JP2002033422A - 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器 - Google Patents

熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器

Info

Publication number
JP2002033422A
JP2002033422A JP2000214512A JP2000214512A JP2002033422A JP 2002033422 A JP2002033422 A JP 2002033422A JP 2000214512 A JP2000214512 A JP 2000214512A JP 2000214512 A JP2000214512 A JP 2000214512A JP 2002033422 A JP2002033422 A JP 2002033422A
Authority
JP
Japan
Prior art keywords
heat
conductive sheet
heat conductive
reinforcing
cooling means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000214512A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002033422A5 (https=
Inventor
Nobuto Fujiwara
伸人 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2000214512A priority Critical patent/JP2002033422A/ja
Publication of JP2002033422A publication Critical patent/JP2002033422A/ja
Publication of JP2002033422A5 publication Critical patent/JP2002033422A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2000214512A 2000-07-14 2000-07-14 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器 Pending JP2002033422A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000214512A JP2002033422A (ja) 2000-07-14 2000-07-14 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000214512A JP2002033422A (ja) 2000-07-14 2000-07-14 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器

Publications (2)

Publication Number Publication Date
JP2002033422A true JP2002033422A (ja) 2002-01-31
JP2002033422A5 JP2002033422A5 (https=) 2007-08-16

Family

ID=18710079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000214512A Pending JP2002033422A (ja) 2000-07-14 2000-07-14 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器

Country Status (1)

Country Link
JP (1) JP2002033422A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9740251B2 (en) 2015-03-26 2017-08-22 Nec Corporation Cooling device and device
US9870973B2 (en) 2015-03-26 2018-01-16 Nec Corporation Cooling device and device
US10607917B2 (en) 2018-05-24 2020-03-31 Fujitsu Limited Substrate
JPWO2022054929A1 (https=) * 2020-09-14 2022-03-17
WO2025047375A1 (ja) * 2023-08-31 2025-03-06 ローム株式会社 半導体装置および半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9740251B2 (en) 2015-03-26 2017-08-22 Nec Corporation Cooling device and device
US9870973B2 (en) 2015-03-26 2018-01-16 Nec Corporation Cooling device and device
US10607917B2 (en) 2018-05-24 2020-03-31 Fujitsu Limited Substrate
JPWO2022054929A1 (https=) * 2020-09-14 2022-03-17
WO2025047375A1 (ja) * 2023-08-31 2025-03-06 ローム株式会社 半導体装置および半導体装置の製造方法

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