JP2002016068A5 - - Google Patents
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- Publication number
- JP2002016068A5 JP2002016068A5 JP2000195007A JP2000195007A JP2002016068A5 JP 2002016068 A5 JP2002016068 A5 JP 2002016068A5 JP 2000195007 A JP2000195007 A JP 2000195007A JP 2000195007 A JP2000195007 A JP 2000195007A JP 2002016068 A5 JP2002016068 A5 JP 2002016068A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- element belonging
- group
- aluminum
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052782 aluminium Inorganic materials 0.000 claims 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 10
- 238000000034 method Methods 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 6
- 229910045601 alloy Inorganic materials 0.000 claims 4
- 239000000956 alloy Substances 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 4
- 229910052758 niobium Inorganic materials 0.000 claims 4
- 238000000059 patterning Methods 0.000 claims 4
- 229910052719 titanium Inorganic materials 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 229910052804 chromium Inorganic materials 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 229910052735 hafnium Inorganic materials 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910021332 silicide Inorganic materials 0.000 claims 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 229910052720 vanadium Inorganic materials 0.000 claims 2
- 229910052726 zirconium Inorganic materials 0.000 claims 2
- 238000009751 slip forming Methods 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000195007A JP4099933B2 (ja) | 2000-06-28 | 2000-06-28 | 配線の製造方法、配線及び電気光学装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000195007A JP4099933B2 (ja) | 2000-06-28 | 2000-06-28 | 配線の製造方法、配線及び電気光学装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002016068A JP2002016068A (ja) | 2002-01-18 |
| JP2002016068A5 true JP2002016068A5 (enExample) | 2004-12-16 |
| JP4099933B2 JP4099933B2 (ja) | 2008-06-11 |
Family
ID=18693750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000195007A Expired - Fee Related JP4099933B2 (ja) | 2000-06-28 | 2000-06-28 | 配線の製造方法、配線及び電気光学装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4099933B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4781066B2 (ja) * | 2004-09-30 | 2011-09-28 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
| JP4754798B2 (ja) * | 2004-09-30 | 2011-08-24 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
-
2000
- 2000-06-28 JP JP2000195007A patent/JP4099933B2/ja not_active Expired - Fee Related
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