CN116097912A - 热传导材料以及电子部件 - Google Patents

热传导材料以及电子部件 Download PDF

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Publication number
CN116097912A
CN116097912A CN202180053797.XA CN202180053797A CN116097912A CN 116097912 A CN116097912 A CN 116097912A CN 202180053797 A CN202180053797 A CN 202180053797A CN 116097912 A CN116097912 A CN 116097912A
Authority
CN
China
Prior art keywords
conductive material
thermally conductive
thickness
region
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180053797.XA
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English (en)
Chinese (zh)
Inventor
白土洋次
河村典裕
服部将也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN116097912A publication Critical patent/CN116097912A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN202180053797.XA 2020-09-14 2021-09-10 热传导材料以及电子部件 Pending CN116097912A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-153416 2020-09-14
JP2020153416 2020-09-14
PCT/JP2021/033407 WO2022054929A1 (ja) 2020-09-14 2021-09-10 熱伝導性材料及び電子部品

Publications (1)

Publication Number Publication Date
CN116097912A true CN116097912A (zh) 2023-05-09

Family

ID=80631765

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180053797.XA Pending CN116097912A (zh) 2020-09-14 2021-09-10 热传导材料以及电子部件

Country Status (4)

Country Link
US (1) US20230352365A1 (https=)
JP (1) JP7788619B2 (https=)
CN (1) CN116097912A (https=)
WO (1) WO2022054929A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023111629A (ja) * 2022-01-31 2023-08-10 パナソニックＩｐマネジメント株式会社 電気機器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002033422A (ja) * 2000-07-14 2002-01-31 Toshiba Corp 熱伝導シート、熱伝導シートを有する冷却装置および回路モジュールならびに回路モジュールを搭載した電子機器
JP5018195B2 (ja) 2007-04-09 2012-09-05 パナソニック株式会社 放熱装置
JP2014175501A (ja) 2013-03-08 2014-09-22 Toshiba Corp 導電性サーマルシートおよび高周波モジュール
KR20160002427U (ko) 2013-11-05 2016-07-11 그라프텍 인터내셔널 홀딩스 인코포레이티드 흑연 물품
JP6809192B2 (ja) * 2016-12-13 2021-01-06 昭和電工マテリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法及び放熱装置
JP6862896B2 (ja) * 2017-02-17 2021-04-21 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP7027094B2 (ja) * 2017-09-28 2022-03-01 デンカ株式会社 放熱部品付きパワーモジュール
JP2018133598A (ja) * 2018-06-05 2018-08-23 三菱電機株式会社 半導体装置およびその製造方法
JP2020019883A (ja) * 2018-07-31 2020-02-06 日本ゼオン株式会社 熱伝導シート
JP7345088B2 (ja) * 2019-02-08 2023-09-15 パナソニックＩｐマネジメント株式会社 熱伝導シートおよびこれを用いた電子機器

Also Published As

Publication number Publication date
JPWO2022054929A1 (https=) 2022-03-17
JP7788619B2 (ja) 2025-12-19
US20230352365A1 (en) 2023-11-02
WO2022054929A1 (ja) 2022-03-17

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