JP2002170802A5 - - Google Patents
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- Publication number
- JP2002170802A5 JP2002170802A5 JP2000307812A JP2000307812A JP2002170802A5 JP 2002170802 A5 JP2002170802 A5 JP 2002170802A5 JP 2000307812 A JP2000307812 A JP 2000307812A JP 2000307812 A JP2000307812 A JP 2000307812A JP 2002170802 A5 JP2002170802 A5 JP 2002170802A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plating
- acid
- peripheral portion
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 118
- 238000004140 cleaning Methods 0.000 claims 29
- 230000002093 peripheral effect Effects 0.000 claims 23
- 239000002253 acid Substances 0.000 claims 22
- 238000007747 plating Methods 0.000 claims 20
- 230000001590 oxidative effect Effects 0.000 claims 18
- 238000000034 method Methods 0.000 claims 17
- 239000007800 oxidant agent Substances 0.000 claims 12
- 239000002184 metal Substances 0.000 claims 11
- 229910052751 metal Inorganic materials 0.000 claims 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 7
- 229910052802 copper Inorganic materials 0.000 claims 7
- 239000010949 copper Substances 0.000 claims 7
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims 2
- WQYVRQLZKVEZGA-UHFFFAOYSA-N hypochlorite Chemical compound Cl[O-] WQYVRQLZKVEZGA-UHFFFAOYSA-N 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 229910017604 nitric acid Inorganic materials 0.000 claims 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 2
- 230000032258 transport Effects 0.000 claims 2
- 238000001465 metallisation Methods 0.000 claims 1
- 235000006408 oxalic acid Nutrition 0.000 claims 1
- 238000005192 partition Methods 0.000 claims 1
- 238000003672 processing method Methods 0.000 claims 1
- 239000001384 succinic acid Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000307812A JP3953265B2 (ja) | 1999-10-06 | 2000-10-06 | 基板洗浄方法及びその装置 |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28541999 | 1999-10-06 | ||
| JP2000007094 | 2000-01-14 | ||
| JP2000-288215 | 2000-09-22 | ||
| JP11-285419 | 2000-09-22 | ||
| JP2000288215 | 2000-09-22 | ||
| JP2000-7094 | 2000-09-22 | ||
| JP2000307812A JP3953265B2 (ja) | 1999-10-06 | 2000-10-06 | 基板洗浄方法及びその装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002170802A JP2002170802A (ja) | 2002-06-14 |
| JP2002170802A5 true JP2002170802A5 (enrdf_load_stackoverflow) | 2005-07-21 |
| JP3953265B2 JP3953265B2 (ja) | 2007-08-08 |
Family
ID=27479373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000307812A Expired - Lifetime JP3953265B2 (ja) | 1999-10-06 | 2000-10-06 | 基板洗浄方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3953265B2 (enrdf_load_stackoverflow) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6498110B2 (en) * | 2001-03-05 | 2002-12-24 | Micron Technology, Inc. | Ruthenium silicide wet etch |
| JP3998426B2 (ja) * | 2001-03-14 | 2007-10-24 | 株式会社荏原製作所 | 基板処理方法 |
| US20060166846A1 (en) * | 2002-08-19 | 2006-07-27 | Ying-Hao Li | Remover solution |
| JP2004303967A (ja) * | 2003-03-31 | 2004-10-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
| US7431040B2 (en) * | 2003-09-30 | 2008-10-07 | Tokyo Electron Limited | Method and apparatus for dispensing a rinse solution on a substrate |
| JP2005327807A (ja) * | 2004-05-12 | 2005-11-24 | Sony Corp | 枚葉式洗浄装置及びその洗浄方法 |
| JP2007150167A (ja) * | 2005-11-30 | 2007-06-14 | Shin Etsu Handotai Co Ltd | 半導体ウエーハの平面研削方法および製造方法 |
| JP4795854B2 (ja) * | 2006-06-05 | 2011-10-19 | 大日本スクリーン製造株式会社 | 基板処理方法および基板処理装置 |
| JP4881262B2 (ja) * | 2006-11-28 | 2012-02-22 | 株式会社荏原製作所 | 基板の表面処理方法 |
| CN101868849B (zh) * | 2007-11-21 | 2012-03-07 | 朗姆研究公司 | 为增强湿法边缘清洁而进行斜面等离子体加工 |
| JP5373367B2 (ja) * | 2008-10-30 | 2013-12-18 | 芝浦メカトロニクス株式会社 | 基板処理装置および基板処理方法 |
| KR101118929B1 (ko) * | 2010-09-13 | 2012-02-27 | 주성엔지니어링(주) | 박막형 태양전지의 제조 장치 및 제조 방법 |
| JP6815799B2 (ja) * | 2016-09-13 | 2021-01-20 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP6971699B2 (ja) * | 2017-08-07 | 2021-11-24 | 東京エレクトロン株式会社 | 基板処理方法、記憶媒体および基板処理装置 |
| JP7034645B2 (ja) * | 2017-09-22 | 2022-03-14 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
| JP7441620B2 (ja) * | 2019-08-29 | 2024-03-01 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法 |
| KR20230042312A (ko) * | 2020-07-28 | 2023-03-28 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 처리 방법 |
| TW202435303A (zh) * | 2023-02-22 | 2024-09-01 | 日商Ｓｕｍｃｏ股份有限公司 | 半導體晶圓的洗淨方法、半導體晶圓的製造方法及半導體晶圓 |
-
2000
- 2000-10-06 JP JP2000307812A patent/JP3953265B2/ja not_active Expired - Lifetime
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