JP2002151827A - Laser-machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an inexpensive laser-machining device, realizing space saving. SOLUTION: A substrate-carrying supply section 1, a laser processing machine 3, and a substrate-carrying recovery section 2 are aligned nearly in a straight line fixedly along the direction of an arrow Y. A positioning device 21 can be moved along the direction of an arrow X between the position of the rear (X direction (forward direction)) of the substrate-carrying supply section 1 and a position directly above a supply truck 8. Also, a setting error bucket 18 can be moved along the direction of the arrow X, between the rear (same) position of the substrate-carrying recovery section 2 and a position directly above a recovery truck 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for laser processing a blind hole or the like in a printed circuit board (hereinafter abbreviated as a substrate), and more particularly, to a substrate positioning portion for positioning a substrate and a positioning state. The present invention relates to an improvement in a laser processing apparatus having an unprocessed substrate collection unit in which a substrate determined to be abnormal is disposed.

[0002]

2. Description of the Related Art When drilling a substrate used for electric wiring or the like, a machining device such as a drill machine has conventionally been used. In recent years, a device using this substrate has been reduced in size and power consumption has been reduced. As a result of the demand for higher processing speeds and the like, as the density of wiring progresses, the hole diameter to be processed becomes extremely fine, for example, a diameter of 0.3 mm or less. It's getting harder. In addition, due to the increase in the number of circuit layers, blind hole processing (BVH: blind via hole), which requires high precision, is increasing, and processing methods such as etching and photo via are increasing in place of drill machines.

[0003] However, a method of processing such as etching and photo-via requires a mask or a mold corresponding to a circuit pattern or the like to be processed, and is not suitable for large-scale small-quantity production.
For this reason, the chances of using a laser processing apparatus using a laser beam which is suitable for high-precision fine processing and small-lot production of various kinds are increasing.

Here, a basic configuration of the laser processing apparatus will be described with reference to FIGS. 6 and 7. FIG. In addition,
FIG. 6 is a front view showing a configuration of an example of a laser processing apparatus.
7 is a plan view of the laser processing apparatus shown in FIG.

The laser processing apparatus includes a substrate loading / supplying unit 1 on which a substrate 16 to be processed is loaded, a substrate loading / recovering unit 2 on which a processed substrate 16 is loaded, and a laser processing for laser processing the substrate 16. Machine (laser processing unit) 3, positioning station (substrate positioning unit) 4 for positioning substrate 16 before processing, set-mis station for collecting substrates 16 collected without laser processing because positioning state is not normal (Unprocessed substrate collecting unit) 5, loaders 6 and unloaders 7, which are devices (transporting means) for transferring the substrate 16 to each unit, a supply truck 8 provided in the substrate loading and supplying unit 1, and a substrate loading and collecting unit 2. Guide rail 10, which guides the traveling drive device 14 of the recovered cart 9, the loader 6 and the unloader 7, the loader 6 and the unloader 7.
, A suction cylinder 11 for sucking a substrate 16, a cylinder 13 with a guide for raising and lowering the frame 12, an XY table 15 provided in the laser beam machine 3, and a set misstation 5. Set miss bucket 17, positioning station 4
The substrate stoppers 18a and 18b provided on the positioning device 21 with the two orthogonal edges of the substrate 16 abutting on the two sides XY orthogonal to each other, the positioning pins 19a contacting the other edges of the substrate 16, 19b, rodless cylinders 20a and 20b for moving the positioning pins 19a and 19b in the X and Y directions, respectively, and installed behind the laser beam machine 3 (in the depth direction in FIG. 6, in the X direction (positive direction in FIG. 7)). Laser oscillator 22 and optical path 2 for transmitting a laser beam emitted from laser oscillator 22
3, a processing head 24 having an optical system for condensing the laser beam transmitted from the optical path 23 and irradiating the substrate 16 with the laser beam
Is provided.

Although not shown in each figure,
For example, as disclosed in Japanese Unexamined Patent Application Publication No. 10-328863 ("laser processing apparatus"), the position of the uppermost surface of a number of substrates 16 loaded on the supply truck 8 in the vertical direction is detected, and this uppermost surface is always detected. The lifter mechanism for vertically moving the entire loading substrate 16 so that the vertical position of the
It is provided on a supply truck 8 of the substrate loading supply unit 1. This is to make the vertical stroke of the guide-cylinder 13 constant so as to ensure the suction of the substrate 16 loaded on the uppermost stage among the loaded substrates 16.

Further, the supply carriage 8 is equipped with a guide bar or the like that can move according to the size of the substrate 16.
This is to roughly position the loading substrate 16 in order to prevent the load of the substrate 16 from collapsing.

Next, the operation of the laser processing apparatus will be described. First, the guide cylinder 13 of the loader 6 extends, and the frame 12 fixed to one end of the guide cylinder 13 descends. When the frame 12 is lowered by a predetermined stroke, the suction pad 11 provided at the lower portion of the frame 12 causes the suction pad 11 provided at the lower part of the frame 16 to move the substrate 16 arranged on the uppermost stage among the substrates 16 loaded on the supply cart 8 to the suction pad 11. Adsorbed.

Next, the guide-equipped cylinder 13 contracts and the frame 12 rises, whereby the uppermost substrate 16 sucked by the suction pad 11 is separated from the other substrates 16 and lifted upward. . Furthermore, the traveling drive device 1
As the 4 moves along the rail 10 to the left in the figure, the substrate 16 sucked by the suction pad 11 is transported to the positioning station 4. Positioning station 4
Then, the sucked substrate 16 is lowered onto the positioning device 21 by the extension operation of the guide cylinder 13, and the substrate 16 is released from the restraint of the suction pad 11 by the suction release operation of the suction pad 11.

Next, the X of the rodless cylinder 20a is
By the movement operation in the direction (negative direction) and the movement operation of the rodless cylinder 20b in the Y direction (negative direction), the rodless cylinders 20a and 20b respectively position the positioning pins 19a in the X direction (negative direction). Pin 19b
Is moved in the Y direction (negative direction). Further, each of the positioning pins 19a and 19b pushes two orthogonal edges of the substrate 16 dropped on the positioning device 21 in the moving direction, and pushes the substrate 16 except for the edge pressed by the positioning pins 19b. The substrate 16 is moved until the edges come into contact with the substrate stoppers 18a and 18b, respectively, and the substrate 16 is roughly positioned. The substrate 16 has a thickness of 0.3 mm to 3.0 m.
Approximately m, length (Y direction) 300 mm x width (X direction) 300
A size of about 515 mm × width 650 mm is generally used.

The positioning device 2 of the positioning station 4
The substrate 16 roughly positioned by 1
Is transferred from the positioning station 4 to the XY table 15 of the laser beam machine 3 by the same operation as that of the laser processing machine 3.

Here, the substrate 16 placed on the XY table 15 passes through a large number of minute suction holes (not shown) formed in the XY table 15 so that the XY table 1
The air is sucked and fixed on the XY table 15 by sucking air from the lower part of the XY table 15, or is fixed on the XY table 15 by fixing means such as a clamp (both not shown). The positioning station 4 and the XY table 1
5, since their XY positional relationships correspond to each other,
Substrate 1 positioned at positioning station 4
6 has an edge contacting the substrate stoppers 18a and 18b,
It is always fixed at a substantially constant position on the XY table 15.

A laser processing machine 3 applies a processing head 2 to a substrate 16 fixed at a fixed position on an XY table 15.
The focused laser beam emitted from 4 is irradiated, and desired laser processing such as the above-described blind hole processing is performed. The substrate 16 on which the laser processing has been completed normally is conveyed from the XY table 15 onto the collection carriage 9 of the substrate loading and collecting unit 2 by the unloader 7 having the same operation as the loader 6, and
The substrate 16 is loaded on the collection trolley 9, and the normal transport and laser processing operations are completed.

By the way, in the laser beam machine 3, before processing the substrate 16 mounted on the XY table 15, an alignment mark previously printed on the substrate is printed by a vision sensor or the like (not shown). After reading and performing high-precision position correction of the machining program,
Laser processing is performed. However, if the mark cannot be read due to printing errors of the alignment mark or adhesion of scratches or dust, laser processing cannot be performed. Such a substrate 16 is referred to as a mis-set product, and the mis-set product is withdrawn from the laser processing machine 3 without being processed. Such a mis-set product is regarded as a normally processed product. Similarly, when placed on the substrate stacking and collecting section 2, a normally processed product and an unprocessed article are mixedly stacked on the substrate stacking and collecting section 2, and extra work is required for subsequent discrimination and sorting.

Therefore, the laser processing machine 3 determines the substrate 16 that has not been processed because it cannot be positioned with high accuracy, and outputs a command corresponding to the result of the determination. It is configured to perform the operation of placing the product on the set miss bucket 17 of the set miss station 5 without loading the data on the set miss station 5. In addition, set miss bucket 1
Reference numeral 7 denotes a drawer type or the like, which is configured to be able to be separated from the normally processed substrate 16 and collected.

The recovery cart 9 is also provided with a lifter mechanism (not shown) similar to the above-described supply cart 8, so that the uppermost substrate upper surface position does not change regardless of the number of substrates 16 loaded. It is configured as follows.

By continuously performing the above operations, automatic transfer and automatic processing of the substrate are performed. The significance of providing the above-described substrate positioning section (positioning station) in the laser processing apparatus will be described below.

On the supply truck 8 in the substrate loading / supplying unit 1, the relative position of the substrate 16 with respect to the truck 8 may be deviated due to the collapse of the loaded substrate 16. This may be caused by positioning bars or the like provided on the truck. Cannot be prevented with high accuracy. When the substrate 16 loaded on the substrate loading / supplying unit 1 is pulled up by the loader 6,
A substrate, such as a vibrator, that is provided to facilitate the separation of the substrate due to the close contact between the substrates, which causes the substrate located below the substrate to be pulled to move together with the pulled substrate and cause the substrate to be separated by the close contact. The dropped substrate may be collapsed by the vibration of the separating means.

When the substrate 16 collapsed in this way is transported as it is onto the XY table 15 of the laser beam machine 3, a large variation occurs in the positional relationship of the substrate 16 on the XY table 15, and the positional relationship between the substrate 16 and the vision sensor becomes large. It may come off. That is, since the imaging range of the vision camera is generally about 4 to 5 mm, the vision camera cannot catch the alignment mark of the substrate 16 that is displaced by about 10 to 20 mm in the supply carriage 8. Therefore, it is necessary to provide a positioning portion for positioning in order to suppress this positional deviation within a range of about 0.5 to 2 mm.

However, since the supply trolley 8 and the positioning section perform positioning with reference to the edge of the substrate 16, there is an error between the reference edge and the position where the alignment mark is marked. It is necessary to absorb and correct this error by the alignment by the vision sensor. Note that a vision sensor is used to perform laser drilling on a substrate on which a fine wiring pattern or the like is formed.
High-precision position correction of about mm is required, and has already been put to practical use with this accuracy.

[0021]

As described above, the conventional laser processing apparatus has a very large length in the width direction as a whole, so that a large installation space must be secured. In particular, recently, in order to process a large number of substrates, the number of cases in which a plurality of laser processing apparatuses are simultaneously introduced has been increasing, and the problem of the installation space has become a serious situation.

In addition, since this laser processing apparatus is often installed in an expensive air-conditioning room with limited space, even if it is desired to increase the number of installed laser processing apparatuses, the above-described space problem causes a problem. In some cases, a desired number of laser processing apparatuses cannot be introduced, and from this point, a laser processing apparatus with high space efficiency has been desired. Further, a processing apparatus having a large installation space requires a large amount of material, and thus has a problem that it is expensive.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a laser processing apparatus which realizes space saving and is inexpensive.

[0024]

In order to achieve the above object, a laser processing apparatus according to the present invention comprises a substrate supply section on which a supplied substrate to be processed is provided, and a substrate for positioning the provided substrate. A laser processing apparatus comprising: a positioning unit, a laser processing unit that performs laser processing on the positioned substrate, a substrate collection unit in which a substrate that has exited from the laser processing unit is disposed, and a transport unit that transports the substrate to each unit. The substrate supply unit, the laser processing unit and the substrate recovery unit, the substrate positioning unit provided so as to be movable between a position retracted from a substantially straight line and a position on the straight line, A positioning unit moving means for moving between the retracted position and the position on the straight line is provided.

According to the laser processing apparatus of the present invention, the substrate supply section, the laser processing section, and the substrate recovery section are disposed substantially in a straight line, but the substrate positioning section includes the substrate supply section, the laser processing section, and the substrate collection section. It is disposed at a position retreated from the straight line on which the collecting units are arranged, that is, at a position deviating from the straight line, and only when necessary for positioning the substrate, the position on the straight line is determined by the positioning unit moving means. Since it will be moved to work, as before,
The substrate supply unit, the substrate positioning unit, the laser processing unit, and the substrate collection unit are not always arranged in a straight line, and avoid a configuration that extends only in one direction, thereby reducing the installation space of the entire apparatus. be able to.

The "position on the straight line" at which the substrate positioning section is movable is, specifically, a straight line on which the substrate supply section, the laser processing section, and the substrate collection section are arranged. The position within the range up to the collection unit is referred to, and the position retracted from this straight line specifically refers to the position retracted in the direction orthogonal to this straight line from the above-mentioned "position on the straight line". .

[0027] In the laser processing apparatus according to the next invention, in the above invention, the position on the straight line at which the substrate positioning unit is moved is determined by the substrate supply unit and the transfer unit transferring the substrate from the substrate supply unit. The positioning unit moving unit is a space position between the substrate positioning unit and the substrate positioning unit. It is characterized by being moved to a position on a line.

According to the laser processing apparatus of the present invention, the substrate positioning section is moved to the retracted position except during the operation of positioning the substrate, so that the installation space of the entire apparatus can be made compact. When the transfer means pulls the substrate upward from the substrate supply section before the substrate positioning operation, the space between the position where the substrate is pulled up by the positioning section moving means and the substrate supply section is moved by the positioning section moving means. By moving the substrate, the substrate can be lowered as it is to perform the positioning operation of the substrate, and the positioning operation of the substrate is not spoiled.

In the laser processing apparatus according to the next invention, in the above-mentioned invention, the laser processing section determines whether the positioning state of the positioned substrate is correct or not prior to the laser processing, and determines whether the substrate is determined to be normal. Only the laser processing is performed, and the substrate recovery unit is configured to arrange the laser-processed substrate among the substrates retreated from the laser processing unit, and to perform the substrate (setting) of the retired substrates whose positioning state is determined to be abnormal. An unprocessed substrate collection unit (set miss bucket) movably provided between a position retracted from the straight line and a position on the straight line on which the mistaken product is disposed;
The apparatus further comprises a collection unit moving unit that moves the unprocessed substrate collection unit between the retracted position and the position on the straight line.

According to the laser processing apparatus of the present invention, the substrate supply section, the laser processing section, and the substrate recovery section are arranged substantially in a straight line. The mis-bucket is also located at a position retracted from the straight line on which the substrate supply unit, the laser processing unit, and the substrate collection unit are arranged, that is, a position deviated from the straight line, and is necessary for collecting mis-set products. Only in the case of the above, since the operation is performed by being moved to the position on this straight line by the recovery unit moving means, the substrate supply unit, the substrate positioning unit, the laser processing unit, the unprocessed substrate recovery unit, and the substrate The collecting unit is not always arranged in a straight line, but avoids a configuration that extends only in one direction, and the installation space of the entire device can be made compact. .

In the laser processing apparatus according to the next invention, in the above invention, the position on the straight line where the unprocessed substrate collecting section is moved is a spatial position above the substrate collecting section, The means moves the unprocessed substrate recovery unit to the position on the straight line when the substrate whose positioning state is determined to be abnormal is in a state of being withdrawn from the laser processing unit. is there.

According to the laser processing apparatus of the present invention, the unprocessed substrate recovery section is moved to the retracted position as described above except during the operation of recovering a set error product, so that the installation space of the entire apparatus is reduced. When the substrate whose positioning state is determined to be abnormal before the collecting operation of the unprocessed substrate is in a state of being withdrawn from the laser processing unit, the unprocessed substrate collecting unit is moved by the collecting unit moving means. The unprocessed substrate can be recovered by moving to the position on the straight line (the position above the substrate recovery unit),
The operation of collecting the unprocessed substrate is not impaired.

In the laser processing apparatus according to the next invention, in the above invention, the position on the straight line where the unprocessed substrate collecting section is moved is a spatial position above the substrate supply section, and The means moves the unprocessed substrate recovery unit to the position on the straight line when the substrate whose positioning state is determined to be abnormal is in a state of being withdrawn from the laser processing unit. is there.

According to the laser processing apparatus of the present invention, the unprocessed substrate recovery section is moved to the retracted position as described above except during the operation of recovering a set error product, so that the installation space of the entire apparatus is reduced. When the substrate whose positioning state is determined to be abnormal before the collecting operation of the unprocessed substrate is in a state of being withdrawn from the laser processing unit, the unprocessed substrate collecting unit is moved by the collecting unit moving means. The unprocessed substrate can be recovered by moving to the position on the straight line (the position above the substrate supply unit),
The operation of collecting the unprocessed substrate is not impaired.

Since the recovered unprocessed substrate is placed in the unprocessed substrate recovery section moved above the substrate supply section, the unprocessed substrate is processed by the same operation as supplying the substrate from the substrate supply section. The unprocessed substrate can be supplied again from the collection unit, and the operation of transferring the unprocessed substrate from the unprocessed substrate collection unit to the substrate supply unit for re-feeding the unprocessed substrate for laser processing can be omitted. It also has the effect.

A laser processing apparatus according to the next invention is a substrate supply section on which a supplied substrate to be processed is disposed, which determines whether the supplied substrate is in a correct positioning state, and determines only the substrate determined to be normal. A laser processing unit for performing laser processing, a substrate recovery unit in which a laser-processed substrate among the substrates retreated from the laser processing unit is disposed, and a substrate in which the positioning state is determined to be abnormal among the retreated substrates is disposed. A laser processing apparatus provided with an unprocessed substrate collecting section and a transfer means for transferring the substrate to the respective sections, and retreats from a substantially straight line on which the substrate supply section, the laser processing section and the substrate collecting section are disposed. The unprocessed substrate collection unit is provided movably between the position and the position on the straight line,
A recovery unit moving means for moving between the retracted position and the position on the straight line is provided.

According to the laser processing apparatus of the present invention, the substrate supply section, the laser processing section, and the substrate recovery section are arranged substantially in a straight line.
The laser processing unit and the substrate recovery unit are disposed at a position retracted from the straight line, that is, a position deviated from the straight line, and only when necessary to collect the unprocessed substrate, the recovery unit moving means. Since the substrate supply unit, the laser processing unit, the unprocessed substrate collection unit, and the substrate collection unit are not always arranged in a straight line as in the related art, By avoiding a configuration extending only in one direction, the installation space of the entire apparatus can be made compact.

In the laser processing apparatus according to the next invention, in the above-mentioned invention, the position on the straight line where the unprocessed substrate collecting section is moved is a spatial position above the substrate collecting section, and the collecting section moving means Is characterized in that, when the substrate whose positioning state is determined to be abnormal is in a state of being withdrawn from the laser processing unit, the unprocessed substrate collection unit is moved to the position on the straight line. It is assumed that.

According to the laser processing apparatus of the present invention, the unprocessed substrate recovery section is moved to the retracted position as described above except during the operation of recovering a set error product, so that the installation space of the entire apparatus is reduced. When the substrate whose positioning state is determined to be abnormal before the collecting operation of the unprocessed substrate is in a state of being withdrawn from the laser processing unit, the unprocessed substrate collecting unit is moved by the collecting unit moving means. The unprocessed substrate can be recovered by moving to the position on the straight line (the position above the substrate recovery unit),
The operation of collecting the unprocessed substrate is not impaired.

In the laser processing apparatus according to the next invention, in the above invention, the position on the straight line where the unprocessed substrate collecting section is moved is a spatial position above the substrate supply section, The means moves the unprocessed substrate collection unit to the position on the straight line when the substrate whose positioning state is determined to be abnormal is in a state of withdrawing from the laser processing unit. It is assumed that.

According to the laser processing apparatus of the present invention, the unprocessed substrate recovery section is moved to the retracted position as described above except during the operation of recovering a set error product, so that the installation space of the entire apparatus is reduced. When the substrate whose positioning state is determined to be abnormal before the collecting operation of the unprocessed substrate is in a state of being withdrawn from the laser processing unit, the unprocessed substrate collecting unit is moved by the collecting unit moving means. The unprocessed substrate can be recovered by moving to the position on the straight line (the position above the substrate supply unit),
The operation of collecting the unprocessed substrate is not impaired.

Since the recovered unprocessed substrate is placed in the unprocessed substrate recovery section moved above the substrate supply section, the same operation as supplying the substrate from the substrate supply section is performed. The unprocessed substrate can be supplied again from the collection unit, and the operation of transferring the unprocessed substrate from the unprocessed substrate collection unit to the substrate supply unit for re-feeding the unprocessed substrate for laser processing can be omitted. , Also has the effect of.

[0043]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of a laser processing apparatus according to the present invention will be described in detail with reference to the drawings.

Embodiment 1 1 to 3 are diagrams showing a schematic configuration of a laser processing apparatus according to a first embodiment of the present invention. FIG. 1 is a front view, FIG. 2 is a plan view, and FIG. 3 is a side view.

The laser processing apparatus includes a substrate loading / supplying unit 1 on which the substrate 16 to be processed is loaded, a substrate loading / recovering unit 2 on which the processed substrate 16 is loaded, and laser processing for laser processing the substrate 16. (Laser processing unit) 3, movable positioning device (substrate positioning unit) 21 for positioning substrate 16 before processing, substrate 1 recovered without laser processing because positioning state is not normal
A movable set miss bucket (unprocessed substrate collecting unit) 17 for collecting the substrate 6, a loader 6 and an unloader 7, which are devices (transporting means) for transporting the substrate 16 to each unit;
A supply trolley 8 provided in the substrate loading / supplying unit 1, a collection trolley 9 provided in the substrate loading / collecting unit 2, a guide rail 10 for guiding a traveling drive device 14 of the loader 6 and the unloader 7,
A suction pad 11 attached to the lower part of the frame 12 of the loader 6 and the unloader 7 for sucking the substrate 16; a guide cylinder 13 for raising and lowering the frame 12;
The XY table 15 provided on the laser beam machine 3, the substrate stoppers 18 a and 18 b provided on the positioning device 21, where two orthogonal edges of the substrate 16 abut against two mutually orthogonal sides XY, respectively. Positioning pins 19a, 19b, abutting against other edges, positioning pins 19
rodless cylinders 20a and 20b for moving a and 19b in the X and Y directions, respectively, and a laser oscillator 22 installed behind the laser beam machine 3 (in the depth direction in FIG. 1 and in the X direction (positive direction) in FIG. 2). , Laser oscillator 2
2, an optical path 23 for transmitting the laser beam emitted from the optical path 2, a processing head 24 having an optical system for condensing the laser beam transmitted from the optical path 23 and irradiating the substrate 16 with the optical path 23, behind the supply cart 8 of the substrate loading / supplying unit 1 ( Positioning for moving the positioning device 21 between the position in the depth direction in FIG. 1 and the position in the X direction (positive direction in FIG. 2) and the position directly above the supply truck 8 (the spatial position between the supply truck 8 and the loader 6). Device moving means 2
5a, 25b, the position behind the collection trolley 9 of the substrate loading and collecting unit 2 (in the depth direction in FIG. 1, in the X direction (positive direction) in FIG. 2) and the position directly above the collection trolley 9 (between the collection trolley 9 and the unloader 7). Set miss bucket moving means 26 for moving the set miss bucket 17 to / from the (space position)
a, 26b.

Here, the substrate loading / supplying section 1, the laser processing machine 3, and the substrate loading / recovering section 2 are fixedly arranged substantially in a straight line along the arrow Y direction as shown in the figure. On the other hand, as shown in FIG. 2, the positioning device 21 is located behind the substrate stacking / supplying unit 1 (in the depth direction in FIG.
In the X direction (positive direction)) and the substrate loading / supplying unit 1
Between the position immediately above the supply truck 8 along the direction of the arrow X.
Is an arrow X direction between a position (in the depth direction in FIG. 1, in the X direction (positive direction) in FIG. 2) of the substrate loading and collecting unit 2 and a position directly above the collection cart 9 of the substrate loading and collecting unit 2. In this manner, the positioning device 21 and the set-mistake bucket 17 can be moved in a straight line except that the substrate loading / supplying unit 1, the laser processing machine 3, and the substrate loading / recovering unit 2 are lined up except during operation. By adopting a configuration arranged at a position off the line (retreat position (rearward position)), the substrate loading / supplying unit 1, the substrate positioning unit (the substrate positioning device 21 or the substrate positioning station), the laser processing machine 3, Unprocessed substrate recovery unit (set miss bucket 17 or set miss station) and substrate loading recovery unit 2
Compared to a conventional laser processing apparatus (for example) shown in FIGS. 6 and 7 which is always arranged in a straight line, it is possible to avoid a configuration extending in one direction (the direction along the arrow Y direction). Space saving is achieved, which contributes to reduction of manufacturing cost.

Although not shown in each of the above drawings, the upper and lower positions of the uppermost surface of a number of substrates 16 loaded on the supply cart 8 are detected, and the upper and lower positions of the uppermost surface are always constant. A lifter mechanism for vertically moving the entire loading substrate 16 is provided on the supply truck 8 of the substrate loading / supplying unit 1. Further, the supply cart 8 is provided with a guide bar or the like that can move according to the size of the substrate 16.

Next, the operation of the laser processing apparatus according to this embodiment will be described. First, in the initial state, the positioning device 21 is retracted to a position behind the supply cart 8 and the loader 6 by the positioning device moving means 25a and 25b. Next, the guide cylinder 13 of the loader 6 extends, and the frame 12 fixed to one end of the guide cylinder 13 descends. When the frame 12 is lowered by a predetermined stroke, the suction pad 11 provided at the lower portion of the frame 12 causes the suction pad 11 provided at the lower part of the frame 12 to move the substrate 16 arranged at the uppermost stage of the substrates 16 loaded on the supply carriage 8 to the suction pad 11. Is adsorbed.

Then, the guide cylinder 13 contracts and the frame 12 rises, whereby the uppermost substrate 16 sucked by the suction pad 11 is separated from the other substrates 16 and pulled upward. . Here, the positioning device 21 is moved by the positioning device moving means 25a and 25b.
From the rear position of the supply cart 8 and the loader 6, the front (see FIG.
Is moved in the X direction (negative direction), and stops at a spatial position between the supply cart 8 and the loader 6.

Thereafter, the guide-equipped cylinder 1 of the loader 6
3 extends to an intermediate position, the sucked substrate 16 descends, is placed on the positioning device 21, and the suction pad 11
The substrate 16 is released from the restraint of the suction pad 11 by the suction releasing operation.

Next, the X of the rodless cylinder 20a is
Movement in the direction (negative direction) and rodless cylinder 2
0b in the Y direction (negative direction) causes the rodless cylinders 20a and 20b to
9a is moved in the X direction (negative direction), and the positioning pin 19b is moved in the Y direction (negative direction). Furthermore, each positioning pin 1
9a and 19b respectively push two orthogonal edges of the substrate 16 dropped on the positioning device 21 in the moving direction, and push the substrate 16 to the substrate stopper except for the edge pressed by the positioning pins 19b. The substrate 16 is moved until it comes into contact with each of the substrates 18a and 18b, and the substrate 16 is roughly positioned. The substrate 16 has a thickness of about 0.3 mm to 3.0 mm and a length (Y direction) of 300 mm × width (X direction) of 300 mm.
A size of about 515 mm long × 650 mm wide is common.

The positioning device 2 of the positioning station 4
1, the substrate 16 roughly positioned by the loader 6
Is sucked and raised again by the suction and the lift by the rail, and guided by the rail 10 to the positioning station 4.
Is transferred onto the XY table 15 of the laser beam machine 3.

During the transportation, the positioning device 21 is returned to the original position, that is, the position behind the supply cart 8 and the loader 6 by the positioning device moving means 25a and 25b, and stopped.

The substrate 16 placed on the XY table 15
Is sucked and fixed on the XY table 15 by sucking air from the lower part of the XY table 15 through a number of minute suction holes (not shown) formed in the XY table 15, or by a fixing means such as a clamp. It is fixed on the XY table 15 (neither is shown). Since the positioning device 21 and the XY table 15 correspond to each other in the XY positional relationship, the positioning device 2 and the XY table 15 correspond to each other.
The substrate 16 positioned at 1 is the substrate stopper 1
The edges abutting on 8a and 18b are always fixed at a substantially constant position on the XY table 15.

As described above, with respect to the substrate 16 fixed at a fixed position on the XY table 15, the laser processing machine 3
The condensed laser beam emitted from the processing head 24 is irradiated, and desired laser processing such as the above-described blind hole processing is performed. At this time, the set miss bucket 17 is retracted by the set miss bucket moving means 26a, 26b to a position behind the collection cart 9 and the unloader 7 (in the depth direction in FIG. 1, in the direction of the arrow X in FIG. 2 (forward direction)). Has become.

The substrate 16 on which the laser processing has been completed normally
The unloader 7 similar to the loader 6 conveys and moves from the XY table 15 onto the collection trolley 9 of the substrate stacking / collection unit 2, and the substrate 16 is loaded on the collection trolley 9, and normal conveyance and laser processing operations are performed. Complete.

When a setting error occurs in the laser processing machine 3, the laser processing machine 3 informs the set error bucket moving means 26a, 26b and the unloader 7 of the occurrence of the setting error without processing the substrate 16. Command. As a result, the unloader 7 goes to attract the unprocessed substrate 16 to the laser processing machine 3, and the set-mis bucket moving means 26a, 26b moves forward from the rear position where the set-mis bucket 17 is retracted, and is collected. It is advanced to a position between the carriage 9 and the unloader 7 and stopped.

On the other hand, the unloader 7 sucks and transports the unprocessed substrate (set error product) 16 in the laser processing machine 3, and replaces the transported unprocessed substrate 16 on the collection carriage 9. Is thrown into the set miss bucket 17 stopped above the collection cart 9. The set miss bucket 17 on which the unprocessed substrate 16 is placed is returned to the original retracted position by the set miss bucket moving means 26a, 26b.

As described above, in the laser processing apparatus according to the first embodiment, the positioning device 21 controls the supply carriage 8 of the substrate stacking supply unit 1 from the rear position every time positioning is performed before processing each substrate 16. Only when an incorrectly set product occurs, the set-mistake bucket 17 moves in and out of the collection cart 9 from the rear position in a shuttle-like manner in accordance with a command from the laser processing machine 3, and a series of The operations of transport, positioning, processing and collection are performed continuously,
Automatic processing and transport of the substrate are performed.

As shown, the substrate loading / supplying unit 1, the laser processing machine 3, and the substrate loading / recovering unit 2 are fixedly arranged substantially in a straight line along the arrow Y direction, while being positioned. As shown in FIG. 2, the apparatus 21 is located at a position rearward (in the depth direction in FIG. 1, in the X direction (positive direction) in FIG. 1) of the substrate stacking supply unit 1 and at a position directly above the supply cart 8 of the substrate stacking supply unit 1. And the set-mistake bucket 17 is located rearward of the substrate stacking and collecting unit 2 (in the depth direction in FIG.
Between the position in the X direction (positive direction) and the position immediately above the collection trolley 9 of the substrate stacking and collecting section 2 along the arrow X direction. 21 and the set miss bucket 17, except during operation,
Since the substrate loading / supplying unit 1, the laser processing machine 3, and the substrate loading / unloading unit 2 are arranged at positions off the straight line (retreat position (rearward position)), the substrate loading / supplying unit 1, the substrate positioning unit (substrate) Positioning device 21 or substrate positioning station), laser processing machine 3, unprocessed substrate collection unit (set miss bucket 17 or set miss station)
And a conventional laser processing apparatus in which the substrate loading and collecting unit 2 is always arranged in a straight line (for example, see FIGS. 6 and 7).
As compared with the configuration described above, it is possible to avoid a configuration that extends in one direction (the direction along the arrow Y direction), thereby saving space and contributing to a reduction in manufacturing cost.

The stroke of the guide cylinder 13 of the unloader 7 does not need to be two-stage as in the case of the loader 6, but may be any as long as it stops only at two positions, the upper end and the lower end. When placing the unprocessed substrate 16 on the set miss bucket 17, the suction may be released at the upper end position and the substrate 16 may be dropped into the set miss bucket 17. Needless to say, the collection of the mis-set product is performed in a state where the mis-set bucket 17 is moved on the collection cart 9.

In this laser processing apparatus, the supply truck 8 is provided in the substrate loading / supplying section 1 and the collection carriage 9 is provided in the substrate loading / recovering section 2.
However, in place of these carts, a direct-type receiving container such as a cassette or a tray may be used.

Further, although the positioning device 21 has been described as having a configuration in which the substrate 16 is positioned between the substrate stoppers 18a and 18b and the positioning pins 19a and 19b, the positioning device 21 is not limited to this configuration. The laser processing machine 3 may use XY for holding and moving the substrate.
The configuration has a table 15, but instead of this configuration, a fixed table is applied, and
May be applied, and the same effects as those of the laser processing apparatus according to the present invention can be obtained regardless of which configuration is applied.

Embodiment 2 4 and 5 are diagrams showing a schematic configuration of a laser processing apparatus according to a second embodiment of the present invention. FIG. 4 is a plan view, and FIG. 5 is a side view. The illustrated laser processing apparatus is the same as the laser processing apparatus according to the first embodiment shown in FIGS. 1 to 3, except that the set miss bucket 17 is arranged behind the collection cart 9, and the supply cart together with the positioning device 21. 8 is a laser processing apparatus having a configuration disposed at the back of the apparatus. In the drawings, the same or corresponding portions as those in the configuration of the laser processing apparatus of the first embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals, and description thereof will be omitted.

As described above, in the laser processing apparatus according to the second embodiment, the set miss bucket 17 is located behind the substrate stacking / supplying unit 1 (in the X direction (positive direction in FIG. 4)) as in the positioning apparatus 21. Between the position and the position immediately above the supply cart 8 of the substrate stacking supply unit 1, the positioning device 21 and the set miss bucket arranged at the back of the supply cart 8 so as to be movable along the arrow X direction. 17 is further provided with a positioning device and a set miss bucket up / down switching means 27 for vertically moving them and separately moving them on the supply truck 8 ahead.

Next, the operation of the laser processing apparatus according to this embodiment will be described. Supply cart 8 of substrate loading supply unit 1
Has a lifter mechanism for vertically moving the loaded substrate 16 so that the loaded position of the uppermost substrate 16 does not always change, as in the conventional apparatus. The positioning device 21 and the set miss bucket 17 are initially retracted to positions behind the supply cart 8 and the loader 6 by the positioning device moving means 25a, 25b and the set miss bucket moving means 26a, 26b, respectively.

The guide cylinder 13 of the loader 6 has a two-stage extension stroke. The extension operation of the guide cylinder 13 of the loader 6 causes the cylinder 13 to extend to the stroke lower end position and to be fixed to the lower end of the cylinder 13. The frame 12 and the suction pad 11 descend to suck the uppermost substrate 16 of the supply cart 8, and then the substrate 16 sucked by the suction pad 11 is moved by the shortening operation of the guide cylinder 13. It rises to the stroke upper end position.

During this time, the positioning device 21 is set by the positioning device and the set mis-bucket up / down switching means 27.
Is set at a predetermined height, and after this setting, the positioning device 21 is moved by the positioning device moving means 25a and 25b.
Is moved forward and stopped between the supply cart 8 and the loader 6. Thereafter, the guided cylinder 13 of the loader 6 descends to the middle position of the stroke, temporarily places the substrate 16 on the positioning device 21, rises to the upper end position, and stands by.

Similar to the conventional device, the positioning device 21 operates the rodless cylinders 20a and 20b to move both ends of the substrate 16 by the positioning pins 19a and 19b.
By pressing in the Y direction, the substrate stopper 18
The substrate 16 is pressed against a and 18b for positioning. The positioned substrate 16 is sucked and held again by the lowering operation of the loader 6 to the middle position of the guide cylinder 13, and after being raised to the upper end position, the XY of the laser processing machine 3 is carried out by the same transporting action as the conventional device. It is transported on the table 15.

When the laser processing by the laser processing machine 3 is normally performed, the substrate 16 is unloaded by the unloader 7.
By the same operation as the conventional device, the substrate is loaded and collected on the collection trolley 9 of the substrate loading and collecting section 2. At this time, the set miss bucket 17 is normally set mis-bucket moving means 26a,
26b, it is located behind the substrate stacking supply unit 1 in a state of being retracted behind the supply cart 8 and the loader 6.

On the other hand, if a setting error occurs in the laser processing machine 3, the loader 6 sends the unprocessed substrate 1 to the laser processing machine 3.
In order to retrieve 6, the positioning device and the set-mis-bucket up / down switching means 27 receive the command from the laser processing machine 3 side, and the positioning device 21 and the set-mis-bucket 1
7, the set miss bucket 17 is set at a predetermined position. Further, the set miss bucket moving means 26a, 26b
It is moved forward from the rear position, which is the evacuation position, and stopped between the supply cart 8 and the loader 6. The loader 6 sucks the unprocessed substrate 16 from the laser processing machine 3, returns to the substrate loading / supplying unit 1, and places the unprocessed substrate 16 on the set mistake bucket 17. Then, the unprocessed substrate 16 collected in the set miss bucket 17 may be stored as it is and readjusted, such as inspection of the substrate 16 alone. It may be supplied to the machine 3.

As described above, in the laser processing apparatus according to the second embodiment, the positioning device 21 controls the supply carriage 8 of the substrate stacking supply unit 1 from the rear position every time positioning is performed before each substrate 16 is processed. The set-up bucket 17 moves in and out of the shuttle, and the set-up bucket 17 is moved by the command from the laser processing machine 3 only when a set-up error occurs.
By operating in such a way as to enter and exit the supply trolley 8 in a shuttle manner from the rear position in place of 1, a series of operations of transport, positioning, processing, and collection are continuously performed,
Automatic processing and transport of the substrate are performed.

As shown in the figure, the substrate loading / supplying unit 1, the laser processing machine 3, and the substrate loading / recovering unit 2 are fixedly arranged substantially in a straight line along the arrow Y direction. Device 21 and set miss bucket 17
As shown in FIGS. 4 and 5, an arrow is provided between a position behind the substrate stacking and supplying unit 1 (in the X direction (positive direction in FIG. 4)) and a position immediately above the supply cart 8 of the substrate stacking and supplying unit 1. Although it is configured to be movable along the X direction, the positioning device 21 and the set-mistake bucket 17 can be moved by the substrate loading / supplying unit 1, the laser processing machine 3, and the substrate loading / recovering unit 2 except during operation. By adopting a configuration that is arranged at a position (retreat position (rear position)) deviating from a line in a line, the substrate loading / supplying unit 1, substrate positioning unit (substrate positioning device 21 or substrate positioning station), laser processing machine 3. Unprocessed substrate recovery unit (set miss bucket 17 or set miss station) and substrate loading recovery unit 2
Compared to a conventional laser processing apparatus (for example) shown in FIGS. 6 and 7 which is always arranged in a straight line, it is possible to avoid a configuration extending in one direction (the direction along the arrow Y direction). Space saving is achieved, which contributes to reduction of manufacturing cost.

The stroke of the guide-equipped cylinder 13 of the unloader 7 does not need to be two-step as in the case of the loader 6, but may be any as long as it stops only at two positions, the upper end and the lower end. When placing the unprocessed substrate 16 on the set miss bucket 17, the suction may be released at the upper end position and the substrate 16 may be dropped into the set miss bucket 17. Needless to say, the collection of the mis-set product is performed in a state where the mis-set bucket 17 is moved on the collection cart 9.

The laser processing apparatus according to the second embodiment has a type in which a supply truck 8 is provided in the substrate loading / supplying unit 1 and a collection truck 9 is provided in the substrate loading / collecting unit 2. Instead, a direct-type receiving container such as a cassette or a tray can be applied.

Further, although the positioning device 21 has been described as having a configuration in which the substrate 16 is positioned between the substrate stoppers 18a and 18b and the positioning pins 19a and 19b, the positioning device 21 is not limited to this configuration. The laser processing machine 3 may use XY for holding and moving the substrate.
The configuration has a table 15, but instead of this configuration, a fixed table is applied, and
May be applied, and the same effects as those of the laser processing apparatus according to the present invention can be obtained regardless of which configuration is applied.

Note that the laser processing apparatus of each embodiment
Before loading the substrate into the laser processing machine, it is a configuration equipped with a positioning device for performing rough positioning, but before loading into the laser processing machine, it is equipped with a laser processing machine that does not require such rough alignment. For example, a laser processing machine equipped with a laser processing machine that can absorb and correct even a large set positional deviation, or a substrate supply unit or a substrate transfer unit that detects a positional deviation of a substrate to be put into the laser processing machine. In a laser processing device that is hardly generated,
It is not necessary to provide a positioning device in the laser processing device of each of the above-described embodiments, and an embodiment having a configuration excluding the positioning device from the laser processing device of each of the above-described embodiments can be applied.

[0078]

As described above, the laser processing apparatus according to the present invention, that is, the substrate supply unit on which the supplied substrate to be processed is provided, the substrate positioning unit for positioning the mounted substrate, and the positioning unit A laser processing unit that performs laser processing on the substrate that has been processed, a substrate recovery unit that places a substrate that has exited from the laser processing unit, and a transport unit that transports the substrate to each unit. Part, a position retracted from a substantially straight line on which the laser processing part and the substrate collecting part are disposed, and the substrate positioning part movably provided between a position on the straight line and the retracted position. According to the laser processing apparatus provided with the positioning unit moving means for moving between the position and the position on the straight line, the substrate supply unit, the laser processing unit, and the substrate collection unit are substantially straightforward. The substrate positioning unit is disposed at a position retracted from a straight line on which the substrate supply unit, the laser processing unit, and the substrate collecting unit are arranged, that is, a position off the straight line. Only when it is necessary to perform the positioning, the positioning unit moving means is operated by being moved to this linear position, so that the substrate supply unit, the substrate positioning unit, the laser processing unit and The substrate collection unit is not always arranged in a straight line, but avoids a configuration that extends in only one direction. This makes it possible to reduce the installation space of the entire apparatus, and further reduces the manufacturing cost by making the apparatus more compact. And the cost can be reduced.

In the laser processing apparatus according to the next invention, that is, in the above-mentioned invention, the position on the straight line where the substrate positioning portion is moved is determined by the substrate supply portion and the transfer means for transferring the substrate from the substrate supply portion to the substrate supply portion. The positioning unit moving means is a space position between the position of the substrate being pulled up, and the substrate positioning unit moving the substrate positioning unit on the straight line in a state where the transporting unit pulls up the substrate from the substrate supply unit. According to the laser processing device for moving to the position, except during the positioning operation of the substrate, the substrate positioning portion is:
Since the apparatus is moved to the retracted position as described above, the installation space of the entire apparatus can be made compact, and when the transport unit pulls the substrate upward from the substrate supply unit before the substrate positioning operation, By moving the substrate positioning part to a space position between the position where the substrate is pulled up and the substrate supply part by the positioning part moving means, the substrate is directly lowered and the substrate positioning operation is performed. And the positioning operation of the substrate is not impaired.

In the laser processing apparatus according to the next invention, that is, in the above-described invention, the laser processing section determines whether the positioning state of the positioned substrate is correct or not prior to the laser processing, and determines whether the substrate is determined to be normal. Only the laser processing is performed, and the substrate recovery unit is configured to arrange the laser-processed substrate among the substrates retreated from the laser processing unit, and to perform the substrate (setting) of the retired substrates whose positioning state is determined to be abnormal. Unprocessed substrate collection unit (set miss bucket) movably provided between a position retreated from the straight line and a position on the straight line on which the mistake product is disposed.
And a collection unit moving means for moving the unprocessed substrate collection unit between the retracted position and the position on the straight line,
According to the laser processing apparatus further provided with, a substrate supply unit,
Although the laser processing section and the substrate recovery section are arranged substantially on a straight line, the board supply section, the laser processing section, and the substrate recovery section also have the same setting mistake bucket that collects a set error product as the substrate positioning section. It is disposed at a position retracted from the aligned straight line, that is, at a position deviated from this straight line, and is moved to this linear position by the collecting unit moving means only when it is necessary to collect the mis-set product. The substrate supply unit, the substrate positioning unit, the laser processing unit, the unprocessed substrate collection unit and the substrate collection unit are not always arranged in a straight line as in the past, but only in one direction. By avoiding the elongated structure, the installation space of the entire device can be reduced, and the downsizing of the device reduces the manufacturing cost and lowers the price. It can be.

In the laser processing apparatus according to the next invention, that is, in the above-mentioned invention, the position on the straight line where the unprocessed substrate collecting section is moved is a spatial position above the substrate collecting section, and According to the laser processing apparatus, when the substrate whose positioning state is determined to be abnormal is withdrawn from the laser processing unit, the laser processing apparatus moves the unprocessed substrate collection unit to the position on the straight line. Since the unprocessed substrate collecting section is moved to the retracted position as described above except during the product collecting operation, the installation space of the entire apparatus can be reduced, and the unprocessed substrate collecting operation can be performed before the unprocessed substrate collecting operation. When the substrate whose positioning state is determined to be abnormal is retracted from the laser processing unit, the unprocessed substrate collection unit is moved along the straight line by the collection unit moving means. Position is moved to (a position above the substrate collecting part) can be a recovery operation of the raw substrate,
The operation of collecting the unprocessed substrate is not impaired.

In the laser processing apparatus according to the next invention, that is, in the above invention, the position on the straight line where the unprocessed substrate collecting section is moved is a spatial position above the substrate supply section, and According to the laser processing apparatus, when the substrate whose positioning state is determined to be abnormal is withdrawn from the laser processing unit, the laser processing apparatus moves the unprocessed substrate collection unit to the position on the straight line. Since the unprocessed substrate collecting section is moved to the retracted position as described above except during the product collecting operation, the installation space of the entire apparatus can be reduced, and the unprocessed substrate collecting operation can be performed before the unprocessed substrate collecting operation. When the substrate whose positioning state is determined to be abnormal is retracted from the laser processing unit, the unprocessed substrate collection unit is moved along the straight line by the collection unit moving means. Position is moved to (a position above the substrate supply unit) can be a recovery operation of the raw substrate,
The operation of collecting the unprocessed substrate is not impaired.

Since the recovered unprocessed substrate is placed in the unprocessed substrate recovery section moved above the substrate supply section, the unprocessed substrate is operated by the same operation as supplying the substrate from the substrate supply section. The unprocessed substrate can be supplied again from the collection unit, and the operation of transferring the unprocessed substrate from the unprocessed substrate collection unit to the substrate supply unit for re-feeding the unprocessed substrate for laser processing can be omitted. It also has the effect.

A laser processing apparatus according to the next invention, that is, a substrate supply unit on which a supplied substrate to be processed is disposed, and whether the supplied substrate is positioned correctly or not, and only the substrate determined to be normal is determined. A laser processing unit for performing laser processing, a substrate recovery unit in which a laser-processed substrate among the substrates retreated from the laser processing unit is disposed, and a substrate in which the positioning state is determined to be abnormal among the retreated substrates is disposed. A laser processing apparatus provided with an unprocessed substrate collecting section and a transfer means for transferring the substrate to the respective sections, and retreats from a substantially straight line on which the substrate supply section, the laser processing section and the substrate collecting section are disposed. And moving the unprocessed substrate collecting portion movably provided between the retracted position and the linear position between the retracted position and the linear position. According to the laser processing apparatus provided with the section moving means, the substrate supply section, the laser processing section, and the substrate recovery section are disposed substantially in a straight line, but the unprocessed substrate recovery section is provided by the substrate supply section, the laser processing section. And at a position retreated from the straight line on which the substrate collection unit is arranged, that is, at a position deviating from the straight line, and only when necessary to collect the unprocessed substrate, the collection unit moving means moves the substrate on this straight line. Will be moved to the position of
As before, the substrate supply unit, the laser processing unit, the unprocessed substrate collection unit and the substrate collection unit are not always arranged on a straight line, avoiding a configuration that extends only in one direction,
The installation space as the whole apparatus can be made compact.

In the laser processing apparatus according to the next invention, that is, in the above-described invention, the position on the straight line where the unprocessed substrate collecting section is moved is a spatial position above the substrate collecting section, and According to the laser processing apparatus, when the substrate whose positioning state is determined to be abnormal is withdrawn from the laser processing unit, the laser processing apparatus moves the unprocessed substrate collection unit to the position on the straight line. Since the unprocessed substrate collecting section is moved to the retracted position as described above except during the product collecting operation, the installation space of the entire apparatus can be reduced, and the unprocessed substrate collecting operation can be performed before the unprocessed substrate collecting operation. In a state where the substrate whose positioning state is determined to be abnormal is withdrawn from the laser processing unit, the unprocessed substrate recovery unit moves the unprocessed substrate recovery unit on the straight line by the recovery unit moving means. Is moved to the location (a position above the substrate recovery unit), it is possible to cause the operation of recovering raw substrate, without impairment of recovery operation of the raw substrate.

In the laser processing apparatus according to the next invention, that is, in the above invention, the position on the straight line where the unprocessed substrate collecting section is moved is a spatial position above the substrate supply section, According to the laser processing apparatus, when the substrate whose positioning state is determined to be abnormal is withdrawn from the laser processing unit, the laser processing apparatus moves the unprocessed substrate collection unit to the position on the straight line. Since the unprocessed substrate collecting section is moved to the retracted position as described above except during the product collecting operation, the installation space of the entire apparatus can be reduced, and the unprocessed substrate collecting operation can be performed before the unprocessed substrate collecting operation. In a state where the substrate whose positioning state is determined to be abnormal is withdrawn from the laser processing unit, the unprocessed substrate recovery unit moves the unprocessed substrate recovery unit on the straight line by the recovery unit moving means. Move the location (a position above the substrate supply unit) can be a recovery operation of the raw substrate,
The operation of collecting the unprocessed substrate is not impaired.

Since the recovered unprocessed substrate is placed in the unprocessed substrate recovery unit moved above the substrate supply unit, the unprocessed substrate is processed by the same operation as supplying the substrate from the substrate supply unit. The unprocessed substrate can be supplied again from the collection unit, and the operation of transferring the unprocessed substrate from the unprocessed substrate collection unit to the substrate supply unit for re-feeding the unprocessed substrate for laser processing can be omitted. It also has the effect.

In the laser processing apparatus of each of the above-mentioned inventions, the substrate positioning section and the unprocessed substrate recovery section are retracted from a position on a straight line where the substrate supply section, the laser processing section and the substrate recovery section are arranged in series. Therefore, the width (length) in the direction in which the straight line extends is shorter than that of the conventional device, so that space can be saved. There is a concern that the depth in the direction perpendicular to the direction in which the laser beam extends will be longer than before, but in a practical laser processing machine, the laser processing unit (particularly the operating range of the XY table, the space of the laser oscillator, , A cooling device or a dust collecting device as an auxiliary device (not shown) has a very large depth compared to other components (a substrate supply portion, a substrate collection portion, and the like). Also in the processing apparatus, the depth of the substrate supply section and the substrate recovery section constitutes an installation space of the apparatus as a dead space (the area indicated by the symbol A in FIG. 7). This dead space in the installation space of the laser processing device is effectively used, and the depth length is not greatly increased. According to the research by the present inventors, the width direction (substrate supply Section, laser processing section, and substrate collection section) can save 30% or more of space, and the number of devices installed in a room with the same installation area is about 1.5 times that of the conventional device. Could be enhanced.

[Brief description of the drawings]

FIG. 1 is a front view illustrating a configuration of a laser processing apparatus according to a first embodiment of the present invention;

FIG. 2 is a plan view showing a configuration of the laser processing apparatus according to the first embodiment of the present invention;

FIG. 3 is a side view showing a configuration of the laser processing apparatus according to the first embodiment of the present invention;

FIG. 4 is a plan view illustrating a configuration of a laser processing apparatus according to a second embodiment of the present invention;

FIG. 5 is a side view showing a configuration of a laser processing apparatus according to a second embodiment of the present invention;

FIG. 6 is a front view showing an example of a conventional laser processing apparatus.

FIG. 7 is a plan view showing an example of a conventional laser processing apparatus.

[Explanation of symbols]

1 substrate loading / supplying section, 2 substrate loading / recovering section, 3 laser processing machine, 4 positioning station, 5 set miss station, 6 loader, 7 unloader, 8 supply trolley,
9 Collection trolley, 10 rail, 11 suction pad, 12
Frame, 13 Guided Cylinder, 14 Traveling Drive, 15 XY Table, 16 Substrates, 17 Misset Bucket, 18a Substrate Stopper, 18b Substrate Stopper, 19a Positioning Pin, 19b Positioning Pin, 20a Rodless Cylinder, 20b Rodless Cylinder, Reference Signs List 21 positioning device, 22 laser oscillator, 23 optical path, 24 processing head, 25a positioning device moving means, 25b positioning device moving means, 26
a mis-set bucket moving means, 26b mis-set bucket moving means, 27 positioning device moving means and mis-set bucket moving means up / down moving means.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor: Takeshi Yazaki 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Mitsui Electric Co., Ltd. (72) Inventor Takashi Mori 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Rishi Electric Co., Ltd. F term (reference) 4E068 CA14 CA18 CE11 DA11

Claims (8)

[Claims] 1. A substrate supply unit on which a substrate to be supplied is provided, a substrate positioning unit for positioning the provided substrate, a laser processing unit for performing laser processing on the positioned substrate, and the laser processing unit. A substrate collection unit in which a substrate exiting from the substrate is disposed, and a laser processing apparatus including a transport unit configured to transport the substrate to the respective units, wherein the substrate supply unit, the laser processing unit, and the substrate collection unit are disposed. A positioning unit moving unit that moves the substrate positioning unit movably provided between a position retracted from a substantially straight line and a position on the straight line, and the position between the retracted position and the position on the straight line; A laser processing apparatus comprising: 2. The position on the straight line where the substrate positioning unit is moved is a spatial position between the substrate supply unit and a position where the transfer unit pulls the substrate upward from the substrate supply unit. And wherein the positioning unit moving means is in a state where the transport means has pulled the substrate upward from the substrate supply unit,
The laser processing apparatus according to claim 1, wherein the substrate positioning unit is moved to the position on the straight line. 3. The laser processing unit, prior to the laser processing, determines whether the positioning state of the positioned substrate is correct or not, and laser-processes only the substrate determined to be normal. A substrate that has been laser-processed among the substrates that have exited from the laser processing unit is disposed, and a substrate whose positioning state has been determined to be abnormal among the substrates that have exited is disposed. An unprocessed substrate collection unit movably provided between a position on the straight line, and a collection unit moving unit for moving the unprocessed substrate collection unit between the retracted position and the position on the straight line; The laser processing apparatus according to claim 1, further comprising: 4. The position on the straight line where the unprocessed substrate recovery unit is moved is a spatial position above the substrate recovery unit, and the recovery unit moving means determines that the positioning state is abnormal. 4. The laser processing apparatus according to claim 3, wherein the unprocessed substrate collection unit is moved to the position on the straight line when the substrate that has been moved out of the laser processing unit. 5. 5. The straight line position where the unprocessed substrate collecting unit is moved is a spatial position above the substrate supply unit, and the collecting unit moving unit determines that the positioning state is abnormal. 4. The laser processing apparatus according to claim 3, wherein when the substrate has been withdrawn from the laser processing unit, the unprocessed substrate collection unit is moved to the position on the straight line. 5. 6. A substrate supply unit on which a supplied substrate to be processed is disposed, a laser processing unit that determines whether the supplied substrate is positioned correctly or not, and laser-processes only the substrate determined to be normal. A substrate collection unit in which a laser-processed substrate is arranged among the substrates withdrawn from the laser processing unit, an unprocessed substrate collection unit in which the substrate whose positioning state is determined to be abnormal among the withdrawn substrates is arranged, and In a laser processing apparatus provided with a transport unit that transports the substrate to each of the units, a position retracted from a substantially straight line on which the substrate supply unit, the laser processing unit, and the substrate collection unit are disposed, and a position on the straight line A collecting unit moving means for moving the unprocessed substrate collecting unit movably provided between the retracted position and the linear position. Engineering equipment. 7. The position on the straight line where the unprocessed substrate collecting unit is moved is a spatial position above the substrate collecting unit, and the collecting unit moving means determines that the positioning state is abnormal. 7. The laser processing apparatus according to claim 6, wherein when the substrate has been withdrawn from the laser processing unit, the unprocessed substrate collection unit is moved to the position on the straight line. 8. 8. The position on the straight line where the unprocessed substrate collection unit is moved is a spatial position above the substrate supply unit, and the collection unit moving unit determines that the positioning state is abnormal. 7. The laser processing apparatus according to claim 6, wherein when the substrate has been withdrawn from the laser processing unit, the unprocessed substrate collection unit is moved to the position on the straight line. 8.