JP2003257901A - Edge polishing device and edge polishing method for device wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To finish the polishing of an edge composed of an upper edge, a lower edge, and an outer circumferential face efficiently, in a short period of time and almost simultaneously, and moreover, to prevent a mutual interference between polishing members for the upper edge, and to reduce the installation area of a polishing device. <P>SOLUTION: This polishing device 10A comprises a pair of upper edge polishing members 13a, 13a' which are arranged to be opposed to each other interposing a chuck means 12 and can be reciprocated in such a manner that they are mutually shifted along the slope of the upper edge 2a of a rotating work 1, a lower edge polishing member 13b which is arranged between the upper edge polishing members 13a, 13a' and can be reciprocated along the slope of the lower edge 2b, and an outer circumferential face polishing member 14a which is arranged between the upper edge polishing members 13a, 13a' and can be reciprocated along the axis of the work 1. Each polishing member is equipped with a loading means 28 for adding polishing pressure. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device wafer edge polishing apparatus and polishing method for polishing the outer periphery of a disk-shaped workpiece such as a semiconductor wafer.

[0002]

2. Description of the Related Art A semiconductor wafer has a disk shape, and has front and back planes, a cylindrical outer peripheral surface, and inclined surfaces commonly called edges formed on both sides of the outer peripheral surface. In manufacturing a semiconductor, a step of removing a film such as a resist film or a metal film formed on the surface of a wafer is repeated. The film is formed not only on the wiring pattern surface but also on the entire wafer including the outer peripheral surface on the outside of the pattern and the front and back edge surfaces. The film formed on the outer side of the pattern does not itself form a semiconductor device, but is peeled off and dust is generated in each step and the yield is lowered, so that the film is removed in advance.

The inventor previously filed Japanese Patent Application No. 2000-33930.
As shown in Fig. 5, a polishing device capable of simultaneously polishing the front and back edges and the outer peripheral surface (hereinafter, simply referred to as edge portion) has been developed. This polishing apparatus includes a front edge polishing member for polishing the front edge and a back edge polishing member for polishing the back edge as a pair, and further, a pair of outer circumferences for polishing the outer peripheral surface. A polishing member for a surface is provided.

Since the edges of a bare wafer, that is, a semiconductor wafer as a raw material on which a pattern, a metal film or a resist film is not formed at all, have the same conditions on both sides, the above polishing apparatus polishes the edge portion of the bare wafer. Suitable for However, in the device wafer as shown in FIG. 7, that is, in the wafer on which these films R are formed, the film R is formed not only on the pattern surface but also on the outside thereof due to the film forming method. Then, the thickness t of the film R
However, the front side edge 2a, the back side edge 2b, and the outer peripheral surface 3 are different over the outer region n. FIG. 8 is an enlarged cross-sectional view of the edge portion of the wafer, exaggeratingly showing the distribution of the film thickness t. The front side on which the pattern is formed is shown as the upper side in FIGS. 7 and 8 and in the drawings for the following description.

The film in the region n has to be removed for the above-mentioned reason. However, when the conventional polishing apparatus is used to polish the film, even when the lower edge is completely polished, the upper film is removed. Since the film thickness is thick, the polishing of the upper edge is not completed yet. Therefore, it takes time to polish the film at the edge portion so as to completely polish and remove the film, so that there is a problem that the efficiency is poor. Furthermore, when silicon of a semiconductor wafer is compared with a metal film or a resist film, the effect that silicon generally tends to be more easily polished than this film is added, and when the above polishing apparatus is used, At the lower edge, there was a phenomenon that the silicon portion was excessively polished.

[0006]

SUMMARY OF THE INVENTION The present invention provides a polishing apparatus capable of polishing the upper edge, the lower edge and the outer peripheral surface almost at the same time, and particularly for polishing the edge of a device wafer. Is an issue. Further, in view of this improvement, it is another object of the present invention to provide an edge polishing apparatus for a device wafer in which polishing members do not interfere with each other, and accordingly, the installation area can be reduced accordingly.

[0007]

The above-mentioned problems can be solved by the following means. That is, the solution means of the first invention is a chuck means for chucking a disk-shaped workpiece to rotate it about an axis, and a chucking means for contacting the upper edge of the workpiece in order to polish the inclined upper edge of the workpiece. A pair of upper edge polishing members having arc-shaped working surfaces, and a lower edge polishing member having an arc-shaped working surface that contacts the lower edges of the workpiece in order to polish the inclined lower edges. In a device wafer edge polishing apparatus provided with an outer peripheral surface polishing member having an arc-shaped work surface for polishing the outer peripheral surface of the work, the pair of upper edge polishing members sandwich the chuck means. The lower edge polishing member is disposed at a facing position, and is disposed between the pair of upper edge polishing members so as to face the chuck means. The outer peripheral surface polishing member is provided between the pair of upper edge polishing member is disposed to face the above chuck means,
An edge polishing apparatus for a device wafer, comprising: load means for applying a polishing pressure toward the upper edge, the lower edge and the circumferential surface of the work to the respective polishing members. .

A second solution means of the present invention is a chuck means for chucking a disk-shaped workpiece to rotate it about an axis, and a polishing means for polishing the inclined upper edge of the workpiece. A pair of upper edge polishing members having arc-shaped working surfaces that come into contact with each other, and a lower edge polishing member having an arc-shaped working surface that comes into contact with the lower edges for polishing the inclined lower edge of the work. And an outer peripheral surface polishing member having an arc-shaped work surface for polishing the outer peripheral surface of the work, in a device wafer edge polishing apparatus, the pair of upper edge polishing members sandwich the chuck means. Are arranged at opposite positions and are movable along the inclination of the upper edge of the work, and the lower edge polishing member is a pair of upper edge polishing members. It is arranged between the members and toward the chuck means, and is movable along the inclination of the lower edge of the work, and the polishing member for the outer peripheral surface is the pair of upper edges. Are arranged between the polishing members for use in the chuck, and are movable toward the chuck means, and are movable along the axis of the chuck means. The device wafer edge polishing apparatus is provided with a load means for applying a polishing pressure to the respective polishing members.

A third means of solving the problem is a chuck means for chucking a disk-shaped workpiece to rotate it about an axis, and a polishing means for polishing the inclined upper edge of the workpiece. A pair of upper edge polishing members having arc-shaped working surfaces that come into contact with each other, and a lower edge polishing member having an arc-shaped working surface that comes into contact with the lower edges for polishing the inclined lower edge of the work. And an outer peripheral surface polishing member having an arc-shaped work surface for polishing the outer peripheral surface of the work, in a device wafer edge polishing apparatus, the pair of upper edge polishing members sandwich the chuck means. And is capable of reciprocating along the inclination of the upper edge of the work, and the lower edge polishing member is for the pair of upper edges. Be between grinding members, are arranged so as toward the chuck means is reciprocable along the inclination of the lower edge of the workpiece,
The outer peripheral surface polishing member is located between the pair of upper edge polishing members, is arranged to face the chuck means, and is capable of reciprocating along the axis of the chuck means, An edge polishing apparatus for a device wafer, comprising: load means for applying a polishing pressure toward the upper edge, the lower edge and the circumferential surface of the work to the respective polishing members. .

According to a fourth aspect of the present invention, there is provided a chuck means for chucking a disk-shaped workpiece to rotate the disk-shaped workpiece around an axis, and a polishing means for polishing an inclined upper edge of the workpiece. A pair of upper edge polishing members having arc-shaped working surfaces that come into contact with each other, and a lower edge polishing member having an arc-shaped working surface that comes into contact with the lower edges for polishing the inclined lower edge of the work. And an outer peripheral surface polishing member having an arc-shaped work surface for polishing the outer peripheral surface of the work, in a device wafer edge polishing apparatus, the pair of upper edge polishing members sandwich the chuck means. Are arranged at opposite positions, and are capable of reciprocating movements out of phase with each other along the inclination of the upper edge of the work. The polishing member for the outer peripheral surface is disposed between the pair of polishing members for the upper edge and is directed toward the chuck means, and is capable of reciprocating along the inclination of the lower edge of the work. Is disposed between the pair of upper edge polishing members, facing the chuck means, and is capable of reciprocating movement along the axis of the chuck means. The device wafer edge polishing apparatus is provided with a load means for applying a polishing pressure toward the lower edge and the circumferential surface to each of the polishing members.

According to a fifth aspect of the present invention, while the disk-shaped work is chucked and rotated about the axis, the arc-shaped working surfaces of a pair of upper edge polishing members facing each other with the work sandwiched therebetween are set forth above. The inclined upper edge of the work is brought into contact, and the arcuate work surface of the lower edge polishing member is brought into contact with the inclined lower edge of the work between the pair of upper edge polishing members, and the pair of upper sides is provided. Among the edge polishing members, the arc-shaped working surface of the outer peripheral surface polishing member is brought into contact with the outer peripheral surface of the work, and the polishing pressures toward the upper edge, the lower edge and the circumferential surface of the work are respectively adjusted. It is an edge polishing method for a device wafer, which is applied to a polishing member.

According to a sixth aspect of the present invention, while the disk-shaped work is chucked and rotated about the axis, the arc-shaped working surfaces of a pair of upper edge polishing members facing each other with the work sandwiched therebetween are defined as above. The inclined upper edge of the work is brought into contact, and the arcuate work surface of the lower edge polishing member is brought into contact with the inclined lower edge of the work between the pair of upper edge polishing members, and the pair of upper sides is provided. Between the edge polishing members, the arc-shaped work surface of the outer peripheral surface polishing member is brought into contact with the outer peripheral surface of the work, and the polishing pressure toward the upper edge, the lower edge and the circumferential surface of the work is applied to each of the polishing surfaces. While being imparted to the member, the upper edge polishing member, the lower edge polishing member, and the outer peripheral surface polishing member have an inclination of the upper edge of the work and an inclination of the lower edge of the work. , And a device wafer edge polishing method, characterized in that to the reciprocating motion along respective axes of the work.

According to a seventh aspect of the present invention, while the disk-shaped work is chucked and rotated about the axis, the arc-shaped work surfaces of the pair of upper edge polishing members facing each other with the work sandwiched therebetween are defined as above. The inclined upper edge of the work is brought into contact, and the arcuate work surface of the lower edge polishing member is brought into contact with the inclined lower edge of the work between the pair of upper edge polishing members, and the pair of upper sides is provided. Between the edge polishing members, the arc-shaped work surface of the outer peripheral surface polishing member is brought into contact with the outer peripheral surface of the work, and the polishing pressure toward the upper edge, the lower edge and the circumferential surface of the work is applied to each of the polishing surfaces. And a reciprocating motion of the pair of upper edge polishing members that are out of phase with each other along the inclination of the upper edge of the work. The use polishing member and the polishing member for the outer peripheral surface, the inclination of the lower edge of the workpiece, and a device wafer edge polishing method, characterized in that to the reciprocating motion along respective axes of the work.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some preferred embodiments of a device wafer edge polishing apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 is a top view showing a relationship between a work and a polishing member for explaining the outline of the embodiment of the present invention. Here, the term “work” simply means a device wafer.

Example 1 FIG. 2 is a sectional view taken along line AA of FIG. 1 and showing a polishing apparatus 10A of Example 1. As shown in FIG. FIG. 3 shows B of FIG.
FIG. 4B is a cross-sectional view showing the polishing apparatus 10 </ b> A according to the first embodiment, which is a −B cross section.

As shown in FIG. 1, the polishing apparatus 10 of the embodiment.
A is a pair of upper edge polishing members 13a facing each other with the work 1 interposed therebetween, and these upper edge polishing members 13a.
A lower edge polishing member 13b and an outer peripheral surface polishing member 14a, which are arranged so as to face the work, are provided between a and chucking means for chucking the work 1 and rotating the work 1 around the axis L. It has twelve.

The upper edge polishing member 13a removes the film R on the upper edge 2a of the work 1 from the lower edge polishing member 13a.
b is for polishing the film R on the lower edge 2b, and the outer peripheral surface polishing member 14a is for polishing the film R on the outer peripheral surface 3 (FIG. 7).

In the present invention, the "disc-shaped work" is used.
The term includes not only a perfectly circular shape but also a substantially circular shape having a straight portion such as an orientation flat or a notch in a part of the outer circumference. However, polishing of these orientation flat surfaces and notch surfaces is not performed by the polishing apparatus of the present invention, but is performed by another step or a polishing station. Further, the upper edge 2a or the lower edge 2b may not be completely flat when viewed in cross-sectional outline, and may be a curved surface curved in a convex shape.

As shown in FIG. 2, the chuck means 12 has a disk-shaped chuck table 16 having a diameter slightly smaller than that of the work 1. The work 1 is placed on the chuck table 16 by vacuum suction so that the outer circumference of the work 1 is reduced. It can be held horizontally while protruding laterally from the chuck table 16. Due to this holding function, a plurality of suction holes are opened on the upper surface of the chuck table 16, and the suction holes are connected to the vacuum pump (not shown) from the flow path in the support shaft 17 through the connection port 18. Further, the support shaft 17 is
A bearing member 19 is supported on the machine body 11 so as to be rotatable about the vertical axis L, and a motor 20 is driven and rotated at a required speed in forward and reverse directions.

The means for chucking the work 1 on the chuck table 16 is not limited to the vacuum suction as described above, but an electrostatic chuck utilizing the adhesive force due to static electricity or any other suitable method can be used. .

The upper edge polishing member 13a and the lower edge polishing member 13b are formed by forming arc-shaped recesses on a hard base material made of metal, synthetic resin, ceramic or the like, and the inner surfaces of these recesses are flexible. By attaching a certain polishing pad 23, a concave arc-shaped work surface 22 that comes into line contact with the work 1 is formed. This work surface 22 is not a surface of a structure in which a concave groove for polishing is provided along an arc and a work is fitted, but a plurality of slurry grooves are arranged in a direction parallel or oblique to the axis of the polishing member. Even if the flow of the abrasive slurry is improved by providing it, it is not excluded.

As described above, the two upper edge polishing members 13a having substantially the same structure are arranged at the diametrically opposite sides of the workpiece 1 held by the chuck means 12 at the positions opposite to each other. By tilting each axis with respect to the axis L of the work 1, the working surface 22 of each upper edge polishing member 13a is arranged so as to contact the upper edge 2a of the work 1 over the entire width. During polishing, the upper edge 2a is polished with the working surface 22 of the upper edge polishing member 13a in line contact with the upper edge 2a.

The lower edge polishing member 13b is disposed between the two upper edge polishing members 13a and polishes the lower edge 2b in a manner substantially similar to that of the upper edge polishing member 13a.

The arc length of each work surface 22 of the upper edge polishing member 13a and the lower edge polishing member 13b is ¼ of the circumference of the work 1 or less. Desirably, the curvature of the arc of the work surface 22 is formed to be the same as or slightly smaller than the curvature of the circumference of the work 1.

In the polishing apparatus 10A, the upper edge polishing member 13a and the lower edge polishing member 13b are parallel to their axes, that is, in the direction substantially along the inclination of the upper edge 2a and the lower edge 2b. , Respective moving mechanisms 26 for moving, and respective linear guides for movably supporting in a direction perpendicular to the above-mentioned axis, in other words, in a direction approaching and separating from the upper edge 2a and the lower edge 2b of the work. Mechanism 27 and polishing member 13 for each upper edge
a, each of the loading means 28 for applying a polishing load by urging the lower edge polishing member 13b in a direction of contacting the upper edge 2a or the lower edge 2b.

Each moving mechanism 26 moves the upper edge polishing member 13a or the lower edge polishing member 13b to abut or separate from the work 1 at the time of starting or ending the polishing operation, or at the time of polishing. This is for changing the contact position of each polishing member with respect to the work 1. Therefore, the moving mechanism 26 includes the ball screw 3 provided on the bracket 30 provided on the machine body 11 in parallel with the axis of the polishing member.
1, a motor 33 for rotating the ball screw 31 via a timing belt 32, a nut member 34 that is screwed to the ball screw 31 and moves forward and backward by the rotation of the ball screw 31, and an arm for the nut member 34. 35
A movable table 35 that is connected by a and moves together, and a sliding mechanism 36 that movably supports the movable table 35.
And have.

The upper edge polishing member 13a and the lower edge polishing member 13b are placed on the movable table 35.
Are supported via the linear guide mechanism 27. The sliding mechanism 36 includes a rail 36a provided on the bracket 30 in parallel with the ball screw 31, and a slider 36b attached to the movable table 35 and sliding on the rail 36a.

The linear guide mechanism 27 is provided on a holder 39 for holding the upper edge polishing member 13a or the lower edge polishing member 13b, and a rail 27a extending in a direction perpendicular to the axis of each polishing member. It has a slider 27b attached to the movable table 35 and movable on the rail 27a. Contrary to the case described above, the rail 27a and the slider 27b can be provided on the movable table 35 and the slider 27b can be provided on the holder 39.

Further, the loading means 28 is composed of an air cylinder 40, and the air cylinder 40
Is attached to the movable table 35, and the piston rod 40a is connected to the upper edge polishing member 13a or the lower edge polishing member 13b side. Then, compressed air whose pressure is adjusted is supplied to or discharged from the air cylinder 40 to extend or shorten the piston rod 40a, and each polishing member is pressed against the work 1, so that each polishing member and the work 1 are pressed by the adjusted air pressure. It is configured so that a required polishing load is applied between and.

2, the upper edge polishing member 13a and the lower edge polishing member 13b rotate the ball screw 31 in the moving mechanism 26 to move rightward or leftward along their respective axes. Thus, the position on the work surface 22 with which the work 1 comes into contact can be appropriately changed during polishing or at the start of polishing. In this case, in the load means 28, the air cylinder 40 is controlled according to the movement of each polishing member, and the expansion / contraction length of the piston rod 40a is adjusted so that a required polishing load can be obtained.

At the start and end of the polishing operation,
Move the upper edge polishing member 13a to the right (in FIG. 2).
Further, by moving the lower edge polishing member 13b to the left (in FIG. 2), these polishing members can be separated from the work 1 and the work 1 can be supplied to and taken out from the chuck means 12. . in this case,
Lower edge polishing member 13b that abuts the lower edge 2b
Either remain in their position or load means 28
Even if the piston rod 40a is shortened so as to be separated from the lower edge 2b, and only the upper edge polishing member 13a contacting the upper edge 2a is moved to a position away from the work 1 by operating the moving mechanism 26. Good.

On the other hand, as shown in FIG. 3, the outer peripheral polishing member 14a has a work surface 4 having substantially the same structure as the upper edge polishing member 13a and the lower edge polishing member 13b.
2, that is, it has a concave arc-shaped work surface 42 having a surface on which a concave groove for polishing is not formed. The outer peripheral surface polishing member 14a is arranged between the two upper edge polishing members 13a at a position different from the above by approximately 90 degrees, with the axis line parallel to the axis line L of the work 1. The outer peripheral surface 3 of the work 1 is abutted at a right angle so as to come into line contact with the work 1 and is polished.

The length of the arc of the working surface 42 of the outer peripheral surface polishing member 14a is 1/4 of the circumference of the work 1.
Or less, and the work surface 4
The curvature of the circular arc 2 is preferably the same as the curvature of the circumference of the work 1, but may be slightly smaller than that.

The outer peripheral surface polishing member 14a includes a moving mechanism 43 for moving each polishing member in parallel with each axis, and a linear guide mechanism 44 for supporting the polishing member so as to be movable in a direction perpendicular to the axis. , Each polishing member work 1
And a loading means 45 for applying a polishing load by urging it in the direction of abutting.

Of these, the moving mechanism 43 includes a ball screw 47 extending parallel to the axis of the outer peripheral surface polishing member 14a.
A motor 48 that rotates the ball screw 47, a movable table 49 that supports the ball screw 47 and the motor 48, and a nut member 50 that is screwed to the ball screw 47 and moves forward and backward by the rotation of the ball screw 47.
A supporting member 51 connected to the nut member 50 and moving together, and a sliding mechanism 52 for guiding the movement of the supporting member 51. The supporting member 51 has an outer peripheral surface polishing member 14a. Are attached via a holder 53.

The sliding mechanism 52 includes a rail 52a provided on the movable table 49 in parallel with the ball screw 47,
The slider 52b is attached to the support member 51 and slides on the rail 52a.

The linear guide mechanism 44 is mounted on the machine body 11 and extends in a direction perpendicular to the axis of the outer peripheral surface polishing member 14a, and is mounted on the movable table 49 so as to be movable on the rail 44a. Slider 44b of.

The load means 45 comprises an air cylinder 54.
The air cylinder 54 is attached to the machine body 11, the piston rod 54a is connected to the movable table 49, and a required polishing load is applied between the outer peripheral surface polishing member 14a and the work 1 by air pressure. It is designed to let you.

The polishing apparatus 10A operates as follows. In transporting the work 1 onto the chuck table 16 by a transport device (not shown), each polishing member (two upper edge polishing members 13a, lower edge polishing member 13b, and outer peripheral surface polishing member 14a) is moved by each movement. Mechanism 26, sliding mechanism 5
2. The linear guide mechanism 27 and the load means 45 are operated to retract the chuck table 16 from the chuck table 16. The rotation of the chuck table 16 is stopped. When the work 1 is placed on the chuck table 16 so that the conveyance device aligns the centers, the chuck table 16 vacuum-sucks and holds the placed work 1.

While the slurry is supplied to the upper surface of the work 1 from a slurry supply device (not shown), the motor 20 is activated and the work 1 starts rotating. The moving mechanisms 26, the sliding mechanism 52, the linear guide mechanism 27, and the load means 45 operate so that the retracted polishing members move to the position where they contact the work 1. When each polishing member comes into contact with the work 1, the air pressure of the air cylinders 40 and 54 is adjusted and changed (or the pressure as it is), and the polishing pressure is continuously applied. At the same time, the speed of the motor 33, 48
The speed is changed so that the contact position of each polishing member with respect to the work 1 is changed every moment. Since the contact position with respect to each polishing member moves with the rotation of the motor, the rotation direction is reversed so as to turn back when reaching the end of each polishing member. By this operation, since each polishing member reciprocates with a constant stroke, uneven wear of each polishing member is prevented.

After completion of polishing, each polishing member is separated from the work 1 and replaced with a new work by the transfer device, and the above-described operation is repeated. The basic operation is as described above.

Since the upper edge 2a is polished by the two upper edge polishing members 13a, even if the film R on the upper edge 2a is thick, the polishing is completed almost simultaneously with the outer peripheral surface 3 and the lower edge 2b, and that much. The polishing time can be shortened and the work efficiency can be improved.

Since the two upper edge polishing members 13a are both on the upper side of the work 1 and in positions facing each other, a large stroke is required depending on the conditions, and the two upper edge polishing members 13a interfere with each other. To do. In order to avoid the occurrence of this interference, the phases of the reciprocating motions of the upper edge polishing member 13a can be shifted from each other.

That is, as shown in FIG. 6, the motor 33 is controlled so that when one of the upper edge polishing members 13a is raised, the other upper edge polishing member 13a is lowered. As a result, the two upper edge polishing members 13
Since a does not exist at the rising end at the same time, mutual interference does not occur. On the contrary, by adopting such a control method, in the case of the same stroke, the space at the stroke rising end can be shared by the two upper edge polishing members 13a, so the overall structure of the polishing apparatus 10A. There is an advantage that the width (in particular, the left and right width in FIG. 2) can be reduced.

Embodiment 2 FIG. 4 is a sectional view taken along line AA of FIG. 1 and showing a polishing apparatus 10B of Embodiment 2. As shown in FIG. FIG. 5 is a cross-sectional view taken along the line BB of FIG. 1 and showing the polishing apparatus 10B of the second embodiment. This polishing apparatus 10B is the first
The difference from the polishing apparatus 10A of the embodiment is that the loading means 28 and 45 in each polishing system are composed of weights.

That is, in the case of the load means 28 in the edge polishing system shown in FIG. 4, one end of the string 57 is connected to the holder 39 which supports the upper edge polishing member 13a, and the other end of the string 57 is linear. Rail 27a of guide mechanism 27
After extending diagonally downward in parallel with the bracket 30,
A weight 59 is hung on a lower end of the pulley 59 so that the weight 59 can be adjusted by being wound around a pulley 58 attached to the.

The weight of the weight 59 urges the upper edge polishing member 13a obliquely downward along the rail 27a to set the polishing load.

On the other hand, in the lower edge polishing member 13b, the string 57, one end of which is connected to the holder 39, is guided obliquely upward in parallel with the rail 27a of the linear guide mechanism 27, and then, is attached by the bracket 61. It is wound around a pulley 58 supported on the machine body 11 and turns downward, and a weight 59 is hung at the lower end thereof. Due to the gravity of the weight 59, the lower edge polishing member 13
A required polishing load is applied by biasing b upward obliquely.

Further, in the load means 45 of the polishing system for the outer peripheral surface, as shown in FIG. 5, one end of the string 57 is connected to the end face of the movable table 49, and the other end of the string 57 is once held by the chuck means 12. After extending horizontally toward the side, it is wound around a pulley 58 on the machine body 11 to change its direction downward, and a weight 59 is suspended at the lower end thereof. The weight of the weight 59 urges the movable table 49 toward the work 1 to apply a required polishing load.

When the weight means 28, 45 are constituted by the weights 59 as described above, the upper edge polishing member 13a, the lower edge polishing member 13b and the outer peripheral surface polishing member 14a are separated from the work 1 during non-polishing. For automation, it is necessary to attach a mechanism for retracting the holder 39 and the movable table 49 by a certain distance so that the holder 39 and the movable table 49 can be held at the above positions.

As in the case of the first embodiment, it is possible to prevent mutual interference and reduce the overall structure of the polishing apparatus 10B by shifting the phases of the reciprocating motions of the two upper edge polishing members 13a from each other. is there.

Since the structure and operation of the second embodiment other than those described above are substantially the same as those of the first embodiment, the same reference numerals as those in the first embodiment are used for the same major components and the description thereof is omitted. To do.

The polishing pad 2 attached to the work surface 22 of the upper edge polishing member 13a and the lower edge polishing member 13b.
By using a polishing member having a suitable thickness and flexibility as 3, it is possible to share a part of the polishing of the outer peripheral surface 3 with these polishing members. The upper edge 2a, the lower edge 2b, and the outer peripheral surface 3 can be properly used depending on the conditions such as the film thickness t or the contact line length of each polishing member.

The polishing pad 23 attached to the work surface of each polishing member has not only a single-layer structure in which it is directly attached to the base material but also a two-layer structure including an elastic sheet layer made of synthetic rubber or sponge. It can be structured. Further, the cross-sectional shape of the work surface of each polishing member is not limited to an arc shape, but deviates from an arc, such as a part of an ellipse,
It may have an arcuate cross-sectional shape having a concave curved surface shape.

In the polishing apparatus of the embodiment, the work 1 is chucked horizontally and rotated about the vertical axis L, but the rotation axis may be horizontal or may be another direction. It is possible.

In the polishing apparatus shown in the above two embodiments,
The upper edge, the lower edge, and the outer peripheral surface can be completely polished at the same time, and mutual interference between the upper edge polishing members can be prevented. Therefore, the installation area of the polishing apparatus can be reduced and the size can be reduced.

[0057]

As described above, according to the present invention, a polishing member having an arc-shaped working surface is used, and the working member is tilted with respect to the axis of the work which is a device wafer. Since the outer peripheral edge is brought into contact with the outer peripheral edge and the outer peripheral edge is polished in this state, the polishing member can be reliably pressed against the edge with a required force and can be brought into line contact, thereby shortening the edge portion. The effect is that polishing can be performed efficiently and reliably in time. Further, the upper edge, the lower edge, and the outer peripheral surface can be polished almost at the same time, and further, mutual interference of the polishing members for the upper edge can be prevented. Has the effect of doing.

[Brief description of drawings]

FIG. 1 is a top view showing a relationship between a work and a polishing member for explaining an outline of an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 and showing the polishing apparatus 10A of the first embodiment.

FIG. 3 is a cross-sectional view taken along the line BB of FIG. 1, showing the polishing apparatus 10A of the first embodiment.

FIG. 4 is a cross-sectional view taken along the line AA of FIG. 1 and showing a polishing apparatus 10B of Example 2.

5 is a cross-sectional view taken along the line BB of FIG. 1, showing the polishing apparatus 10B of the second embodiment.

FIG. 6 is an explanatory diagram showing reciprocating movements of two upper edge polishing members 13a.

FIG. 7 is a wafer and a partial sectional view thereof.

FIG. 8 is an enlarged cross-sectional view of the edge portion of the wafer showing an exaggerated view of the distribution of the film thickness t.

[Explanation of symbols]

1 work 10A polishing machine 10B polishing machine 11 aircraft 12 Chuck means 13a Upper edge polishing member 13b Lower edge polishing member 14a Abrasive member for outer peripheral surface 16 Chuck table 17 spindle 18 connection ports 19 Bearing member 20 motors 22 Working surface 23 polishing pad 26 Moving mechanism 27 Linear guide mechanism 27a rail 27b slider 28 load means 2a Upper edge 2b lower edge 3 outer peripheral surface 30 brackets 31 ball screw 32 Timing belt 33 motor 34 Nut member 35 movable table 35a arm 36 Sliding mechanism 36a rail 36b slider 39 holder 40 air cylinder 40a piston rod 42 Working surface 43 Moving mechanism 44 Linear guide mechanism 44a rail 44b slider 45 load means 47 ball screw 48 motor 49 movable table 50 Nut member 51 support member 52 Sliding mechanism 52a rail 52b slider 53 holder 54 air cylinder 54a Piston rod 57 strings 58 pulley 59 Weight

Claims (7)

[Claims] 1. A chuck means for chucking a disk-shaped workpiece to rotate it about an axis, and an arc-shaped working surface in contact with the upper edge for polishing the inclined upper edge of the workpiece. A pair of upper edge polishing members, a lower edge polishing member having an arc-shaped working surface that contacts the lower edge of the work for polishing the inclined lower edge of the work, and an outer peripheral surface of the work. In a device wafer edge polishing apparatus including an outer peripheral surface polishing member having an arc-shaped working surface for polishing, the pair of upper edge polishing members are arranged at opposing positions with the chuck means interposed therebetween. The polishing member for the lower edge is arranged between the pair of polishing members for the upper edge and faces the chuck means, and the polishing member for the outer peripheral surface is provided. The polishing member is disposed between the pair of upper edge polishing members and is directed toward the chuck means, and the polishing pressure applied to the upper edge, the lower edge and the circumferential surface of the work is applied to each of the polishing members. An edge polishing apparatus for a device wafer, which is provided with a loading means for applying to the device wafer. 2. A chuck means for chucking and rotating a disk-shaped workpiece about an axis, and an arc-shaped working surface in contact with the inclined upper edge of the workpiece for polishing the upper edge. A pair of upper edge polishing members, a lower edge polishing member having an arc-shaped working surface that contacts the lower edge of the work for polishing the inclined lower edge of the work, and an outer peripheral surface of the work. In a device wafer edge polishing apparatus provided with an outer peripheral surface polishing member having an arc-shaped work surface for polishing, the pair of upper edge polishing members are arranged at opposing positions with the chuck means interposed therebetween. Along with it, it is possible to move along the inclination of the upper edge of the work, the lower edge polishing member is between the pair of upper edge polishing members, The polishing member for the outer peripheral surface is arranged so as to face the backing means and is movable along the inclination of the lower edge of the work, and the polishing member for the outer peripheral surface is between the pair of polishing members for the upper edge. , Is arranged so as to face the chuck means, and is movable along the axis of the chuck means, and the polishing pressure toward the upper edge, the lower edge and the circumferential surface of the work is adjusted by each of the polishing means. An edge polishing apparatus for a device wafer, which is provided with a loading means for applying to a member. 3. A chuck means for chucking and rotating a disk-shaped workpiece about an axis, and an arc-shaped working surface in contact with the upper edge for polishing the inclined upper edge of the workpiece. A pair of upper edge polishing members, a lower edge polishing member having an arc-shaped working surface that contacts the lower edge of the work for polishing the inclined lower edge of the work, and an outer peripheral surface of the work. In a device wafer edge polishing apparatus provided with an outer peripheral surface polishing member having an arc-shaped work surface for polishing, the pair of upper edge polishing members are arranged at opposing positions with the chuck means interposed therebetween. Along with the inclination of the upper edge of the work, reciprocating movement is possible, and the lower edge polishing member is between the pair of upper edge polishing members. The polishing member is arranged so as to face the chuck means and is capable of reciprocating along the inclination of the lower edge of the work, and the outer peripheral surface polishing member is between the pair of upper edge polishing members. , Is arranged so as to face the chuck means, and is capable of reciprocating movement along the axis of the chuck means, and the polishing pressure toward the upper edge, the lower edge and the circumferential surface of the work is adjusted to An edge polishing apparatus for a device wafer, characterized in that a load means for applying to the polishing member is provided. 4. A chuck means for chucking a disk-shaped workpiece to rotate it about an axis, and an arc-shaped working surface contacting the upper edge of the workpiece for polishing an inclined upper edge of the workpiece. A pair of upper edge polishing members, a lower edge polishing member having an arc-shaped working surface that contacts the lower edge of the work for polishing the inclined lower edge of the work, and an outer peripheral surface of the work. In a device wafer edge polishing apparatus provided with an outer peripheral surface polishing member having an arc-shaped work surface for polishing, the pair of upper edge polishing members are arranged at opposing positions with the chuck means interposed therebetween. Along with the inclination of the upper edge of the work, reciprocating motions out of phase with each other are possible, and the lower edge polishing member is the pair of upper edge polishing members. It is arranged between the materials and is directed toward the chuck means, and is capable of reciprocating movement along the inclination of the lower edge of the work. It is arranged between the edge polishing members and is directed toward the chuck means, and is capable of reciprocating movement along the axis of the chuck means. The upper edge, the lower edge, and the circumference of the workpiece. An edge polishing apparatus for a device wafer, comprising a load means for applying a polishing pressure toward a surface to each of the polishing members. 5. An arc-shaped working surface of a pair of upper edge polishing members facing each other with the work sandwiched therebetween is contacted with the inclined upper edge of the work while chucking and rotating the disk work around the axis. Then, between the pair of upper edge polishing members, the arc-shaped working surface of the lower edge polishing member is contacted with the inclined lower edge of the work, between the pair of upper edge polishing members, The arcuate work surface of the polishing member for the outer peripheral surface is brought into contact with the outer peripheral surface of the work, and a polishing pressure toward the upper edge, the lower edge and the circumferential surface of the work is applied to each of the polishing members. A method for polishing an edge of a device wafer, comprising: 6. A disk-shaped workpiece is chucked and rotated about an axis, and the arc-shaped working surfaces of a pair of upper edge polishing members facing each other with the workpiece sandwiched are brought into contact with the inclined upper edge of the workpiece. Then, between the pair of upper edge polishing members, the arc-shaped working surface of the lower edge polishing member is contacted with the inclined lower edge of the work, between the pair of upper edge polishing members, The arc-shaped working surface of the polishing member for the outer peripheral surface is brought into contact with the outer peripheral surface of the work, and an upper edge of the work, a lower edge and a polishing pressure toward the circumferential surface are applied to the respective polishing members, The upper edge polishing member, the lower edge polishing member, and the outer peripheral surface polishing member include the upper edge of the work, the lower edge of the work, and the axis of the work. Edge polishing method of the device wafer, characterized in that to the reciprocating motion along each. 7. An arc-shaped work surface of a pair of upper edge polishing members opposed to each other with the work sandwiched therebetween is in contact with the inclined upper edge of the work while chucking and rotating the disk work around the axis. Then, between the pair of upper edge polishing members, the arc-shaped working surface of the lower edge polishing member is contacted with the inclined lower edge of the work, between the pair of upper edge polishing members, The arc-shaped working surface of the outer peripheral surface polishing member is brought into contact with the outer peripheral surface of the work, and an upper edge of the work, a lower edge and a polishing pressure toward the circumferential surface are applied to the respective polishing members. Each of the pair of upper edge polishing members is reciprocally moved out of phase with each other along the inclination of the upper edge of the work, and the lower edge polishing member and the outer periphery are provided. The use abrasive member, the inclination of the lower edge of the workpiece, and the edge polishing method of the device wafer, characterized in that to the reciprocating motion along respective axes of the work.