JPWO2022054929A1 - - Google Patents
Info
- Publication number
- JPWO2022054929A1 JPWO2022054929A1 JP2022548368A JP2022548368A JPWO2022054929A1 JP WO2022054929 A1 JPWO2022054929 A1 JP WO2022054929A1 JP 2022548368 A JP2022548368 A JP 2022548368A JP 2022548368 A JP2022548368 A JP 2022548368A JP WO2022054929 A1 JPWO2022054929 A1 JP WO2022054929A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/01—Manufacture or treatment
- H10W40/03—Manufacture or treatment of arrangements for cooling
- H10W40/037—Assembling together parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
- H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020153416 | 2020-09-14 | ||
| JP2020153416 | 2020-09-14 | ||
| PCT/JP2021/033407 WO2022054929A1 (ja) | 2020-09-14 | 2021-09-10 | 熱伝導性材料及び電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022054929A1 true JPWO2022054929A1 (https=) | 2022-03-17 |
| JP7788619B2 JP7788619B2 (ja) | 2025-12-19 |
Family
ID=80631765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022548368A Active JP7788619B2 (ja) | 2020-09-14 | 2021-09-10 | 熱伝導性材料及び電子部品 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230352365A1 (https=) |
| JP (1) | JP7788619B2 (https=) |
| CN (1) | CN116097912A (https=) |
| WO (1) | WO2022054929A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023111629A (ja) * | 2022-01-31 | 2023-08-10 | パナソニックＩｐマネジメント株式会社 | 電気機器 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033422A (ja) * | 2000-07-14 | 2002-01-31 | Toshiba Corp | 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器 |
| JP2008258527A (ja) * | 2007-04-09 | 2008-10-23 | Matsushita Electric Ind Co Ltd | 放熱装置 |
| JP2019067801A (ja) * | 2017-09-28 | 2019-04-25 | デンカ株式会社 | 放熱部品付きパワーモジュール |
| JP2020019883A (ja) * | 2018-07-31 | 2020-02-06 | 日本ゼオン株式会社 | 熱伝導シート |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014175501A (ja) | 2013-03-08 | 2014-09-22 | Toshiba Corp | 導電性サーマルシートおよび高周波モジュール |
| KR20160002427U (ko) | 2013-11-05 | 2016-07-11 | 그라프텍 인터내셔널 홀딩스 인코포레이티드 | 흑연 물품 |
| JP6809192B2 (ja) * | 2016-12-13 | 2021-01-06 | 昭和電工マテリアルズ株式会社 | 熱伝導シート、熱伝導シートの製造方法及び放熱装置 |
| JP6862896B2 (ja) * | 2017-02-17 | 2021-04-21 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2018133598A (ja) * | 2018-06-05 | 2018-08-23 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| JP7345088B2 (ja) * | 2019-02-08 | 2023-09-15 | パナソニックＩｐマネジメント株式会社 | 熱伝導シートおよびこれを用いた電子機器 |
-
2021
- 2021-09-10 WO PCT/JP2021/033407 patent/WO2022054929A1/ja not_active Ceased
- 2021-09-10 US US18/043,857 patent/US20230352365A1/en active Pending
- 2021-09-10 JP JP2022548368A patent/JP7788619B2/ja active Active
- 2021-09-10 CN CN202180053797.XA patent/CN116097912A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002033422A (ja) * | 2000-07-14 | 2002-01-31 | Toshiba Corp | 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器 |
| JP2008258527A (ja) * | 2007-04-09 | 2008-10-23 | Matsushita Electric Ind Co Ltd | 放熱装置 |
| JP2019067801A (ja) * | 2017-09-28 | 2019-04-25 | デンカ株式会社 | 放熱部品付きパワーモジュール |
| JP2020019883A (ja) * | 2018-07-31 | 2020-02-06 | 日本ゼオン株式会社 | 熱伝導シート |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116097912A (zh) | 2023-05-09 |
| JP7788619B2 (ja) | 2025-12-19 |
| US20230352365A1 (en) | 2023-11-02 |
| WO2022054929A1 (ja) | 2022-03-17 |
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