JP2002036080A5 - - Google Patents

Description

[0009]
[Means for Solving the Problems]
According to the first aspect of the present invention, a rotatable substrate holding portion for holding the substrate by exposing the edge of the substrate and a circumferential position opposite to the edge of the substrate held by the substrate holding portion a polishing portion having a multiple polishing plate to the disposed surface facing the substrate and the polishing surface, and characterized by having a moving mechanism for the said abrasive part and the substrate holder relative tangent away Substrate edge polishing apparatus.

[0010]
Accordingly, while contacting an edge of the substrate to the polishing surface of the polishing board over substantially the entire length along the circumferential direction thereof, by polishing the Rotate the edge of the substrate, the entire surface of the polishing surface of the polishing board The edge of the substrate can be efficiently polished at a low surface pressure while being used more effectively.

[0012]
In the invention according to the third aspect, the polishing surface of the polishing disc is arc-shaped or inclined in a direction gradually approaching outward with respect to the surface formed by the substrate held by the substrate holding portion. It is a substrate edge polish device according to claim 1 or 2 characterized by things. This makes it possible to ensure that one half of the edge of the substrate abuts against the polishing surface during polishing, or to set an arbitrary edge cut width. The inclination angle is arbitrarily determined by, for example, the hardness of the material constituting the polishing surface, the edge shape of the substrate, the edge cut width, the load applied in polishing, and the like.

[0013]
The invention according to claim 4, the inner peripheral surface in any one of claims 1 to 3 a polishing surface and the end face polishing unit, characterized in that arranged freely separable to the end surface of the substrate in a circular cylindrical It is a substrate edge polishing apparatus as described. Depending on the type of substrate, this edge may have a flat end face perpendicular to the surface of the substrate, but in such a case, while holding the substrate by the substrate holder, in addition to one or both sides of the edge, This end face can be polished by the end face polishing unit.

Claims (5)

A rotatable substrate holder for holding the substrate by exposing the edge of the substrate;
A polishing portion having a multiple polishing plate to a surface facing the disposed positions along the circumferential direction the substrate was polished surface that faces the edge of the substrate held by the substrate holder,
A substrate edge polishing apparatus, comprising: a contacting / separating mechanism for relatively contacting / separating the substrate holding portion and the polishing portion. The substrate edge polishing apparatus according to claim 1, wherein the polishing unit is provided on both sides of the substrate held by the substrate holding unit. The polishing surface of the polishing disc is arc-shaped, or is inclined in a direction gradually approaching outward with respect to the surface formed by the substrate held by the substrate holding portion. 2. The substrate edge polishing apparatus according to 2. Substrate edge polishing apparatus according to any one of claims 1 to 3, wherein the end face polishing portion the inner circumferential surface and the polishing surface in a circular cylindrical be arranged freely separable to the end surface of the substrate. The substrate edge polishing apparatus according to any one of claims 1 to 4, further comprising a mechanism for polishing the end face of the notch portion of the substrate.