JP2002134666A5 - - Google Patents

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Publication number
JP2002134666A5
JP2002134666A5 JP2000330067A JP2000330067A JP2002134666A5 JP 2002134666 A5 JP2002134666 A5 JP 2002134666A5 JP 2000330067 A JP2000330067 A JP 2000330067A JP 2000330067 A JP2000330067 A JP 2000330067A JP 2002134666 A5 JP2002134666 A5 JP 2002134666A5
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JP
Japan
Prior art keywords
heat
resin sheet
expandable member
dissipating
resin
Prior art date
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Granted
Application number
JP2000330067A
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English (en)
Japanese (ja)
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JP4584439B2 (ja
JP2002134666A (ja
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Publication date
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Priority to JP2000330067A priority Critical patent/JP4584439B2/ja
Priority claimed from JP2000330067A external-priority patent/JP4584439B2/ja
Publication of JP2002134666A publication Critical patent/JP2002134666A/ja
Publication of JP2002134666A5 publication Critical patent/JP2002134666A5/ja
Application granted granted Critical
Publication of JP4584439B2 publication Critical patent/JP4584439B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000330067A 2000-10-30 2000-10-30 放熱樹脂シート Expired - Fee Related JP4584439B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000330067A JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000330067A JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Publications (3)

Publication Number Publication Date
JP2002134666A JP2002134666A (ja) 2002-05-10
JP2002134666A5 true JP2002134666A5 (https=) 2007-11-22
JP4584439B2 JP4584439B2 (ja) 2010-11-24

Family

ID=18806645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000330067A Expired - Fee Related JP4584439B2 (ja) 2000-10-30 2000-10-30 放熱樹脂シート

Country Status (1)

Country Link
JP (1) JP4584439B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
KR20060127049A (ko) * 2003-12-18 2006-12-11 제온 코포레이션 열전도성 감압 접착제 조성물, 열전도성 발포 시트상성형체 및 그 제조 방법
JP2005272505A (ja) * 2004-03-23 2005-10-06 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物及び熱伝導性シート状成形体
JP2005239744A (ja) * 2004-02-24 2005-09-08 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物並びに熱伝導性発泡シート状成形体及びその製造方法
EP2071002A4 (en) * 2006-06-21 2009-11-18 Hitachi Kasei Polymer Co Ltd THERMALLY CONDUCTIVE THERMOPLASTIC ADHESIVE COMPOSITION
JP5173166B2 (ja) * 2006-08-14 2013-03-27 スリーエム イノベイティブ プロパティズ カンパニー 粘着性フィルム剥離方法
JP5042899B2 (ja) * 2008-03-31 2012-10-03 ポリマテック株式会社 熱伝導性シート及びその製造方法
JP2012119674A (ja) * 2010-11-11 2012-06-21 Kitagawa Ind Co Ltd 熱伝導シート
WO2018062172A1 (ja) * 2016-09-30 2018-04-05 積水化学工業株式会社 熱伝導性熱膨張性樹脂組成物、熱伝導性熱膨張性成形体、バッテリーモジュール、及びバッテリーパック
JP2019061959A (ja) * 2017-09-26 2019-04-18 積水化学工業株式会社 伝導率可変部材及び安全システム
JP6517909B1 (ja) * 2017-11-16 2019-05-22 株式会社パワーバンクシステム 蓄冷／蓄熱シート及び蓄冷／蓄熱シート生成方法
US20230081610A1 (en) 2020-02-28 2023-03-16 Zeon Corporation Intercell spacer and battery module
WO2026014350A1 (ja) * 2024-07-08 2026-01-15 日東電工株式会社 熱伝導易解体接着組成物、熱伝導易解体接着シート、接合体、及び接合体の解体方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07307351A (ja) * 1994-05-11 1995-11-21 Toshiba Chem Corp 導電性ペースト
JPH08139235A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 電子機器およびその製造方法
JPH08133873A (ja) * 1994-11-11 1996-05-28 Sumitomo Metal Ind Ltd ろう付け用治具およびその製造方法
JPH09129793A (ja) * 1995-10-27 1997-05-16 Tonen Corp 半導体パッケージ用の熱伝プレート
JPH09219113A (ja) * 1996-02-08 1997-08-19 Asahi Chem Ind Co Ltd 熱伝導用ペースト
JP2000150742A (ja) * 1998-11-18 2000-05-30 Shibafu Engineering Kk 伝熱シート、半導体装置及び伝熱シートの製造方法

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