producing

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