JP2002134448A - 研磨装置 - Google Patents

研磨装置

Info

Publication number
JP2002134448A
JP2002134448A JP2000323474A JP2000323474A JP2002134448A JP 2002134448 A JP2002134448 A JP 2002134448A JP 2000323474 A JP2000323474 A JP 2000323474A JP 2000323474 A JP2000323474 A JP 2000323474A JP 2002134448 A JP2002134448 A JP 2002134448A
Authority
JP
Japan
Prior art keywords
polishing
polished
guide member
protruding portion
polishing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000323474A
Other languages
English (en)
Japanese (ja)
Inventor
Isao Sugaya
功 菅谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2000323474A priority Critical patent/JP2002134448A/ja
Priority to PCT/JP2001/008801 priority patent/WO2002035592A1/ja
Priority to TW090126242A priority patent/TW491752B/zh
Publication of JP2002134448A publication Critical patent/JP2002134448A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000323474A 2000-10-24 2000-10-24 研磨装置 Pending JP2002134448A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000323474A JP2002134448A (ja) 2000-10-24 2000-10-24 研磨装置
PCT/JP2001/008801 WO2002035592A1 (fr) 2000-10-24 2001-10-05 Dispositif de polissage
TW090126242A TW491752B (en) 2000-10-24 2001-10-24 Polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000323474A JP2002134448A (ja) 2000-10-24 2000-10-24 研磨装置

Publications (1)

Publication Number Publication Date
JP2002134448A true JP2002134448A (ja) 2002-05-10

Family

ID=18801135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000323474A Pending JP2002134448A (ja) 2000-10-24 2000-10-24 研磨装置

Country Status (3)

Country Link
JP (1) JP2002134448A (zh)
TW (1) TW491752B (zh)
WO (1) WO2002035592A1 (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010023122A (ja) * 2008-07-15 2010-02-04 Nikon Corp 保持装置および研磨装置
US20110021115A1 (en) * 2009-07-24 2011-01-27 Semes Co., Ltd. Substrate polishing apparatus and method of polishing substrate using the same
US7967660B2 (en) 2005-02-25 2011-06-28 Ebara Corporation Polishing apparatus and polishing method
JP2012505762A (ja) * 2008-10-16 2012-03-08 アプライド マテリアルズ インコーポレイテッド 研磨パッド端部の延伸
US8296931B2 (en) 2007-08-27 2012-10-30 Showa Denko K.K. Method for manufacturing storage medium
JP2013523470A (ja) * 2010-03-31 2013-06-17 アプライド マテリアルズ インコーポレイテッド 縁部ペデスタル向けのサイドパッド設計
JP2013173227A (ja) * 2013-05-07 2013-09-05 Nikon Corp 保持装置
WO2019154630A1 (en) * 2018-02-06 2019-08-15 Asml Netherlands B.V. System, device and method for reconditioning a substrate support

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9120194B2 (en) * 2011-07-21 2015-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for wafer grinding
CN111390750B (zh) * 2020-03-25 2021-09-03 福建北电新材料科技有限公司 晶片面型加工装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3109558B2 (ja) * 1994-11-24 2000-11-20 住友金属工業株式会社 ウエハ保持具
JP3850924B2 (ja) * 1996-02-15 2006-11-29 財団法人国際科学振興財団 化学機械研磨装置及び化学機械研磨方法
JP2780703B2 (ja) * 1996-06-28 1998-07-30 日本電気株式会社 液晶パネルクリーニング装置
JPH11262854A (ja) * 1997-12-15 1999-09-28 Canon Inc 精密研磨装置および該精密研磨装置を用いた精密研磨方法
JP2000334655A (ja) * 1999-05-26 2000-12-05 Matsushita Electric Ind Co Ltd Ｃｍｐ加工装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7967660B2 (en) 2005-02-25 2011-06-28 Ebara Corporation Polishing apparatus and polishing method
US7976358B2 (en) 2005-02-25 2011-07-12 Ebara Corporation Polishing apparatus and polishing method
US8002607B2 (en) 2005-02-25 2011-08-23 Ebara Corporation Polishing apparatus and polishing method
US8296931B2 (en) 2007-08-27 2012-10-30 Showa Denko K.K. Method for manufacturing storage medium
JP2010023122A (ja) * 2008-07-15 2010-02-04 Nikon Corp 保持装置および研磨装置
JP2012505762A (ja) * 2008-10-16 2012-03-08 アプライド マテリアルズ インコーポレイテッド 研磨パッド端部の延伸
US20110021115A1 (en) * 2009-07-24 2011-01-27 Semes Co., Ltd. Substrate polishing apparatus and method of polishing substrate using the same
JP2013523470A (ja) * 2010-03-31 2013-06-17 アプライド マテリアルズ インコーポレイテッド 縁部ペデスタル向けのサイドパッド設計
JP2013173227A (ja) * 2013-05-07 2013-09-05 Nikon Corp 保持装置
WO2019154630A1 (en) * 2018-02-06 2019-08-15 Asml Netherlands B.V. System, device and method for reconditioning a substrate support

Also Published As

Publication number Publication date
TW491752B (en) 2002-06-21
WO2002035592A1 (fr) 2002-05-02

Similar Documents

Publication Publication Date Title
CN112123196B (zh) 用于化学机械研磨的方法、系统与研磨垫
WO2018198997A1 (ja) 基板の研磨装置
JP5236515B2 (ja) ドレッシング装置、化学的機械的研磨装置及び方法
US6402588B1 (en) Polishing apparatus
JP2000301450A (ja) Ｃｍｐ研磨パッドおよびそれを用いたｃｍｐ処理装置
JP3030276B2 (ja) 表面研磨方法およびその装置
US6343978B1 (en) Method and apparatus for polishing workpiece
CN108604543B (zh) 用于化学机械抛光的小型垫的载体
JP2002134448A (ja) 研磨装置
JPH10230451A (ja) 研磨装置及びワーク測定方法
US6270397B1 (en) Chemical mechanical polishing device with a pressure mechanism
JPH06270052A (ja) 半導体ウエーハの鏡面研磨装置
US6935938B1 (en) Multiple-conditioning member device for chemical mechanical planarization conditioning
JP5422262B2 (ja) 研磨パッドのコンディショナー
WO2020208967A1 (ja) 両面研磨方法
JP4416958B2 (ja) 半導体ウエハの外周研磨装置及び研磨方法
JP2000218514A (ja) 研磨装置及び研磨方法
JP5478945B2 (ja) 研磨パッドのコンディショナー
KR20190054323A (ko) 베젤프레임 연마장치
US6752698B1 (en) Method and apparatus for conditioning fixed-abrasive polishing pads
JP2000000757A (ja) 研磨装置及び研磨方法
US20140273767A1 (en) Polishing pad conditioner pivot point
KR100504116B1 (ko) 집적회로 제조를 위한 화학적 기계적 연마 장치
WO2000024548A1 (fr) Dispositif de polissage et procede de fabrication de semi-conducteurs au moyen dudit dispositif
US20040224617A1 (en) Static pad conditioner