JP2002036080A5 - - Google Patents
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- JP2002036080A5 JP2002036080A5 JP2000227437A JP2000227437A JP2002036080A5 JP 2002036080 A5 JP2002036080 A5 JP 2002036080A5 JP 2000227437 A JP2000227437 A JP 2000227437A JP 2000227437 A JP2000227437 A JP 2000227437A JP 2002036080 A5 JP2002036080 A5 JP 2002036080A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- polishing
- edge
- polishing apparatus
- held
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【0009】
【課題を解決するための手段】
請求項1に記載の発明は、基板を該基板のエッジを露出させて保持する回転自在な基板保持部と、前記基板保持部で保持した基板のエッジに対向する円周方向に沿った位置に配置され該基板との対向面を研磨面とした複数の研磨盤を有する研磨部と、前記基板保持部と前記研磨部とを相対的に接離させる接離機構とを有することを特徴とする基板エッジ研磨装置である。[0009]
[Means for Solving the Problems]
According to the first aspect of the present invention, a rotatable substrate holding portion for holding the substrate by exposing the edge of the substrate and a circumferential position opposite to the edge of the substrate held by the substrate holding portion a polishing portion having a multiple polishing plate to the disposed surface facing the substrate and the polishing surface, and characterized by having a moving mechanism for the said abrasive part and the substrate holder relative tangent away Substrate edge polishing apparatus.
【0010】
これにより、基板のエッジをその円周方向に沿ったほぼ全長に亘って研磨盤の研磨面に接触させながら、基板を回転させてエッジを研磨することで、研磨盤の研磨面をその全面に亘ってより有効に利用しつつ、低い面圧で基板のエッジを効率良く研磨することができる。[0010]
Accordingly, while contacting an edge of the substrate to the polishing surface of the polishing board over substantially the entire length along the circumferential direction thereof, by polishing the Rotate the edge of the substrate, the entire surface of the polishing surface of the polishing board The edge of the substrate can be efficiently polished at a low surface pressure while being used more effectively.
【0012】
請求項3に記載の発明は、前記研磨盤の研磨面は、弧状としているか、または前記基板保持部で保持した基板のなす面に対して、外方に向け徐々に近づく方向に傾斜していることを特徴とする請求項1または2記載の基板エッジ研磨装置である。これにより、研磨の際に基板のエッジの半分を確実に研磨面に当接させるようにしたり、任意のエッジカット幅を設定することができる。この傾斜角度は、例えば研磨面を構成する素材の硬さ、基板のエッジ形状、エッジカット幅、研磨の際に加えられる荷重等によって任意に決められる。[0012]
In the invention according to the third aspect, the polishing surface of the polishing disc is arc-shaped or inclined in a direction gradually approaching outward with respect to the surface formed by the substrate held by the substrate holding portion. It is a substrate edge polish device according to claim 1 or 2 characterized by things. This makes it possible to ensure that one half of the edge of the substrate abuts against the polishing surface during polishing, or to set an arbitrary edge cut width. The inclination angle is arbitrarily determined by, for example, the hardness of the material constituting the polishing surface, the edge shape of the substrate, the edge cut width, the load applied in polishing, and the like.
【0013】
請求項4に記載の発明は、円筒状で内周面を研磨面とした端面研磨部を前記基板の端面に接離自在に配置したことを特徴とする請求項1乃至3のいずれかに記載の基板エッジ研磨装置である。基板の種類によっては、このエッジに基板の表面と垂直で平坦な端面を有するものもあるが、このような場合に、基板を基板保持部で保持したまま、エッジの片面或いは両面の他に、この端面を端面研磨部で研磨することができる。[0013]
The invention according to claim 4, the inner peripheral surface in any one of claims 1 to 3 a polishing surface and the end face polishing unit, characterized in that arranged freely separable to the end surface of the substrate in a circular cylindrical It is a substrate edge polishing apparatus as described. Depending on the type of substrate, this edge may have a flat end face perpendicular to the surface of the substrate, but in such a case, while holding the substrate by the substrate holder, in addition to one or both sides of the edge, This end face can be polished by the end face polishing unit.
Claims (5)
前記基板保持部で保持した基板のエッジに対向する円周方向に沿った位置に配置され該基板との対向面を研磨面とした複数の研磨盤を有する研磨部と、
前記基板保持部と前記研磨部とを相対的に接離させる接離機構とを有することを特徴とする基板エッジ研磨装置。A rotatable substrate holder for holding the substrate by exposing the edge of the substrate;
A polishing portion having a multiple polishing plate to a surface facing the disposed positions along the circumferential direction the substrate was polished surface that faces the edge of the substrate held by the substrate holder,
A substrate edge polishing apparatus, comprising: a contacting / separating mechanism for relatively contacting / separating the substrate holding portion and the polishing portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000227437A JP3933376B2 (en) | 2000-07-27 | 2000-07-27 | Substrate edge polishing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000227437A JP3933376B2 (en) | 2000-07-27 | 2000-07-27 | Substrate edge polishing equipment |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2002036080A JP2002036080A (en) | 2002-02-05 |
JP2002036080A5 true JP2002036080A5 (en) | 2004-12-24 |
JP3933376B2 JP3933376B2 (en) | 2007-06-20 |
Family
ID=18720889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000227437A Expired - Fee Related JP3933376B2 (en) | 2000-07-27 | 2000-07-27 | Substrate edge polishing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3933376B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5033066B2 (en) * | 2008-06-13 | 2012-09-26 | 株式会社Bbs金明 | Polishing apparatus and polishing method for workpiece outer periphery |
JP6350857B2 (en) * | 2014-04-21 | 2018-07-04 | スピードファム株式会社 | Method and apparatus for polishing edge of disk-shaped semiconductor wafer |
KR101578713B1 (en) * | 2015-06-22 | 2015-12-18 | 황정하 | Chamfering device of both sides of the optical lens |
KR102341340B1 (en) * | 2020-03-06 | 2021-12-17 | 에스케이실트론 주식회사 | Pad dresser loading device |
CN114193308B (en) * | 2021-12-09 | 2024-06-04 | 云浮市坚诚机械有限公司 | Automatic polishing machine for tray holes of deck plate |
-
2000
- 2000-07-27 JP JP2000227437A patent/JP3933376B2/en not_active Expired - Fee Related
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