JP2002134448A - Polisher - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem, related to the projection of a polishing unit from a circumference of a wafer by supporting the projecting part with a guide member, and further, to reduce wear of the guide member and the polishing unit. SOLUTION: When a wafer 2 is polished by a polishing unit 7, the projecting part of the polishing unit 7 projecting from the circumference of the wafer 2 is supported by a guide plane 5a of an annular guide member 5. The guide plane 5a is located approximately in the same plane as that of the polished surface of the wafer 2. The guide member 5 is attached to a member 13 via a bearing and supported rotatably and coaxially with a holding unit 3 holding the wafer 2 but is independent of the holding unit 3. The guide member 5 follows the movement of the projection part of the polishing unit 7 with a friction supplied by the projection part of the polishing unit 7. As a result, the relative speed between the projecting part of the polishing unit 7 and the guide member 5 becomes very low, and their wear can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to, for example, ULSI
The present invention relates to a polishing apparatus suitable for use in flattening and polishing of a semiconductor device in a method of manufacturing a semiconductor device.

[0002]

2. Description of the Related Art In recent years, chemical mechanical polishing (Chemical M
echanical Polishing or Chemical Mechanical Planari
zation, hereinafter referred to as CMP) technology. CMP is a process for removing the surface irregularities of a wafer by using a chemical action (dissolution with an abrasive or a solution) in combination with physical polishing. A polishing apparatus that performs polishing by CMP includes a polishing body such as a polishing pad and a holding unit such as a chuck that holds an object to be polished such as a wafer, and an abrasive is interposed between the polishing body and the object to be polished. In this state, the object to be polished is polished by applying a load between the object to be polished and the object to be polished and relatively moving the object.

[0003] In this type of polishing apparatus, there is an apparatus which can temporarily protrude a part of the polishing body from the polishing object to the periphery of the polishing object due to relative movement between the polishing object and the polishing object when polishing the polishing object. is there. Conventionally, for example, when polishing a wafer that is vacuum-adsorbed face-up to a chuck with a small pad (a polishing pad smaller in diameter than the wafer) attached to a flexible polishing head part having an angle following ability, the polishing pad is Is provided.

[0004]

In the above-mentioned conventional polishing apparatus, when a polishing object such as a wafer is polished, the polishing body such as a polishing pad protrudes from the object to be polished.
Due to the overhang that occurs when the polishing pad protrudes from the wafer, the following three problems have arisen.

The first problem is "pad inclination".
In the conventional polishing apparatus, in order to absorb a parallelism error between the pad surface and the chuck surface due to processing and assembling, and a undulation of the wafer surface, the head unit employs a flexible mechanism having an angle following ability. . For this reason, if the pad protrudes from the wafer while swinging, the flexibility is conversely backfired and the pad is inclined to the protruding side, so that the desired polishing is not performed. Specifically, there is a problem that the pressing force of the pad on the wafer is not uniformly distributed, and as a result, an edge first in which the edge of the wafer is cut most often, and the polishing is not performed uniformly. was there.

[0006] The second problem is the "step of the pad".
Pads not protruding from the wafer are crushed by the pressing force, but the protruding portions are thicker than the former due to the restoring force of the pad material. The region which has been released from the pressing force and restored to this thickness comes into contact with the wafer again by the rotation of the head portion. At the moment when the step portion rides on the wafer, the released pad surface is rapidly compressed again, so that the pressure applied to the wafer becomes non-uniform near the edge. The same occurs at the moment when the crushed pad is released from the pressing force. For these reasons, there has been a problem that desired polishing cannot be obtained near the edge of the wafer.

[0007] The third problem is "pad pressure". The pressing force of the pad on the wafer has a great influence on the polishing state. Basically, in order to uniformly polish the entire wafer, it is desirable that the pressing force per unit area of the pad against the wafer be uniform. But,
As described above, in the related art, since the pad surface sometimes protrudes from the wafer, the contact area changes, and as a result, there has been a problem that the pressing force per unit area changes.

In order to solve these problems, it is conceivable to provide a guide member for supporting a protruding portion of the polishing pad which protrudes from the wafer to the periphery when polishing the wafer. In this case, if the guide surface for supporting the protruding portion of the guide member is disposed substantially in the same plane as the polishing surface of the wafer, even if the polishing pad protrudes from the wafer, the polishing pad does not protrude from the wafer. A state substantially equivalent to that described above is realized, the first to third problems described above are solved, and the object to be polished can be uniformly polished.

However, since the protruding portion of the polishing pad and the guide member rub against each other, there is a danger that the wear of the polishing pad is accelerated and the guide member is also worn. However, as the difference between the height of the guide surface and the height of the polished surface of the wafer is smaller, the effect of the guide member for supporting the protruding portion of the polishing pad is sufficiently exhibited, and the first to third problems described above are sufficiently solved. Can be eliminated. Therefore, the guide member is basically made of a material having better wear resistance than the wafer. For this reason, the progress of wear of the polishing pad is further accelerated, and the life of the polishing pad is shortened. Also,
Even if a material having excellent wear resistance is used for the guide member, it is preferable that the progress of wear of the guide member is slow.

Further, as described above, the smaller the difference between the height of the guide surface and the height of the polished surface of the wafer is, the more preferable it is.
When the guide member is installed, the height of the guide member is set so that the heights of the guide members coincide with each other. However, with continued use, the guide member wears out and the difference in height between the two increases. For this reason, it is necessary to adjust the height of the guide member so that the heights of the guide members coincide with each other. Of course,
Although the guide member may be replaced without re-adjusting the height, the cost increases in that case. As described above, it is necessary to adjust the height of the guide member according to the progress of the wear of the guide member, and it is required that the adjustment can be easily performed.

By the way, in the above-mentioned polishing apparatus,
When the polishing pad is continuously used, the polishing pad is clogged, and sufficient polishing characteristics cannot be obtained. For this reason, the polishing pad is conditioned by a dresser or the like at an appropriate frequency. However, conventionally, conditioning cannot be performed during polishing of the wafer, and the throughput of wafer polishing has been reduced.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a problem in that a polishing body such as a polishing pad protrudes from an object to be polished to the periphery thereof, and the protruding portion is supported by a guide member. It is an object of the present invention to provide a polishing apparatus that can reduce wear of the guide member and the polishing body while solving the problems described above.

Further, the present invention can easily adjust the height of the guide member while solving the problem of the polishing body protruding from the object to be polished to the periphery thereof by supporting the protruding portion with the guide member. It is an object of the present invention to provide a polishing apparatus that can be used for polishing.

Further, the present invention solves the problem of the polishing body protruding from the object to be polished to its surroundings by supporting the protruding portion with a guide member, and further reduces the problem during polishing of the object to be polished. An object of the present invention is to provide a polishing apparatus which can obtain a conditioning effect of a polishing body and can improve a throughput of polishing an object to be polished.

By the way, as a result of the research by the present inventors, for example, polishing in which a wafer or the like is held on a chuck having a flexible support mechanism capable of following an angle and the wafer or the like protrudes from a polishing body such as a polishing pad to the periphery thereof. It has been found that the same problem as the first problem occurs in the device.

Accordingly, an object of the present invention is to provide a polishing apparatus which can solve the same problem as the first problem also in such a polishing apparatus of this type.

[0017]

In order to solve the above-mentioned problems, a polishing apparatus according to a first aspect of the present invention comprises: a polishing body;
A holding portion for holding the object to be polished, with a polishing agent interposed between the polishing body and the object to be polished, while applying a load between the object to be polished and the object to be polished, and By relative movement, in the polishing apparatus for polishing the polishing target, the polishing apparatus has a guide surface located in substantially the same plane as the polishing surface of the polishing target, from the polishing target when polishing the polishing target A guide member for supporting the protruding portion of the polishing body protruding to the periphery thereof on the guide surface,
The guide member is supported movably independently of the holding portion in a predetermined direction in a plane substantially parallel to a polishing surface of the object to be polished.

According to the first aspect, since the guide member is provided, the above-described first to third problems caused by the polishing body protruding from the object to be polished to the periphery thereof can be solved. And in the said 1st aspect, since a guide member is supported movably independently of the holding | maintenance part,
For example, the guide member is driven by the protruding portion by the frictional force received from the protruding portion of the abrasive body as in a third embodiment described later, or the guide member is driven by an actuator as in a fourth embodiment described later. By doing so, it is possible to reduce the relative speed between the protruding portion of the polishing body and the portion of the guide member facing the protruding portion, as compared with a case where the guide member is fixed integrally with the holding portion. Therefore, according to the first aspect,
Wear of the polishing body such as the polishing pad and the guide member can be reduced.

In the polishing apparatus according to a second aspect of the present invention, in the first aspect, the guide member is rotatable about the same axis as the rotation axis of the holding portion independently of the holding portion. Is supported. When the guide member is supported as in the second embodiment, the mechanism is simplified and the cost is reduced. However, the first aspect is not limited to this example.

In a polishing apparatus according to a third aspect of the present invention, in the first or second aspect, the guide member is driven by the protruding portion by a frictional force received from the protruding portion.

According to the third aspect, since the guide member may be supported so-called free, an actuator is not required and the cost is reduced.

A polishing apparatus according to a fourth aspect of the present invention is the polishing apparatus according to the first or second aspect, further comprising an actuator for driving the guide member.

According to the fourth aspect, since the guide member can be actively moved by the actuator, the relative speed between the protruding portion of the abrasive body and the guide member can be freely set. Therefore, according to the fourth aspect, for example, as in a fifth aspect to be described later, the relative speed between the protruding portion of the polishing body and the portion of the guide member facing the protruding portion is reduced, or described later. In the case where the guide member has the dresser region as in the eighth aspect, the relative speed between the protruding portion and the dresser region can be set to a speed suitable for conditioning the polishing body.

A polishing apparatus according to a fifth aspect of the present invention is the polishing apparatus according to the fourth aspect, wherein the actuator is moved so that a relative speed between the protruding portion and a portion of the guide member facing the protruding portion is reduced. It has a control unit for controlling.

According to the fifth aspect, since the relative speed between the protruding portion of the polishing body and the portion of the guide member facing the protruding portion is reduced, the wear of the polishing body and the guide member can be reduced. . In the third aspect, since the guide member is driven by the frictional force received from the protruding portion, it is inevitable that a slip speed is generated as a relative speed between the protruding portion and the guide member. On the other hand, in the fifth aspect, since the guide member can be actively moved by the actuator, such a slip can be removed, and the relative speed between the protruding portion and the guide member is further reduced. It is also possible. Therefore, it is possible to further reduce the wear of the polishing body and the guide member.

In a polishing apparatus according to a sixth aspect of the present invention, in the polishing apparatus according to any one of the first to fifth aspects, the excitation section excites the guide member such that the guide surface is formed with irregularities due to vibration. It is provided with.

The vibration is preferably an ultrasonic vibration or another high frequency vibration, but is not necessarily limited thereto. The excitation unit may generate, for example, a standing wave or a traveling wave on the guide surface.
The excitation unit can be configured using various electromechanical energy conversion elements such as a piezoelectric element, an electrostrictive element, and a magnetostrictive element. These points are the same in a ninth embodiment described later.

According to the sixth aspect, since irregularities due to vibration are formed on the guide surface of the guide member, the contact area of the guide surface with the abrasive body is reduced, and the apparent friction coefficient between the two is reduced. Become smaller. Therefore, the wear of the polishing body and the guide member can be further reduced. In addition, a conditioning effect of eliminating clogging of the polishing body can be obtained by the vibration. For this reason, it is not necessary to condition the polished body at times other than during polishing of the object to be polished, or the frequency of conditioning performed at times other than during polishing is reduced, and the polishing throughput of the object to be polished is improved.

A polishing apparatus according to a seventh aspect of the present invention is the polishing apparatus according to any one of the first to sixth aspects, wherein the element causing a volume change according to the applied electric signal is adapted to respond to the volume change of the element. The guide surface is provided such that the relative height of the guide surface with respect to the polishing surface of the polishing object changes.

As the element, for example, a piezoelectric element, an electrostrictive element, a magnetostrictive element or the like can be used. This is the same for the tenth and eleventh aspects described later.

According to the seventh aspect, since the height of the guide surface of the guide member can be adjusted by changing the electric signal applied to the element, the adjustment is facilitated.

In a polishing apparatus according to an eighth aspect of the present invention, in any one of the first to seventh aspects, at least a part of the guide surface is a dresser region capable of conditioning the polishing body. It is.

If at least a part of the guide surface is in the dresser region as in the eighth aspect, as long as the relative speed between the dresser region and the polishing body is not completely zero, the polishing speed of the polishing object is somewhat reduced during polishing. Conditioning of the abrasive body is performed. Therefore, conditioning of the polished body is not required except during polishing of the object to be polished, or the frequency of conditioning performed at times other than during polishing is reduced, and the polishing throughput of the object to be polished is improved.

A polishing apparatus according to a ninth aspect of the present invention comprises a polishing body and a holding portion for holding an object to be polished, wherein a polishing agent is interposed between the polishing body and the object to be polished. In, applying a load between the polishing body and the object to be polished,
And, by relative movement, in the polishing apparatus for polishing the object to be polished, has a guide surface located in substantially the same plane as the polishing surface of the object to be polished, the object to be polished when polishing the object to be polished A guide member that supports the protruding portion of the polishing body that protrudes from the guide surface on the guide surface, and an excitation unit that excites the guide member so that irregularities due to vibration are formed on the guide surface of the guide member. It is provided.

According to the ninth aspect, since the guide member is provided, it is possible to eliminate the problem caused by the polishing body protruding from the object to be polished to the periphery thereof. And
According to the ninth aspect, unevenness due to vibration is formed on the guide surface of the guide member. Therefore, similarly to the sixth aspect, wear of the polishing body and the guide member can be reduced, and the object to be polished can be reduced. The polishing throughput of the object is improved.

The polishing apparatus according to the tenth aspect of the present invention comprises:
In the ninth aspect, there is provided an element for causing a volume change in accordance with an applied electric signal, wherein the element is provided in accordance with the volume change of the element, wherein the guide surface is based on a polishing surface of the object to be polished. And the excitation unit includes an electromechanical energy conversion element that also serves as the element.

According to the tenth aspect, similarly to the seventh aspect, the height of the guide surface of the guide member can be easily adjusted. In the tenth aspect, since the element causing the volume change is also used as the electromechanical energy conversion element constituting the excitation unit, the cost is reduced.

The polishing apparatus according to the eleventh aspect of the present invention comprises:
A polishing body, and a holding portion for holding the object to be polished, wherein a load is applied between the polishing body and the object to be polished while an abrasive is interposed between the polishing body and the object to be polished. In addition, and by relatively moving, in a polishing apparatus for polishing the object to be polished, having a guide surface located substantially in the same plane as the polishing surface of the object to be polished, the polishing at the time of polishing the object to be polished A guide member for supporting the protruding portion of the polishing body protruding from the polishing object to the periphery thereof on the guide surface, and an element for causing a volume change according to an applied electric signal, wherein the element has a volume of the element. The guide surface is provided such that the relative height of the guide surface with respect to the polished surface of the polishing object changes in accordance with the change.

According to the eleventh aspect, since the guide member is provided, it is possible to solve the problem caused by the polishing body protruding from the object to be polished to the periphery thereof. According to the eleventh aspect, similarly to the seventh aspect, the height of the guide surface of the guide member can be easily adjusted.

The polishing apparatus according to the twelfth aspect of the present invention comprises:
A polishing body, and a holding portion for holding the object to be polished, wherein a load is applied between the polishing body and the object to be polished while an abrasive is interposed between the polishing body and the object to be polished. In addition, and by relatively moving, in a polishing apparatus for polishing the object to be polished, having a guide surface located substantially in the same plane as the polishing surface of the object to be polished, the polishing at the time of polishing the object to be polished A guide member that supports the protruding portion of the polishing body that protrudes from the object to be polished to the periphery thereof is supported by the guide surface, and at least a part of the guide surface of the guide member is a dresser region where conditioning of the polishing body is possible. There is something.

According to the twelfth aspect, since the guide member is provided, it is possible to solve the problem caused by the polishing body protruding from the object to be polished to the periphery thereof. According to the twelfth aspect, in the same manner as in the eighth aspect, as long as the relative speed between the dresser region and the polishing body is not completely zero, conditioning of the polishing body at least during polishing of the polishing object is performed. Is performed, and the throughput of polishing the object to be polished is improved.

A polishing apparatus according to a thirteenth aspect of the present invention comprises:
In the twelfth aspect, an actuator for driving the guide member, wherein the guide member is supported movably independently of the holding portion in a predetermined direction in a plane substantially parallel to a polishing surface of the object to be polished, and drives the guide member When the protruding portion and the dresser region face each other, a control unit that controls the actuator so that a relative speed between the protruding portion and the dresser region becomes a speed suitable for conditioning the polishing body. It is provided.

According to the thirteenth aspect, when the protruding portion of the polishing body faces the dresser region of the guide member, the relative speed between the protruding portion and the dresser region becomes a speed suitable for conditioning the polishing body. In addition, conditioning of the polishing body is more effectively performed during polishing of the polishing object, and the throughput of polishing the polishing object is further improved.

A polishing apparatus according to a fourteenth aspect of the present invention comprises:
In the thirteenth aspect, the control unit, when the protruding portion and the dresser region do not face each other,
As the relative speed between the protruding portion and the portion of the guide member facing the protruding portion decreases,
It controls the actuator.

According to the fourteenth aspect, when the protruding portion of the polishing body does not face the dresser region of the guide member, the relative speed between the protruding portion of the polishing body and the portion of the guide member facing the protruding portion is reduced. As a result, the wear of the polishing body and the guide member can be reduced.

A polishing apparatus according to a fifteenth aspect of the present invention comprises:
In the thirteenth or fourteenth aspect, the guide member is supported so as to be freely rotatable about the same axis as the rotation axis of the holding part independently of the holding part. When the guide member is supported as in the fifteenth aspect, the mechanism is simplified and the cost is reduced. However, the thirteenth and fourteenth aspects are not limited to this example.

A polishing apparatus according to a sixteenth aspect of the present invention comprises:
A polishing body, and a holding portion for holding the object to be polished, wherein a load is applied between the polishing body and the object to be polished while an abrasive is interposed between the polishing body and the object to be polished. In addition, and by relatively moving, in a polishing apparatus for polishing the object to be polished, having a guide surface positioned substantially in the same plane as the polishing surface of the polishing body at the time of polishing the object to be polished, A guide member is provided for supporting a protruding portion of the polishing object, which protrudes from the polishing body to the periphery when the polishing object is polished, by the guide surface.

In the first to fifteenth aspects, the guide member supports the protruding portion of the polishing body which protrudes from the object to be polished to the periphery during polishing of the object to be polished. The members are supported differently in that the member supports a protruding portion of the polishing object that protrudes from the polishing body to the periphery when the polishing object is polished.

According to the sixteenth aspect, since the guide member is provided, the problem associated with the object to be polished protruding from the polishing body to the periphery thereof (the same problem as the first problem described above) is solved. be able to.

A polishing apparatus according to a seventeenth aspect of the present invention comprises:
In the sixteenth aspect, the guide member is supported movably independently of the polishing body in a predetermined direction substantially in the same plane as a polishing surface of the polishing body when polishing the object to be polished. It is. According to the seventeenth aspect, advantages similar to those of the second aspect can be obtained.

The sixteenth and seventeenth aspects are the same as the third aspect.
The features corresponding to the features of the seventh to seventh aspects may be provided alone or in any combination.

[0052]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A polishing apparatus according to the present invention will be described below with reference to the drawings.

[First Embodiment]

FIG. 1 is a schematic cross-sectional view schematically showing a state of a polishing apparatus according to a first embodiment of the present invention during polishing. FIG. 2 is an enlarged view of the vicinity of a portion C in FIG. FIG.
FIG. 2 is a view taken along the line DD ′ in FIG. 1.

The polishing apparatus according to the present embodiment includes a polishing member 1, a holder 3 for holding a process wafer 2 as an object to be polished under the polishing member 1, and an abrasive (slurry) on the wafer 2. And a guide member 5 that supports a protruding portion of the polishing body 7 protruding from the wafer 2 to the periphery thereof when the wafer 2 is polished by a guide surface 5a. The guide surface 5 a of the guide member 5 is located substantially in the same plane as the polished surface of the wafer 2.

The polishing member 1 is formed by fixing a polishing body (polishing pad) 7 on the lower surface of a polishing platen 6. As shown by arrows J, K, and M in FIGS. In addition, it can rotate, move up and down, and swing right and left (reciprocate). As the polishing body 7, for example, a sheet-like foamed polyurethane or a non-foamed resin having a groove structure on the surface can be used.

The holding unit 3 has a large number of air passages (not shown), a chuck 8 capable of vacuum-sucking the wafer 2 on the upper surface, a chuck table 9 supporting the chuck 8, and a member 10 constituting a rotary shaft. And has a known structure. Further, the holding unit 3 is provided with a conduit 11 for vacuum suction or the like. The wafer 2 is held on the holding unit 3 by vacuum suction, and the upper surface of the wafer 2 is a polished surface. The holding section 3 can be rotated by a mechanism (not shown) using an electric motor as an actuator, as shown by an arrow N in FIG.

The diameter of the polishing member 1 is smaller than the diameter of the wafer 2. During the polishing of the wafer 2, a part of the polishing body 7 temporarily protrudes from the wafer 2 to the periphery thereof as shown in FIGS. 1 and 3 due to the swing of the polishing member 1 in the direction indicated by the arrow M. ing.

The guide member 5 is movable independently of the holder 3 in a predetermined direction in a plane substantially parallel to the polished surface of the wafer 2.
Supported.

More specifically, in the present embodiment,
The guide member 5 is formed in a ring shape from a ceramic material having excellent wear resistance such as zirconia or alumina, and is disposed coaxially with the holding portion 3 along the outer periphery of the holding portion 3.
The upper surface of the guide member 5 serves as a guide surface 5a that supports the protruding portion of the polishing body 7 during polishing. The guide member 5 is attached to the member 13 via a ring-shaped bearing 12 provided coaxially with the holding portion 3, and is independent of the holding portion 3 coaxially with the holding portion 3 by the member 13 via the bearing 12. It is supported so that it can rotate freely. The member 13 is a member that rotatably supports the holding unit 3 in the direction of the arrow N or a member fixed thereto. For example, when an index table structure as disclosed in JP-A-2000-127028 is adopted, the member 13 is an index table or a member fixed thereto. The index table supports each of the plurality of holding units 3 rotatably. With the use of the index table, when one holding unit 3 is located on the polishing stage, another holding unit 3 is located on the loading stage or the unloading stage, and the plurality of wafers 2 can be efficiently polished. . However,
The polishing apparatus according to the present invention may have only a single holding unit 3.

In this embodiment, in order to prevent the abrasive from flowing around the bearing 12, as shown in FIG. 2, a labyrinth (labyrinth) is formed so that the gap between the guide member 5 and the member 13 forms a maze. ) Structure is adopted.
However, for example, using a sealing member such as rubber,
The abrasive may be prevented from flowing around the bearing 12.

Instead of attaching the guide member 5 to the member 13 via the bearing 12, the guide member 5 may be attached to the holder 3 via a bearing. In this case, the guide member 5 is supported by the holding portion 3, but can rotate freely independently of the holding portion 3.

According to the polishing apparatus of this embodiment, the polishing member 1 swings in the direction of arrow M while rotating in the direction of arrow J, and presses the upper surface of the wafer 2 on the holding portion 3 with a predetermined pressure. Can be The holding unit 3 is rotated in the direction of the arrow N, and the wafer 2 is also rotated in the direction of the arrow N, so that relative movement between the wafer 2 and the polishing member 1 is performed. In normal polishing, in order to increase the polishing rate, as shown in FIG. 3, the rotation direction of the wafer 2 (direction of arrow N) and the rotation direction of the polishing body 7 (direction of arrow J) are opposite to each other. To increase the relative speed.

In this state, the abrasive is supplied from the abrasive supply unit 4 onto the wafer 2, and the abrasive is diffused on the wafer 2,
As the polishing member 1 and the wafer 2 move relative to each other, they enter between the polishing body 7 and the wafer 2 to polish the polishing surface of the wafer 2. That is, the mechanical polishing by the relative movement of the polishing member 1 and the wafer 2 and the chemical action of the polishing agent act synergistically to perform good polishing.

At this time, as shown in FIG.
Swings in the direction M in FIG. 1 so that a part of the polishing body 7 temporarily protrudes from the wafer 2 to the periphery thereof. However, the protruding portion is supported by the guide member 5 close to the outer periphery of the wafer 2 while being substantially flush with the polished surface of the wafer 2, so that the polishing body 7 is substantially equivalent to a state in which the polishing body 7 does not protrude from the wafer 2. The state is realized. As a result, the first to third problems described above are solved, and the wafer 2 can be polished uniformly.

In the present embodiment, the guide member 5
Are supported coaxially with the holding portion 3 so as to be freely rotatable independently of the holding portion 3, and as shown in FIG. 3, the frictional force received from the protruding portion of the polishing body 7 It follows and rotates in the direction of arrow P. for that reason,
The peripheral speed of the protruding portion of the polishing body 7 and the peripheral speed of the portion of the guide member 5 facing the protruding portion are substantially the same, and the relative speed of the two is substantially zero except for the slip. Therefore, according to the present embodiment, abrasion of the polishing body 7 and the guide member 5 can be suppressed extremely low. In addition, since the peripheral speed of the guide member 5 is substantially equal to the peripheral speed of the polishing body 7, the abrasive and particles of the wafer 2 generated by polishing are discharged without receiving unnecessary external force. Of the abrasive body 7 is hardly clogged.

Here, a comparative example to be compared with the present embodiment will be described with reference to FIG. FIG. 4 is a schematic plan view corresponding to FIG. 3. In FIG. 4, the same or corresponding elements as those in FIG. 3 are denoted by the same reference numerals, and overlapping description will be omitted. In this comparative example, unlike the present embodiment, the guide member 5 is integrally fixed to the holding portion 3,
The wafer 2 rotates in the direction of the arrow P ′, which is the same as the rotation direction of the wafer 2 (the direction of the arrow N). Therefore, in this comparative example, the relative speed between the protruding portion of the polishing body 7 and the portion of the guide member 5 facing the protruding portion is significantly increased, and the abrasion of the polishing body 7 and the guide member 5 is increased. Further, since the relative speed between the guide member 5 and the polishing body 7 is large, the abrasive and the particles of the wafer 2 generated by polishing are likely to be discharged by receiving an unnecessary external force. The abrasive body 7 is easily clogged. Even when the guide member 5 is integrally fixed to the member 13, the relative speed becomes considerably large, so that the wear of the polishing body 7 and the guide member 5 also increases, and the polishing body 7 is clogged. It will be easier.

[Second Embodiment]

FIG. 5 is a schematic enlarged sectional view schematically showing a main part of a polishing apparatus according to a second embodiment of the present invention.
This corresponds to FIG. 2 described above. FIG. 7 is a schematic plan view of the polishing apparatus according to the present embodiment, and corresponds to FIG. 3 described above. In FIGS. 5 and 7, the same or corresponding elements as those in FIGS. 2 and 3 are denoted by the same reference numerals, and redundant description will be omitted.

This embodiment differs from the first embodiment only in the points described below. In the present embodiment, an electric motor 21 as an actuator for driving the guide member 5 is added, and the motor 21 is controlled by the motor control unit 24. A ring-shaped gear 22 arranged coaxially with the holding portion 3 and having teeth formed on the outer periphery thereof
Is fixed to the outer peripheral side of the lower part of the. This gear 22 has
The gear 23 fixed to the output shaft 21a of the motor 21 is meshed with the gear 23 and is driven by the motor 21 so that the guide member 5
Are rotated coaxially with the holding unit 3.

According to this embodiment, since the guide member 5 can be actively rotated by the motor 21, the relative speed between the protruding portion of the polishing body 7 and the guide member 5 can be freely set. Can be.

For example, the control unit 24 controls the motor 2 so that the relative speed between the protruding portion of the polishing body 7 and the guide member 5 is reduced (for example, the relative speed is minimized).
Control 1 For example, as shown in FIG. 7, the rotation center of the wafer 2 (that is, the rotation center of the holding unit 3) is O ₁ , the rotation center of the polishing body 7 is O ₂ , and a straight line including the points O ₁ and O ₂ is A is the midpoint of each intersection that intersects the inner and outer circumferences of the guide member 5, the length of the line segment O ₂ A is L ₁ (t), the length of the line segment O ₁ A is L ₂ , and the rotation of the polishing body 7 Assuming that the speed is r ₁ (t) and the rotation speed of the guide member 5 is r ₂ (t), the control unit 24 controls the guide member 5 to rotate at a rotation speed r ₂ (t) that satisfies Equation 1 below. The motor 21 is controlled. Equation 1 shows a condition that the moving speed of the guide member 5 at the point A is equal to the moving speed of the polishing body 7 at the point A. However, the abrasive body 7
There direction swinging (direction of arrow M) coincides with the direction of the straight line including the point O ₁ and the point O _2. In this example, L
₁ (t), r ₁ (t), and r ₂ (t) are values that change with time.

[0073]

## EQU1 ## r ₂ (t) = r ₁ (t) · L ₁ (t) / L ₂

The control unit 24 determines that r ₁ (t), r
A control unit (not shown) that controls the rotation and swing of the polishing body 7 and the rotation of the holding unit 3 based on the information of ₂ (t) and L ₁ (t).
Or an encoder or other detector.

In the first embodiment described above, since the guide member 5 is driven by the frictional force received from the polishing body 7, a slip speed is generated as a relative speed between the protruding portion of the polishing body 7 and the guide member 5. That is inevitable.
On the other hand, in the present embodiment, if the guide member 5 is actively rotated, for example, so as to satisfy Equation 1, the slip as described above is reduced, and the protruding portion of the polishing body 7 and the guide member 2 And the relative speed with respect to the abrasive body 7
And the wear of the guide member 5 is further reduced.

[Third Embodiment]

FIG. 6 is an exploded perspective view schematically showing a main part of a polishing apparatus according to a third embodiment of the present invention. FIG.
In FIG. 2, the same or corresponding elements as those in FIGS. 2 and 3 are denoted by the same reference numerals, and redundant description will be omitted.

This embodiment is different from the third embodiment only in the points described below. In the present embodiment, the dresser 31 is embedded in a part of the guide member 5. The dresser 31 has, for example, a structure in which diamond abrasive grains are fixed to a stainless steel plate with an adhesive or the like,
The abrasive surface 31 a is located in the same plane as the guide surface 5 a of the guide member 5. The guide member 5 and the dresser 31 constitute a guide member that supports the protruding portion of the polishing body 7 as a whole. The abrasive grain surface 31a of the dresser 31 and the guide surface 5a of the guide member 5 as a whole constitute a guide surface that supports the protruding portion of the polishing body 7. The abrasive grain surface 31a forms a dresser region where conditioning of the polishing body 7 is possible.

In this embodiment, the control unit 24
Controls the motor 21 so that when the protruding portion of the polishing body 7 faces the dresser region 31a, the relative speed between the protruding portion of the polishing body 7 and the dresser region 31a becomes a speed suitable for conditioning the polishing body 7. I do.
When the protruding portion of the polishing body 7 does not face the dresser region 31a, the controller 24 reduces the relative speed between the protruding portion of the polishing body 7 and the portion of the guide member 5 facing the protruding portion of the polishing body 7. For example, the motor 21 is controlled so as to satisfy Equation 1 described above.

If necessary, the dresser region 31
In order for the conditioning by a to work on the entire surface of the polishing body 7, the polishing body 7 is increased so that the amount of protrusion of the polishing body 7 increases, for example, once every several periods.
Swinging in the direction of arrow M may be performed.

According to the present embodiment, the polishing body 7 can be conditioned by the dresser region 31a even during polishing of the wafer 2, so that it is necessary to perform conditioning of the polishing body 7 except during polishing of the wafer 2. Is eliminated, or the frequency of conditioning performed at times other than during polishing is reduced, and the throughput of polishing the wafer 2 is improved.

The control section 24 may always control the motor 21 so as to satisfy, for example, Equation (1). Also,
In the first embodiment, a part of the guide surface 5a may be a dresser 31a. Even in these cases, conditioning of the polishing body 7 is performed to some extent by the dresser region 31a, the frequency of conditioning performed at times other than during polishing is reduced, and the throughput of polishing the wafer 2 is improved.

In this embodiment, a part of the guide surface 5a of the guide member 5 is used as the dresser region 31a. However, the entire guide surface 5a of the guide member 5 may be used as the dresser region. In this case, the guide member 5 may be constituted only by the dresser. When the entire guide surface 5a of the guide member 5 is used as a dresser region, the control unit 24 normally controls the motor 21 so as to satisfy the above-described Formula 1, for example, and controls the relative speed between the dresser region and the polishing body 7. The motor 21 may be controlled so that the relative speed between the dresser region and the polishing body 7 becomes a speed suitable for conditioning, at a minimum or when necessary.

Further, in this embodiment, it is possible to remove the bearing 12 and fix the guide member 5 to the member.

[Fourth Embodiment]

FIG. 8 is a schematic enlarged sectional view schematically showing a main part of a polishing apparatus according to a fourth embodiment of the present invention.
This corresponds to FIG. 2 described above. FIG. 9 is an exploded perspective view showing a main part of the polishing apparatus according to the present embodiment. Note that the upper and lower sides in FIG. 9 are opposite to the upper and lower sides in FIG. 8, but the following description is based on the upper and lower sides in FIG. 8. FIG.
FIG. 5 is a diagram illustrating a driving circuit 50 of the piezoelectric element 40 and a state of excitation. FIG. 11 is a waveform diagram showing an example of a voltage applied to the piezoelectric element 40. FIG. 12 is an explanatory diagram showing the state of excitation. 8 and 9, the same or corresponding elements as those in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description will be omitted.

The present embodiment is different from the first embodiment only in the points described below.

In the present embodiment, a piezoelectric element 40 is added as an exciting section for exciting the guide member 5 so that the guide surface 5a of the guide member 5 is formed with irregularities due to vibration. The piezoelectric element 40 includes a ring-shaped piezoelectric body 41 whose polarization direction is indicated by an arrow X in FIG. 9, one ring-shaped ground electrode plate 42, and eight A-phase electrode plates. 43A and eight B-phase electrode plates 43B.

On the lower surface of the guide member 5, a piezoelectric body 42 is provided.
It is bonded coaxially to the guide member 5 via the ground electrode plate 42. The ground electrode plate 42 has a brush portion 42 a that slides on a slip ring 44 fixed coaxially with the holding portion 3 at an appropriate position of the member 13. Of the 16 regions obtained by dividing the lower surface of the piezoelectric body 41 into 16 equal parts in the circumferential direction,
An A-phase electrode plate 43A is bonded to every other eight regions 41A, and a B-phase electrode plate 43B is bonded to the remaining eight regions 41B. Electrode plate 4
3A is a brush part 43a that slides on a slip ring 45 fixed coaxially with the holding part 3 at another appropriate position of the member 13.
have. The electrode plate 43B is provided with a slip ring 4 coaxially fixed to the holding portion 3 at another appropriate position of the member 13.
6 is provided with a brush portion 43b that slides on the brush portion 6. A
The phase electrode plate 43A and the B-phase electrode plate 43B are not electrically short-circuited to each other.

In the present embodiment, the piezoelectric element 40 is mounted on the bearing 1 via ring-shaped mounting members 47 and 48 which are arranged coaxially with the holding portion 3 on the inner and outer peripheral sides, respectively.
2, 49, respectively. Mounting member 4
Reference numerals 7 and 48 are fixed to the inner peripheral position and the outer peripheral position of the lower surface of the electrode plates 43A and 43B, respectively. In the present embodiment, in addition to the bearing 12, a bearing 49
Is added to make the guide member 5 more stable,
This is for rotatably supporting the holding unit 3 coaxially, but it is not always necessary to add the bearing 49.

In the present embodiment, as the material of the guide member 5, it is preferable to use a material having excellent wear resistance and suitable for excitation, for example, a zirconia-based or alumina-based ceramic.

FIG. 10 shows the guide member 5 and the piezoelectric element 40.
Are developed along the circumferential direction, and the piezoelectric element 4
1 shows an example of a drive circuit 50 that drives 0.

In the present embodiment, the drive circuit 50 is composed of an AC power supply 51 and a phase shifter 52 for shifting the output voltage of the AC power supply by 180 ° and outputting it. Then, the drive circuit 50 applies the electrodes 42, 43A, 43B to the electrodes 42, 43A, 43B via the slip rings 44 to 46 (not shown in FIG. 10).
0, an AC voltage Va shown in FIG. 11A is applied between each electrode 43A and the electrode 42, and an AC voltage Va shown in FIG. 11B is applied between each electrode 43B and the electrode 42. Is applied. The frequencies of the AC voltages Va and Vb are set equal to the eighth-order bending mode frequency so that the eighth-order bending mode of the ring-shaped member constituted by the guide member 5 and the piezoelectric element 40 is excited. This voltage V
By the application of a and Vb, a standing wave indicated by a broken line curve and a dashed line curve in FIG. 10 is generated on the guide surface 5 a of the guide member 5. FIG. 12A shows the expansion and contraction of the piezoelectric body 41 and the irregularities of the guide surface 5 a of the guide member 5 at the time corresponding to the broken line curve in FIG. 10. FIG.
(B) shows the expansion and contraction of the piezoelectric body 41 and the guide surface 5a of the guide member 5 at the time corresponding to the one-dot chain line curve in FIG.
3 shows the state of unevenness.

As described above, the guide surface 5a of the guide member 5
As a result, the contact area of the guide surface 5a with the polishing body 7 is reduced, and the apparent friction coefficient between the two is significantly reduced. Therefore, according to the present embodiment, abrasion of abrasive body 7 and guide member 5 is further reduced. In addition, a conditioning effect of eliminating clogging of the polishing body 7 can be obtained by the minute ultrasonic vibration. The guide member 5 may be excited by the piezoelectric element 40 only for the purpose of obtaining this effect. In this case, the excitation may not always be performed during the polishing of the wafer 2 but may be performed only when a conditioning effect is to be obtained.

The guide surface 5a is not a standing wave but a
For example, a similar effect can be obtained by generating a traveling wave.
In order to generate a traveling wave, for example, a phase shifter that shifts the phase by 90 ° may be used instead of the phase shifter 52 that shifts the phase by 180 °.

In the present embodiment, the bearings 12, 49
, And is rotatably supported independently of the holding portion 3 coaxially with the holding portion 3.
For example, the attachment members 47 and 48 may be fixed to the member 13 by removing 49. Even in this case, since the contact area of the guide surface 5a with the polishing body 7 is reduced by the standing wave, the effect of reducing the wear of the polishing body 7 and the guide member 5 can be obtained, and the above-described conditioning effect can be obtained. Can also be obtained.

Since the piezoelectric element 40 is provided between the guide member 5 and the bearings 12, 49 as described above, the DC voltage Vx is applied between the electrodes 43A, 43B and the electrode 42, respectively. When applied, the voltage V
The volume changes according to x, and the height of the guide surface 5a becomes a height corresponding to the voltage Vx.

Therefore, voltages Va and Vb shown in FIGS. 13A and 13B, which correspond to voltages obtained by adding the DC voltage Vx to the AC voltage shown in FIGS.
If the voltage is applied between each electrode 43A and the electrode 42 and between each electrode 43B and the electrode 42, and the magnitude of the DC voltage Vx can be adjusted by a variable resistor or the like (a circuit for realizing this). The configuration itself is well known.), And the height of the guide surface 5a of the guide member 5 can be adjusted very easily. For this reason, even if the guide member 5 is worn out over a long period of use and needs to be readjusted in the height direction, the adjustment becomes extremely simple.

When the piezoelectric element 40 is used only for the purpose of adjusting the height, the electrodes 43A and 42
14 and between each electrode 43B and the electrode 42.
(A) It is sufficient to apply DC voltages Va and Vb that can be adjusted in level and do not include an AC component as shown in (b). In this case, it is not necessary to divide the electrode into eight electrodes 43A and eight electrodes 43B, and it is needless to say that one electrode may be used instead.

The second embodiment can be modified by adding a motor 21 for driving the guide member 5 to the first embodiment.
Similarly to the embodiment described above, a motor for driving the guide member 5 may be added to the present embodiment.

In the present embodiment and each of the above-described modifications, a part of the guide surface 5a of the guide member 5 and the entire guide surface 5a of the guide member 5 are similar to the third embodiment. May be a dresser area.

[Fifth Embodiment]

FIG. 15 is a schematic sectional view schematically showing a polishing apparatus according to a fifth embodiment of the present invention at the time of polishing. 15, the same or corresponding elements as those in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description will be omitted. In FIG. 15, the abrasive supply unit 4 is not shown.

This embodiment differs from the first embodiment only in the points described below. In the present embodiment, the positional relationship between holding unit 3 holding wafer 2 and polishing member 1 is upside down. The holding unit 3 has a flexible support mechanism 71 having an angle following property, and the held wafer 2 is freely supported in the tilt direction.

The polishing member 1 is moved by a mechanism (not shown).
It can be rotated as shown by an arrow N 'in FIG. The holding section 3 is moved by a mechanism not shown in FIG.
As shown by arrows J ′, K ′, and M ′ in the middle, the apparatus can rotate, move up and down, and swing right and left (reciprocate). When the wafer 2 is polished, a part of the wafer 2 temporarily protrudes from the polishing body 7 to the periphery thereof as shown in FIG. .

The guide member 5 is disposed around the polishing body 7 so that the protruding portion of the wafer 2 that protrudes from the polishing body 7 during polishing of the wafer 2 is supported by the guide surface 5a. When the wafer 2 is polished, the polishing body 7 is deformed by the pressure of the wafer 2 and the height of the polished surface of the polishing body 7 is reduced. Is set so as to substantially coincide with the height of the polished surface. That is, the guide surface 5a of the guide member 5
Are located substantially in the same plane as the polished surface of the polishing body 2 when the wafer 2 is polished. In the present embodiment, when the wafer 2 protrudes from the polishing body 2, the wafer 2 smoothly moves onto the guide surface 5 a of the guide member 5.
A chamfered portion 5b is formed on the upper inner peripheral side of the guide member 5.

The guide member 5 is rotatably supported similarly to the first embodiment. However, the guide member 5 is attached via a bearing 12 to a member 72 which rotatably supports the polishing member 1. Thereby, it is possible to freely move (in this embodiment, freely rotatable coaxially with the polishing body 7) independently of the polishing body 7 in a predetermined direction substantially in the same plane as the polishing surface of the polishing body 7 when polishing the wafer 2. Supported.

If the guide member 5 is not provided, if the wafer 2 protrudes from the polishing body 7, the angle followability of the support mechanism 71 of the holding unit 3 is backfired, and as a result, the wafer 2 is tilted toward the protruding side. The desired polishing is not performed.

On the other hand, in the present embodiment, the wafer 2
During the polishing, the protruding portion of the wafer 2 protruding from the polishing body 2 to the periphery thereof is supported by the guide member 5, so that a state substantially equivalent to a state in which the wafer 2 does not protrude from the polishing body 7 is realized. Is uniformly polished.

In this embodiment, the guide member 5
Is rotatably supported independently of the holding portion 3 coaxially with the polishing body 7, and therefore has the advantage that the abrasion of the guide member 5 is remarkably suppressed as in the first embodiment. Can be However, in the present invention, the guide member 5 may be fixed to the member 72 or may be fixed to the polishing member 1.

In this embodiment, since the guide member 5 supports the protruding portion of the wafer 2 instead of the protruding portion of the polishing body 2, the guide member 5 is made of a material having high wear resistance such as ceramics. It is preferable to use a material that is softer, has a lower coefficient of friction, and has excellent chemical resistance among resins, such as resin-based PTFE (polytetrafluoroethylene) and PEEK (polyetheretherketone).

The second embodiment is modified by modifying the first embodiment.
By modifying the fifth embodiment in the same manner as in the fourth to fourth embodiments and their modifications (except for the dresser), still another embodiment of the present invention is provided. Various embodiments can be obtained.

The embodiments of the present invention and their modifications have been described above, but the present invention is not limited to these.

[0114]

As described above, according to the present invention,
The problem of the polishing body such as the polishing pad protruding from the object to be polished to the periphery thereof can be eliminated by supporting the protruding portion with the guide member, and the wear of the guide member and the polishing body can be reduced.

Further, according to the present invention, the problem of the polishing body protruding from the object to be polished to the periphery thereof is solved by supporting the protruding portion with the guide member, and adjusting the height of the guide member. Can be easily performed.

Further, according to the present invention, the problem of the polishing body protruding from the object to be polished to the periphery thereof is solved by supporting the protruding portion with the guide member.
During polishing of the object to be polished, a conditioning effect of the polished body can be obtained to some extent, and the polishing throughput of the object to be polished can be improved.

Further, according to the present invention, the problem of the object to be polished protruding from the polishing body to the periphery thereof can be solved by supporting the protruding portion with the guide member.

Further, according to the present invention, the problem of the object to be polished protruding from the polishing body to the periphery thereof is eliminated by supporting the protruding portion with the guide member, and the wear of the guide member is reduced. be able to.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view schematically showing a state during polishing of a polishing apparatus according to a first embodiment of the present invention.

FIG. 2 is an enlarged view of the vicinity of a portion C in FIG.

FIG. 3 is a view taken along the line D-D 'in FIG.

FIG. 4 is a schematic plan view showing a comparative example.

FIG. 5 is a schematic enlarged sectional view schematically showing a main part of a polishing apparatus according to a second embodiment of the present invention.

FIG. 6 is an exploded perspective view schematically showing a main part of a polishing apparatus according to a third embodiment of the present invention.

FIG. 7 is a schematic plan view showing a polishing apparatus according to a second embodiment of the present invention.

FIG. 8 is a schematic enlarged sectional view schematically showing a main part of a polishing apparatus according to a fourth embodiment of the present invention.

FIG. 9 is an exploded perspective view showing a main part of a polishing apparatus according to a fourth embodiment of the present invention.

FIG. 10 is a diagram showing a driving circuit of a piezoelectric element and a state of excitation.

FIG. 11 is a waveform chart showing an example of a voltage applied to a piezoelectric element.

FIG. 12 is an explanatory diagram showing a state of excitation.

FIG. 13 is a waveform chart showing another example of the voltage applied to the piezoelectric element.

FIG. 14 is a waveform chart showing still another example of the voltage applied to the piezoelectric element.

FIG. 15 is a schematic cross-sectional view schematically showing a polishing apparatus according to a fifth embodiment of the present invention at the time of polishing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Polishing member 2 Wafer 3 Holding part 4 Abrasive supply part 5 Guide member 5a Guide surface 6 Polishing surface plate 7 Polishing body (polishing pad) 12,49 Bearing 21 Motor 22,23 Gear 24 Motor control unit 31 Dresser 31a Dresser area 40 Piezoelectric element 41 Piezoelectric body 42 Grounding electrode plate 43A A-phase electrode plate 43B B-phase electrode plate 44, 45, 46 Slip ring 50 Drive circuit 51 AC power supply 52 Phase shifter

Claims (17)

[Claims] 1. A polishing body comprising: a polishing body; and a holding portion for holding an object to be polished. A polishing apparatus for polishing the object to be polished by applying a load between the object and the object to be polished, comprising: a guide surface positioned substantially in the same plane as the surface to be polished of the object to be polished; A guide member that supports the protruding portion of the polishing body that protrudes from the object to be polished to the periphery at the time of polishing the object with the guide surface, wherein the guide member is in a plane substantially parallel to the polishing surface of the object to be polished. A polishing apparatus characterized in that the polishing apparatus is supported movably independently of the holding section in a predetermined direction. 2. The polishing apparatus according to claim 1, wherein the guide member is supported so as to be freely rotatable about the same axis as the rotation axis of the holding portion independently of the holding portion. 3. The polishing apparatus according to claim 1, wherein the guide member is driven by the protruding portion by a frictional force received from the protruding portion. 4. The polishing apparatus according to claim 1, further comprising an actuator for driving said guide member. 5. The control device according to claim 4, further comprising a control unit that controls the actuator such that a relative speed between the protruding portion and a portion of the guide member facing the protruding portion decreases. Polishing equipment. 6. The polishing apparatus according to claim 1, further comprising: an excitation unit that excites the guide member so that the guide surface is formed with irregularities due to vibration. 7. An element causing a volume change in accordance with an applied electric signal, wherein the relative height of the guide surface with respect to the polished surface of the object to be polished is changed according to the volume change of the element. The polishing apparatus according to claim 1, wherein the polishing apparatus is provided so as to change. 8. The polishing apparatus according to claim 1, wherein at least a part of the guide surface is a dresser region where conditioning of the polishing body is possible. 9. A polishing body comprising: a polishing body; and a holding portion for holding the polishing object, wherein the polishing body and the polishing object are interposed in a state where an abrasive is interposed between the polishing body and the polishing object. A polishing apparatus for polishing the object to be polished by applying a load between the object and the object to be polished, comprising: a guide surface positioned substantially in the same plane as the surface to be polished of the object to be polished; A guide member that supports the protruding portion of the polishing body that protrudes from the object to be polished to the periphery thereof during polishing of the object, on the guide surface; A polishing apparatus, comprising: an excitation unit that excites a member. 10. An element for causing a volume change in accordance with an applied electric signal, wherein the element has a relative position with respect to the guide surface with respect to a polishing surface of the object to be polished in accordance with the volume change of the element. The polishing apparatus according to claim 9, wherein the excitation unit includes an electromechanical energy conversion element that also serves as the element. 11. A polishing body comprising: a polishing body; and a holding portion for holding the polishing object, wherein the polishing body and the polishing object are interposed in a state where an abrasive is interposed between the polishing body and the polishing object. A polishing apparatus for polishing the object to be polished by applying a load between the object and the object to be polished, comprising: a guide surface positioned substantially in the same plane as the surface to be polished of the object to be polished; A guide member for supporting the protruding portion of the polishing body protruding from the polishing object to the periphery thereof when polishing the object by the guide surface; and an element for causing a volume change according to an applied electric signal, wherein the element is A polishing apparatus provided so that a relative height of the guide surface with respect to a polishing surface of the object to be polished changes according to a volume change of the element. 12. A polishing body comprising: a polishing body; and a holding portion for holding the polishing object, wherein the polishing body and the polishing object are interposed in a state where an abrasive is interposed between the polishing body and the polishing object. A polishing apparatus for polishing the object to be polished by applying a load between the object and the object to be polished, comprising: a guide surface positioned substantially in the same plane as the surface to be polished of the object to be polished; A guide member that supports the protruding portion of the polishing body that protrudes from the polishing object to the periphery when polishing the object by the guide surface, wherein at least a part of the guide surface of the guide member is conditioned by the polishing body. A polishing apparatus characterized by being a possible dresser area. 13. An actuator for driving the guide member, wherein the guide member is supported movably independently of the holding portion in a predetermined direction in a plane substantially parallel to a polishing surface of the object to be polished, and drives the guide member. A control unit that controls the actuator such that when the protruding portion and the dresser region face each other, the relative speed between the protruding portion and the dresser region becomes a speed suitable for conditioning the polishing body. 13. The polishing apparatus according to claim 12, wherein: 14. The actuator according to claim 1, wherein, when the protruding portion and the dresser region do not face each other, the controller reduces the relative speed between the protruding portion and a portion of the guide member that faces the protruding portion. The polishing apparatus according to claim 13, wherein the polishing is controlled. 15. The polishing device according to claim 13, wherein the guide member is supported so as to be freely rotatable about the same axis as the rotation axis of the holding portion independently of the holding portion. apparatus. 16. A polishing body comprising: a polishing body; and a holding portion for holding a polishing object, wherein the polishing body and the polishing object are interposed in a state where an abrasive is interposed between the polishing body and the polishing object. A polishing apparatus for polishing the object to be polished by applying a load between them and moving relative to each other, wherein a guide surface located substantially in the same plane as the polished surface of the polished body when polishing the object to be polished And a guide member for supporting, by the guide surface, a protruding portion of the polishing object that protrudes from the polishing body to the periphery when the polishing object is polished. 17. The polishing apparatus according to claim 17, wherein the guide member is supported movably independently of the polishing body in a predetermined direction substantially in the same plane as the polishing surface of the polishing body when polishing the object to be polished. Polishing equipment.