JP7788619B2 - 熱伝導性材料及び電子部品 - Google Patents

熱伝導性材料及び電子部品

Info

Publication number
JP7788619B2
JP7788619B2 JP2022548368A JP2022548368A JP7788619B2 JP 7788619 B2 JP7788619 B2 JP 7788619B2 JP 2022548368 A JP2022548368 A JP 2022548368A JP 2022548368 A JP2022548368 A JP 2022548368A JP 7788619 B2 JP7788619 B2 JP 7788619B2
Authority
JP
Japan
Prior art keywords
thermally conductive
conductive material
thickness
region
screws
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022548368A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022054929A1 (https=
Inventor
洋次 白土
典裕 河村
将也 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of JPWO2022054929A1 publication Critical patent/JPWO2022054929A1/ja
Application granted granted Critical
Publication of JP7788619B2 publication Critical patent/JP7788619B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
JP2022548368A 2020-09-14 2021-09-10 熱伝導性材料及び電子部品 Active JP7788619B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020153416 2020-09-14
JP2020153416 2020-09-14
PCT/JP2021/033407 WO2022054929A1 (ja) 2020-09-14 2021-09-10 熱伝導性材料及び電子部品

Publications (2)

Publication Number Publication Date
JPWO2022054929A1 JPWO2022054929A1 (https=) 2022-03-17
JP7788619B2 true JP7788619B2 (ja) 2025-12-19

Family

ID=80631765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022548368A Active JP7788619B2 (ja) 2020-09-14 2021-09-10 熱伝導性材料及び電子部品

Country Status (4)

Country Link
US (1) US20230352365A1 (https=)
JP (1) JP7788619B2 (https=)
CN (1) CN116097912A (https=)
WO (1) WO2022054929A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023111629A (ja) * 2022-01-31 2023-08-10 パナソニックＩｐマネジメント株式会社 電気機器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258527A (ja) 2007-04-09 2008-10-23 Matsushita Electric Ind Co Ltd 放熱装置
JP2014175501A (ja) 2013-03-08 2014-09-22 Toshiba Corp 導電性サーマルシートおよび高周波モジュール
JP3207324U (ja) 2013-11-05 2016-11-10 グラフテック インターナショナル ホールディングス インコーポレーテッドＧｒａｆＴｅｃｈ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｈｏｌｄｉｎｇｓ Ｉｎｃ． グラファイト物品

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033422A (ja) * 2000-07-14 2002-01-31 Toshiba Corp 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器
JP6809192B2 (ja) * 2016-12-13 2021-01-06 昭和電工マテリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法及び放熱装置
JP6862896B2 (ja) * 2017-02-17 2021-04-21 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP7027094B2 (ja) * 2017-09-28 2022-03-01 デンカ株式会社 放熱部品付きパワーモジュール
JP2018133598A (ja) * 2018-06-05 2018-08-23 三菱電機株式会社 半導体装置およびその製造方法
JP2020019883A (ja) * 2018-07-31 2020-02-06 日本ゼオン株式会社 熱伝導シート
JP7345088B2 (ja) * 2019-02-08 2023-09-15 パナソニックＩｐマネジメント株式会社 熱伝導シートおよびこれを用いた電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258527A (ja) 2007-04-09 2008-10-23 Matsushita Electric Ind Co Ltd 放熱装置
JP2014175501A (ja) 2013-03-08 2014-09-22 Toshiba Corp 導電性サーマルシートおよび高周波モジュール
JP3207324U (ja) 2013-11-05 2016-11-10 グラフテック インターナショナル ホールディングス インコーポレーテッドＧｒａｆＴｅｃｈ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｈｏｌｄｉｎｇｓ Ｉｎｃ． グラファイト物品

Also Published As

Publication number Publication date
CN116097912A (zh) 2023-05-09
JPWO2022054929A1 (https=) 2022-03-17
US20230352365A1 (en) 2023-11-02
WO2022054929A1 (ja) 2022-03-17

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