JPH11262854A - Precisely polishing device and precisely polishing method using thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove micro-unevenness occurring in device forming processes with high precision and improve dressing or conditioning efficiency. SOLUTION: A board station 20 includes a rotary table 7 supported on the rotational shaft 6a of a rotationally driving means 6 in freely equalizing and integrally rotating relation and an oscillation mechanism for oscillating the rotary table 7 to a radial direction. The rotary table 7 is provided with a guide ring 8 arranged on the upper face via an elastic member 9 and having a dresser 8a on the upper face and with a backing material 10 for covering a board holding face. On the other hand, a polishing tool station 21 includes a polishing tool 11 rotated by a polishing tool rotationally driving means 13, a pressure mechanism 14 for moving the polishing tool 11 forward and backward to the board station 20 and a supply path with one end open to the lower face of a polishing pad 12 and the other end selectively connected to a polishing agent supply means 15 and a conditioning liquid supply means 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to Si, GaAs,
A semiconductor wafer such as InP, a quartz or glass substrate having a plurality of island-shaped semiconductor regions formed on a surface thereof (hereinafter, referred to as a “substrate”).
That. ) Relates to a precision polishing apparatus for polishing the surface with high precision.

[0002]

2. Description of the Related Art Ultra-miniaturization and multi-layer wiring of semiconductor devices have advanced, and in particular, it has been required to flatten the surface of the substrate with high precision in a process of manufacturing a semiconductor integrated circuit. As a planarization technique responding to the above, a precision polishing apparatus as described below has been proposed.

FIG. 6 shows an example of a conventional precision polishing apparatus which the present inventor has performed so far. The precision polishing apparatus includes a substrate holding means 103 having a guide ring 107 attached to a substrate holding surface on the lower surface of the figure. Tool 101 having a polishing pad 102 disposed below the substrate holding means 103 in the figure
A polishing agent supply nozzle 104 for supplying an abrasive 105 onto the polishing pad 102; and a brush 106 for dressing or conditioning the polishing pad 102.
3 of the guide ring substrate W ₀ held in the 107 to abut in a state given a predetermined processing pressure, the substrate W ₀ by the polishing tool 101 and the substrate holding means 103 is rotated while supplying an abrasive 105 It is configured to polish a surface.

[0004]

The technique [0005] may, by holding fitted the substrate W ₀ on the inner diameter surface of the guide ring 107 which is attached to the substrate holding means 103, displacement and outer periphery of the substrate W ₀ The occurrence of so-called edge droop, in which the polishing rate of the portion is higher than the polishing rate of the inner portion, can be prevented to some extent. However, on the other hand, it prevents the inflow to the surface of the substrate W ₀ abrasives 105 guide ring 107 is supplied to the polishing pad 102, the abrasive 1 in the surface of the substrate W ₀
There is a problem that the distribution of the particles 05 becomes non-uniform and the polishing cannot be performed uniformly.

Further, since the brush 106 is in contact with a portion of the polishing pad 102 which is separated from the contact portion of the substrate W ₀ , not only the effect of dressing or conditioning is reduced by half, but also the size of the precision polishing apparatus is increased. There is a problem that.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to remove minute irregularities generated in a device forming step or the like with high accuracy and to improve a dressing or conditioning effect. It is an object of the present invention to realize a precision polishing apparatus capable of performing the polishing and a precision polishing method using the precision polishing apparatus.

[0007]

In order to achieve the above object, a precision polishing apparatus according to the present invention comprises a substrate station capable of holding a substrate with its surface to be polished facing upward, and a substrate station above the substrate station. In the precision polishing apparatus having a polishing tool station provided, the substrate station is provided with a rotary table and a guide urged to be always flush with the substrate by an elastic member disposed on an upper surface of the rotary table. A ringer and a dresser concentrically provided on at least a portion of the upper surface of the guide ring, while the polishing tool station comprises:
A polishing tool having a polishing surface having a diameter larger than the diameter of the substrate rotated by the polishing tool rotation driving means, and the polishing tool being integrally moved with the polishing tool rotation driving means to advance and retreat the polishing tool with respect to the substrate station. And a supply path, one end of which is open to the polishing surface of the polishing tool, and the other end of which is connected to a liquid supply means.

The dresser may be hard fine particles attached to the upper surface of the guide ring, or the dresser may be hard brush bristle implanted on the upper surface of the guide ring.

The rotary table may be supported on the rotary shaft of the rotary drive means so as to be able to be equalized and rotate integrally with the rotary table, or a swing table for swinging the rotary table in the radial direction integrally with the rotary drive means. It is assumed that a moving mechanism is provided.

Further, it is assumed that the liquid supply means is divided into an abrasive supply means and a conditioning liquid supply means.

According to a precision polishing method of the present invention, a substrate, which is fitted and held on an inner diameter surface of a guide ring of a rotary table, is rotated and radially integrated with the rotary table using the precision polishing apparatus according to claim 1. While swinging the polishing tool, the polishing tool is rotated while the polishing surface thereof is brought into contact with the surface to be polished of the substrate by applying a predetermined processing pressure, and at the same time, the surface of the substrate and the surface of the polishing tool are polished. A polishing step of performing polishing while supplying an abrasive through a supply path between the polishing surface, and a conditioning liquid instead of the abrasive at a predetermined cycle during the polishing step, the supply path of the substrate from the supply path. A dressing or conditioning step of performing dressing or conditioning by supplying between the surface to be polished and the polishing surface of the polishing tool.

The precision polishing apparatus according to the present invention is a precision polishing apparatus having a substrate station capable of holding a substrate with its surface to be polished facing upward and a polishing tool station disposed above the substrate station. The station is concentrically disposed outside the guide ring and a guide ring which is constantly urged to be flush with the substrate by an elastic member disposed on an upper surface of the rotary table. An outer ring that is moved up and down by up-down driving means, and a dresser provided concentrically on the upper surface of the outer ring, while the polishing tool station is rotated by a polishing tool rotation driving means. A polishing tool having a polishing surface having a diameter larger than the diameter of the substrate; A pressurizing mechanism for moving a tool forward and backward with respect to the substrate station, and a supply path having one end opening to the polishing surface of the polishing tool and the other end connected to liquid supply means. Is what you do.

The dresser may be hard fine particles attached to the upper surface of the outer ring, or the dresser may be hard brush bristles implanted on the upper surface of the outer ring.

Further, the rotary table may be supported on the rotary shaft of the rotary drive means so as to be able to rotate in an equalizable manner and integrally with the rotary drive means, or may be used to swing the rotary table in the radial direction integrally with the rotary drive means. It is assumed that a moving mechanism is provided.

In addition, the liquid supply means is divided into an abrasive supply means and a conditioning liquid supply means.

According to a second aspect of the present invention, there is provided a precision polishing apparatus for rotating and rotating a substrate, which is fitted and held on an inner diameter surface of a guide ring of a rotary table, integrally with the rotary table, using the precision polishing apparatus according to the twelfth aspect. While swinging the polishing tool, the polishing tool is rotated while the polishing surface thereof is brought into contact with the surface to be polished of the substrate by applying a predetermined processing pressure, and at the same time, the surface of the substrate and the surface of the polishing tool are polished. A polishing step of performing polishing while supplying an abrasive through a supply path between the polishing surface,
During the polishing step, the outer ring is raised at a predetermined cycle, and the upper surface of the dresser is projected to a height equal to or higher than the surface to be polished of the substrate, and the conditioning liquid is supplied from the supply path in place of the abrasive. A dressing or conditioning step of supplying and dressing between the polished surface of the substrate and the polished surface of the polishing tool.

The present invention also provides a precision polishing apparatus having a polishing tool and a substrate holding means, wherein the polishing tool polishes a substrate held by the substrate holding means. Outer peripheral concave portion, a detachable elastic member provided in the outer peripheral concave portion, and provided in the outer peripheral concave portion, and vertically moved in conjunction with the vertical movement of the elastic member, and flush with the substrate during polishing. And a precision polishing apparatus characterized by having a dresser.

According to the present invention, there is provided a precision polishing method for polishing a substrate by bringing a polishing tool into contact with a substrate held by the substrate holding means, wherein a vertical movement of an elastic member provided in an outer peripheral recess of the substrate holding means is provided. And a dresser capable of moving up and down in synchronization with the substrate becomes flush with the substrate at the outer periphery of the substrate when the substrate is polished.

Further, the present invention provides a precision polishing apparatus having a polishing tool and a substrate holding means, wherein the polishing tool polishes a substrate held by the substrate holding means, provided on an outer periphery of the substrate holding means. An outer peripheral recess, a vertical movement driving means provided in the outer peripheral recess, and a vertical movement provided in the outer peripheral recess and interlocking with the vertical movement of the vertical driving means, and flush with the substrate during polishing. And a dresser having the following characteristics.

According to the present invention, there is provided a precision polishing method for polishing a substrate by bringing a polishing tool into contact with a substrate held by the substrate holding means. A precision polishing method is provided, wherein a dresser that can move up and down in conjunction with up and down movement is flush with the substrate at the outer periphery of the substrate when polishing the substrate.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG.
1A is a schematic side view of the entire precision polishing apparatus, and FIG. 2B is a schematic cross-sectional view of a substrate holding mechanism. FIG. 2 is an explanatory view showing a part of the precision polishing apparatus of FIG. 1 from the side.

The precision polishing apparatus includes a substrate station 20 having a substrate holding means for holding a substrate W, and a polishing tool station 21 described below, which is disposed above the substrate station 20 so as to face the drawing.

The substrate station 20 includes a rotary table 7 (described later) supported on a rotary shaft 6a of a rotary drive unit 6 composed of an electric motor or the like so as to be able to rotate integrally with the rotary shaft 6a.
And a slider 5 slidably guided by a guide table 3 provided integrally on the base 1, which is a swing mechanism for swinging the rotary table 7 in the radial direction integrally with the rotation drive means 6. And a linear drive means 4 including a fluid pressure cylinder for linearly moving the slider 5.

The rotary table 7 serving as the substrate holding means has an outer peripheral concave portion 80, and is made of a hard material urged to be always flush with the substrate W by an elastic member 9 disposed on the upper surface in the figure. A guide ring 8 and a backing material 10 made of a polymer material such as polyurethane or polyether having elasticity that covers the substrate holding surface surrounded by the inner surface of the guide ring 8 are provided. A dresser 8a made of hard fine particles made of diamond abrasive grains or the like adhered to the entire surface thereof, or synthetic resin such as polyamide planted on the entire surface thereof, or hard brush bristles made of metal such as steel or copper. ing. The elastic member 9 may be provided in the outer peripheral concave portion 80 so as to be detachable.

The material of the fine particles or the brush may be appropriately selected from the hardness thereof. For example, it is more preferable to use the same material as the material of the object to be polished in order to improve the dressing ability. Alternatively, the material may be the same as the foreign material to be removed by dressing, for example, the fine particles contained in the abrasive, and examples thereof include aluminum and silicon oxide.

The polishing tool station 21 includes a pressurizing mechanism 14 composed of a fluid pressure cylinder and the like supported by a yoke 2a that protrudes above the substrate station 20 of the support member 2 erected on the base 1, and a pressurizing mechanism. A polishing tool rotation drive unit 13 such as an electric motor which is moved forward and backward with respect to the substrate station 20 by the mechanism 14, and a polishing tool 11 integrally provided at a lower end of the rotation shaft 13 a of the rotation tool 13 as shown in the figure. And a supply path 17 connected to a liquid supply means at one end side, which is opened at the lower surface of the polishing pad 12 as a polishing surface of the polishing tool 11 in the drawing.
The polishing surface of the polishing pad 12 is provided with a groove. In the present embodiment, the liquid supply means is divided into an abrasive supply means 15 and a conditioning liquid supply means 16, and the other end of the supply path 17 is connected to a supply pipe of the abrasive supply means 15 via a switching valve 17a. 15a and the supply line 16a of the conditioning liquid supply means 16 can be selectively connected.

The polishing tool 11 has a polishing pad 12 whose polishing surface has a diameter larger than the diameter of the substrate W, and is preferably substantially the same diameter or less than twice the diameter of the substrate W.

Next, the precision polishing method according to the present invention will be described with reference to an example in which the precision polishing apparatus shown in FIGS. 1 and 2 is used.

(1) The polishing tool 11 is lifted upward in the figure by the pressing mechanism 14 to be separated from the rotary table 7, and the substrate W is fitted to the inner diameter surface of the guide ring 8 of the rotary table 7, and the back surface thereof is fixed. It is held in contact with the backing material 10 so as to rotate integrally with the turntable 7.
Next, the slider 5 is slid by the linear drive means 4 to position the entire surface of the substrate W held on the rotary table 7 at a position where the substrate W comes into contact with the polishing pad 12 of the polishing tool 11.

(2) After the above (1), the supply pipe 15a and the supply path 17 of the abrasive supply means 15 are connected to the switching valve 17a.
And the polishing agent is pressure-fed to the supply path 17, the polishing tool 11 is rotated at a predetermined rotation speed by the polishing tool rotation driving means 13, and the polishing tool is rotated by the pressing mechanism 14 together with the polishing tool rotation driving means 13. The polishing pad 12 is pressed against the surface to be polished (surface) of the substrate W in a state where a predetermined processing pressure is applied by linearly moving the substrate 11 toward the substrate W. Then, while the abrasive is supplied between the substrate W and the polishing pad 12 through the supply path 17, the substrate W held on the rotary table 7 is rotated at a predetermined rotation speed by the rotation driving unit 6 and the linear driving unit 4. At the same time, polishing is performed by swinging in a radial direction at a predetermined stroke. At this time, it is preferable that the rotational speeds of the polishing tool 11 and the rotary table 7 be different from each other by the same rotational speed or several rpm within a range of several tens to several hundreds of rpm. As a result, the groove shape of the polishing pad is transferred to the substrate. Can be prevented.

(3) During the polishing process according to the above procedures (1) and (2), the switching valve 17a is switched at a predetermined cycle to switch the supply line 1 of the conditioning liquid supply means 16.
6a is communicated with the supply path 17 of the polishing tool 11, and the conditioning liquid is replaced with the substrate W and the polishing pad 1 in place of the polishing agent.
2 to perform dressing or conditioning.

As the conditioning liquid, potassium hydroxide (KOH), pure water or the like can be used. Alternatively, an abrasive may be used as the conditioning liquid. Further, the cycle and time for supplying the conditioning liquid instead of the abrasive may be determined within a range where an appropriate polishing rate can be maintained.

In the above embodiment, when the polishing pad 12 of the polishing tool 11 is pressed against the substrate W in a state where a predetermined processing pressure is applied, the substrate W is held in correspondence with the undulation or warpage existing on the substrate W. Since the rotating table 7 is equalized and the backing material 10 is deformed, minute irregularities on the order of microns existing on the substrate W can be removed without being affected by the undulation or warpage existing on the substrate W. Since the elastic member 9 interposed between the rotary table 7 and the rotating table 7 expands and contracts, the surface of the dresser 8a of the guide ring 8 becomes flush with the surface of the substrate W without being deformed, and Is prevented from occurring.

Further, since the polishing liquid is supplied from the supply path 17 provided in the polishing tool 11 between the substrate W and the polishing pad 12, the polishing agent is uniformly distributed between the substrate W and the polishing pad 12. Uniform polishing becomes possible.

Further, the dressing 8a provided on the guide ring 8 during the polishing process allows the polishing pad 12 to be dressed or conditioned to recover the polishing ability, thereby preventing the polishing ability of the polishing pad from being deteriorated due to a change with time. You.

As a result, the surface to be polished of the substrate W can be flattened with high precision and efficiency.

According to the present invention, the same effects as those of the precision polishing apparatus according to the above-described embodiment can be obtained by using the rotary table according to each of the modifications described below.

FIG. 3 is a schematic cross-sectional view of a rotary table according to a modification. The rotary table 27 is arranged on an upper surface of the rotary table in a state where the rotary table 27 is constantly urged to be flush with the substrate W by an elastic member 29. A guide ring provided with an elastic backing material for covering the substrate holding surface surrounded by the provided guide ring and an inner diameter surface of the guide ring;
A dresser 28a made of hard fine particles fixed concentrically or hard brush hairs concentrically planted is provided at a position near the outer periphery of the upper surface of FIG.
According to the present modification, it is possible to prevent polishing debris or the like generated by dressing from entering the center of the rotary table holding the substrate W, and it is possible to easily discharge unnecessary substances such as the polishing debris from the rotary table.

FIG. 4 is a schematic sectional view of a rotary table according to another modification. The rotary table 47 is urged by an elastic member 49 on the upper surface of the rotary table so as to be always flush with the substrate W. A guide ring 48 provided, a ring body 52 concentrically surrounding the guide ring 48, and a backing material 50 having elasticity for covering a portion surrounded by the inner diameter surface of the guide ring 48. Is provided with a dresser 52a made of hard fine particles such as diamond abrasive grains adhered concentrically or planted hard brush bristles.

In the present invention, the backing material is not necessarily provided, but if the backing material is provided,
The substrate can be kept flat by eliminating undulations present on the substrate itself and warpage caused by heat treatment in a device forming step. As a result, minute irregularities generated in a device forming step or the like can be removed with high accuracy.

The substrate that can be polished according to the present invention is S
a wafer made of a semiconductor such as i, Ge, GaAs, GaAlAs, and InP; and an S having a semiconductor layer on an insulating surface.
There is an OI wafer or an insulating substrate, which may be before, during, or after the production of functional elements such as resistors, capacitors, diodes, and transistors.

Therefore, the outer surface of the substrate to be polished, that is, the surface to be polished is a semiconductor surface, an insulating surface, a conductive surface such as a metal, or at least two of these three. One can be a mixed surface. In particular, the present invention is suitable for polishing an insulating film and / or a conductor film of a multi-layer wiring that requires a film having substantially the same thickness on one substrate. Further, a rectangular substrate or the like for a display may be used as the object to be polished.

As the polishing surface of the polishing tool of the present invention, it is desirable to use the surface of a pad made of nonwoven fabric, foamed polyurethane or the like.

As the polishing slurry (abrasive solution) used in the present invention, a liquid containing fine particles is used. Specifically, the fine particles include silicon oxide (SiO 2).
_2, etc.), aluminum oxide (Al ₂ O _3, etc.), manganese oxide _{(MnO 2, Mn 2 O 3} , Mn 3 O 4 , etc.), cerium oxide (CeO, CeO ₂ or the like), yttrium oxide (Y
₂ O ₃ ), molybdenum oxide (MoO ₂ etc.), calcium oxide (CaO ₂ etc.), magnesium oxide (MgO ₂ etc.)
And the like, and tin oxide (SnO _{2 and the} like). Examples of the liquid include sodium hydroxide (NaOH), potassium hydroxide (KOH), and aqueous hydrogen peroxide (H ₂ O ₂ ). The particle size of the fine particles is preferably from 8 nm to 50 nm. For example, the degree of aggregation of the particles can be controlled by changing the pH of KOH. The amount of polishing can be changed depending on the degree of aggregation.

These polishing slurries are appropriately selected and used according to the polishing surface. A silica-dispersed sodium hydroxide solution is used for polishing the semiconductor surface, and a silica-dispersed hydroxide solution is used for polishing the insulating film. A potassium solution is preferable, and when polishing a metal film such as tungsten, a hydrogen peroxide solution in which aluminum oxide or manganese oxide is dispersed is preferable.

(Second Embodiment) This embodiment is characterized in that a vertical movement driving means is provided between the elastic member and the rotary table, instead of the elastic member described in the first embodiment. And Otherwise, the configuration is the same as that of the first embodiment. As shown in FIG. 5, the turntable 7 has a guide ring 8 and a guide ring 8 which are constantly urged by an elastic member 9 disposed on the upper surface in the drawing so as to be flush with the substrate W.
A backing material 10 having elasticity to cover the substrate holding surface surrounded by the inner diameter surface and an outer ring 60 described later, which is concentrically arranged so as to surround the outer periphery of the guide ring 8 and is movable vertically. . The outer ring 60 is made of a hard fine particle made of diamond abrasive particles or the like adhered concentrically to the upper surface thereof, a synthetic resin such as polyamide planted concentrically on the upper surface thereof, or a hard resin such as a metal such as steel or copper. A dresser 8a made of brush bristles or the like is provided, and a plurality of fluid pressure cylinders or piezo elements arranged at a distance from each other in the circumferential direction between the back surface and the rotary table 7 are provided. By moving the dresser 8a up and down by the dynamic driving means 70, the height in the vertical direction can be changed between a position where the surface of the dresser 8a protrudes upward from the surface of the guide ring 8 and a position where the dresser 8a is drawn downward. It is configured as follows. The vertical movement driving means 70 can change its vertical movement not only before polishing but also during polishing by the control means 100 such as a personal computer.

Next, the precision polishing method according to the present embodiment will be described with reference to an example.

(1) The polishing tool 11 is lifted upward in the figure by the pressing mechanism 14 to be separated from the rotary table 7, and the substrate W is fitted to the inner diameter surface of the guide ring 8 of the rotary table 7, and the back surface thereof is fixed. By being brought into contact with the backing material 10, it is held so as to rotate integrally with the turntable 7. Next, the slider 5 is slid by the linear drive means 4 to position the entire surface of the substrate W held on the rotary table 7 at a position where the substrate W comes into contact with the polishing pad 12 of the polishing tool 11.

(2) After the above (1), the supply pipe 15a and the supply path 17 of the abrasive supply means 15 are connected to the switching valve 17a.
And the polishing agent is pressure-fed to the supply path 17, the polishing tool 11 is rotated at a predetermined rotation speed by the polishing tool rotation drive means 13, and the polishing mechanism is polished together with the polishing tool rotation drive means 13 by the pressing mechanism 14. The polishing pad 12 is pressed against the surface to be polished (surface) of the substrate W in a state where the tool 11 is linearly moved toward the substrate W and a predetermined processing pressure is applied. Then, while the polishing agent is supplied between the substrate W and the polishing pad 12 via the supply path 17, the substrate W held on the rotary table 7 by the rotary driving unit 6 and the linear driving unit 4.
Is rotated at a predetermined rotation speed and simultaneously oscillated in a radial direction by a predetermined stroke to perform polishing.

(3) During the polishing process according to the above procedures (1) and (2), the vertical movement driving means 70 is provided at a predetermined cycle.
Raises the outer ring 60 so that the dresser 8a
Is projected above the surface of the substrate W, and at the same time, the switching valve 17a is switched to connect the supply pipe 16a of the conditioning liquid supply means 16 to the supply path 17 to supply the conditioning liquid instead of the abrasive. By pressure feeding to the passage 17, a conditioning liquid is supplied between the substrate W and the polishing pad 12 in place of the polishing agent to perform dressing or conditioning.

According to the present embodiment, the outer ring 60 is raised at a predetermined period during the polishing process, and at the same time, a conditioning liquid is supplied between the substrate W and the polishing pad 12 in place of the abrasive to dress the polishing pad. Alternatively, by performing conditioning, the polishing ability of the polishing pad in a time series is prevented from being deteriorated, and efficient polishing can be performed.

[0052]

Since the present invention is configured as described above, it has the following effects.

The dressing or conditioning effect can be greatly improved, and the precision polishing apparatus can be downsized.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of a precision polishing apparatus according to the present invention, wherein (a) is a schematic side view of the entire precision polishing apparatus,
(B) is a schematic cross-sectional view of the turntable.

FIG. 2 is an explanatory view showing a part of the precision polishing apparatus shown in FIG. 1 from the side.

FIG. 3 is a schematic cross-sectional view of a modification of the turntable in the precision polishing apparatus according to the first embodiment.

FIG. 4 is a schematic cross-sectional view of another modification of the turntable in the precision polishing apparatus according to the first embodiment.

FIG. 5 is a schematic side view of the entire precision polishing apparatus according to a second embodiment.

FIG. 6 is an explanatory view showing an example of a precision polishing apparatus performed by the present inventors so far.

[Explanation of symbols]

 Reference Signs List 1 base 2 support member 3 guide table 4 linear drive means 5 slider 6 rotary drive means 6a, 13a, rotary shaft 7, 27, 47 rotary table 8, 28, 48 guide ring 8a, 28a, 52a dresser 9, 29, 49 Elastic member 10, 30, 50 Backing material 11 Polishing tool 12 Polishing pad 13 Rotary drive unit for polishing tool 14 Pressurizing mechanism 15 Polishing agent supply unit 16 Conditioning liquid supply unit 17 Supply path 20 Substrate station 21 Polishing tool station 52 Ring body 60 Outer ring 70 Vertical movement driving means 80 Outer peripheral recess 100 Control means

Claims (26)

[Claims] 1. A precision polishing apparatus comprising: a substrate station capable of holding a substrate with its surface to be polished facing upward; and a polishing tool station disposed above the substrate station. A guide ring urged by an elastic member disposed on an upper surface of the rotary table so as to be always flush with the substrate, and a dresser concentrically provided on at least a portion of the upper surface of the guide ring. On the other hand, the polishing tool station comprises: a polishing tool having a polishing surface having a diameter larger than the diameter of the substrate rotated by the polishing tool rotation driving means; and the polishing tool rotation driving means integrated with the polishing tool. A pressurizing mechanism for moving a tool forward and backward with respect to the substrate station; Precision polishing apparatus and the other end side is provided with a supply channel connected to the liquid supply means as well as opening the. 2. The dresser according to claim 1, wherein the dresser is hard fine particles attached to an upper surface of the guide ring.
The precision polishing apparatus as described. 3. The precision polishing apparatus according to claim 1, wherein the dresser is a hard brush bristle implanted on the upper surface of the guide ring. 4. The precision polishing apparatus according to claim 1, wherein the rotary table is supported on the rotary shaft of the rotary drive means so as to be able to be equalized and rotate integrally. 5. The precision polishing apparatus according to claim 4, further comprising a swing mechanism for swinging the rotary table in a radial direction integrally with the rotation driving means. 6. The precision polishing apparatus according to claim 1, wherein the liquid supply unit is divided into an abrasive supply unit and a conditioning liquid supply unit. 7. The precision polishing apparatus according to claim 1, wherein the substrate fitted and held on the inner diameter surface of the guide ring of the rotary table is rotated and oscillated in the radial direction integrally with the rotary table. The polishing tool is rotated while its polishing surface is brought into contact with the surface to be polished of the substrate by applying a predetermined processing pressure, and simultaneously between the surface to be polished of the substrate and the polishing surface of the polishing tool. A polishing step of performing polishing while supplying an abrasive through a supply path; and a conditioning liquid instead of the abrasive at a predetermined cycle during the polishing step. A precision polishing method, comprising a dressing or conditioning step of supplying dressing or conditioning between the polishing surface and a tool. 8. The precision polishing method according to claim 7, wherein the substrate is a substrate during or after the formation of the functional element. 9. The precision polishing method according to claim 7, wherein the substrate is a semiconductor. 10. The precision polishing method according to claim 7, wherein the substrate is formed by forming a semiconductor film on an insulating substrate. 11. The precision polishing method according to claim 7, wherein the substrate is a substrate having a surface on which an insulating film and / or a metal film is formed. 12. A precision polishing apparatus comprising: a substrate station capable of holding a substrate with its surface to be polished facing upward; and a polishing tool station disposed above the substrate station. A guide ring urged by an elastic member disposed on the upper surface of the rotary table so as to be always flush with the substrate, and a vertically moving driving means concentrically disposed outside the guide ring. An outer ring to be moved, and a dresser provided concentrically on the upper surface of the outer ring, while the polishing tool station is larger than a diameter of the substrate rotated by a rotation driving means for the polishing tool. A polishing tool having a polishing surface having a diameter, and the polishing tool being integrated with the rotation driving means for the polishing tool. A pressure mechanism for advancing / retreating the polishing tool, and a supply path having one end opening to the polishing surface of the polishing tool and the other end connected to liquid supply means. apparatus. 13. The dresser according to claim 1, wherein the dresser is hard fine particles attached to an upper surface of the outer ring.
2. The precision polishing apparatus according to 2. 14. The precision polishing apparatus according to claim 12, wherein the dresser is a hard brush bristle implanted on the upper surface of the outer ring. 15. The precision polishing apparatus according to claim 12, wherein the rotary table is supported on the rotary shaft of the rotary drive means so as to be able to be equalized and rotate integrally. 16. The precision polishing apparatus according to claim 15, further comprising a swing mechanism for swinging the rotary table in a radial direction integrally with the rotation driving means. 17. The precision polishing apparatus according to claim 12, wherein the liquid supply unit is divided into an abrasive supply unit and a conditioning liquid supply unit. 18. A substrate, which is fitted and held on an inner diameter surface of a guide ring of a rotary table, is rotated and oscillated in a radial direction integrally with the rotary table, using the precision polishing apparatus according to claim 12. The polishing tool is rotated while its polishing surface is brought into contact with the surface to be polished of the substrate by applying a predetermined processing pressure, and simultaneously between the surface to be polished of the substrate and the polishing surface of the polishing tool. A polishing step of performing polishing while supplying an abrasive through a supply path; and, during the polishing step, raising an outer ring at a predetermined cycle to raise the upper surface of the dresser to a height equal to or higher than the surface to be polished of the substrate. A conditioning liquid is supplied between the polished surface of the substrate and the polished surface of the polishing tool through the supply path in place of the polishing agent and dressing or conditioning. A precision polishing method comprising a dressing or conditioning step. 19. The precision polishing method according to claim 18, wherein the substrate is a substrate during or after the formation of the functional element. 20. The precision polishing method according to claim 18, wherein the substrate is a semiconductor. 21. The precision polishing method according to claim 18, wherein the substrate is obtained by forming a semiconductor film on an insulating substrate. 22. The precision polishing method according to claim 18, wherein the substrate is a substrate having a surface on which an insulating film and / or a metal film is formed. 23. A polishing tool comprising: a polishing tool; and a substrate holding means.
A precision polishing apparatus for polishing the substrate held by the substrate holding means with the polishing tool; an outer peripheral recess provided on an outer periphery of the substrate holding means; a detachable elastic member provided on the outer peripheral recess; A precision polishing apparatus, comprising: a dresser provided in an outer peripheral concave portion, the dresser moving up and down in conjunction with the vertical movement of the elastic member, and being flush with the substrate during polishing. 24. A precision polishing method for polishing a substrate by bringing a polishing tool into contact with a substrate held by the substrate holding means, wherein the elastic member provided in an outer peripheral concave portion of the substrate holding means is moved up and down. A dresser capable of moving up and down to be flush with the substrate at the outer periphery of the substrate when the substrate is polished. 25. A polishing tool comprising: a polishing tool; and a substrate holding means.
A precision polishing apparatus for polishing the substrate held by the substrate holding means with the polishing tool; an outer peripheral recess provided on an outer periphery of the substrate holding means; a vertical movement driving means provided on the outer peripheral recess; A precision polishing apparatus, comprising: a dresser provided in a concave portion, which moves up and down in conjunction with the up and down movement of the up and down movement driving means, and which is flush with the substrate during polishing. 26. A precision polishing method for polishing a substrate by bringing a polishing tool into contact with a substrate held by the substrate holding means, wherein the vertical movement of a vertical movement driving means provided in an outer peripheral concave portion of the substrate holding means. A dresser that can move up and down in conjunction with
A precision polishing method, wherein the outer periphery of the substrate is flush with the substrate when the substrate is polished.