JP2002036080A5 - - Google Patents
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- Publication number
- JP2002036080A5 JP2002036080A5 JP2000227437A JP2000227437A JP2002036080A5 JP 2002036080 A5 JP2002036080 A5 JP 2002036080A5 JP 2000227437 A JP2000227437 A JP 2000227437A JP 2000227437 A JP2000227437 A JP 2000227437A JP 2002036080 A5 JP2002036080 A5 JP 2002036080A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- polishing
- edge
- polishing apparatus
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 238000005498 polishing Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000227437A JP3933376B2 (ja) | 2000-07-27 | 2000-07-27 | 基板エッジ研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000227437A JP3933376B2 (ja) | 2000-07-27 | 2000-07-27 | 基板エッジ研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002036080A JP2002036080A (ja) | 2002-02-05 |
| JP2002036080A5 true JP2002036080A5 (https=) | 2004-12-24 |
| JP3933376B2 JP3933376B2 (ja) | 2007-06-20 |
Family
ID=18720889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000227437A Expired - Fee Related JP3933376B2 (ja) | 2000-07-27 | 2000-07-27 | 基板エッジ研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3933376B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5033066B2 (ja) * | 2008-06-13 | 2012-09-26 | 株式会社Bbs金明 | ワーク外周部の研磨装置および研磨方法 |
| JP6350857B2 (ja) * | 2014-04-21 | 2018-07-04 | スピードファム株式会社 | 円盤状半導体ウェーハエッジ部の研磨方法、及びその装置 |
| KR101578713B1 (ko) * | 2015-06-22 | 2015-12-18 | 황정하 | 광학렌즈의 양면 모따기 장치 |
| KR102341340B1 (ko) * | 2020-03-06 | 2021-12-17 | 에스케이실트론 주식회사 | 패드 드레서 로딩 장치 |
| CN114193308B (zh) * | 2021-12-09 | 2024-06-04 | 云浮市坚诚机械有限公司 | 一种台面板的盘孔自动抛光机 |
-
2000
- 2000-07-27 JP JP2000227437A patent/JP3933376B2/ja not_active Expired - Fee Related
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