JP3917619B2 - 半導体発光素子の製法 - Google Patents
半導体発光素子の製法 Download PDFInfo
- Publication number
- JP3917619B2 JP3917619B2 JP2004343711A JP2004343711A JP3917619B2 JP 3917619 B2 JP3917619 B2 JP 3917619B2 JP 2004343711 A JP2004343711 A JP 2004343711A JP 2004343711 A JP2004343711 A JP 2004343711A JP 3917619 B2 JP3917619 B2 JP 3917619B2
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- JP
- Japan
- Prior art keywords
- semiconductor
- substrate
- light emitting
- layer
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- Led Device Packages (AREA)
- Led Devices (AREA)
Description
3 n形層
4 活性層
5 p形層
8 p側電極
9 n側電極
10 半導体積層部
30 LEDチップ
31 絶縁基板
32 端子電極
33 端子電極
34 金線
35 樹脂パッケージ
Claims (2)
- (a)ウェハ状のサファイア基板上に発光層を形成すべくチッ化ガリウム系化合物半導体からなる半導体層を積層して半導体積層部を形成し、
(b)該半導体積層部の表面側に一対の電極を形成した後に支持基板を貼着し、
(c)前記半導体積層部が設けられたサファイア基板を裏面側から研磨することによりサファイア基板の厚さを10〜50μmにし、
(d)ウェハから各発光素子チップに切断分離し、
(e)該発光素子チップの研磨された面を下にして両端部に端子電極を有する絶縁基板上にマウントした後に前記支持基板を除去し、
(f)露出した前記半導体積層部の表面側の一対の電極を前記絶縁基板の両端部の端子電極とワイヤボンディングをする
ことを特徴とする半導体発光素子の製法。 - (a)ウェハ状のサファイア基板上に発光層を形成すべくチッ化ガリウム系化合物半導体からなる半導体層を積層して半導体積層部を形成し、
(b)該半導体積層部の表面側に一対の電極を形成した後に支持基板を貼着し、
(c)前記半導体積層部が設けられたサファイア基板を裏面側から研磨することによりサファイア基板の厚さを10〜50μmにし、
(d)ウェハから各発光素子チップに切断分離し、
(e’)該発光素子チップの研磨された面を保持して前記支持基板を除去し、
(f’)該支持基板の除去により露出した前記半導体積層部の表面側の一対の電極が、両端部に端子電極を有する絶縁基板上に該端子電極のそれぞれと直接接続されるように前記発光素子チップをマウントする
ことを特徴とする半導体発光素子の製法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004343711A JP3917619B2 (ja) | 1997-01-24 | 2004-11-29 | 半導体発光素子の製法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1122497 | 1997-01-24 | ||
JP2004343711A JP3917619B2 (ja) | 1997-01-24 | 2004-11-29 | 半導体発光素子の製法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11807397A Division JP4146527B2 (ja) | 1997-01-24 | 1997-05-08 | 半導体発光素子およびその製法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005094031A JP2005094031A (ja) | 2005-04-07 |
JP3917619B2 true JP3917619B2 (ja) | 2007-05-23 |
Family
ID=34466453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004343711A Expired - Fee Related JP3917619B2 (ja) | 1997-01-24 | 2004-11-29 | 半導体発光素子の製法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3917619B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005035722B9 (de) * | 2005-07-29 | 2021-11-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
JP4971672B2 (ja) * | 2005-09-09 | 2012-07-11 | パナソニック株式会社 | 発光装置 |
DE202009018419U1 (de) * | 2009-03-09 | 2011-08-17 | Tridonic Jennersdorf Gmbh | LED-Modul mit verbesserter Lichtleistung |
JP6349953B2 (ja) * | 2014-05-20 | 2018-07-04 | 日亜化学工業株式会社 | 発光装置の製造方法 |
-
2004
- 2004-11-29 JP JP2004343711A patent/JP3917619B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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JP2005094031A (ja) | 2005-04-07 |
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