JP4289365B2 - Printed wiring board manufacturing method and printed wiring board - Google Patents

Description

  The present invention relates to a method for manufacturing a printed wiring board using a sheet material for manufacturing a printed wiring board, and a printed wiring board manufactured by the method for manufacturing a printed wiring board. In particular, the inductor (L) is connected to the printed wiring board. This is related to the technology to be built in a simple and easy process.

  In recent years, with the demand for higher performance and smaller size of electronic devices, higher density and higher functionality of circuit components have been further strengthened. Therefore, when electronic components are mounted on a printed wiring board, an inductor (L), a capacitor (C), a resistor (R), etc. (hereinafter these may be collectively referred to as LCR) in order to increase the mounting efficiency. There is a demand for a printed wiring board having a structure in which a circuit board is built in a substrate.

  In addition, with the increase in signal speed, capacity, and power consumption, the problem of noise generation has become serious. For this reason, conventionally, in circuit components including semiconductor elements and capacitors, the noise of electrical signals can be reduced by shortening the distance between the semiconductor elements and the capacitors. Therefore, it is generated by incorporating a capacitor layer in the circuit board. Noise has been reduced. In addition, attempts have been made to reduce noise by forming a magnetic layer in a circuit board (for example, disclosed in Patent Document 1).

  As described above, as a conventional technique for incorporating passive components for the purpose of improving mounting density and reducing noise, a formation method by LCR batch firing on a ceramic substrate is well known and has been performed for a long time.

  On the other hand, many attempts have been made to incorporate an LCR in a resin substrate.

  For example, as a method for forming a dielectric layer of a capacitor, it has been practiced to use a material in which a filler having a high dielectric constant is dispersed in a resin as a core material of a multilayer printed wiring board.

  Further, as a method of forming a resistor on a resin substrate, a carbon black resistor paste is often printed and formed.

  Further, as a method for forming an inductor on a resin substrate, a coil pattern is generally formed by patterning a conductor circuit.

Furthermore, in recent years, attempts have been made to sequentially stack a high-precision LCR on a circuit board by applying a semiconductor process such as spin coating or physical etching by laser irradiation or the like. That is, the insulating layer and the circuit layer are sequentially laminated and formed.
JP-A-10-163636

  However, the conventional methods for incorporating LCR as described above have the following problems.

  First, the ceramic firing method has problems in terms of productivity and cost.

  In addition, in forming a capacitor, a method in which a high dielectric constant filler dispersed in a resin is used as the core material of a multilayer printed wiring board cannot be expected to significantly improve the dielectric constant, and the filler content As the thickness increases, the substrate becomes brittle, and when the substrate thickness is reduced, deformation, cracks, cracks, and the like are likely to occur. Here, the capacitance required for the bypass capacitor layer has become extremely high year by year. For this purpose, it is necessary to reduce the thickness of the dielectric layer. By using a high dielectric constant core substrate, Current methods of forming capacitors are becoming technically limited.

  Also, in recent years, when manufacturing multilayer printed wiring boards, many methods for sequentially laminating build-up film materials have been seen, and a thin resin film for build-up is highly filled with a high dielectric constant filler. A possible method is to form a thin dielectric layer by using a capacitor and incorporate a capacitor. In this case, as shown in FIG. 8, the lower electrode 6 of the capacitor is formed on the upper surface of the insulating resin layer 7, and the metal layer 3 for forming the upper electrode of the capacitor is disposed above the lower electrode 6. In addition, a thin dielectric layer 17 is formed between the lower electrode 6 and the metal layer 3. However, in this case, as shown in the drawing, the dielectric layer 17 and the metal layer 3 are affected by the unevenness of the lower electrode 6 and are in a state of poor coplanarity (smoothness).

  In addition, in the method of printing a carbon black resistor paste as a resistor forming method, a resistance value change caused by heat or pressure in a subsequent heat and pressure molding process occurs, so that the resistance value is controlled. However, there was a problem in stability.

  Further, in an attempt to sequentially stack high-precision LCRs on the core substrate, versatility is lacking and expensive equipment is required in terms of process.

  Further, in the method of forming an inductor as a circuit pattern, it has been difficult to form an inductor having a high inductance value like a chip component.

  The present invention has been made in view of the above points, and by using a general-purpose sheet material, it is possible to realize high-accuracy LCR incorporation in a resin circuit board by a low-cost and simple process. An object of the present invention is to provide a printed wiring board manufacturing method and a printed wiring board. Specifically, the present invention provides a technique capable of easily forming an inductor having a high inductance.

  The printed wiring board manufacturing method according to claim 1 of the present invention is a printed circuit board comprising a support layer 2, a metal layer 3, and a passive component forming layer 4 formed of a high permeability material 4b in this order. A high permeability layer 14 is formed in the passive component forming layer 4 of the wiring board manufacturing sheet material 1, and the surface on which the high permeability layer 14 is formed is opposed to one surface of the semi-cured insulating resin layer 7. It is characterized in that the inductor pattern 13 is formed by performing an etching process on the metal layer 3 after the support layer 2 is peeled off from the metal layer 3 by stacking and heating and pressing to be integrated. is there.

  In addition to the structure of claim 1, the invention described in claim 2 is a high magnetic permeability layer having through holes 12 by etching away a part of the passive component forming layer 4 of the sheet material 1 for manufacturing a printed wiring board. 14, the printed wiring board manufacturing sheet material 1 is laminated and integrated with the insulating resin layer 7, and then the inductor pattern 13 is formed in a planar coil shape centering on the position matching the through hole 12. At the position where the hole 12 is formed, a through-hole connecting the inductor pattern 13 and the conductor layer 8 formed on the other surface of the insulating resin layer 7 is formed, and the inner surface of the through-hole is plated It is characterized by.

  The invention according to claim 3 is characterized in that, in addition to the configuration of claim 1 or 2, the thickness of the passive component forming layer 4 is formed in the range of 0.05 to 500 μm.

  Moreover, the manufacturing method of the printed wiring board which concerns on Claim 4 of this invention is added to the structure of any one of Claims 1 thru | or 3, A metal layer is iron, copper, aluminum, nickel, titanium, and those alloys. It forms from at least 1 or more types of these.

  Moreover, the printed wiring board concerning Claim 5 of this invention is manufactured by the method as described in any one of Claims 1 thru | or 4. It is characterized by the above-mentioned.

  In the printed wiring board manufacturing method according to claim 1 of the present invention, when the inductor is built in the printed wiring board, the high permeability layer can be built in the printed wiring board, and the inductance value is improved. Compared to the case where the inductor is formed only by routing the circuit, a higher inductance value can be achieved, and the high permeability layer is formed on a part or the entire surface of the circuit where noise is generated. By doing so, it is possible to make the high permeability layer function as a radio wave absorption component layer and achieve noise reduction, and in the production of a printed wiring board, a high permeability layer and an insulating resin layer are laminated. When integrated, the shape of the high permeability layer and the metal layer is supported by the support layer, so that deformation and cracking are less likely to occur. Can be incorporated with a high-reliability inductor with a high yield, and using a sheet material in which the high permeability layer and the metal layer are sequentially laminated and supported by the support layer as described above, Since the printed wiring board is manufactured by laminating and integrating with the insulating resin layer, the dimensions and shape of the high permeability layer, which is a passive component, are maintained as they were before being laminated and integrated with the insulating resin layer. In addition, by using a general-purpose sheet material, it is possible to incorporate an inductor by a simple process at a low cost.

  According to the invention of claim 2, the inductor pattern can be electrically connected to a circuit formed of a conductor layer different from the inductor pattern.

  Further, the invention of claim 3 can maintain the dimensional accuracy of the passive component forming layer and improve the embedding property.

  The invention of claim 4 can easily form circuit parts, electrodes, circuit portions, etc. having good electrical conductivity on a printed wiring board by etching the metal layer.

  In the printed wiring board according to claim 5 of the present invention, the metal layer and the passive component forming layer are supported by the support layer and the outer electrode layer is not patterned by the support layer in the production of the printed wiring board. By laminating and forming, the deformation and cracking of the metal layer and passive component forming layer during molding are suppressed, and this circuit component is formed by forming an inductor with this metal layer and passive component forming layer. It can be built in a printed wiring board and can be formed with high accuracy, and by using a general-purpose sheet material, it is possible to incorporate a circuit component by a simple process at a low cost. .

  Hereinafter, embodiments and reference examples of the present invention will be described with reference to the drawings. 2 and 3 show the printed wiring board manufacturing sheet material 1, which is used depending on the manufacturing process of the printed wiring board.

  The sheet material 1 for manufacturing a printed wiring board shown in FIG. 2 is provided with a heat-resistant support film as an outermost layer as a carrier film, and a support layer 2 is formed by this carrier film. The heat-resistant support film has heat resistance to such an extent that the film does not cause chemical changes or mechanical changes such as decomposition, deterioration, and melting in the heating and pressurizing step in the subsequent step, and the metal layers 3 and 5 In order to prevent the passive component forming layer 4 from being cracked or cracked, the metal layers 3 and 5 and the passive component forming layer 4 provide mechanical property support. Examples of such a heat resistant support film include polyester resin films such as polyethylene terephthalate, polyphenylene sulfide films, polyimide films, and further fluorine resin films, or metal films such as aluminum foil, nickel foil, and copper foil. be able to.

  On this support layer 2, a metal layer 3, a passive component forming layer 4, and a metal layer 5 are sequentially laminated on one side. Further, in the sheet material 1 for producing a printed wiring board shown in FIG. 3, a metal layer 3 and a passive component forming layer 4 are sequentially laminated on one surface side of the same support layer 2 as described above.

  In the printed wiring board manufacturing process, the metal layers 3 and 5 constitute circuit components or are formed as electrodes or circuit parts, and therefore are preferably formed of a material having good electrical conductivity. In particular, it is preferable to form with iron, copper, aluminum, nickel, titanium, or an alloy thereof in terms of performance and cost. However, it is not limited to these materials, and may be a conductor combined with gold, silver, palladium, platinum, molybdenum, tungsten, or the like. In forming the metal layers 3 and 5, they can be deposited by plating or vapor deposition. Alternatively, a metal foil may be used as a starting material and the metal foil may be laminated and formed.

  The passive component forming layer 4 is formed from the high dielectric constant material 4a, the high magnetic permeability material 4b, or the resistor material 4c according to the circuit component formed by the printed wiring board manufacturing sheet material 1. A high dielectric constant material 4a is applied to form a capacitor, a high magnetic permeability material 4b is applied to form an inductor or a wave absorbing component layer, and a resistor material 4c is used to form a resistor. Apply. The thickness of the passive component forming layer 4 is preferably in the range of 0.05 μm to 500 μm. If the thickness is less than 0.05 μm, it is difficult to ensure sufficient insulation when electrical insulation is required between both surfaces of the passive component forming layer 4 as in the case of forming a capacitor. In addition, it is difficult to maintain the dimensional accuracy within a range of less than 0.05 μm, and it becomes difficult to impart desired performance to the circuit component. On the contrary, if the thickness exceeds 500 μm, the embedding property of the passive component forming layer 4 in the insulating layer of the printed wiring board is lowered, and it becomes difficult to make the passive component forming layer 4 into the printed wiring board. .

  First, the printed wiring board manufacturing sheet material 1 for forming a capacitor, in which the passive component forming layer 4 is formed of the high dielectric constant material 4a will be described.

  The passive component forming layer 4 can be formed as a B-stage or C-stage sheet-like layer by curing and molding a resin filled and dispersed with a high dielectric constant filler into a sheet. As the resin, it is possible to use an epoxy resin, a phenol resin, or the like that is generally applied to the formation of an insulating layer of a printed wiring board. As the high dielectric constant filler, titanium oxide, barium titanate ceramic, zirconate titanate ceramic, strontium titanate ceramic, etc. can be used. It may be a thing.

  Alternatively, the passive component forming layer 4 can be formed by depositing an inorganic compound such as titanium oxide, zirconium oxide, or barium titanate in a layered manner by a sol-gel method. In addition, the passive component forming layer 4 is formed by barium titanate, strontium titanate, zirconate titanate, etc. by spraying, chemical vapor deposition (CVD), physical vapor deposition (PVD), or ion plating. These inorganic compound layers can also be formed, or these methods can be combined to form. In this way, when the passive component forming layer 4 is formed of an inorganic compound only layer, the passive component forming layer 4 can have a higher dielectric constant than when the high dielectric constant filler is dispersed in the resin. Become. Here, when the passive component forming layer 4 is formed by CVD, PVD, sputtering, or the like, the dielectric constant can be particularly improved, but this promotes crystallization, crystal grain growth, and orientation. This is probably because of this.

  When the passive component forming layer 4 is formed of a resin filled and dispersed with a high dielectric constant filler, the relative dielectric constant can be adjusted in the range of 2 to 200, while the passive component forming layer 4 is sprayed. When the chemical vapor deposition method (CVD method), physical vapor deposition method (PVD method), or ion plating method is used, the relative dielectric constant can be adjusted in the range of up to about 50,000. Here, in order to exhibit a sufficient function as a capacitor, the relative dielectric constant is preferably 10 or more, and the practical upper limit is 50,000 as described above. The rate is preferably adjusted in the range of 10 to 50000.

  Moreover, in order to give sufficient capacitance to the capacitor, it is preferable to form the passive component forming layer 4 thin. Particularly preferably, the passive component forming layer 4 is formed in a thickness of 0.05 to 50 μm. If this thickness is less than 0.05 μm, it will be difficult to ensure electrical insulation between both surfaces of the passive component forming layer 4. On the other hand, if it exceeds 50 μm, the capacitance of the capacitor will decrease and sufficient performance will be obtained. It becomes difficult to obtain.

  Further, when forming the passive component forming layer 4 using a resin filled and dispersed with a high dielectric constant filler, if the relative dielectric constant of the passive component forming layer 4 is 10 to 200 and the thickness is within the range of 1 to 50 μm. The passive component forming layer 4 having a high dielectric constant and good adhesion with the metal layers 3 and 5 can be formed at low cost. Here, if the thickness of the passive component forming layer 4 is less than 1 μm, it is difficult to obtain accurate accuracy in forming the passive component forming layer 4, and if the thickness exceeds 50 μm, the capacitance of the capacitor decreases. It is difficult to obtain sufficient performance.

  Moreover, when forming the passive component formation layer 4 by CVD method or PVD method, it is preferable to form the thickness of the passive component formation layer 4 in the range of 0.05 to 1 μm, and this thickness is less than 0.05 μm. Otherwise, the insulating property may be lowered, and if it exceeds 1 μm, it takes time to form a film, which causes a problem in terms of productivity and manufacturing cost.

  4 and 5 show a process of incorporating a capacitor in a printed wiring board using the printed wiring board manufacturing sheet material 1.

  In the example of FIG. 4, the sheet material 1 for manufacturing a printed wiring board has a support layer 2, a first metal layer 3, a passive component forming layer 4, and a second metal layer 5, which are sequentially laminated, as shown in FIG. 2. It has been configured. The passive component forming layer 4 is formed of a high dielectric constant material 4a.

  First, as shown in FIG. 4B, a part of the sheet material 1 for producing a printed wiring board is removed by etching the second metal layer 5 to form an electrode having a desired shape (hereinafter referred to as an electrode) , Referred to as “inner electrode 6”). The processing method for performing the etching process on the second metal layer 5 differs depending on the type of metal, but generally when the second metal layer 5 is formed of copper or nickel, The process with the etching liquid used for manufacture of a printed wiring board can be performed. For example, a cupric chloride aqueous solution is used. Here, while the etching process is performed on the second metal layer 5, the first metal layer 3 is protected by the support layer 2, and only the second metal layer 5 is etched. Is possible. Therefore, as will be described later, the dielectric layer 17 formed from the passive component forming layer 4 is less likely to be deformed or cracked.

  In this state, the surface on which the inner electrode 6 is formed is overlapped with one surface of the semi-cured insulating resin layer 7 formed of prepreg or the like, and then heated and pressed to be laminated and integrated. In this case, the support layer 2, the first metal layer 3, the passive component forming layer 4, the inner electrode 6, and the insulating resin layer 7 are laminated in this order from one surface side to the other surface side. It has become. At this time, the passive component forming layer 4 is formed as the dielectric layer 17. Here, a metal conductor layer 8 is formed on the other surface of the insulating resin layer 7, and this conductor layer 8 may be integrated with the insulating resin layer 7 in advance. 6 and the like may be laminated and integrated with the insulating resin layer 7 at the same time. And after lamination | stacking integration, as shown in FIG.4 (c), the support body layer 2 is peeled from the metal layer 3. FIG.

  Here, the dielectric layer 17 is formed on both sides of the insulating resin layer 7 by laminating the printed wiring board manufacturing sheet material 1 instead of the metal conductor layer 8 on the other surface of the insulating resin layer 7 in FIG. You may make it let it.

  4A to 4C as described above, when the inner electrode 6 and the insulating resin layer 7 are laminated and integrated, the semi-cured insulating resin layer 7 is first formed into the inner electrode 6. In this state, the insulating resin layer 7 is cured. At this time, the shape of the inner electrode 6, the dielectric layer 17, and the first metal layer 3 is supported by the support layer 2, and the metal layer 3 is etched by the second metal layer 5 due to the presence of the support layer 2. Since it is not patterned at the time of processing, deformation and cracking are less likely to occur. Therefore, a highly reliable capacitor can be built in with a high yield even when the dielectric layer 17 is thin.

  Further, using the sheet material in which the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are sequentially laminated and supported by the support layer 2, the insulating resin layer 7 is laminated and integrated and printed. Since the wiring board is manufactured, the dimensions and shape of the dielectric layer 17 serving as a passive component are maintained as they were before being laminated and integrated with the insulating resin layer 7, and are accurately formed as designed. It will be in a good state of coplanarity without.

  Here, in the illustrated example, the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are laminated on the insulating resin layer 7 in a configuration in which only one insulating resin layer 7 and the conductor layer 8 are formed. However, when the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are laminated on the insulating resin layer 7 formed on the surface of the multilayer printed wiring board, a multilayer printed wiring board is produced. The same effect can be obtained.

  In this state, the first metal layer 3 is subjected to the same etching treatment as in the case of the second metal layer 5, and is illustrated in FIGS. 4D, 4 E, and 4 F. In this manner, an electrode having a desired shape (hereinafter referred to as “outer electrode 9”) and a circuit 10 for electric transmission are formed. The outer electrode 9 is formed to face the inner electrode 6 with the dielectric layer 17 in between. The outer electrode 9, the inner electrode 6, and the dielectric layer 17 disposed between the electrodes 6 and 9 constitute a capacitor, and thus the capacitor is built in the printed wiring board. is there.

  In the example shown in FIG. 4D, the outer electrode 9 also serves as a circuit 10 for electric transmission. On the other hand, the conduction to the inner electrode 6 is ensured by connecting the inner electrode 6 and the circuit 10 for electric transmission through a through hole, a via hole (inner via hole) or the like. That is, in the illustrated example of FIG. 4D, a part of the inner electrode 6 is formed to protrude outward from the outer electrode 9, and a part of the protruding inner electrode 6 is used for electric transmission. The circuit 10 is disposed so as to face a part of the circuit 10 with the dielectric layer 17 therebetween. A non-through hole for connecting the inner electrode 6 and the circuit for electric transmission 10 is formed at a portion where the inner electrode 6 and the circuit for electric transmission 10 face each other, and a plating layer is formed on the inner surface of the non-through hole. Thus, a via hole 11a is formed.

  4E and 4F show examples of patterns in which a capacitor can be formed between two outer electrodes 9 without forming a via hole or a through hole. In FIG. 4 (e) and FIG. 4 (f), one inner electrode 6 is formed so as to face two outer electrodes 9. In the example shown in FIG. 4 (e), the inner electrode 6 is formed in substantially the same shape as the shape of the region including the two outer electrodes 9 and the region between the two outer electrodes 9, 9. It is formed at a position that matches the region. On the other hand, in the example shown in FIG. 4 (f), the inner electrode 6 is formed in a shape larger than the shape of the region including the two outer electrodes 9 and the region between the two outer electrodes 9, 9. , So as to protrude outward from this region. In the example shown in FIGS. 4 (e) and 4 (f), capacitors are equivalently formed in series, and two capacitors are formed in series between the two outer electrodes 9,9. Yes.

  In this case, the capacitance per unit area is reduced to ¼ or less than that shown in FIG. 4D, but there is no need to form via holes 11a and through holes for ensuring conduction between layers. This eliminates the need for the conduction reliability of the via hole 11a and the through hole.

  The performance of the capacitor is determined by the size and shape of the inner electrode 6, the outer electrode 9, and the dielectric layer 17. As described above, in the present invention, the inner electrode 6, the outer electrode 9, and the dielectric layer 17 are The size and shape are formed with high accuracy, and the presence of the support layer 2 ensures that the desired size and shape can be maintained without causing cracks or deformation even when the dielectric layer 17 is thinned to increase the capacity of the capacitor. The dielectric layer 17 can be formed. Accordingly, it is possible to easily incorporate a capacitor in the printed wiring board and to achieve high capacity and high accuracy of the capacitor.

  Further, when performing fine adjustment (trimming) of the capacitance of the capacitor, it can be adjusted by removing a part of the outer electrode 9 if necessary.

  On the other hand, in the example shown in FIG. 5, after the inner electrode 6 is formed by etching the second metal layer 5 in the same manner as in FIGS. 4A and 4B (FIGS. 5A and 5B). b)), as shown in FIG. 5C, the passive component forming layer 4 where the inner electrode 6 is not formed is removed by etching, and the passive component forming layer remaining in the portion where the inner electrode 6 is formed. 4 is formed as the dielectric layer 17.

  As a method for partially etching the passive component forming layer 4, dry etching such as ion etching or reactive ion etching that performs physical removal by irradiating an ion source of an inert gas, or removal by laser irradiation, etc. Physical etching can be applied.

  When the passive component forming layer 4 is made of a resin, the passive component forming layer 4 is treated with a desmear liquid such as a concentrated sulfuric acid solution or a chromic acid solution in the same manner as the desmear treatment. Part of 4 can be removed. Further, when the passive component forming layer 4 is composed of a photo-disintegrating resin, the passive component forming layer 4 is irradiated with light (ultraviolet rays), and then the photosensitive part is processed with a developing solution, so that A part of the formation layer 4 is removed. Here, the photodegradable resin uses a photosensitive resin that can be developed and removed with a developer such as an alkaline solution by exposure to light such as a positive resist. For example, a polymer obtained by adding a sensitizer such as a naphthoquinone diazide compound to a polymer such as naphthoquinone can be used. When a part of the passive component forming layer 4 is removed by these methods, the inner electrode 6 serves as a mask, and the passive component forming layer 4 is removed at a portion where the inner electrode 6 is not formed.

  In this state, the surface on which the inner electrode 6 is formed is overlapped with one surface of the semi-cured insulating resin layer 7 formed of prepreg or the like, and then heated and pressed to be laminated and integrated. At this time, the support layer 2, the first metal layer 3, the dielectric layer 17, the inner electrode 6, and the insulating resin layer 7 are laminated in this order from the one surface side to the other surface side. Here, a metal conductor layer 8 is formed on the other surface of the insulating resin layer 7, and this conductor layer 8 may be integrated with the insulating resin layer 7 in advance. 6 and the like may be laminated and integrated with the insulating resin layer 7 at the same time. After the lamination and integration, the support layer 2 is peeled from the metal layer 3 as shown in FIG.

  Further, in FIG. 5, the dielectric layer 17 is formed on both sides of the insulating resin layer 7 by laminating the printed wiring board manufacturing sheet material 1 instead of the metal conductor layer 8 on the other surface of the insulating resin layer 7. You may do it.

  5A to 5D as described above, when the inner electrode 6 and the insulating resin layer 7 are laminated and integrated, the semi-cured insulating resin layer 7 is first formed into the inner electrode 6. And it deform | transforms along the shape of the dielectric material layer 17, and the insulating resin layer 7 hardens | cures in this state. At this time, the shapes of the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are supported by the support layer 2 and the metal layer 3 is formed by the presence of the support layer 2. Since it is not patterned during the etching process, deformation and cracking are less likely to occur. Therefore, a highly reliable capacitor can be incorporated with a high yield even when the dielectric layer 17 is thin.

  Further, using the sheet material in which the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are sequentially laminated and supported by the support layer 2, the insulating resin layer 7 is laminated and integrated and printed. Since the wiring board is manufactured, the dimensions and shape of the dielectric layer 17 serving as a passive component are maintained as they were before being laminated and integrated with the insulating resin layer 7, and are accurately formed as designed. It becomes a good state of coplanarity without.

  Here, in the illustrated example, the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are laminated on the insulating resin layer 7 in a configuration in which only one insulating resin layer 7 and the conductor layer 8 are formed. However, when the inner electrode 6, the dielectric layer 17, and the first metal layer 3 are laminated on the insulating resin layer 7 formed on the surface of the multilayer printed wiring board, a multilayer printed wiring board is produced. The same effect can be obtained.

  In this state, the first metal layer 3 is subjected to the same etching treatment as in the case of the second metal layer 5, and is illustrated in FIGS. 5 (e), 5 (f), and 5 (g). Thus, the outer electrode 9 having a desired shape and the circuit 10 for electric transmission are formed. The outer electrode 9 is formed to face the inner electrode 6 with the dielectric layer 17 in between. The outer electrode 9, the inner electrode 6, and the dielectric layer 17 disposed between the electrodes 6 and 9 constitute a capacitor, and thus the capacitor is built in the printed wiring board. is there.

  In the example shown in FIG. 5E, the outer electrode 9 also serves as a circuit 10 for electric transmission. On the other hand, the conduction to the inner electrode 6 is ensured by connecting the inner electrode 6 and the circuit 10 for electric transmission through a through hole, a via hole (inner via hole) or the like. That is, in the example shown in FIG. 5E, a part of the inner electrode 6 is formed to protrude outward from the outer electrode 9, and a part of the protruding inner electrode 6 is used for electric transmission. It arrange | positions so that a part of circuit 10 may oppose through the dielectric material layer 17. FIG. A non-through hole for connecting the inner electrode 6 and the circuit for electric transmission 10 is formed at a portion where the inner electrode 6 and the circuit for electric transmission 10 face each other, and a plating layer is formed on the inner surface of the non-through hole. Thus, a via hole 11a is formed.

  5 (f) and 5 (g) show examples of patterns in which a capacitor can be formed between two outer electrodes 9 without forming a via hole or a through hole. In FIG. 5 (f) and FIG. 5 (g), one inner electrode 6 is formed so as to face two outer electrodes 9. In the example shown in FIG. 5 (f), the inner electrode 6 is formed in substantially the same shape as the shape of the region including the two outer electrodes 9 and the region between the two outer electrodes 9, 9. It is formed at a position that matches the region. On the other hand, in the example shown in FIG. 5 (g), the inner electrode 6 is formed in a shape larger than the shape of the region including the two outer electrodes 9 and the region between the two outer electrodes 9, 9. , So as to protrude outward from this region. In the example shown in FIGS. 5 (f) and 5 (g), capacitors are equivalently formed in series, and two capacitors are formed in series between the two outer electrodes 9, 9. Yes.

  In this case, the capacitance per unit area is reduced to ¼ or less than that shown in FIG. 5E, but there is no need to form via holes 11a and through holes for ensuring conduction between layers. This eliminates the need for the conduction reliability of the via hole 11a and the through hole.

  When the capacitor is built in the printed wiring board in this way, the plurality of dielectric layers 17 formed from the passive component forming layer 4 are partially built in the printed wiring board, so that the printed wiring board is formed. A plurality of capacitors can be built in, and the degree of freedom in pattern design can be improved. In other words, when a plurality of capacitors are provided, if a large number of terminals are formed on the substrate as in the past and a chip capacitor is connected to each terminal, it is necessary to secure an area for arranging the chip capacitors. In addition, routing of the circuit on the substrate becomes complicated. Further, in order to improve the noise removal efficiency by the bypass capacitor, it is necessary to shorten the length of the wiring connected to the capacitor. However, when the chip capacitor is used, it is difficult to shorten the wiring. On the other hand, in this method, it is possible to incorporate a plurality of capacitors in the printed wiring board, and at this time, it is not necessary to set a region for placing the capacitors, and the circuit routing can be designed easily. In addition, the wiring connected to the capacitor can be shortened to improve the noise removal efficiency when used as a bypass capacitor.

  4 and 5 is used as a core substrate, and multilayered by a conventional multilayered method of printed wiring boards such as a build-up method or a press method, so that a multilayer with a built-in capacitor is provided. A printed wiring board can be obtained, and the form of the printed wiring board with a built-in capacitor is not limited to a single substrate as shown in FIGS.

  Next, the printed wiring board manufacturing sheet material 1 for forming the inductor and the radio wave absorbing component layer in which the passive component forming layer 4 is formed of the high magnetic permeability material 4b will be described.

  The passive component forming layer 4 made of the high magnetic permeability material 4b deposits a high magnetic permeability material 4b such as Ni-Zn ferrite, Mn-Zn ferrite, Cu-Zn-Mg ferrite, Mn-Mg-Al ferrite. It can form by making it precipitate by methods, such as.

  Also, inorganic solid ceramic sintered bodies such as Ni—Zn ferrite, Mn—Zn ferrite, Cu—Zn—Mg ferrite, and Mn—Mg—Al ferrite can be used.

  In addition, the passive component forming layer 4 can be formed by curing and molding a resin in which powders of these substances are filled and dispersed into a sheet shape. At this time, the resin includes an epoxy resin, a phenol resin, and the like. Those generally used for the formation of insulating layers on printed wiring boards can be used, and high glass transition temperatures for use in electronic components such as polyethersulfone, polyetherimide, liquid crystal polymer, nylon (polyamide), polyphenylene sulfide, etc. The thermoplastic resin etc. which have are also applied.

  1 and 6 show a process of incorporating an inductor in a printed wiring board using the printed wiring board manufacturing sheet material 1.

  In the example of FIG. 1, the printed wiring board manufacturing sheet material 1 has a structure in which a support layer 2, a metal layer 3, and a passive component forming layer 4 are laminated in this order, as shown in FIG. The passive component forming layer 4 is formed of a high magnetic permeability material 4b. In the printed wiring board manufacturing sheet material 1, a part of the passive component forming layer 4 is first etched away to form a high permeability layer 14 patterned into a desired shape.

  As a method for partially etching the passive component forming layer 4, physical etching such as ion etching or laser irradiation can be applied as in the case of forming a capacitor.

  Similarly, when the passive component forming layer 4 is formed of a resin, physical etching such as ion etching or laser irradiation can be similarly applied, and a desmear solution such as a sulfuric acid solution or a chromic acid solution is applied to a portion to be removed. Etching can also be performed by performing the above-described process. Alternatively, the passive component forming layer 4 may be made of a photo-disintegrating resin, and etching may be performed by irradiating light on a portion to be removed on the passive component forming layer 4.

  The high magnetic permeability layer 14 has through holes 12 for forming through holes and via holes (inner via holes). If not necessary, the passive component forming layer 4 is not patterned, and the passive component forming layer 4 formed on the printed wiring board manufacturing sheet material 1 is configured as the high permeability layer 14 as it is. The high magnetic permeability layer 14 may be formed over the entire surface of the printed wiring board, and the through hole 12 may be formed only when it is necessary to route the circuit by a through hole or a via hole. Such patterning is an example of an embodiment in which the high permeability layer 14 is formed, and conductor patterning is formed on the high permeability layer 14 incorporated in the multilayer printed wiring board. This is applied when configuring an inductor.

  After the high permeability layer 14 is formed in this way, the surface on which the high permeability layer 14 is formed is overlapped with one surface of the semi-cured insulating resin layer 7 formed of prepreg or the like. After that, it is formed by heat and pressure molding and laminated and integrated. At this time, the support layer 2, the metal layer 3, the high magnetic permeability layer 14, and the insulating resin layer 7 are laminated in this order. Here, a metal conductor layer 8 is formed on the other surface of the insulating resin layer 7, and this conductor layer 8 may be integrated with the insulating resin layer 7 in advance. When the layers 14 and the like are laminated and integrated, the insulating resin layer 7 may be laminated and integrated at the same time. After the lamination and integration, the support layer 2 is peeled from the metal layer 3.

  In FIG. 1, the printed wiring board manufacturing sheet material 1 may be laminated on the other surface of the insulating resin layer 7 instead of the metal conductor layer 8. The magnetic permeability layer 14 can be formed.

  In the molding process as described above, when the high permeability layer 14 and the insulating resin layer 7 are laminated and integrated, first, the semi-cured insulating resin layer 7 is deformed along the shape of the high permeability layer 14. In this state, the insulating resin layer 7 is cured. At this time, since the shapes of the high magnetic permeability layer 14 and the metal layer 3 are supported by the support layer 2, deformation and cracking are less likely to occur, and thus even a thin high magnetic permeability layer 14 is highly reliable. Inductors can be built in with high yield.

  Further, using the sheet material in which the high permeability layer 14 and the first metal layer 3 are sequentially laminated and formed by being supported by the support layer 2 in this manner, the printed wiring board is laminated and integrated with the insulating resin layer 7. Since it is manufactured, the dimension and shape of the high permeability layer 14 serving as a passive component are maintained as they were before being laminated and integrated with the insulating resin layer 7 and are accurately formed as designed. .

  Here, in the illustrated example, in the configuration in which only one insulating resin layer 7 and conductor layer 8 are formed, the high magnetic permeability layer 14 and the first metal layer 3 are laminated on the insulating resin layer 7. The same effect can be obtained when a multi-layer printed wiring board is manufactured by laminating the high magnetic permeability layer 14 and the first metal layer 3 on the insulating resin layer 7 formed on the surface of the printed wiring board. can get.

  In this state, the metal layer 3 is etched to form an inductor pattern 13 having a desired shape. In the illustrated example, the inductor pattern 13 is formed in a spiral shape (planar coil shape), but the pattern shape is not particularly limited as long as it functions as a desired inductor. Further, through holes, via holes and the like are formed as necessary, and the presence or absence thereof is not limited.

  In the illustrated example, the center of the spiral inductor pattern 13 is formed at a position that matches the through hole 12 of the high magnetic permeability layer 14. A through hole for connecting the inductor pattern 13 and the conductor layer 8 is formed at a position where the through hole 12 is formed, and the inner surface of the through hole is plated to form a through hole 11b. The conductor layer 8 is formed as a circuit 15 by forming a circuit by etching or the like. In this way, the inductor pattern 13 is electrically connected to the circuit 15 formed on a different layer from the inductor pattern 13.

  In the example shown in FIG. 6, the printed wiring board manufacturing sheet material 1 includes a support layer 2, a first metal layer 3, a passive component forming layer 4, and a second metal layer 5 as shown in FIG. It has a laminated structure. The passive component forming layer 4 is formed of a high magnetic permeability material 4b. In the printed wiring board manufacturing sheet material 1, first, the second metal layer 5 is etched to form a plurality of parallel and parallel inner surface side line patterns 13 b. At this time, similarly to the case shown in FIG. 4, the first metal layer 3 is protected by the support layer 2. Further, a part of the passive component forming layer 4 is etched away by the same method as that shown in FIG. 1 to form a high permeability layer 14 patterned into a desired shape. At this time, the passive component forming layer 4 is such that the portion where the inner side line pattern 13b is not formed is removed by etching, but if not necessary, the passive component forming layer 4 is not patterned and printed circuit board. The high permeability layer 14 may be formed over the entire surface of the printed wiring board by configuring the passive component forming layer 4 formed on the manufacturing sheet material 1 as the high permeability layer 14 as it is.

  After the inner surface side line pattern 13b and the high permeability layer 14 are formed in this way, the surface on which the high permeability layer 14 and the inner surface side line pattern 13b are formed is in a semi-cured state formed by prepreg or the like. After superposing the insulating resin layer 7 so as to face each other, it is heat-press molded and laminated and integrated. At this time, the support layer 2, the metal layer 3, The magnetic permeability layer 14, the inner surface side line pattern 13b, and the insulating resin layer 7 are stacked in this order. Here, a metal conductor layer 8 is formed on the other surface of the insulating resin layer 7, and this conductor layer 8 may be integrated with the insulating resin layer 7 in advance. When the magnetic layer 14 and the like are laminated and integrated, the insulating resin layer 7 may be laminated and integrated at the same time. After the lamination and integration, the support layer 2 is peeled from the metal layer 3.

  Further, in FIG. 6, the printed wiring board manufacturing sheet material 1 may be laminated on the other surface of the insulating resin layer 7 instead of the metal conductor layer 8. The magnetic permeability layer 14 can be formed.

  In the molding process as described above, when the high magnetic permeability layer 14 and the inner surface side line pattern 13b and the insulating resin layer 7 are laminated and integrated, first, the semi-cured insulating resin layer 7 is changed to the inner surface side line pattern 13b. And it deform | transforms along the shape of the high magnetic permeability layer 14, and the insulating resin layer 7 hardens | cures in this state. At this time, the shape of the inner surface side line pattern 13b, the high magnetic permeability layer 14, and the first metal layer 3 is supported by the support layer 2 and is less likely to be deformed or cracked.

  Further, using the sheet material in which the inner surface side line pattern 13b, the high magnetic permeability layer 14, and the first-layer metal layer 3 are sequentially laminated and formed by being supported by the support layer 2 in this manner, the insulating resin layer 7 and the integral resin are integrated. Since the printed wiring board is manufactured, the size and shape of the high permeability layer 14 serving as a passive component are maintained as they were before being laminated and integrated with the insulating resin layer 7 and accurately as designed. Is formed.

  Here, in the illustrated example, in a configuration in which only one insulating resin layer 7 and conductor layer 8 are formed, the inner-side line pattern 13b, the high magnetic permeability layer 14, and the first metal layer 3 are laminated on the insulating resin layer 7. However, the inner surface side line pattern 13b, the high magnetic permeability layer 14, and the first metal layer 3 are laminated on the insulating resin layer 7 formed on the surface of the multilayer printed wiring board to further increase the multilayer printed wiring. Similar effects can be obtained in the case of producing a plate.

  Then, the first metal layer 3 is etched to form a plurality of parallel-parallel outer surface side line patterns 13a. The outer surface side line pattern 13a is formed on the opposite side of the inner surface side line pattern 13b with the high permeability layer 14 interposed therebetween. Further, among the plurality of outer surface side line patterns 13a, terminal circuits 13d for electric transmission are formed in the outer surface side line patterns 13a arranged at both ends in the illustrated example.

  Furthermore, the side part line pattern 13c connects between the front-end | tip part of the inner surface side line pattern 13b, and the front-end | tip part of the outer surface side line pattern 13a. The side line pattern 13c is formed along the edge of the high permeability layer 14, and is formed by a through hole, a via hole (inner via hole), or the like that connects the outer surface side line pattern 13a and the side line pattern 13c. Composed. That is, at both end portions of each of the plurality of outer surface side line patterns 13a, a through hole or a non-through hole that connects the tip portion of one outer surface side line pattern 13a and the tip portion of one inner surface side line pattern 13b is highly transparent. The side line pattern 13c is formed by forming along the edge of the magnetic layer 14 and plating the inner surface of the through hole or the non-through hole with a conductive paste. At this time, the inner pattern line pattern 13b, the outer pattern line pattern 13a and the side line pattern 13c that are electrically connected to each other constitute the inductor pattern 13 that surrounds the periphery of the high permeability layer 14 in a coil shape. The pair of terminal circuits 13 d are arranged at both ends of the inductor pattern 13 to constitute a terminal for power transmission to the inductor pattern 13. FIG. 6F conceptually shows a state where the inductor pattern 13 is formed around the high permeability layer 14.

  In FIG. 6, the high permeability layer 14 may be formed on both sides of the insulating resin layer 7 by using the printed wiring board sheet material 1 instead of the metal conductor layer 8.

  In the method shown in FIGS. 1 and 6, when the inductor is built in the printed wiring board, the high magnetic permeability layer 14 can be built in the printed wiring board, and the inductance value can be improved. A higher inductance value can be achieved as compared with the case where the inductor is formed only by circuit routing.

  Further, in forming a circuit pattern of such a coil-like structure, the present invention is also applied to the case where the passive component forming layer 4 is not selectively removed but left over the entire surface of the printed wiring board. The configuration is not limited to that shown in FIG.

  Further, by forming the high permeability layer 14 on a part or the entire surface of a circuit that generates noise, the high permeability layer 14 can function as a radio wave absorbing component layer, and noise can be reduced. It becomes.

  Next, the printed wiring board manufacturing sheet material 1 for forming the resistance, in which the passive component forming layer 4 is formed of the resistor material 4c, will be described.

  The passive component forming layer 4 can be formed by curing and molding a resin filled and dispersed with carbon into a sheet shape. As the resin, those that are generally applied to the formation of an insulating layer of a printed wiring board, such as an epoxy resin or a phenol resin, can be used, and polyether sulfone, polyether imide, liquid crystal polymer, nylon (polyamide), Thermoplastic resins for use in electronic parts having a high glass transition temperature such as polyphenyl sulfide can also be used. Here, if a resin having a high glass transition temperature is used, the micro-Brownian motion of the matrix polymer does not occur up to the high temperature side, and the agglomeration of carbon is prevented, so that the carbon dispersion structure in the passive component forming layer 4 is maintained. It becomes easy to stabilize the resistance value. The passive component forming layer 4 can also be formed of an alloy metal such as a nickel alloy or a chromium alloy, or a ceramic material such as silicon carbide (SiC). In this case, the passive component forming layer 4 may be deposited by plating or the like and formed by metal plating, or may be formed by vapor deposition.

  In FIG. 7, the process of incorporating resistance in a printed wiring board using the sheet | seat material 1 for printed wiring board manufacture is shown.

  In the illustrated example, the printed wiring board manufacturing sheet material 1 has a structure in which a support layer 2, a metal layer 3, and a passive component forming layer 4 are laminated in this order, as shown in FIG. The passive component forming layer 4 is formed of a resistor material 4c. In the printed wiring board manufacturing sheet material 1, a part of the passive component forming layer 4 is first removed by etching to form a resistor layer 15 having a desired shape. As a method for partially etching the passive component forming layer 4, when the passive component forming layer 4 is formed of the resistor material 4c made of an alloy metal, it is preferable to perform the etching by wet etching. Similarly to the case of forming a capacitor, physical etching such as ion etching or laser irradiation can also be applied. Further, when the passive component forming layer 4 is formed of a resin, the portion to be removed can be etched by performing a treatment with a desmear solution such as a sulfuric acid solution or a chromic acid solution. By adjusting the shape and dimensions of the resistor layer 15, the resistance value of the resistor built in the circuit is adjusted. In this state, the surface on which the resistor layer 15 is formed is overlapped with one surface of the semi-cured insulating resin layer 7 formed of prepreg or the like, and then laminated by heating and pressing. At this time, the support layer 2, the metal layer 3, the resistor layer 15, and the insulating resin layer 7 are laminated in this order from one surface side to the other surface side. And after lamination | stacking integration, the support body layer 2 is peeled from the metal layer 3. FIG.

  In the molding process as described above, when the resistor layer 15 and the insulating resin layer 7 are laminated and integrated, first, the semi-cured insulating resin layer 7 is deformed along the shape of the resistor layer 15, In this state, the insulating resin layer 7 is cured. At this time, the shapes of the resistor layer 15 and the metal layer 3 are supported by the support layer 2 and are not easily deformed or cracked.

  In addition, a printed wiring board is produced by laminating and integrating with the insulating resin layer 7 using a sheet material in which the resistor layer 15 and the metal layer 3 are sequentially laminated and supported by the support layer 2 as described above. The dimension and shape of the resistor layer 15 serving as a passive component are maintained as they were before being laminated and integrated with the insulating resin layer 7 and are accurately formed as designed.

  Here, in the illustrated example, the insulating resin layer 7 and the conductor layer 8 are formed in a single layer, and the resistor layer 15 and the metal layer 3 are laminated on the insulating resin layer 7. The same effect can be obtained also when a multilayer printed wiring board is produced by laminating the resistor layer 15 and the metal layer 3 on the insulating resin layer 7 formed on the surface.

  In this state, the metal layer 3 is etched to form a circuit 16 for electric transmission having a desired shape. At this time, the resistor layer 15 is electrically connected to the circuit 16 and constitutes a resistor.

  In the conventional carbon paste printing method, processes such as screen printing are very laborious, whereas in this method, the resistor layer 15 formed in advance as a film-like cured product as described above is used. By incorporating it in the printed wiring board, the printing process can be omitted, and the handleability is good. Further, when the resistor layer 15 is formed of an alloy or a ceramic material, a change in the resistance value in the subsequent heating and pressurizing process is suppressed, and a stable resistance can be built in.

  In addition, since the metal layer 3 is protected by the support layer 2 during the patterning of the resistor layer 15, it is not necessary to increase the difference in etch rate between the resistor layer 15 and the metal layer 3. There is an advantage that many variations of the etching solution and the material of the body layer 15 can be taken. That is, in particular, when the passive component forming layer 4 is formed of a metal layer such as metal plating, a part of the passive component forming layer 4 is removed by etching as shown in FIGS. In forming the body layer 15, since the metal layer 3 is protected by the support layer 2, in selecting an etching solution for the passive component forming layer 4, whether or not the etching solution dissolves the metal layer 3 is determined. This eliminates the need for consideration and widens the selection range of the etching solution.

(Reference Example 1)
Using a copper foil with a support in which a copper foil with a thickness of 18 μm is laminated on a support made of a polyimide sheet with a thickness of 50 μm, the support layer 2 is formed with this polyimide sheet, and the first metal layer 3 with the copper foil. Configured.

  On the other hand, bisphenol-A diglycidyl ether (manufactured by Dainippon Ink and Chemicals, product number “Epicron 850S”) 23.3 parts by mass as an epoxy resin, polyfunctional epoxy resin (product number “VG3101” manufactured by Mitsui Chemicals, Inc.) 40 9 parts by mass, 34.5 parts by mass of a novolak type phenol resin (Maywa Kasei Co., Ltd., product number “H3M”) as a curing agent, and triphenylphosphine (manufactured by Hokuko Chemical Co., “TPP”) 0.4 parts by mass, 0.9 parts by mass of γ-glycidoxypropyltrimethoxysilane (SH6040) as a coupling agent, 40 parts by mass of methyl ethyl ketone (Daishin Chemical Co., Ltd.) as a solvent, and further as a filler Barium titanate powder (“BT-4” manufactured by Nippon Chemical Industry Co., Ltd.) with a volume fraction of 80 Were mixed at a ratio of ol% of the resin composition was prepared.

  This resin composition was applied to the surface of the first metal layer 3 with a gravure coater to a thickness of 1 μm, and dried by heating at 100 ° C. for 10 minutes to remove the solvent and make the epoxy resin semi-cured. Furthermore, it was fully cured by heating at 175 ° C. for 1 hour, and the passive component forming layer 4 made of the high dielectric constant material 4a was formed. Then, after applying desmear treatment with potassium permanganate, by applying electroless copper plating and electrolytic copper plating, a second metal layer 5 having a thickness of 18 μm made of copper plating on the surface of the passive component forming layer 4. The sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 2 was obtained. Furthermore, for the purpose of improving the adhesion between the passive component forming layer 4 and the second metal layer 5, a heat treatment was further performed at 150 ° C. for 3 hours.

  The relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was measured and found to be 100 at a frequency of 1 MHz.

(Reference Example 2)
In the same manner as in Reference Example 1, a support layer 2 and a first metal layer 3 were formed.

  On the other hand, the resin composition was the same as in Reference Example 1 except that barium titanate (“BT-4” manufactured by Nippon Chemical Industry Co., Ltd.) was mixed as a filler at a volume fraction of 25 vol% with respect to the resin. A product was prepared.

  This resin composition was applied to the surface of the first metal layer 3 with a roll coater to a thickness of 20 μm, and dried by heating at 100 ° C. for 10 minutes to remove the solvent and make the epoxy resin semi-cured. . A copper foil having a thickness of 18 μm is laminated on the surface of this semi-cured resin composition using a vacuum laminator, and further subjected to a heat treatment at 150 ° C. for 3 hours to completely cure the resin composition to obtain a high dielectric constant. A passive component forming layer 4 made of the material 4a was formed, and a second metal layer 5 was formed with a copper foil to obtain a printed wiring board manufacturing sheet material 1 having the configuration shown in FIG.

  The relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for producing a printed wiring board thus obtained was measured and found to be 10 at a frequency of 1 MHz.

(Reference Example 3)
The support layer 2 and the metal layer 3 were configured in the same manner as in Reference Example 1.

  10 parts by mass of a polyethersulfone resin (Sumitomo Chemical Co., Ltd .; “Sumika Excel”) was dissolved in 400 parts by mass of dimethylformamide as a solvent, and barium titanate (manufactured by Nippon Chemical Industry Co., Ltd .; “BT-”). 4 ”) was mixed at a volume fraction of 25 vol% with respect to the resin to prepare a resin composition.

  This resin composition was applied to the surface of the metal layer 3 to a thickness of 20 μm with a roll coater and dried by heating at 150 ° C. for 40 minutes to completely remove the solvent. A copper foil having a thickness of 18 μm is laminated on the surface of the resin composition after drying using a vacuum laminator to form a passive component forming layer 4 made of a high dielectric constant material 4a and a second metal layer using the copper foil. 5 was obtained, and a sheet material 1 for producing a printed wiring board having the configuration shown in FIG. 2 was obtained.

  The relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for producing a printed wiring board thus obtained was measured and found to be 10 at a frequency of 1 MHz.

(Reference Example 4)
In the same manner as in Reference Example 1, a support layer 2 and a first metal layer 3 were formed.

  On the other hand, a resin composition was prepared in the same manner as in Reference Example 1 except that barium titanate whisker (manufactured by Otsuka Chemical Co., Ltd.) was mixed as an inorganic filler at a volume fraction of 80 vol% with respect to the resin.

  This resin composition was applied to the surface of the first metal layer 3 with a roll coater to a thickness of 20 μm, and dried by heating at 100 ° C. for 10 minutes to remove the solvent and make the epoxy resin semi-cured. . A copper foil having a thickness of 18 μm is laminated on the surface of this semi-cured resin composition using a vacuum laminator, and further subjected to a heat treatment at 150 ° C. for 3 hours to completely cure the resin composition to obtain a high dielectric constant. A passive component forming layer 4 made of the material 4a was formed, and a second metal layer 5 was formed with a copper foil to obtain a printed wiring board manufacturing sheet material 1 having the configuration shown in FIG.

  When the relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for producing a printed wiring board thus obtained was measured, it was 200 at a frequency of 1 MHz.

(Reference Example 5)
In the same manner as in Reference Example 1, a support layer 2 and a first metal layer 3 were formed.

  On the other hand, a resin composition was prepared in the same manner as in Reference Example 1.

  This resin composition was applied to the surface of the first metal layer 3 with a roll coater to a thickness of 50 μm, and dried by heating at 100 ° C. for 20 minutes to remove the solvent and make the epoxy resin semi-cured. . On the surface of this semi-cured resin composition, a 25 μm thick nickel foil is laminated using a vacuum laminator, and further heat-treated at 150 ° C. for 3 hours to completely cure the resin composition and to have a high dielectric constant. A passive component forming layer 4 made of the material 4a was formed, and a second metal layer 5 was formed with nickel foil to obtain a sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG.

  The relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was measured and found to be 100 at a frequency of 1 MHz.

(Reference Example 6)
In the same manner as in Reference Example 1, a support layer 2 and a first metal layer 3 were formed.

  Using a plasma spray gun, a titanium oxide layer having a thickness of 2 μm is formed on the surface of the metal layer 3 by spraying under the conditions of a spray current of 1000 A and a supply amount of 50 g / min. The component forming layer 4 was configured. Here, at the time of thermal spraying, water cooling treatment was performed from the support layer 2 side, and the support layer 2 and the metal layer 3 were wound at a predetermined winding speed. Thereafter, heat treatment was further performed at 150 ° C. for 1 hour.

  Next, by applying electroless copper plating and electrolytic copper plating, a second metal layer 5 having a thickness of 18 μm made of copper plating is formed on the surface of the passive component forming layer 4, and has the configuration shown in FIG. A sheet material 1 for producing a printed wiring board was obtained.

  When the relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for producing a printed wiring board thus obtained was measured, it was 500 at a frequency of 1 MHz.

(Reference Example 7)
In the same manner as in Reference Example 1, a support layer 2 and a first metal layer 3 were formed.

  A titanium oxide layer having a thickness of 10 μm was formed on the surface of the metal layer 3 by a sol-gel method to constitute a passive component forming layer 4 made of a high dielectric constant material 4a. Here, in carrying out the sol-gel method, using an isopropyl solution of titanium tetraisoproposide, hydrolyzing with a 0.001 mol / L hydrochloric acid solution to increase the molecular weight, followed by heating at 300 ° C. for 2 hours. To obtain a dielectric layer 14 having a thickness of 10 μm.

  Next, by applying electroless copper plating and electrolytic copper plating, a second metal layer 5 having a thickness of 18 μm made of copper plating is formed on the surface of the passive component forming layer 4, and has the configuration shown in FIG. A sheet material 1 for producing a printed wiring board was obtained.

  The relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was measured and found to be 300 at a frequency of 1 MHz.

(Reference Example 8)
In the same manner as in Reference Example 1, a support layer 2 and a first metal layer 3 were formed.

  A layer of lead lanthanum titanate with a thickness of 0.05 μm was formed on the surface of the metal layer 3 by sputtering to form a passive component forming layer 4 made of a high dielectric constant material 4a. Sputtering at this time is performed using a normal sputtering apparatus, using lanthanum lead titanate as a target material, a substrate temperature of 50 ° C., an argon gas pressure of 25 mTorr (3.3 Pa), an oxygen partial pressure of 25 mTorr (3.3 Pa), The deposition was performed under the condition of 20 minutes.

  Next, a second metal layer 5 was formed by sputtering aluminum with titanium as a base. Sputtering at this time was performed using a normal sputtering apparatus, aluminum as a target material, a substrate temperature of 200 ° C., an output of 12 kW, and an argon partial pressure of 25 mTorr (3.3 Pa). Thus, the printed wiring board manufacturing sheet material 1 having the configuration shown in FIG. 2 was obtained.

  The relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for producing a printed wiring board thus obtained was measured and found to be 50000 at a frequency of 1 MHz.

(Reference Example 9)
An aluminum foil with a support in which an aluminum foil with a thickness of 20 μm is laminated on a support made of a polyimide sheet with a thickness of 50 μm is used. The support layer 2 is formed with this polyimide sheet, and the first metal layer 3 with an aluminum foil. Configured.

  A barium titanate layer having a thickness of 1 μm was formed on the surface of the metal layer 3 by ion plating to form a passive component forming layer 4 made of a high dielectric constant material 4a. Here, the ion plating was performed using a DC ion plating apparatus, using barium titanate as an evaporation source, under an argon atmosphere, under a pressure of 3 mTorr (0.4 Pa), and an applied voltage of 2000 kV.

  Next, by applying electroless copper plating and electrolytic copper plating, a second metal layer 5 having a thickness of 18 μm made of copper plating is formed on the surface of the passive component forming layer 4, and has the configuration shown in FIG. A sheet material 1 for producing a printed wiring board was obtained.

  The relative permittivity of the passive component forming layer 4 in the printed wiring board manufacturing sheet material 1 thus obtained was measured and found to be 2000 at a frequency of 1 MHz.

(Reference Example 10)
In the same manner as in Reference Example 1, a support layer 2 and a first metal layer 3 were formed.

  On the other hand, in a novolak photosensitive resist material using a novolak resin as a base polymer and an o-naphthoquinonediazide compound as a photosensitive material, dimethylformamide is blended as a solvent, and barium titanate powder (Nippon Chemical Industry Co., Ltd.) is used as an inorganic filler. A resin composition was prepared by mixing “BT-4” manufactured by the company at a volume fraction of 60 vol% with respect to the resin.

  The resin composition was applied to the surface of the first metal layer 3 with a roll coater to a thickness of 20 μm, heated at 150 ° C. for 20 minutes and dried, and then a 18 μm thick copper foil was vacuum-laminated. And laminated to obtain a sheet material 1 for producing a printed wiring board having the configuration shown in FIG.

  The relative dielectric constant of the passive component forming layer 4 in the sheet material 1 for manufacturing a printed wiring board thus obtained was measured and found to be 50 at a frequency of 1 MHz.

(Reference Example 11)
In the same manner as in Reference Example 1, a support layer 2 and a first metal layer 3 were formed.

  On the other hand, a resin composition was prepared in the same manner as in Reference Example 1 except that Mn—Zn ferrite powder (manufactured by Toda Kogyo Co., Ltd.) was added as a filler in a volume fraction of 60 vol% with respect to the resin.

  This resin composition was applied to the surface of the first metal layer 3 with a roll coater to a thickness of 500 μm, dried by heating at 100 ° C. for 1 hour to remove the solvent and to make the epoxy resin semi-cured. Furthermore, it was fully cured by heating at 175 ° C. for 1 hour, and the passive component forming layer 4 made of the high magnetic permeability material 4b was formed. Then, after applying desmear treatment with potassium permanganate, by applying electroless copper plating and electrolytic copper plating, a second metal layer 5 having a thickness of 18 μm made of copper plating on the surface of the passive component forming layer 4. The sheet material 1 for manufacturing a printed wiring board having the configuration shown in FIG. 2 was obtained. Furthermore, for the purpose of improving the adhesion between the passive component forming layer 4 and the second metal layer 5, a heat treatment was further performed at 150 ° C. for 3 hours.

  The magnetic permeability of the passive component forming layer 4 in the printed wiring board manufacturing sheet material 1 thus obtained was measured and found to be 10 at a frequency of 100 kHz.

(Reference Example 12)
The support layer 2 and the metal layer 3 were configured in the same manner as in Reference Example 1.

  On the other hand, a resin composition was obtained in the same manner as in Reference Example 1 except that Cu—Zn—Mg ferrite powder (manufactured by Toda Kogyo Co., Ltd.) was mixed as a filler at a volume fraction of 60 vol% with respect to the resin.

  This resin composition was applied to the surface of the metal layer 3 with a roll coater to a thickness of 30 μm, dried by heating at 100 ° C. for 10 minutes to remove the solvent, and the epoxy resin was made into a semi-cured state, and further 175 ° C. Was sufficiently cured by heating for 1 hour to form a passive component forming layer 4 made of a high magnetic permeability material 4b, and a printed wiring board manufacturing sheet material 1 having the configuration shown in FIG. 3 was obtained.

  When the magnetic permeability of the passive component forming layer 4 in the sheet material 1 for producing a printed wiring board thus obtained was measured, it was 16 at a frequency of 100 kHz.

(Reference Example 13)
The support layer 2 and the metal layer 3 were configured in the same manner as in Reference Example 1.

  A passive component made of a resistor material 4c is formed by forming an alloy plating layer of Ni / W / P (Ni: 75%, W: 19%, P: 6%) on the surface of the metal layer 3 to a thickness of 5 μm. The formation layer 4 was comprised and the sheet | seat material 1 for printed wiring board manufacture which has the structure shown in FIG. 3 was obtained.

  It was 0.00012 (ohm * cm) when the specific resistivity of the passive component formation layer 4 in the sheet | seat 1 for printed wiring board manufacture obtained in this way was measured.

(Reference Example 14)
The support layer 2 and the metal layer 3 were configured in the same manner as in Reference Example 1.

  On the other hand, a resin composition was prepared in the same manner as in Reference Example 1 except that carbon black was added as a filler in a volume fraction of 30 vol% with respect to the resin.

  This resin composition is applied to the surface of the metal layer 3 with a roll coater to a thickness of 20 μm, dried by heating at 100 ° C. for 10 minutes to remove the solvent, and then heated at 175 ° C. for 1 hour. Then, the passive component forming layer 4 made of the resistor material 4c was formed, and the printed wiring board manufacturing sheet material 1 having the configuration shown in FIG. 3 was obtained.

  It was 200 (ohm * cm) when the specific resistivity of the passive component formation layer 4 in the sheet material 1 for printed wiring board manufacture obtained in this way was measured.

  The results are summarized in Table 1.

An example of a printed wiring board manufacturing process is shown, (a)-(d) is a schematic sectional drawing, (e) is a top view of (d). It is a perspective view which shows an example of the sheet material for printed wiring board manufacture. It is a perspective view which shows the other example of the sheet | seat material for printed wiring board manufacture. The other example of a printed wiring board manufacturing process is shown, (a)-(f) is a schematic sectional drawing. The other example of a printed wiring board manufacturing process is shown, (a)-(g) is a schematic sectional drawing. The other example of a printed wiring board manufacturing process is shown, (a)-(e) is a schematic sectional drawing, (f) is the perspective view which showed notionally the structure of the inductor in this printed wiring board. . The other example of a printed wiring board manufacturing process is shown, (a)-(e) is schematic sectional drawing. It is sectional drawing which shows a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet material for printed wiring board 2 Support body layer 3 Metal layer 4 Passive component formation layer 4b High magnetic permeability material 7 Insulating resin layer 8 Conductive layer 10 Circuit 12 Through-hole 13 Inductor pattern 14 High magnetic permeability layer

Claims (5)

  A high permeability layer is formed in a passive component forming layer of a printed wiring board manufacturing sheet material having a structure in which a support layer, a metal layer, and a passive component forming layer formed of a high permeability material are laminated in this order. The surface on which this high magnetic permeability layer is formed is overlapped with one surface of the semi-cured insulating resin layer, laminated by heat and pressure molding, and then peeled off the support layer from the metal layer, A method of manufacturing a printed wiring board, wherein an inductor pattern is formed by etching a metal layer.   After etching and removing a part of the passive component forming layer of the printed wiring board manufacturing sheet material to form a high permeability layer having through holes, the printed wiring board manufacturing sheet material is laminated and integrated with the insulating resin layer, An inductor pattern is formed in a planar coil shape centering on a position matching the through hole, and at the position where the through hole is formed, the inductor pattern and a conductor layer formed on the other surface of the insulating resin layer are provided. 2. The method for manufacturing a printed wiring board according to claim 1, wherein a through-hole to be connected is formed and an inner surface of the through-hole is plated.   The method for producing a printed wiring board according to claim 1, wherein the passive component forming layer is formed to have a thickness in the range of 0.05 to 500 μm.   4. The printed wiring board according to claim 1, wherein the metal layer is formed of at least one of iron, copper, aluminum, nickel, titanium, and alloys thereof. 5. Method.   A printed wiring board manufactured by the method according to any one of claims 1 to 4.

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