JP2002009416A - Sheet for manufacturing printed wiring board, method for manufacturing printed wiring board using the sheet for manufacturing printed wiring board, and printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet for manufacturing a printed wiring board, which can realize with high yield that LCR of high precision and a radio wave absorbing component layer are built in a resin circuit board with a simple process at a low cost by using a general-purpose sheet. SOLUTION: When a printed wiring board formed by laminating and molding a support layer 2, a metal layer 3, a passive component forming layer 4 and a metal layer 5 in this order is manufactured, the laminating and molding are performed in the state that the metal layers 3, 5 and the passive component forming layer 4 are retained by the support layer 2, and the metal layer 3 is not patterned of the support layer 2. As a result, deformation and crack of the passive component forming layer 4 are restrained in the case of molding. Circuit components such as a capacitor, an inductor, a resistor and a radio wave absorbing component layer are formed by using the metal layers 3, 5 and the passive component forming layer 4. Thereby the circuit components are built on the printed wiring board, and the passive component forming layer 4 which is thin can be formed precisely with high yield.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet material for manufacturing a printed wiring board used for manufacturing a printed wiring board, a method for manufacturing a printed wiring board using the sheet material for manufacturing a printed wiring board, and manufacturing of the printed wiring board. The present invention relates to a printed wiring board manufactured by using a sheet material for an electronic device, and more particularly to a technique for incorporating an inductor (L), a capacitor (C), and a resistor (R) into a printed wiring board by a simple process.

[0002]

2. Description of the Related Art In recent years, with the demand for higher performance and smaller size of electronic equipment, higher density and higher function of circuit parts have been further enhanced. Therefore, when an electronic component is mounted on a printed wiring board, an inductor (L), a capacitor (C), a resistor (R), or the like (hereinafter, these may be collectively referred to as LCR) in order to increase the mounting efficiency. Is included in a substrate.

[0003] In addition, with the increase in signal speed, the increase in capacity, and the reduction in power consumption, the problem of noise generation has become more serious. Conventionally, in circuit components including semiconductor elements and capacitors, noise of electric signals can be reduced by shortening the distance between the semiconductor element and the capacitor. Noise reduction has been performed. Also, attempts have been made to reduce noise by forming a magnetic layer in a circuit board (for example, disclosed in Japanese Patent Application Laid-Open No. 10-163636).

As described above, as a conventional technique of incorporating passive components for the purpose of improving the mounting density and reducing noise, a method of forming a ceramic substrate by LCR batch firing has been known and used for a long time.

On the other hand, many attempts have been made to incorporate the LCR into a resin substrate.

For example, as a method of forming a dielectric layer of a capacitor, a method in which a filler having a high dielectric constant is dispersed in a resin is used.
It has been conventionally used as a core material of a multilayer printed wiring board.

As a method of forming a resistor on a resin substrate, a method of printing and forming a resistor paste of carbon black has often been used.

As a method of forming an inductor on a resin substrate, a coil pattern is generally formed by patterning a conductor circuit.

Further, in recent years, high-precision LCR has been applied onto a circuit board by using a semiconductor process such as spin coating or physical etching by laser irradiation.
Attempts are being made to stack them sequentially. That is, the insulating layer and the circuit layer are sequentially laminated and formed.

[0010]

However, each of the above-described conventional methods of incorporating LCR has the following problems.

First, the method of forming ceramics by batch firing has problems in terms of productivity and cost.

Further, in forming a capacitor, a method in which a filler having a high dielectric constant dispersed in a resin is used as a core material of a multilayer printed wiring board cannot remarkably improve the dielectric constant. As the content ratio increases, the substrate becomes brittle, and when the substrate thickness is reduced, deformation, cracks, cracks, and the like are likely to occur. Here, the capacitance required for the bypass capacitor layer is becoming extremely high year by year. For this purpose, it is necessary to reduce the thickness of the dielectric layer. Current approaches to forming capacitors are becoming technologically limited.

In recent years, in manufacturing a multilayer printed wiring board, a method of sequentially laminating and building up a film material for build-up has been found in many cases, and a thin resin film for build-up has been filled with a high dielectric constant filler. A possible method is to form a thin dielectric layer using the thin film and to incorporate the capacitor therein. In this case, as shown in FIG. 8, the lower electrode 6 of the capacitor is formed on the upper surface of the insulating resin layer 7, and the metal layer 3 for forming the upper electrode of the capacitor is provided above the lower electrode 6. In addition, a thin dielectric layer 17 is formed between the lower electrode 6 and the metal layer 3. However, in this case, as shown in the figure, the dielectric layer 17 and the metal layer 3 were affected by the unevenness of the lower electrode 6 and were in a poor coplanarity (smoothness) state.

In a method of printing and forming a resistor paste of carbon black as a resistor forming method,
Since a change in resistance occurs due to heat and pressure in the subsequent heating and pressing step, it is very difficult to control the resistance, and there is also a problem in stability.

Further, in an attempt to sequentially stack high-precision LCRs on a core substrate, versatility is lacking and expensive equipment is required in terms of process.

In the method of forming an inductor as a circuit pattern, it has conventionally been difficult to form an inductor having a high inductance value such as a chip component.

The present invention has been made in view of the above points, and uses a general-purpose sheet material to achieve a high-precision L in a resin circuit board by a low-cost and simple process.
A sheet material for manufacturing a printed wiring board capable of realizing the incorporation of a CR and a radio wave absorbing component layer, a method for manufacturing a printed wiring board using the sheet material for manufacturing a printed wiring board, and a printed wiring board. Specifically, it is technically possible to form a high-capacity and high-precision capacitor layer, and it is possible to easily form an inductor having a high inductance, and it is possible to form a capacitor layer in a circuit board. An object of the present invention is to provide a technique capable of forming a radio wave absorbing layer or easily forming a resistor layer having a small change in resistance value.

[0018]

A sheet material for manufacturing a printed wiring board according to claim 1 of the present invention is formed by laminating a support layer 2, a metal layer 3, a passive component forming layer 4, and a metal layer 5 in this order. It is characterized by comprising a configuration.

A sheet material for manufacturing a printed wiring board according to a second aspect of the present invention has a structure in which a support layer 2, a metal layer 3, and a passive component forming layer 4 are laminated in this order. It is.

According to a third aspect of the present invention, in addition to the constitution of the first or second aspect, the metal layers 3 and 5 are made of at least one of iron, copper, aluminum, nickel, titanium and alloys thereof. It is characterized by being formed from the above.

According to a fourth aspect of the present invention, in addition to any one of the first to third aspects, the passive component forming layer 4 is
It is characterized by being formed of a high dielectric constant material 4a.

According to a fifth aspect of the present invention, in addition to the structure of the fourth aspect, the thickness of the passive component forming layer 4 is set to 0.05 to 0.05.
It is characterized by being formed in a range of 50 μm.

According to a sixth aspect of the present invention, in addition to the configuration of the fourth or fifth aspect, the relative permittivity of the passive component forming layer 4 is set to
It is characterized by being formed in the range of 10 to 50,000.

According to a seventh aspect of the present invention, in addition to the constitution of the fourth aspect, the passive component forming layer 4 is formed of a high dielectric material 4a made of a resin in which a high dielectric filler is dispersed. It is characterized by becoming.

According to an eighth aspect of the present invention, in addition to the configuration of the seventh aspect, the relative permittivity of the passive component forming layer 4 is set to 10 to 2
The thickness is formed in the range of 1 to 50 μm.

According to a ninth aspect of the present invention, in addition to the constitution of any one of the fourth to sixth aspects, the passive component forming layer 4 is formed by a sol-gel method.

[0027] The invention described in claim 10 is the fourth invention.
6, the passive component forming layer 4
Is formed by a thermal spraying method or an ion plating method.

The invention described in claim 11 is the fourth invention.
6, the passive component forming layer 4
Is formed by a chemical vapor deposition method or a physical vapor deposition method.

The invention described in claim 12 is the first invention.
1, the thickness of the passive component forming layer 4 is set to 0.05
It is characterized by being formed in the range of の 1 μm.

The invention described in claim 13 is the first invention.
3 to the passive component forming layer 4
Is formed of a high magnetic permeability material 4b.

The invention according to claim 14 is the first invention.
In addition to the constitution 3, the passive component forming layer 4 is formed of a high magnetic permeability material 4b made of a resin in which a high magnetic permeability filler is dispersed.

The invention according to claim 15 is the first invention.
3 to the passive component forming layer 4
Is formed of the resistor material 4c.

The invention according to claim 16 is the first invention.
In addition to the constitution of 5, the passive component forming layer 4 is formed of a resin in which carbon is dispersed.

The seventeenth aspect of the present invention is the first aspect of the present invention.
In addition to the configuration of 5, the passive component forming layer 4 is formed by metal plating.

The invention according to claim 18 is the first invention.
In addition to any one of the constitutions 3 to 17, the passive component forming layer 4 is formed in a thickness of 0.05 to 500 μm.

According to a nineteenth aspect of the present invention, there is provided a method for manufacturing a printed wiring board, wherein the sheet material for manufacturing a printed wiring board according to any one of the first to eighteenth aspects is laminated and formed in a printed wiring board. The present invention is characterized in that an inductor, a capacitor, a resistor, or a radio wave absorbing component layer is formed at an arbitrary position on a printed wiring board.

According to a twentieth aspect of the present invention, there is provided a printed wiring board using the sheet material for manufacturing a printed wiring board according to any one of the first to eighteenth aspects. It is characterized in that at least one of the layers is built-in.

[0038]

An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show an embodiment of a sheet material 1 for manufacturing a printed wiring board according to the present invention, which can be used properly depending on the manufacturing process of the printed wiring board.

In the sheet material 1 for manufacturing a printed wiring board shown in FIG. 1, a heat-resistant support film is provided as an outermost layer as a carrier film, and a support layer 2 is formed by the carrier film. The heat-resistant support film has a heat resistance that does not cause a chemical change such as decomposition, deterioration, melting or the like or a mechanical change in a heating and pressing step in a later step. In some cases, the metal layers 3 and 5 and the passive component forming layer 4 support mechanical characteristics so as not to cause cracks and cracks in the passive component forming layer 4. Examples of such a heat-resistant support film include a polyester resin film such as polyethylene terephthalate, a polyphenylene sulfide film, a polyimide film, and a fluorine resin film or the like, or a metal film such as an aluminum foil, a nickel foil, and a copper foil. be able to.

On the support layer 2, a metal layer 3, a passive component forming layer 4, and a metal layer 5 are sequentially laminated and formed on one surface side. Further, a sheet material 1 for manufacturing a printed wiring board shown in FIG.
The metal layer 3 and the passive component forming layer 4 are sequentially laminated and formed on one surface side of the support layer 2 similar to the above.

The metal layers 3 and 5 are used to form circuit components or to be formed as electrodes or circuit parts in the process of manufacturing a printed wiring board. Therefore, the metal layers 3 and 5 should be formed of a material having good electric conductivity. In particular, it is preferable to form from iron, copper, aluminum, nickel, titanium, or an alloy thereof in terms of performance and cost. However, it is not limited to these materials,
A conductor compounded with silver, palladium, platinum, molybdenum, tungsten, or the like may be used. In forming the metal layers 3 and 5, they can be deposited by plating or vapor deposition. Further, the metal foil may be used as a starting material, and the metal foil may be laminated and formed.

The passive component forming layer 4 is formed of a high dielectric constant material 4a, a high magnetic permeability material 4b, or a resistor material 4c according to the circuit component formed by the printed wiring board manufacturing sheet material 1. A high-permittivity material 4a is applied to form a capacitor, a high-permeability material 4b is applied to form an inductor or a radio wave absorbing component layer, and a resistor material 4c is used to form a resistor. Apply. The thickness of the passive component forming layer 4 is preferably in the range of 0.05 μm to 500 μm. If the thickness is less than 0.05 μm, when electrical insulation between both surfaces of the passive component forming layer 4 is required as in the case of forming a capacitor,
It is difficult to ensure sufficient insulation, and 0.0
It is difficult to maintain dimensional accuracy within a range of less than 5 μm, and it is difficult to impart desired performance to circuit components. Conversely, when the thickness exceeds 500 μm, the embedding property of the passive component forming layer 4 in the insulating layer of the printed wiring board is reduced, and it is difficult to form the passive component forming layer 4 in the printed wiring board. .

First, the passive component forming layer 4 is made of a high dielectric material 4
The sheet material 1 for manufacturing a printed wiring board for forming a capacitor, which is formed in a, will be described.

The passive component forming layer 4 can be formed as a sheet-like layer in a B-stage state or a C-stage state by hardening and molding a resin in which a high dielectric constant filler is filled and dispersed into a sheet. As the resin, a resin generally used for forming an insulating layer of a printed wiring board, such as an epoxy resin or a phenol resin, can be used. As the high dielectric constant filler, titanium oxide, barium titanate-based ceramics, zirconate titanate-based ceramics, strontium titanate-based ceramics, and the like can be used. It may be something.

Further, the passive component forming layer 4 can be formed by depositing an inorganic compound such as titanium oxide, zirconium oxide, barium titanate or the like into a layer by a sol-gel method. Further, the passive component forming layer 4 is formed by spraying, chemical vapor deposition (CVD), physical vapor deposition (PVD), or ion plating, and forming barium titanate, strontium titanate, zirconate titanate, or the like. Can be formed by forming a layer of the inorganic compound described above, or by combining these methods. In this manner, when the passive component forming layer 4 is formed of a layer made of only an inorganic compound, it is possible to further increase the dielectric constant of the passive component forming layer 4 as compared with a case where a high dielectric constant filler is dispersed in a resin. Become. Here, when the passive component forming layer 4 is formed by a CVD method, a PVD method, sputtering, or the like, the dielectric constant can be particularly improved, but this promotes crystallization, growth of crystal grains, and orientation. It is thought that it is.

When the passive component forming layer 4 is formed of a resin filled and dispersed with a high dielectric constant filler, the relative dielectric constant is 2
In the case where the passive component forming layer 4 is formed by thermal spraying, chemical vapor deposition (CVD), physical vapor deposition (PVD), or ion plating. Can adjust the relative dielectric constant in a range up to about 50,000. Here, in order to exert a sufficient function as a capacitor, the relative dielectric constant is preferably 10 or more, and the practical upper limit is 50,000 as described above. The rate is preferably adjusted in the range of 10 to 50,000.

In order to provide a sufficient capacitance to the capacitor, it is preferable to make the thickness of the passive component forming layer 4 small. Particularly preferably, the thickness of the passive component forming layer 4 is formed in the range of 0.05 to 50 μm. If the thickness is less than 0.05 μm, it will be difficult to secure electrical insulation between both surfaces of the passive component forming layer 4. If the thickness exceeds 50 μm, the capacitance of the capacitor will be reduced and sufficient performance will be obtained. It is difficult to obtain.

In forming the passive component forming layer 4 using a resin filled and dispersed with a high dielectric constant filler,
The relative permittivity of the passive component forming layer 4 is 10 to 200, and the thickness is 1
When formed in the range of about 50 μm, the passive component forming layer 4 having a high dielectric constant and a low cost and having good adhesion to the metal layers 3 and 5 can be formed. Here, if the thickness of the passive component forming layer 4 is less than 1 μm, it is difficult to obtain accurate precision in forming the passive component forming layer 4,
If it exceeds 50 μm, the capacitance of the capacitor will decrease, and it will be difficult to obtain sufficient performance.

When forming the passive component forming layer 4 by the CVD method or the PVD method, it is preferable that the thickness of the passive component forming layer 4 is formed in the range of 0.05 to 1 μm, and the thickness is set to 0.1 μm. If the thickness is less than 05 μm, the insulating property may be deteriorated. If the thickness exceeds 1 μm, it takes a long time to form a film, which causes problems in terms of productivity and manufacturing cost.

FIGS. 3 and 4 show a process of incorporating a capacitor in a printed wiring board using the sheet material 1 for manufacturing a printed wiring board.

In the example shown in FIG. 3, as shown in FIG. 1, a sheet material 1 for manufacturing a printed wiring board is composed of a support layer 2, a first metal layer 3, a passive component forming layer 4, a second metal layer 5 Are sequentially laminated. The passive component forming layer 4 is formed of a high dielectric constant material 4a.

First, as shown in FIG. 3 (b), the sheet material 1 for manufacturing a printed wiring board is partly removed by etching the second metal layer 5 to obtain a desired shape. An electrode (hereinafter, referred to as “inside electrode 6”) is formed. The processing method for performing the etching process on the second metal layer 5 varies depending on the type of metal, but when the second metal layer 5 is formed of copper or nickel, generally, Processing with an etching solution used for manufacturing a printed wiring board can be performed. For example, an aqueous solution of cupric chloride is used. Here, while the second metal layer 5 is being subjected to the etching process, the first metal layer 3 is protected by the support layer 2, and the etching process is performed only on the second metal layer 5. Becomes possible. For this reason, as described later, the dielectric layer 17 formed from the passive component forming layer 4 is not easily deformed or cracked.

In this state, the surface on which the inner electrode 6 is formed is opposed to one surface of the semi-cured insulating resin layer 7 formed of a prepreg or the like, and then laminated by heating and pressing. At this time, the support layer 2, the first metal layer 3, the passive component forming layer 4, the inner electrode 6, and the insulating resin layer 7 are laminated in this order from one surface side to the other surface side. Configuration. At this time, the passive component forming layer 4
Is formed as the dielectric layer 17. Here, a metal conductor layer 8 is formed on the other surface of the insulating resin layer 7, and this conductor layer 8 may be integrated with the insulating resin layer 7 in advance, and the insulating resin layer 7 and the inner electrode 6 and the like may be laminated and integrated with the insulating resin layer 7 at the same time.
After the lamination and integration, the support layer 2 is peeled off from the metal layer 3 as shown in FIG.

Here, the sheet material 1 for manufacturing a printed wiring board is laminated on the other surface of the insulating resin layer 7 instead of the metal conductor layer 8 in FIG. 17 may be formed.

In the molding steps shown in FIGS. 3A to 3C, when the inner electrode 6 and the insulating resin layer 7 are laminated and integrated, first, the insulating resin layer 7 in a semi-cured state is formed. It is deformed along the shape of the inner electrode 6, and in this state, the insulating resin layer 7
Cures. At this time, the shapes of the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are supported by the support layer 2, and the metal layer 3 is etched by the presence of the support layer 2 in the second metal layer 5. Since it is not patterned during processing, deformation and cracks are less likely to occur.
Therefore, even if the dielectric layer 17 is thin, a highly reliable capacitor can be incorporated with a high yield.

Further, using the sheet material in which the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are laminated and formed in this order while being supported by the support layer 2, the insulating resin layer 7 and the insulating resin layer 7 are integrally laminated. Since the printed wiring board is manufactured by the above-described process, the size and shape of the dielectric
It is maintained in a state before being laminated and integrated, is formed with high precision as designed, and has a good coplanarity without irregularities.

Here, in the example shown in the drawing, the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are laminated on the insulating resin layer 7 in a configuration in which only one insulating resin layer 7 and one conductive layer 8 are formed. However, the inner electrode 6 and the dielectric layer 1 are formed on the insulating resin layer 7 formed on the surface of the multilayer printed wiring board.
7. The same effect can be obtained when a first-layer metal layer 3 is laminated to produce a multilayer printed wiring board.

In this state, the first metal layer 3 is subjected to the same etching treatment as in the case of the second metal layer 5, whereby
As illustrated in FIG. 3D, FIG. 3E, and FIG. 3F, an electrode having a desired shape (hereinafter, referred to as “outer electrode 9”) and a circuit 10 for electric transmission are formed. . Outer electrode 9
Are formed so as to face the inner electrode 6 with the dielectric layer 17 interposed therebetween. The outer electrode 9, the inner electrode 6, and the dielectric layer 17 disposed between the electrodes 6, 9 constitute a capacitor. In this way, the capacitor is built in the printed wiring board. is there.

In the example shown in FIG. 3D, the outer electrode 9 also serves as a circuit 10 for electric transmission. On the other hand, conduction to the inner electrode 6 is ensured by connecting the inner electrode 6 and the circuit 10 for electric transmission with a through hole, a via hole (inner via hole) or the like. That is, in the illustrated example of FIG. 3D, a part of the inner electrode 6 is formed so as to protrude outward from the outer electrode 9, and a part of the protruding inner electrode 6 Is arranged to face a part of the circuit 10 via the dielectric layer 17. Forming a non-through hole connecting the inner electrode 6 and the circuit 10 for electric transmission at a portion where the inner electrode 6 and the circuit 10 for electric transmission face each other, and forming a plating layer on the inner surface of the non-through hole. Thereby, a via hole 11a is formed.

FIGS. 3E and 3F show examples of patterns in which a capacitor can be formed between two outer electrodes 9 without forming a via hole or a through hole. I have. FIGS. 3E and 3F
Here, one inner electrode 6 is formed so as to face two outer electrodes 9. In the example shown in FIG. 3E, the inner electrode 6 is composed of two outer electrodes 9 and the two outer electrodes 9,9.
Are formed in substantially the same shape as the shape of the region including the region between the two, and formed at a position matching this region.
On the other hand, in the example shown in FIG. 3F, the inner electrode 6 is formed in a shape larger than the shape of the region including the two outer electrodes 9 and the region between the two outer electrodes 9 and 9. Are formed so as to protrude outside this region. In the example shown in FIGS. 3E and 3F, the capacitors are equivalently formed in series, and two capacitors are formed in series between the two outer electrodes 9. I have.

In this case, the capacitance per unit area is reduced to 1/4 or less of the case shown in FIG. 3D, but the via holes 11a and the through holes for ensuring the conduction between the layers are formed. This eliminates the need to make the conduction reliability of the via hole 11a and the through hole a problem.

The performance of the capacitor is determined by the dimensions and shapes of the inner electrode 6, the outer electrode 9, and the dielectric layer 17, but as described above, in the present invention, the inner electrode 6, the outer electrode 9, and the dielectric layer 17 is formed with high precision in size and shape, and the dielectric layer 17
Even if the capacitor is made thinner to increase the capacity of the capacitor, the dielectric layer 17 maintains a desired size and shape without cracking or deformation.
Can be formed. Therefore, the capacitor can be easily built in the printed wiring board, and the capacity and accuracy of the capacitor can be increased.

When performing fine adjustment (trimming) of the capacitance of the capacitor, the outer electrode 9 may be used if necessary.
Can be adjusted by removing some of them.

On the other hand, in the example shown in FIG.
After the inner electrode 6 is formed by etching the second metal layer 5 in the same manner as in FIG.
(A), (b)), as shown in FIG. 4 (c), the passive component forming layer 4 where the inner electrode 6 is not formed is removed by etching, and the passive component forming layer 4 remains in the portion where the inner electrode 6 is formed. The passive component forming layer 4 is formed as a dielectric layer 17.

As a method for partially etching the passive component forming layer 4, dry etching such as ion etching for irradiating an ion source of an inert gas to perform physical removal or reactive ion etching, or laser irradiation is used. Physical etching such as removal can be applied.

When the passive component forming layer 4 is made of a resin, the passive component forming layer 4 is treated with a desmear solution such as a concentrated sulfuric acid solution or a chromic acid solution in the same manner as in the desmearing process. Part of the component forming layer 4 can be removed. Further, when the passive component forming layer 4 is made of a photo-degradable resin, light (ultraviolet)
After that, a part of the passive component forming layer 4 is removed by treating the photosensitive portion with a developing solution. Here, the photodegradable resin is a resin using a photosensitive resin or the like that can be developed and removed with a developing solution such as an alkaline solution by exposing to light, such as a positive resist, and a novolak resin. A polymer obtained by adding a sensitizer such as a naphthoquinonediazide compound to a polymer such as the above can be used. In removing a part of the passive component forming layer 4 by these methods, the inner electrode 6 serves as a mask, and the passive component forming layer 4 is removed in a portion where the inner electrode 6 is not formed.

In this state, the surface on which the inner electrode 6 is formed is opposed to one surface of the semi-cured insulating resin layer 7 formed by prepreg or the like, and then laminated by heating and pressing. At this time, the support layer 2, the first metal layer 3, the dielectric layer 17, the inner electrode 6, and the insulating resin layer 7 are laminated in this order from one surface side to the other surface side. . Here, a metal conductor layer 8 is formed on the other surface of the insulating resin layer 7, and this conductor layer 8 is previously formed on the insulating resin layer 7.
The insulating resin layer 7 and the inner electrode 6 may be integrated.
And the like may be simultaneously laminated and integrated with the insulating resin layer 7. After lamination and integration, FIG.
As shown in (d), the support layer 2 is separated from the metal layer 3.

Further, in FIG. 4, the sheet material 1 for manufacturing a printed wiring board is laminated on the other surface of the insulating resin layer 7 instead of the metal conductor layer 8 so that the dielectric layers 17 are formed on both sides of the insulating resin layer 7. May be formed.

In the molding steps shown in FIGS. 4A to 4D, when the inner electrode 6 and the insulating resin layer 7 are laminated and integrated, first, the insulating resin layer 7 in a semi-cured state is formed. Deformation follows the shapes of the inner electrode 6 and the dielectric layer 17, and the insulating resin layer 7 is cured in this state. At this time, the shapes of the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are such that the metal layer 3 is supported by the support layer 2 and the second metal layer 5 is formed by the presence of the support layer 2. Since no patterning is performed during the etching process, deformation and cracking are less likely to occur. Therefore, a highly reliable capacitor can be incorporated with a high yield even when the dielectric layer 17 is thin.

Also, using the sheet material in which the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are laminated and formed in this order and supported by the support layer 2, the insulating resin layer 7 and the insulating resin layer 7 are integrally laminated. Since the printed wiring board is manufactured by the above-described process, the size and shape of the dielectric
It is maintained as it is before being integrated with the stack, is formed with high precision as designed, and has good coplanarity without irregularities.

Here, in the example shown in the figure, in the configuration in which only one insulating resin layer 7 and one conductor layer 8 are formed, the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are laminated on the insulating resin layer 7. However, the inner electrode 6 and the dielectric layer 1 are formed on the insulating resin layer 7 formed on the surface of the multilayer printed wiring board.
7. The same effect can be obtained when a first-layer metal layer 3 is laminated to produce a multilayer printed wiring board.

In this state, the first metal layer 3 is subjected to the same etching treatment as in the case of the second metal layer 5, whereby
As illustrated in FIGS. 4E, 4F, and 4G, an outer electrode 9 having a desired shape and a circuit 10 for electric transmission are formed. The outer electrode 9 is formed so as to face the inner electrode 6 via the dielectric layer 17. The outer electrode 9, the inner electrode 6, and the dielectric layer 17 disposed between the electrodes 6, 9 constitute a capacitor.
Thus, the capacitor is built in the printed wiring board.

In the example shown in FIG. 4E, the outer electrode 9 also serves as a circuit 10 for electric transmission. On the other hand, conduction to the inner electrode 6 is ensured by connecting the inner electrode 6 and the circuit 10 for electric transmission with a through hole, a via hole (inner via hole) or the like. That is, in the example shown in FIG. 4E, a part of the inner electrode 6 is formed so as to protrude outward from the outer electrode 9, and a part of the protruding inner electrode 6 is used for electric transmission. Part of the circuit 10 and the dielectric layer 1
7 so as to face each other. This inner electrode 6
By forming a non-through hole connecting the inner electrode 6 and the circuit 10 for transmission in a portion where the circuit 10 for transmission and the power transmission circuit 10 are opposed to each other, and forming a plating layer on the inner surface of the non-through hole, the via hole is formed. 11a is formed.

FIGS. 4F and 4G show examples of patterns in which a capacitor can be formed between two outer electrodes 9 without forming a via hole or a through hole. I have. FIGS. 4F and 4G
Here, one inner electrode 6 is formed so as to face two outer electrodes 9. In the example shown in FIG. 4F, the inner electrode 6 is composed of two outer electrodes 9 and the two outer electrodes 9, 9.
Are formed in substantially the same shape as the shape of the region including the region between the two, and formed at a position matching this region.
On the other hand, in the example shown in FIG. 4 (g), the inner electrode 6 is formed in a shape larger than the shape of the region including the two outer electrodes 9 and the region between the two outer electrodes 9, 9. Are formed so as to protrude outside this region. In the example shown in FIGS. 4F and 4G, the capacitors are equivalently formed in series, and two capacitors are formed in series between the two outer electrodes 9. I have.

In this case, the capacitance per unit area is reduced to 1/4 or less of the case shown in FIG. 4E, but the via holes 11a and the through holes for ensuring the conduction between the layers are formed. This eliminates the need to make the conduction reliability of the via hole 11a and the through hole a problem.

When the capacitor is built in the printed wiring board in this way, the plurality of dielectric layers 17 formed from the passive component forming layer 4 are partially built in the printed wiring board, and printed. A plurality of capacitors can be built in the wiring board, and the degree of freedom in pattern design can be improved. That is, when a plurality of capacitors are provided, if a large number of terminals are formed on a substrate and a chip capacitor is connected to each of the terminals as in the conventional case, it is necessary to secure an area for disposing the chip capacitors. In addition, the routing of the circuit on the substrate becomes complicated. Further, in order to improve the noise removal efficiency of the bypass capacitor, it is necessary to shorten the length of the wiring connected to the capacitor. However, it is difficult to shorten the wiring when a chip capacitor is used. On the other hand, in this method, a plurality of capacitors can be built in the printed wiring board, and at this time, there is no need to particularly set an area for arranging the capacitors, and the circuit layout can be easily designed. It is possible to further shorten the wiring connected to the capacitor,
This can improve the noise removal efficiency when used as a bypass capacitor.

Also, the printed wiring board formed in FIGS. 3 and 4 is used as a core substrate, and the printed wiring board is multilayered by a conventional multilayering method such as a build-up method or a press method, so that the capacitor is built in. Thus, the form of the printed wiring board having a built-in capacitor according to the present invention is not limited to a single substrate as shown in FIGS.

Next, the passive component forming layer 4 is made of the high magnetic permeability material 4.
The sheet material 1 for manufacturing a printed wiring board for forming an inductor and a radio wave absorbing component layer formed in b will be described.

The passive component forming layer 4 made of the high magnetic permeability material 4b is made of Ni—Zn ferrite, Mn—Zn ferrite, Cu—Zn—Mg ferrite, Mn—Mg—Al
It can be formed by depositing a high magnetic permeability material 4b such as a system ferrite by a method such as vapor deposition.

Further, Ni—Zn ferrite or Mn—Zn
Ferrite, Cu-Zn-Mg ferrite, Mn-
An inorganic solid ceramic sintered body such as an Mg-Al ferrite can also be used.

Further, the passive component forming layer 4 can be formed by curing and molding a resin in which powders of these substances are filled and dispersed into a sheet shape. In this case, the resin may be an epoxy resin or a phenol resin. And the like generally used for forming an insulating layer of a printed wiring board, and are widely used in electronic parts such as polyethersulfone, polyetherimide, liquid crystal polymer, nylon (polyamide), and polyphenylene sulfide. A thermoplastic resin having a glass transition temperature is also applied.

FIGS. 5 and 6 show a process of incorporating an inductor in a printed wiring board using the sheet material 1 for manufacturing a printed wiring board.

In the example of FIG. 5, the sheet material 1 for manufacturing a printed wiring board has a configuration in which a support layer 2, a metal layer 3, and a passive component forming layer 4 are laminated in this order, as shown in FIG. The passive component forming layer 4 is formed of a high magnetic permeability material 4b.
In the sheet material 1 for manufacturing a printed wiring board, a part of the passive component forming layer 4 is first removed by etching to form a high magnetic permeability layer 14 patterned into a desired shape.

As the method of partially etching the passive component forming layer 4, as in the case of forming a capacitor, physical etching such as ion etching and laser irradiation can be applied.

When the passive component forming layer 4 is formed of resin, ion etching, physical etching such as laser irradiation and the like can be applied in the same manner, and a sulfuric acid solution, a chromic acid solution, etc. Etching can also be performed by performing the treatment with the desmear liquid. Alternatively, the passive component forming layer 4 may be made of a photo-degradable resin, and the portion to be removed on the passive component forming layer 4 may be irradiated with light to perform etching.

The high magnetic permeability layer 14 has a through hole 12 for forming a through hole or a via hole (inner via hole). If it is not necessary, the passive component forming layer 4 is not subjected to patterning, and the passive component forming layer 4 formed on the sheet material 1 for manufacturing a printed wiring board is formed as the high magnetic permeability layer 14 as it is. The high magnetic permeability layer 14 may be formed over the entire surface of the printed wiring board, and the through hole 12 may be formed only when it is necessary to route a circuit by a through hole or a via hole. Such patterning is an example of an embodiment in the case where the high magnetic permeability layer 14 is formed, and includes the high magnetic permeability layer 14 embedded in the multilayer printed wiring board.
It is applied when an inductor is formed by forming a conductor patterning thereon.

After the high magnetic permeability layer 14 is formed in this way, the surface on which the high magnetic permeability layer 14 is formed is made to face one surface of the semi-cured insulating resin layer 7 formed of a prepreg or the like. Then, they are laminated by laminating by heating and pressing, and at this time, the support layer 2, the metal layer 3, the high magnetic permeability layer 14, and the insulating resin layer 7 are laminated in this order. . Here, a metal conductive layer 8 is formed on the other surface of the insulating resin layer 7, and this conductive layer 8 may be integrated with the insulating resin layer 7 in advance, and the insulating resin layer 7 and the high magnetic permeability Layer 14
And the like may be simultaneously laminated and integrated with the insulating resin layer 7. After the lamination and integration, the support layer 2 is peeled off from the metal layer 3.

In FIG. 5, a sheet material 1 for producing a printed wiring board may be laminated on the other surface of the insulating resin layer 7 instead of the metal conductor layer 8. The high magnetic permeability layer 14 can be formed on the surface.

In the above-described forming step, when the high magnetic permeability layer 14 and the insulating resin layer 7 are laminated and integrated, first, the semi-cured insulating resin layer 7 is formed into the shape of the high magnetic permeability layer 14. Along with the insulating resin layer 7 in this state. At this time, since the shapes of the high magnetic permeability layer 14 and the metal layer 3 are supported by the support layer 2, they are less likely to be deformed or cracked. The inductor can be built in with good yield.

Further, using the sheet material in which the high magnetic permeability layer 14 and the first metal layer 3 supported and supported by the support layer 2 are laminated and formed in this order, they are laminated and integrated with the insulating resin layer 7 and printed. Since the wiring board is manufactured, the dimensions and the shape of the high magnetic permeability layer 14 serving as a passive component are maintained in the state before being laminated and integrated with the insulating resin layer 7, and are accurately formed as designed. Things.

Here, in the example shown in the figure, the high magnetic permeability layer 14 and the first metal layer 3 are laminated on the insulating resin layer 7 in a configuration in which only one insulating resin layer 7 and one conductive layer 8 are formed. However, the same applies to the case where the high magnetic permeability layer 14 and the first metal layer 3 are laminated on the insulating resin layer 7 formed on the surface of the multilayer printed wiring board to produce a multilayer printed wiring board. The effect of is obtained.

In this state, the metal layer 3 is etched to form an inductor pattern 13 having a desired shape. In the illustrated example, the inductor pattern 13 is formed in a spiral shape (planar coil shape). However, the pattern shape is not particularly limited as long as it functions as a desired inductor. Further, through holes, via holes, and the like are formed as needed, and the presence or absence thereof is not limited.

In the illustrated example, the center of the spiral inductor pattern 13 is formed at a position that matches the through hole 12 of the high magnetic permeability layer 14. Then, at a position where the through hole 12 is formed, a through hole for connecting the inductor pattern 13 and the conductor layer 8 is formed, and the inner surface of the through hole is plated to form a through hole 11b. A circuit 15 is formed on the conductor layer 8 by etching or the like to form a circuit 15. In this way,
The inductor pattern 13 is electrically connected to a circuit 15 formed on a different layer from the inductor pattern 13.

In the example shown in FIG. 6, as shown in FIG. 1, the sheet material 1 for manufacturing a printed wiring board is composed of a support layer 2, a first metal layer 3, a passive component forming layer 4, and a second metal layer. 5 are sequentially laminated and formed. The passive component forming layer 4 is formed of a high magnetic permeability material 4b. In the sheet material 1 for manufacturing a printed wiring board, first, the second metal layer 5 is subjected to an etching process to form a plurality of parallel-parallel inner surface side line patterns 13b. At this time, the first metal layer 3 is protected by the support layer 2 as in the case shown in FIG. Further, a part of the passive component forming layer 4 is etched and removed by the same method as that shown in FIG. 5 to form the high magnetic permeability layer 14 patterned into a desired shape. At this time, the portion where the inner side line pattern 13b is not formed is removed by etching of the passive component forming layer 4, but if it is not necessary, the passive component forming layer 4 is not patterned and the printed wiring board is By forming the passive component forming layer 4 formed on the manufacturing sheet material 1 as the high magnetic permeability layer 14 as it is, the high magnetic permeability layer 14 may be formed over the entire surface of the printed wiring board.

Thus, the inner side line pattern 13
After the formation of the high magnetic permeability layer 14 and the high magnetic permeability layer 14,
After the surface on which the inner-side line pattern 13b is formed is opposed to one surface of the semi-cured insulating resin layer 7 formed of a prepreg or the like, the surface is overlaid, and then heated and pressed to be laminated and integrated. In this case, the support layer 2, the metal layer 3, the high magnetic permeability layer 14, the inner surface side line pattern 13b, and the insulating resin layer 7 are laminated in this order from one surface side to the other surface side. Here, a metal conductor layer 8 is formed on the other surface of the insulating resin layer 7, and this conductor layer 8 may be integrated with the insulating resin layer 7 in advance, When the magnetic susceptibility layer 14 and the like are laminated and integrated, the insulating resin layer 7
May be laminated and integrated. And after lamination integration,
The support layer 2 is separated from the metal layer 3.

In FIG. 6, a sheet material 1 for producing a printed wiring board may be laminated on the other surface of the insulating resin layer 7 instead of the metal conductor layer 8. The high magnetic permeability layer 14 can be formed on the surface.

In the above molding step, when the high magnetic permeability layer 14 and the inner side line pattern 13b and the insulating resin layer 7 are laminated and integrated, first the semi-cured insulating resin layer 7 is Line pattern 13b and high permeability layer 1
In this state, the insulating resin layer 7 is cured. At this time, the shapes of the inner surface side line pattern 13b, the high magnetic permeability layer 14, and the first metal layer 3 are supported by the support layer 2 and are less likely to be deformed or cracked.

The inner side line pattern 13b, the high magnetic permeability layer 14,
Since the printed wiring board is manufactured by laminating and integrating the insulating resin layer 7 using a sheet material in which the first metal layer 3 is sequentially laminated and formed, the dimensions of the high magnetic permeability layer 14 serving as a passive component are reduced.
The shape is maintained as it is before being laminated and integrated with the insulating resin layer 7, and is formed accurately as designed.

Here, in the illustrated example, in the configuration in which only one insulating resin layer 7 and one conductor layer 8 are formed, the insulating resin layer 7 is provided with the inner side line pattern 13b, the high magnetic permeability layer 14,
Although the first metal layer 3 is laminated, the inner side line pattern 13b, the high magnetic permeability layer 14, and the first metal layer 3 are formed on the insulating resin layer 7 formed on the surface of the multilayer printed wiring board. The same effect can be obtained when a multilayer printed wiring board is produced by laminating.

Then, an etching process is performed on the first metal layer 3 to form a plurality of parallel outer-surface-side line patterns 13a. The outer surface side line pattern 13a is formed on the opposite side of the inner surface side line pattern 13b via the high magnetic permeability layer 14. Of the plurality of outer-side line patterns 13a, each of the outer-side line patterns 13a disposed at both ends is provided with a terminal circuit 13d for electric transmission.
Is formed in the example shown in FIG.

Furthermore, a side line pattern 13c is connected between the end of the inner side line pattern 13b and the end of the outer side line pattern 13a. The side line pattern 13c is formed along the edge of the high magnetic permeability layer 14, and is formed by a through hole or a via hole (inner via hole) connecting the outer side line pattern 13a and the side line pattern 13c. Be composed. That is, a plurality of outer surface side line patterns 13a
At both ends, one outer surface side line pattern 13
a through-hole or non-through-hole connecting the front end portion of the high-permeability layer 1 and the front end portion of one inner-side line pattern 13b.
The side line pattern 13c is formed by forming an inner surface of the through hole or the non-through hole by plating or filling the conductive paste. At this time, the inner side line patterns 13 which are electrically connected to each other are formed.
b, an outer side line pattern 13a and a side line pattern 13c constitute an inductor pattern 13 that surrounds the high magnetic permeability layer 14 in a number of turns in a coil shape, and a pair of terminal circuits 13d Terminals for transmitting power to the inductor pattern 13 are arranged at both ends of the pattern 13. FIG. 6F conceptually illustrates a state in which the inductor pattern 13 is formed around the high magnetic permeability layer 14.

In FIG. 6, by using the printed wiring board sheet material 1 instead of the metal conductor layer 8,
The high magnetic permeability layers 14 may be formed on both sides of the insulating resin layer 7.

In the method shown in FIGS. 5 and 6, when the inductor is built in the printed wiring board, the high permeability layer 14 can be built in the printed wiring board, and the inductance value can be improved. That is, a higher inductance value can be achieved as compared with a case where the inductor is formed only by leading the circuit.

In forming such a coil-shaped circuit pattern, the present invention is also applied to the case where the passive component forming layer 4 is not selectively removed but is left over the entire surface of the printed wiring board. 5. The configuration is not limited to the configuration shown in FIG.

Further, by forming the high magnetic permeability layer 14 on a part or the whole surface of a circuit in which noise is generated, the high magnetic permeability layer 14 functions as a radio wave absorbing component layer, thereby reducing noise. It becomes possible.

Next, the passive component forming layer 4 is made of the resistor material 4c.
The sheet material 1 for producing a printed wiring board for forming a resistor, which is formed by the method described above, will be described.

The passive component forming layer 4 can be formed by curing and molding a resin filled and dispersed with carbon into a sheet. As the resin, those generally used for forming an insulating layer of a printed wiring board, such as epoxy resin and phenol resin, can be used. In addition, polyether sulfone, polyether imide, liquid crystal polymer, nylon (polyamide), It is also possible to use a thermoplastic resin having a high glass transition temperature, such as polyphenyl sulfide, for electronic parts. Here, when a resin having a high glass transition temperature is used, micro-Brownian motion of the matrix polymer does not occur to a high temperature side and carbon agglomeration is prevented, so that the dispersed structure of carbon in the passive component forming layer 4 is maintained. And it is easy to stabilize the resistance value. Further, the passive component forming layer 4 can be formed of an alloy metal such as a nickel alloy or a chromium alloy, or a ceramic material such as silicon carbide (SiC). In this case, the passive component forming layer 4 may be deposited by plating or the like and formed by metal plating, or may be formed by vapor deposition.

FIG. 7 shows a sheet material 1 for manufacturing a printed wiring board.
5 shows a process of incorporating a resistor in a printed wiring board using the method shown in FIG.

In the illustrated example, the sheet material 1 for manufacturing a printed wiring board has a structure in which a support layer 2, a metal layer 3, and a passive component forming layer 4 are laminated in this order, as shown in FIG. The passive component forming layer 4 is formed of a resistor material 4c. In the sheet material 1 for manufacturing a printed wiring board, first, a part of the passive component forming layer 4 is removed by etching to form a resistor layer 15 having a desired shape. As a method for partially etching the passive component forming layer 4, when the passive component forming layer 4 is formed of the resistor material 4c made of an alloy metal, it is preferable to perform wet etching. As in the case of forming a capacitor, physical etching such as ion etching and laser irradiation can be applied. When the passive component forming layer 4 is formed of a resin, the portion to be removed can be etched by applying a treatment with a desmear solution such as a sulfuric acid solution or a chromic acid solution. By adjusting the shape and size of the resistor layer 15, the resistance value of the resistor incorporated in the circuit is adjusted. In this state, the surface on which the resistor layer 15 is formed is opposed to one surface of the semi-cured insulating resin layer 7 formed of a prepreg or the like, and then superposed. At this time, the support layer 2, the metal layer 3, the resistor layer 15, and the insulating resin layer 7 are laminated in this order from one surface side to the other surface side. And after lamination integration,
The support layer 2 is separated from the metal layer 3.

In the above-described forming step, when the resistor layer 15 and the insulating resin layer 7 are laminated and integrated, first, the insulating resin layer 7 in a semi-cured state is formed along the shape of the resistor layer 15. It is deformed, and the insulating resin layer 7 is cured in this state. At this time, the shapes of the resistor layer 15 and the metal layer 3 are supported by the support layer 2 and are less likely to be deformed or cracked.

Using the sheet material in which the resistor layer 15 and the metal layer 3 are laminated and formed in this order by being supported by the support layer 2, the printed wiring board is manufactured by being laminated and integrated with the insulating resin layer 7. The resistance layer 1 which becomes a passive component
The dimensions and shape of 5 are maintained as they are before being laminated and integrated with the insulating resin layer 7, and are formed with high precision as designed.

Here, in the illustrated example, the resistor layer 15 and the metal layer 3 are laminated on the insulating resin layer 7 in a configuration in which only one insulating resin layer 7 and one conductor layer 8 are formed. The same effect can be obtained when a multilayer printed wiring board is produced by laminating the resistor layer 15 and the metal layer 3 on the insulating resin layer 7 formed on the surface of the wiring board.

In this state, the metal layer 3 is subjected to an etching process to form a transmission circuit 16 having a desired shape. At this time, the resistor layer 15 is electrically connected to the circuit 16,
It constitutes a resistor.

In the conventional method for printing carbon paste, steps such as screen printing are very troublesome, whereas in the present method, the resistor previously formed as a film-shaped cured product as described above is used. By embedding the layer 15 in the printed wiring board, the printing step can be omitted, and the handleability is good. Further, when the resistor layer 15 is formed of an alloy or a ceramic material, a change in the resistance value in the subsequent heating and pressurizing step is suppressed, and a stable built-in resistor can be provided.

Since the metal layer 3 is protected by the support layer 2 during the patterning of the resistor layer 15, it is not necessary to increase the difference between the etch rates of the resistor layer 15 and the metal layer 3. Therefore, there is a merit that a variety of etching solutions and materials of the resistor layer 15 can be obtained. That is, particularly when the passive component forming layer 4 is formed of a metal layer such as metal plating, FIGS.
Since the metal layer 3 is protected by the support layer 2 when forming the resistor layer 15 by etching away a part of the passive component formation layer 4 as shown in FIG.
In selecting the etching solution, it is not necessary to consider whether the etching solution dissolves the metal layer 3, and the range of selection of the etching solution is widened.

[0116]

(Example 1) A copper foil with a support in which a copper foil with a thickness of 18 μm was laminated on a support made of a polyimide sheet with a thickness of 50 μm was used. The first metal layer 3 was composed of foil.

On the other hand, as an epoxy resin, 23.3 parts by mass of bisphenol-A diglycidyl ether (manufactured by Dainippon Ink and Chemicals, Inc., part number "Epiclon 850S"), and a polyfunctional epoxy resin (manufactured by Mitsui Chemicals, Inc., part number "VG3101") 40.9 parts by mass, 34.5 parts by mass of a novolak type phenol resin (manufactured by Meiwa Kasei Co., Ltd., product number "H3M") as a curing agent, and triphenylphosphine (manufactured by Hokuko Chemical Co., Ltd.) as a curing accelerator. TP
P ") 0.4 parts by mass of γ-glycidoxypropyltrimethoxysilane (SH6040) as a coupling agent
0.9 parts by mass, 40 parts by mass of methyl ethyl ketone (manufactured by Daishin Chemical Co., Ltd.) as a solvent, and barium titanate powder ("BT" manufactured by Nippon Chemical Industry Co., Ltd.) as a filler.
-4 ") was mixed at a volume fraction of 80 vol% with respect to the resin to prepare a resin composition.

This resin composition was applied to the surface of the first metal layer 3 by a gravure coater to a thickness of 1 μm.
The solvent is removed by heating and drying at 100 ° C. for 10 minutes, and the epoxy resin is brought into a semi-cured state. The epoxy resin is further cured by heating at 175 ° C. for 1 hour to obtain a high dielectric constant material 4a.
Was formed. Thereafter, a desmear treatment is performed with potassium permanganate, and then an electroless copper plating and an electrolytic copper plating are performed to form a second metal layer 5 having a thickness of 18 μm made of copper plating on the surface of the passive component forming layer 4. Was formed, and a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 1 was obtained. Further, in order to improve the adhesion between the passive component forming layer 4 and the second metal layer 5, a heat treatment was further performed at 150 ° C. for 3 hours.

The relative permittivity of the passive component forming layer 4 of the sheet material 1 for manufacturing a printed wiring board thus obtained was 100 at a frequency of 1 MHz.

Example 2 A support layer 2 and a first metal layer 3 were formed in the same manner as in Example 1.

On the other hand, in the same manner as in Example 1, except that barium titanate (“BT-4” manufactured by Nippon Chemical Industry Co., Ltd.) was mixed as a filler at a volume fraction of 25 vol% with respect to the resin. And a resin composition was prepared.

This resin composition was applied on the surface of the first metal layer 3 to a thickness of 20 μm using a roll coater.
The solvent was removed by heating and drying at 100 ° C. for 10 minutes, and the epoxy resin was in a semi-cured state. A copper foil having a thickness of 18 μm is laminated on the surface of the resin composition in a semi-cured state using a vacuum laminator, and further subjected to a heat treatment at 150 ° C. for 3 hours to completely cure the resin composition and obtain a high dielectric constant. The passive component forming layer 4 made of the material 4a was formed, and the second metal layer 5 was formed of copper foil. Thus, a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 1 was obtained.

The relative permittivity of the passive component forming layer 4 of the sheet material 1 for manufacturing a printed wiring board thus obtained was 10 at a frequency of 1 MHz.

Example 3 A support layer 2 and a metal layer 3 were formed in the same manner as in Example 1.

10 parts by mass of a polyether sulfone resin (manufactured by Sumitomo Chemical Co., Ltd .; “Sumika Excel”) is dissolved in 400 parts by mass of dimethylformamide as a solvent, and barium titanate (manufactured by Nippon Chemical Industry Co., Ltd .; "BT-4") was mixed with the resin at a volume fraction of 25 vol% to prepare a resin composition.

This resin composition was applied on the surface of the metal layer 3 to a thickness of 20 μm using a roll coater.
For 40 minutes to completely remove the solvent. A copper foil having a thickness of 18 μm is laminated on the surface of the dried resin composition using a vacuum laminator to form a passive component forming layer 4 made of a high dielectric constant material 4a and a second metal layer made of the copper foil. 5 was obtained, and a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 1 was obtained.

The relative permittivity of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was 10 at a frequency of 1 MHz.

Example 4 A support layer 2 and a first metal layer 3 were formed in the same manner as in Example 1.

On the other hand, Example 1 was repeated except that barium titanate whisker (manufactured by Otsuka Chemical Co., Ltd.) was mixed as an inorganic filler with the resin at a volume fraction of 80 vol%.
In the same manner as in the above, a resin composition was prepared.

This resin composition was applied to the surface of the first metal layer 3 with a roll coater to a thickness of 20 μm.
The solvent was removed by heating and drying at 100 ° C. for 10 minutes, and the epoxy resin was in a semi-cured state. A copper foil having a thickness of 18 μm is laminated on the surface of the resin composition in a semi-cured state using a vacuum laminator, and further subjected to a heat treatment at 150 ° C. for 3 hours to completely cure the resin composition and obtain a high dielectric constant. The passive component forming layer 4 made of the material 4a was formed, and the second metal layer 5 was formed of copper foil. Thus, a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 1 was obtained.

The relative permittivity of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was 200 at a frequency of 1 MHz.

Example 5 A support layer 2 and a first metal layer 3 were formed in the same manner as in Example 1.

On the other hand, a resin composition was prepared in the same manner as in Example 1.

This resin composition was applied to the surface of the first metal layer 3 by a roll coater to a thickness of 50 μm.
The solvent was removed by heating and drying at 100 ° C. for 20 minutes, and the epoxy resin was semi-cured. A nickel foil having a thickness of 25 μm is laminated on the surface of the resin composition in a semi-cured state using a vacuum laminator, and further subjected to a heat treatment at 150 ° C. for 3 hours to completely cure the resin composition and obtain a high dielectric constant. The passive component forming layer 4 made of the material 4a was formed, and the second metal layer 5 was formed of nickel foil. Thus, a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 1 was obtained.

The relative permittivity of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was 100 at a frequency of 1 MHz.

(Example 6) A support layer 2 and a first metal layer 3 were formed in the same manner as in Example 1.

A 2 μm-thick titanium oxide layer was formed on the surface of the metal layer 3 by spraying using a plasma spray gun at a spray current of 1000 A and a supply amount of 50 g / min. The passive component forming layer 4 was formed. Here, at the time of thermal spraying, water cooling treatment was performed from the support layer 2 side, and the spraying was performed while winding the support layer 2 and the metal layer 3 at a predetermined winding speed. Then, at 150 ° C for 1
Heat treatment was applied for a time.

Next, an 18 μm-thick second metal layer 5 made of copper plating was formed on the surface of the passive component forming layer 4 by performing electroless copper plating and electrolytic copper plating, as shown in FIG. Sheet material 1 for manufacturing a printed wiring board having a structure
I got

The relative permittivity of the passive component forming layer 4 of the sheet material 1 for manufacturing a printed wiring board obtained as described above was 500 at a frequency of 1 MHz.

Example 7 A support layer 2 and a first metal layer 3 were formed in the same manner as in Example 1.

On the surface of the metal layer 3, a layer of titanium oxide was formed to a thickness of 10 μm by a sol-gel method to form a passive component forming layer 4 made of a high dielectric constant material 4a. here,
In performing the sol-gel method, an isopropyl solution of titanium tetraisoproposide is used, and 0.001 mol
After hydrolyzing with a 1 / L hydrochloric acid solution to increase the molecular weight, heating was performed at 300 ° C. for 2 hours to obtain a dielectric layer 14 having a thickness of 10 μm.

Next, an 18 μm-thick second metal layer 5 made of copper plating was formed on the surface of the passive component forming layer 4 by performing electroless copper plating and electrolytic copper plating, as shown in FIG. Sheet material 1 for manufacturing a printed wiring board having a structure
I got

The relative permittivity of the passive component forming layer 4 of the sheet material 1 for manufacturing a printed wiring board thus obtained was 300 at a frequency of 1 MHz.

Example 8 A support layer 2 and a first metal layer 3 were formed in the same manner as in Example 1.

A layer of lead lanthanum titanate having a thickness of 0.05 μm was formed on the surface of the metal layer 3 by sputtering to form a passive component forming layer 4 made of a high dielectric constant material 4a. The sputtering at this time is performed using a normal sputtering apparatus, using lanthanum lead titanate as a target material, a substrate temperature of 50 ° C., and an argon gas pressure of 25.
mTorr (3.3 Pa), oxygen partial pressure 25 mTorr
(3.3 Pa) and a deposition time of 20 minutes.

Next, a second metal layer 5 was formed by sputtering aluminum with titanium as a base. The sputtering at this time was performed using a normal sputtering apparatus, using aluminum as a target material, at a substrate temperature of 200 ° C., an output of 12 kW, and a partial pressure of argon of 25 mTorr (3.3 Pa). Thus, a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 1 was obtained.

The relative permittivity of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was measured.
Met.

Example 9 An aluminum foil with a support in which a 20 μm-thick aluminum foil was laminated on a support made of a 50 μm-thick polyimide sheet was used. To form the first metal layer 3.

A barium titanate layer having a thickness of 1 μm was formed on the surface of the metal layer 3 by ion plating to form a passive component forming layer 4 made of a high dielectric constant material 4a. Here, ion plating was performed using a DC ion plating apparatus, barium titanate as an evaporation source, and a pressure of 3 mTorr (0.4 mTorr) under an argon atmosphere.
Pa) at an applied voltage of 2000 kV.

Next, an 18 μm-thick second metal layer 5 made of copper plating was formed on the surface of the passive component forming layer 4 by performing electroless copper plating and electrolytic copper plating, as shown in FIG. Sheet material 1 for manufacturing a printed wiring board having a structure
I got

The relative permittivity of the passive component forming layer 4 of the sheet material 1 for manufacturing a printed wiring board thus obtained was 2,000 at a frequency of 1 MHz.

Example 10 A support layer 2 and a first metal layer 3 were formed in the same manner as in Example 1.

On the other hand, dimethylformamide is blended as a solvent in a novolak-based photosensitive resist material using a novolak resin as a base polymer and an o-naphthoquinonediazide compound as a photosensitive material, and barium titanate powder (Japan) is used as an inorganic filler. “BT-4” manufactured by Chemical Industry Co., Ltd.
To prepare a resin composition.

The resin composition was applied to the surface of the first metal layer 3 to a thickness of 20 μm using a roll coater.
After heating and drying at 150 ° C. for 20 minutes, a thickness of 18 μm
1 m of copper foil was laminated using a vacuum laminator, and FIG.
The sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG.

The relative permittivity of the passive component forming layer 4 of the sheet material 1 for manufacturing a printed wiring board thus obtained was 50 at a frequency of 1 MHz.

(Example 11) A support layer 2 and a first metal layer 3 were formed in the same manner as in Example 1.

On the other hand, a resin composition was prepared in the same manner as in Example 1, except that Mn-Zn ferrite powder (manufactured by Toda Kogyo KK) was added as a filler in an amount of 60 vol% with respect to the resin.

This resin composition was applied to the surface of the first metal layer 3 to a thickness of 500 μm using a roll coater, and dried by heating at 100 ° C. for 1 hour to remove the solvent and semi-cured the epoxy resin. And then fully cured by heating at 175 ° C. for 1 hour.
The passive component forming layer 4 made of b was formed. Thereafter, a desmear treatment is performed with potassium permanganate, and then an electroless copper plating and an electrolytic copper plating are performed to form a second metal layer 5 having a thickness of 18 μm made of copper plating on the surface of the passive component forming layer 4. Was formed, and a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 1 was obtained. Further, in order to improve the adhesion between the passive component forming layer 4 and the second metal layer 5, a heat treatment was further performed at 150 ° C. for 3 hours.

The magnetic permeability of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was 10 at a frequency of 100 kHz.

Example 12 A support layer 2 and a metal layer 3 were formed in the same manner as in Example 1.

On the other hand, a resin composition was prepared in the same manner as in Example 1 except that Cu—Zn—Mg ferrite powder (manufactured by Toda Kogyo KK) was mixed as a filler at a volume fraction of 60 vol% with respect to the resin. Obtained.

This resin composition was applied to the surface of the metal layer 3 with a roll coater to a thickness of 30 μm.
For 10 minutes to remove the solvent and to make the epoxy resin in a semi-cured state, and further heat it at 175 ° C. for 1 hour to sufficiently cure it to form the passive component forming layer 4 made of the high magnetic permeability material 4b. Thus, a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 2 was obtained.

The magnetic permeability of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was 16 at a frequency of 100 kHz.

Example 13 A support layer 2 and a metal layer 3 were formed in the same manner as in Example 1.

On the surface of the metal layer 3, Ni / W / P (N
(i: 75%, W: 19%, P: 6%) is formed into a 5 μm thick alloy plating layer to form the passive component forming layer 4 made of the resistor material 4c, and has the configuration shown in FIG. A sheet material 1 for manufacturing a printed wiring board was obtained.

The specific resistance of the passive component forming layer 4 of the sheet material 1 for manufacturing a printed wiring board obtained as described above was 0.00012 (Ω · cm).

Example 14 A support layer 2 and a metal layer 3 were formed in the same manner as in Example 1.

On the other hand, a resin composition was prepared in the same manner as in Example 1 except that carbon black was added as a filler at a volume fraction of 30 vol% with respect to the resin.

This resin composition was applied on the surface of the metal layer 3 to a thickness of 20 μm using a roll coater.
After heating and drying at 175 ° C. for 10 minutes to remove the solvent, the film is sufficiently cured by heating at 175 ° C. for 1 hour to form a passive component forming layer 4 made of a resistor material 4c. A sheet material 1 for manufacturing a wiring board was obtained.

The specific resistance of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board obtained as described above was 200 (Ω · cm).

Table 1 summarizes the above results.

[0172]

[Table 1]

[0173]

As described above, the sheet material for manufacturing a printed wiring board according to the first aspect of the present invention has a structure in which a support layer, a metal layer, a passive component forming layer, and a metal layer are laminated in this order. In the manufacture of a printed wiring board, the metal layer and the passive component forming layer are supported and supported by the support layer to form a laminate, thereby suppressing deformation and cracking of the metal layer and the passive component forming layer during molding. This means that capacitors, inductors,
By forming circuit components such as a resistor and a radio wave absorbing component layer, these circuit components can be built in a printed wiring board and formed with high accuracy.
By using a general-purpose sheet material, it is possible to realize the incorporation of circuit components by a low-cost and simple process.

The invention according to claim 2 has a structure in which a support layer, a metal layer, and a passive component forming layer are laminated in this order, so that the metal layer and the passive component forming layer are formed by the support layer in manufacturing a printed wiring board. By supporting and laminating, the deformation and cracking of the metal layer and the passive component forming layer at the time of molding are suppressed, and the capacitors, inductors, resistors, and resistors are formed by the metal layer and the passive component forming layer. By forming circuit components such as a radio wave absorbing component layer, these circuit components can be built in a printed wiring board and formed with high accuracy.

According to a third aspect of the present invention, in addition to the constitution of the first or second aspect, the metal layer is formed of at least one of iron, copper, aluminum, nickel, titanium and alloys thereof.
Since the metal layer is formed from more than one kind, it is possible to easily form a circuit component, an electrode, a circuit portion, and the like having good electric conductivity on the printed wiring board by performing an etching process on the metal layer.

According to a fourth aspect of the present invention, in addition to the constitution of any one of the first to third aspects, the passive component forming layer is formed of a high dielectric constant material. By forming the body layer, the capacitor can be built into the printed wiring board. At this time, even if the dielectric layer is thinned, cracking and deformation of the dielectric layer are less likely to occur. Can be achieved.

According to a fifth aspect of the present invention, in addition to the configuration of the fourth aspect, the thickness of the passive component forming layer is 0.05 to 50 μm.
Therefore, it is possible to further increase the capacity of the capacitor incorporated in the printed wiring board using the sheet material for manufacturing a printed wiring board.

According to a sixth aspect of the present invention, in addition to the constitution of the fourth or fifth aspect, the relative permittivity of the passive component forming layer is set to 10 to 5
Since it is formed in the range of 0000, the capacitor incorporated in the printed wiring board can exhibit a sufficient function.

According to a seventh aspect of the present invention, in addition to the configuration of the fourth aspect, the passive component forming layer is formed of a high dielectric constant material made of a resin in which a high dielectric constant filler is dispersed. The adhesiveness between the layer and the metal layer can be improved, and the adhesiveness between the dielectric layer formed from the passive component forming layer and the insulating resin layer as the core material can be improved in manufacturing a printed wiring board. Can be
Moreover, this passive component forming layer can be formed at a low cost by a simple process, and does not require a large device.
Good mass productivity.

According to an eighth aspect of the present invention, in addition to the constitution of the seventh aspect, the passive component forming layer is formed to have a relative dielectric constant of 10 to 200 and a thickness of 1 to 50 μm. It is possible to form a passive component forming layer having a high dielectric constant and good adhesion to a metal layer.

According to the ninth aspect of the present invention, in addition to the constitution of any one of the fourth to sixth aspects, the passive component forming layer is formed by a sol-gel method. It can be formed at low cost, does not require a large-scale device, has good mass productivity, and can form a passive component forming layer having a high dielectric constant.

According to a tenth aspect of the present invention, in addition to any one of the fourth to sixth aspects, the passive component forming layer is formed by a thermal spraying method or an ion plating method. In addition, the dielectric constant can be further increased, and the capacitance of the formed capacitor can be further increased.

The invention of claim 11 is the invention of claims 4 to 6
In addition to any of the above configurations, the passive component forming layer is formed by a chemical vapor deposition method or a physical vapor deposition method, so that the passive component forming layer can have a further higher dielectric constant, and is formed. It is possible to further increase the capacity of the capacitor.

According to a twelfth aspect of the present invention, in addition to the configuration of the eleventh aspect, the thickness of the passive component forming layer is 0.05 to 1 μm.
In this case, the electrical insulation between both surfaces of the passive component forming layer can be stably maintained, and the film forming time of the passive component forming layer is prevented from becoming too long, thereby improving productivity. It can be improved.

The thirteenth aspect of the present invention relates to the first to third aspects.
In addition to the above configuration, the passive component forming layer is formed of a high magnetic permeability material, so that the passive component forming layer forms a high magnetic permeability layer for improving the inductance value of the inductor, and is printed. A high permeability layer can be built in together with the inductor built into the wiring board, and the inductance value of the inductor can be improved.

According to a fourteenth aspect of the present invention, in addition to the constitution of the thirteenth aspect, the passive component forming layer is formed of a high magnetic permeability material made of a resin in which a high magnetic permeability filler is dispersed.
The adhesiveness between the passive component forming layer and the metal layer can be improved, and the adhesion between the high magnetic permeability layer formed from the passive component forming layer and the insulating resin layer as a core material in manufacturing a printed wiring board can be improved. In addition, by dispersing the resin, the application of inductance on the high frequency side and the effect of absorbing electromagnetic waves on the high frequency side can be obtained. Moreover, this passive component forming layer can be formed at a low cost by a simple process, does not require a large-scale device, and has good mass productivity.

Further, the invention of claim 15 is the invention of claims 1 to 3
In addition to any one of the above configurations, the passive component forming layer is formed of a resistor material, so that the passive component forming layer configures the resistance of the circuit, and the printed wiring board can incorporate the resistor. The handleability can be improved.

According to a sixteenth aspect of the present invention, in addition to the constitution of the fifteenth aspect, since the passive component forming layer is formed of a resin in which carbon is dispersed, adhesion between the passive component forming layer and the metal layer is improved. It is possible to improve the adhesion between the resistor layer formed from the passive component forming layer and the insulating resin layer as a core material when manufacturing a printed wiring board.

According to a seventeenth aspect of the present invention, in addition to the structure of the fifteenth aspect, since the passive component forming layer is formed by metal plating, a change in resistance value in a heating and pressing step after formation of the resistor is suppressed. This makes it possible to incorporate a stable resistor. In addition, since the metal layer is protected by the support layer during the pattern formation of the resistor layer, it is not necessary to increase the difference in the etch rate between the resistor layer and the metal layer, and the etching rate of the resistor layer is reduced. Many variations of materials can be taken. In other words, in forming the resistor layer by removing a part of the passive component forming layer by etching, the metal layer is protected by the support layer. It is not necessary to consider whether or not to dissolve the metal layer, and the range of choice of the etchant is widened.

According to the eighteenth aspect of the present invention, in addition to the constitution of any one of the thirteenth to seventeenth aspects, the thickness of the passive component forming layer is formed in the range of 0.05 to 500 μm. It is possible to maintain the accuracy and improve the embedding property.

Further, the invention of claim 19 provides the invention as set forth in claims 1 to 1
8 to form an inductor, a capacitor, a resistor, or a radio wave absorbing component layer at an arbitrary position on the printed wiring board by laminating and molding the sheet material for manufacturing a printed wiring board according to any of 8 above. In manufacturing the board, the metal layer and the passive component forming layer are supported by the support layer, and the outer electrode layer is not patterned by the presence of the support layer. Deformation and cracking of the component forming layer are suppressed, and by forming circuit components such as a capacitor, an inductor, a resistor, and a radio wave absorbing component layer with the metal layer and the passive component forming layer, these circuit components can be formed. It can be built into the printed wiring board and formed with high precision. The one in which it is possible to realize the internal of the circuit components by a simple process at low cost.

The invention according to claim 20 is the invention according to claims 1 to 1.
8. By using the printed wiring board manufacturing sheet material according to any one of 8 above, at least one of an inductor, a capacitor, a resistor, and a radio wave absorbing component layer is built in. The metal layer and the passive component forming layer are supported by the support layer, and the outer electrode layer is not patterned by the support layer. The occurrence of cracks is suppressed, and by forming circuit components such as a capacitor, an inductor, a resistor, and a radio wave absorbing component layer with the metal layer and the passive component forming layer, these circuit components are built into the printed wiring board. It can be formed with high accuracy at the same time, and at low cost by using a general-purpose sheet material. In which it is possible to realize the internal of the circuit components by a process.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a sheet material for manufacturing a printed wiring board.

FIG. 2 is a perspective view showing another example of a sheet material for manufacturing a printed wiring board.

FIG. 3 shows an example of a printed wiring board manufacturing process, and (a) to (f) are schematic sectional views.

FIG. 4 shows another example of a printed wiring board manufacturing process, and (a) to (g) are schematic sectional views.

FIGS. 5A to 5D show still another example of the printed wiring board manufacturing process, in which FIGS. 5A to 5D are schematic sectional views, and FIG. 5E is a plan view of FIG.

6 (a) to 6 (e) are schematic sectional views, and FIG. 6 (f) conceptually shows a configuration of an inductor in the printed wiring board. It is a perspective view.

FIG. 7 shows still another example of the printed wiring board manufacturing process, and (a) to (e) are schematic sectional views.

FIG. 8 is a sectional view showing a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sheet material for printed wiring board manufacture 2 Support layer 3 Metal layer 4 Passive component forming layer 4a High permittivity material 4b High permeability material 4c Resistor material 5 Metal layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01C 17/14 H01C 17/14 5E082 H01F 17/00 H01F 17/00 B 5E346 F H01G 2/06 H01G 4 / 12 358 4/12 358 361 361 364 364 4/30 301D 4/30 301 301E 311Z 311 H05K 3/46 Q H05K 3/46 H01G 1/035 Z (72) Inventor Kiyoshiro Yamakawa 1048 Odoma Kadoma, Kadoma, Osaka Matsushita Electric Works Co., Ltd. (72) Inventor Koji Miwa 1048 Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor Kenji Ogasawara 1048 Okadoma, Kazuma, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72 Inventor Keiko Kashiwara 1048 Kazuma Kadoma, Kadoma City, Osaka Inside Matsushita Electric Works, Ltd. 72) Inventor Taisuke Nishimori 1048 Kadoma Kadoma, Kadoma-shi, Osaka F-term in Matsushita Electric Works Co., Ltd. (reference) FF04 FF06 GG20 5E001 AB03 AC09 AC10 AE01 AE02 AE03 AH01 AH03 AH05 AJ01 AJ02 AZ01 5E032 BA11 BA12 BA18 BB01 CC14 5E033 AA02 BB09 BC01 5E070 AA11 AB01 BA12 BB03 CB12 CB02 CB02 CB02 CC03 CB02 FG04 FG06 FG08 FG26 FG27 FG34 FG42 FG46 JJ15 LL02 MM22 MM24 5E346 AA11 AA12 AA13 AA14 AA15 AA23 AA33 AA34 BB01 BB20 CC08 CC21 CC31 CC32 CC34 CC37 DD01 DD07 DD09 DD11 EE02 GG33 H32 H45

Claims (20)

[Claims] 1. A sheet material for manufacturing a printed wiring board, comprising a structure in which a support layer, a metal layer, a passive component forming layer, and a metal layer are laminated in this order. 2. A sheet material for producing a printed wiring board, comprising a structure in which a support layer, a metal layer, and a passive component forming layer are laminated in this order. 3. The method according to claim 1, wherein the metal layer comprises at least one of iron, copper, aluminum, nickel, titanium and alloys thereof.
The sheet material for manufacturing a printed wiring board according to claim 1, wherein the sheet material is formed from at least one kind. 4. The sheet material according to claim 1, wherein the passive component forming layer is formed of a high dielectric constant material. 5. The passive component forming layer has a thickness of 0.05 to 5
5. The semiconductor device according to claim 4, wherein said film is formed in a range of 0 .mu.m.
A sheet material for manufacturing a printed wiring board according to item 1. 6. The relative dielectric constant of the passive component forming layer is 10 to 5
6. The printed wiring board manufacturing sheet material according to claim 4, wherein the sheet material is formed in the range of 0000. 7. The sheet material for manufacturing a printed wiring board according to claim 4, wherein the passive component forming layer is formed of a high dielectric material made of a resin in which a high dielectric filler is dispersed. . 8. The relative dielectric constant of the passive component forming layer is 10 to 20.
8. The sheet material for manufacturing a printed wiring board according to claim 7, wherein the sheet material is formed to have a thickness of 0 to 1 to 50 [mu] m. 9. The sheet material for manufacturing a printed wiring board according to claim 4, wherein the passive component forming layer is formed by a sol-gel method. 10. The sheet material for manufacturing a printed wiring board according to claim 4, wherein the passive component forming layer is formed by a thermal spraying method or an ion plating method. 11. The sheet material according to claim 4, wherein the passive component forming layer is formed by a chemical vapor deposition method or a physical vapor deposition method. 12. The thickness of the passive component forming layer is 0.05 to 1
12. The film according to claim 11, wherein the film is formed in a range of μm.
A sheet material for manufacturing a printed wiring board according to item 1. 13. The sheet material according to claim 1, wherein the passive component forming layer is formed of a material having a high magnetic permeability. 14. The sheet material for manufacturing a printed wiring board according to claim 13, wherein the passive component forming layer is formed of a high magnetic permeability material made of a resin in which a high magnetic permeability filler is dispersed. . 15. The sheet material for manufacturing a printed wiring board according to claim 1, wherein the passive component forming layer is formed of a resistor material. 16. The passive component forming layer is formed of a resin in which carbon is dispersed.
A sheet material for manufacturing a printed wiring board according to item 1. 17. The sheet material for manufacturing a printed wiring board according to claim 15, wherein the passive component forming layer is formed by metal plating. 18. The thickness of the passive component forming layer is 0.05 to 5
The sheet material according to any one of claims 13 to 17, wherein the sheet material is formed in a range of 00 µm. 19. An inductor, a capacitor, a resistor, or a radio wave absorber at an arbitrary position on a printed wiring board by laminating and molding the sheet material for manufacturing a printed wiring board according to any one of claims 1 to 18 in the printed wiring board. A method for manufacturing a printed wiring board, comprising forming a component layer. 20. A printed wiring board manufacturing sheet material according to claim 1, wherein at least one of an inductor, a capacitor, a resistor, and a radio wave absorbing component layer is built-in. A printed wiring board characterized by the following.