JP2002118294A - フリップチップ型発光ダイオード及び製造方法 - Google Patents

フリップチップ型発光ダイオード及び製造方法

Info

Publication number
JP2002118294A
JP2002118294A JP2001106049A JP2001106049A JP2002118294A JP 2002118294 A JP2002118294 A JP 2002118294A JP 2001106049 A JP2001106049 A JP 2001106049A JP 2001106049 A JP2001106049 A JP 2001106049A JP 2002118294 A JP2002118294 A JP 2002118294A
Authority
JP
Japan
Prior art keywords
solder
electrode
emitting diode
package
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001106049A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002118294A5 (enrdf_load_stackoverflow
Inventor
Hiroaki Tamemoto
広昭 為本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2001106049A priority Critical patent/JP2002118294A/ja
Publication of JP2002118294A publication Critical patent/JP2002118294A/ja
Publication of JP2002118294A5 publication Critical patent/JP2002118294A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Die Bonding (AREA)
  • Led Device Packages (AREA)
JP2001106049A 2000-04-24 2001-04-04 フリップチップ型発光ダイオード及び製造方法 Pending JP2002118294A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001106049A JP2002118294A (ja) 2000-04-24 2001-04-04 フリップチップ型発光ダイオード及び製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000122288 2000-04-24
JP2000-122288 2000-04-24
JP2001106049A JP2002118294A (ja) 2000-04-24 2001-04-04 フリップチップ型発光ダイオード及び製造方法

Publications (2)

Publication Number Publication Date
JP2002118294A true JP2002118294A (ja) 2002-04-19
JP2002118294A5 JP2002118294A5 (enrdf_load_stackoverflow) 2008-03-06

Family

ID=26590642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001106049A Pending JP2002118294A (ja) 2000-04-24 2001-04-04 フリップチップ型発光ダイオード及び製造方法

Country Status (1)

Country Link
JP (1) JP2002118294A (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005045038A (ja) * 2003-07-23 2005-02-17 Nichia Chem Ind Ltd 窒化物半導体発光素子
JP2005057265A (ja) * 2003-07-31 2005-03-03 Lumileds Lighting Us Llc 半導体発光デバイス用の実装
JP2005079593A (ja) * 2003-08-29 2005-03-24 Lumileds Lighting Us Llc 半導体発光装置のためのパッケージ
JP2005526402A (ja) * 2002-05-16 2005-09-02 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 半導体チップをプラスチックケーシング体に固定する方法及びオプトエレクトロニック半導体構成素子及びオプトエレクトロニック半導体構成素子を製造する方法
JP2005244152A (ja) * 2004-01-29 2005-09-08 Kyocera Corp 発光素子搭載用基板および発光装置
JP2005243795A (ja) * 2004-02-25 2005-09-08 Matsushita Electric Ind Co Ltd 光半導体装置
KR101082169B1 (ko) 2002-09-04 2011-11-09 크리, 인코포레이티드 전력 표면 장착식 발광 다이 패키지
WO2015053595A1 (ko) * 2013-10-11 2015-04-16 주식회사 세미콘라이트 반도체 발광소자
WO2015194804A1 (ko) * 2014-06-16 2015-12-23 엘지이노텍(주) 발광 소자 및 이를 포함하는 발광소자 패키지
WO2016010270A1 (ko) * 2014-07-14 2016-01-21 주식회사 헥사솔루션 기판 구조, 그 형성방법, 및 이를 이용한 질화물 반도체 제조방법
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548462A (en) * 1977-06-21 1979-01-22 Nec Home Electronics Ltd Manufacture for semiconductor
JPS5413774A (en) * 1977-07-01 1979-02-01 Nec Home Electronics Ltd Production of semiconductor devices
JPS5421261A (en) * 1977-07-19 1979-02-17 Nec Home Electronics Ltd Manufacture for semiconductor device
JPS63130258A (ja) * 1986-11-19 1988-06-02 Hitachi Ltd 接合構造
JPH0222605A (ja) * 1988-07-11 1990-01-25 Fujitsu Ltd 光半導体アセンブリ製造用治具
JPH07142491A (ja) * 1993-11-19 1995-06-02 Hitachi Ltd 半田バンプ形成方法及びそれによって形成されたバンプを有する半導体装置
JPH07321412A (ja) * 1994-05-27 1995-12-08 Fujitsu Ltd 半導体装置
JPH07326856A (ja) * 1994-05-31 1995-12-12 Toshiba Corp 電子部品のはんだ付け方法
JPH0992682A (ja) * 1995-09-22 1997-04-04 Internatl Business Mach Corp <Ibm> ハンダ付け方法、ハンダ付け装置
JPH09283803A (ja) * 1996-04-09 1997-10-31 Nichia Chem Ind Ltd チップタイプｌｅｄ及びその製造方法
JPH1154563A (ja) * 1997-08-06 1999-02-26 Nec Corp チップ部品の実装方法
JPH1177377A (ja) * 1997-09-08 1999-03-23 Sanei Kagaku Kk フラックス組成物

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548462A (en) * 1977-06-21 1979-01-22 Nec Home Electronics Ltd Manufacture for semiconductor
JPS5413774A (en) * 1977-07-01 1979-02-01 Nec Home Electronics Ltd Production of semiconductor devices
JPS5421261A (en) * 1977-07-19 1979-02-17 Nec Home Electronics Ltd Manufacture for semiconductor device
JPS63130258A (ja) * 1986-11-19 1988-06-02 Hitachi Ltd 接合構造
JPH0222605A (ja) * 1988-07-11 1990-01-25 Fujitsu Ltd 光半導体アセンブリ製造用治具
JPH07142491A (ja) * 1993-11-19 1995-06-02 Hitachi Ltd 半田バンプ形成方法及びそれによって形成されたバンプを有する半導体装置
JPH07321412A (ja) * 1994-05-27 1995-12-08 Fujitsu Ltd 半導体装置
JPH07326856A (ja) * 1994-05-31 1995-12-12 Toshiba Corp 電子部品のはんだ付け方法
JPH0992682A (ja) * 1995-09-22 1997-04-04 Internatl Business Mach Corp <Ibm> ハンダ付け方法、ハンダ付け装置
JPH09283803A (ja) * 1996-04-09 1997-10-31 Nichia Chem Ind Ltd チップタイプｌｅｄ及びその製造方法
JPH1154563A (ja) * 1997-08-06 1999-02-26 Nec Corp チップ部品の実装方法
JPH1177377A (ja) * 1997-09-08 1999-03-23 Sanei Kagaku Kk フラックス組成物

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005526402A (ja) * 2002-05-16 2005-09-02 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 半導体チップをプラスチックケーシング体に固定する方法及びオプトエレクトロニック半導体構成素子及びオプトエレクトロニック半導体構成素子を製造する方法
US8110437B2 (en) 2002-05-16 2012-02-07 Osram Opto Semiconductors Gmbh Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
KR101082235B1 (ko) * 2002-09-04 2011-11-09 크리, 인코포레이티드 전력 표면 장착식 발광 다이 패키지
KR101082169B1 (ko) 2002-09-04 2011-11-09 크리, 인코포레이티드 전력 표면 장착식 발광 다이 패키지
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005045038A (ja) * 2003-07-23 2005-02-17 Nichia Chem Ind Ltd 窒化物半導体発光素子
JP2005057265A (ja) * 2003-07-31 2005-03-03 Lumileds Lighting Us Llc 半導体発光デバイス用の実装
EP1503433A3 (en) * 2003-07-31 2011-03-09 Philips Lumileds Lighting Company LLC Mount for semiconductor light emitting device
JP2005079593A (ja) * 2003-08-29 2005-03-24 Lumileds Lighting Us Llc 半導体発光装置のためのパッケージ
JP2005244152A (ja) * 2004-01-29 2005-09-08 Kyocera Corp 発光素子搭載用基板および発光装置
JP2005243795A (ja) * 2004-02-25 2005-09-08 Matsushita Electric Ind Co Ltd 光半導体装置
US10686102B2 (en) 2006-05-18 2020-06-16 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US11631790B2 (en) 2006-05-18 2023-04-18 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9634204B2 (en) 2006-05-18 2017-04-25 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US9929318B2 (en) 2006-05-18 2018-03-27 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10971656B2 (en) 2006-05-18 2021-04-06 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
US10263161B2 (en) 2006-05-18 2019-04-16 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
WO2015053595A1 (ko) * 2013-10-11 2015-04-16 주식회사 세미콘라이트 반도체 발광소자
US9748446B2 (en) 2013-10-11 2017-08-29 Semicon Light Co., Ltd. Semiconductor light emitting device
WO2015194804A1 (ko) * 2014-06-16 2015-12-23 엘지이노텍(주) 발광 소자 및 이를 포함하는 발광소자 패키지
US9947835B2 (en) 2014-06-16 2018-04-17 Lg Innotek Co., Ltd. Light-emitting element and light-emitting package comprising same
US10355169B2 (en) 2014-07-14 2019-07-16 Hexasolution Co., Ltd. Substrate structure, method for forming same, and method for manufacturing nitride semiconductor using same
WO2016010270A1 (ko) * 2014-07-14 2016-01-21 주식회사 헥사솔루션 기판 구조, 그 형성방법, 및 이를 이용한 질화물 반도체 제조방법

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