JP3933376B2 - 基板エッジ研磨装置 - Google Patents
基板エッジ研磨装置 Download PDFInfo
- Publication number
- JP3933376B2 JP3933376B2 JP2000227437A JP2000227437A JP3933376B2 JP 3933376 B2 JP3933376 B2 JP 3933376B2 JP 2000227437 A JP2000227437 A JP 2000227437A JP 2000227437 A JP2000227437 A JP 2000227437A JP 3933376 B2 JP3933376 B2 JP 3933376B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- polishing
- edge
- unit
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims description 181
- 239000000758 substrate Substances 0.000 title claims description 180
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000007788 liquid Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000012530 fluid Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004744 fabric Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000227437A JP3933376B2 (ja) | 2000-07-27 | 2000-07-27 | 基板エッジ研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000227437A JP3933376B2 (ja) | 2000-07-27 | 2000-07-27 | 基板エッジ研磨装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002036080A JP2002036080A (ja) | 2002-02-05 |
| JP2002036080A5 JP2002036080A5 (https=) | 2004-12-24 |
| JP3933376B2 true JP3933376B2 (ja) | 2007-06-20 |
Family
ID=18720889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000227437A Expired - Fee Related JP3933376B2 (ja) | 2000-07-27 | 2000-07-27 | 基板エッジ研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3933376B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5033066B2 (ja) * | 2008-06-13 | 2012-09-26 | 株式会社Ｂｂｓ金明 | ワーク外周部の研磨装置および研磨方法 |
| JP6350857B2 (ja) * | 2014-04-21 | 2018-07-04 | スピードファム株式会社 | 円盤状半導体ウェーハエッジ部の研磨方法、及びその装置 |
| KR101578713B1 (ko) * | 2015-06-22 | 2015-12-18 | 황정하 | 광학렌즈의 양면 모따기 장치 |
| KR102341340B1 (ko) * | 2020-03-06 | 2021-12-17 | 에스케이실트론 주식회사 | 패드 드레서 로딩 장치 |
| CN114193308B (zh) * | 2021-12-09 | 2024-06-04 | 云浮市坚诚机械有限公司 | 一种台面板的盘孔自动抛光机 |
-
2000
- 2000-07-27 JP JP2000227437A patent/JP3933376B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002036080A (ja) | 2002-02-05 |
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