JPH1126943A - Multilayer wiring board and manufacture of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a compact wiring board incorporating a capacitor element in a simple method without affecting the characteristics or structure of the wiring board. SOLUTION: A capacitor element A in which a dielectric layer 6 is interposed between a pair of electrodes 4 and 5 made of a metallic foil or the like is formed on the surface of a film. Next, a through-hole conductor 2 and a wiring circuit layer 3 are formed in an insulating sheet 1 including an organic resin so that a wiring layer S1 can be formed. The capacitor element A is transferred from the film on which the capacitor element A is formed to the surface of a wiring layer S1. Other wiring layers S2 and S3 in which wiring circuit layers 8 and 9 and through-hole conductors 10 and 11 are formed are laminated and pressed on the surface so that a multilayer wiring board incorporating the capacitor element can be obtained. Also, the wiring circuit layer 3 is processed simultaneously with the transfer of the capacitor element A so that the process can be simplified.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board suitable for a semiconductor device housing package or the like having a built-in capacitor element and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, ceramic multilayer wiring boards capable of high-density wiring have been frequently used as multilayer wiring boards, for example, multilayer wiring boards used for packages containing semiconductor elements. This multilayer ceramic wiring board is composed of an insulating substrate such as alumina and W or Mo formed on the surface thereof.
And a wiring conductor made of a metal having a high melting point such as the above. A concave portion is formed in a part of the insulating substrate, the semiconductor element is accommodated in the concave portion, and the concave portion is hermetically sealed by the lid. Things.

However, ceramics constituting such an insulating substrate of a ceramic multilayer wiring board are hard and brittle, so that chipping or cracking of the ceramics is liable to occur, and firing shrinkage due to firing at high temperature. The problem is that the resulting substrate is liable to be deformed such as warpage or dimensional variation in the obtained substrate. Therefore, there was a problem that it was not possible to respond sufficiently.

On the other hand, a fine circuit is formed on the surface of an insulating substrate containing an organic resin to which a copper foil is adhered by an etching method.
Multi-layer printed circuit boards that form through holes and plating the inner surface to make electrical connections between layers do not require processing at high temperatures like ceramics, and are advantageous in that they can be used in any shape. It is.

[0005] In recent years, with the development of portable information terminals and the spread of so-called mobile computing that carries and operates a computer, these devices have become smaller and thinner, and a multilayer wiring board mounted in the device has also been required. ,
Demands for high definition and miniaturization are increasing.

In a packaging technique for mounting a semiconductor element, a capacitor formed of a dielectric layer and a pair of electrodes is formed in an insulating substrate in order to reduce disturbance of a signal waveform to the semiconductor element. 2. Description of the Related Art A so-called decoupling capacitor is formed by various methods such as attaching a capacitor externally to a surface or forming a capacitor element on a semiconductor element or a lid.

[0007]

Generally, when a decoupling capacitor is provided in a package using a multilayer printed circuit board made of an insulating substrate containing an organic resin,
As shown in FIG. 3, a pair of electrodes 21 and 22 are formed on both sides of a single insulating layer 20a in an insulating substrate 20 having a multilayer structure, and the electrodes 21 and 22 are connected to through-hole conductors 23 and 2 respectively.
4. Pads 25 and 26 formed on the surface by being pulled out to the surface with 4
A structure is known in which the capacitance is connected to the pads 25 and 26 to take out the capacitance. However, in such a structure, since the capacitance of the capacitor is determined by the properties of the insulating layer, in order to take out the necessary capacitance, the electrode area or the thickness of the insulating layer must be changed in design. Restrictions occur.

It is also possible to control the dielectric properties of the insulating layer sandwiched between the electrodes by changing the dielectric properties of the other insulating layers. It is necessary to consider sex etc.

Therefore, at present, a method of mounting a capacitor on the surface of a substrate is mainly used, but such a method has a problem that it cannot sufficiently cope with miniaturization of a wiring substrate.

Accordingly, it is an object of the present invention to provide a wiring board having a built-in capacitor element which can be reduced in size and does not affect the characteristics and structure of the wiring board. It is another object of the present invention to provide a method of manufacturing a wiring board that can incorporate a capacitor element by a simple method without affecting the characteristics and structure of the wiring board.

[0011]

Means for Solving the Problems The present inventor has repeatedly studied a method of incorporating a capacitor element into a substrate, and as a result,
On a film, a capacitor element formed by laminating a metal foil and a dielectric layer is transferred while being pressed onto the surface of an uncured or semi-cured insulating sheet on which a wiring circuit layer is formed, and the surface of the insulating sheet is After embedding the capacitor element and further laminating another insulating sheet, it is cured together, or the capacitor element is interposed between the uncured or semi-cured insulating sheets with the wiring circuit layer formed, and laminated and crimped Then, after embedding the capacitor element between the insulating sheets and curing it all together, it was found that the capacitor element can be built into the wiring board without affecting the characteristics and structure of the wiring board of the board. Invented the invention.

That is, the multilayer wiring board of the present invention comprises an insulating substrate having at least a plurality of insulating layers containing an organic resin laminated, and a wiring circuit layer provided at least between the insulating layers of the insulating substrate. In the multilayer wiring board provided,
A capacitor element in which a dielectric layer is sandwiched between a pair of electrodes is buried between the insulating layers, and further, a pair of surface electrodes is provided on the surface of the wiring board,
The surface electrode and the pair of electrodes of the capacitor element are electrically connected by a pair of through-hole conductors.

[0013] The method for manufacturing a multilayer wiring board according to the present invention comprises the steps of: forming a capacitor element having a dielectric layer sandwiched between a pair of electrodes on a surface of a film; Forming a wiring circuit layer on the surface of the semi-cured insulating sheet, transferring the capacitor element formed on the film surface to the insulating sheet surface while applying pressure, and embedding the capacitor element on the insulating sheet surface. Step, and a step of laminating and pressing another insulating sheet containing a thermosetting resin on the surface of the insulating sheet in which the capacitor element is embedded, including an uncured or semi-cured state,
Heat-treating the laminate, and curing the laminate at once, characterized by comprising:
Further, the wiring circuit layer is formed by etching a metal foil adhered to a film surface to form a wiring circuit layer, and then transferring the film from the film to the insulating sheet. Furthermore, the transfer of the wiring circuit layer to the insulating sheet and the transfer of the capacitor element to the insulating sheet are performed simultaneously.

Further, another method of manufacturing a multilayer wiring board according to the present invention includes a step of forming a wiring circuit layer on a surface of an uncured or semi-cured first insulating sheet containing a thermosetting resin;
Forming a wiring circuit layer on the surface of an uncured or semi-cured second insulating sheet containing a thermosetting resin; and forming the first insulating sheet on which a wiring circuit layer is formed and the second insulating sheet.
Laminating the insulating sheet, while pressing a capacitor element having a dielectric layer sandwiched between a pair of electrodes at a predetermined position, embedding the capacitor element between the insulating sheets, and heating the laminate. And curing the laminate at once.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A multilayer wiring board according to the present invention will be described with reference to FIG. 1 which is a process chart for explaining a first manufacturing method and FIG. 2 for explaining a second manufacturing method. This will be explained. According to the first method for manufacturing a wiring board of the present invention, first, as shown in FIG. 1A, a soft insulating sheet 1 made of an organic resin is prepared. Further, the insulating sheet 1 is formed with a through-hole penetrating in the thickness direction as required, and the through-hole is filled with a conductive paste containing a metal powder while performing screen printing or suction processing to form the through-hole conductor 2. Form.

Specifically, first, as an insulating sheet, a thermosetting organic resin or a composition of a thermosetting organic resin and a filler as described above is sufficiently mixed by means of a kneader or a three-roll mill. This is formed into a sheet by a rolling method, an extrusion method, an injection method, a doctor blade method, or the like. Then, the thermosetting resin is semi-cured by heat treatment if desired. For semi-curing, the resin is heated to a temperature slightly lower than a temperature sufficient to completely cure the resin.

Then, a through hole is formed in the insulating layer in this state. A well-known method such as drilling, punching, sandblasting, or processing by irradiation with a carbon dioxide gas laser, a YAG laser, an excimer laser, or the like is employed for forming the through hole.

The organic resin forming the insulating sheet is as follows:
Usually, a thermosetting resin, a heat-resistant thermoplastic resin having a high melting point, a composition composed of these resins, or the like is used.

The thermosetting resin is not particularly limited as long as it is a thermosetting resin having electrical properties, heat resistance, and mechanical strength as an insulating material. Examples of the thermosetting resin include a phenol resin, an epoxy resin, Imide resin, fluororesin, phenylene ether resin, bismailide triazine resin, urea resin, melamine resin, silicone resin,
Urethane resins, unsaturated polyester resins, allyl resins and the like can be used alone or in combination.

In the insulating sheet 1, a filler can be compounded with an organic resin in order to increase the strength of the entire insulating substrate or wiring substrate. SiO ₂ , Al
₂ O ₃ , ZrO ₂ , TiO ₂ , AlN, SiC, BaT
Inorganic fillers such as iO ₃ , SrTiO ₃ , zeolite, CaTiO ₃ and aluminum borate are preferably used. Further, a nonwoven fabric or a woven fabric made of glass or aramid resin may be used by impregnating the above resin. The organic resin and the filler are in a volume ratio of 15:85 to 50: 5.
Suitably, the compound is formed in a ratio of 0.

On the other hand, the metal paste filled in the through-hole conductor 2 includes metal powder having an average particle size of 0.5 to 50 μm, such as copper powder, silver powder, silver-coated copper powder, and copper-silver alloy.

If the average particle size of the metal powder is smaller than 0.5 μm, the contact resistance between the metal powders increases and the resistance of the through-hole conductor tends to increase. Tend to be difficult.

The conductor paste is prepared by adding and mixing the above-mentioned binding organic resin and solvent to the above-mentioned metal powder. The solvent to be added to the paste may be any solvent that can dissolve the binding organic resin to be used. For example, isopropyl alcohol, terpineol, 2-octanol, butyl carbitol acetate and the like are used.

As the above-mentioned organic resin for binding, cellulose and the like are used in addition to the organic resins constituting the above-mentioned various insulating sheets. The organic resin has a function of bonding the metal powders to each other in a state where they contact each other and bonding the metal powders to the insulating sheet. This organic resin is desirably contained in the metal paste at a ratio of 0.1 to 40% by volume, particularly 0.3 to 30% by volume. If the amount of the resin is less than 0.1% by volume, it is difficult to firmly bond the metal powders to each other, and it is difficult to firmly bond the low-resistance metal to the insulating layer. If it exceeds, the resin is interposed between the metal powders, making it difficult to bring the powders into sufficient contact with each other and increasing the resistance of the through-hole conductor.

Next, as shown in FIG. 1B, a wiring circuit layer 3 is formed on the surface of the insulating sheet 1. The wiring circuit layer 3 is formed by attaching a metal foil to the surface of the insulating sheet 1 and then etching it to form a circuit pattern, forming a resist on the surface of the insulating sheet 1 and plating the same, resin A method of attaching a metal foil to the film surface, etching the metal foil to form a circuit pattern, and transferring the circuit pattern made of the metal foil to the surface of the insulating sheet 1 may be used.

Next, according to the present invention, the insulating sheet 1 on which the through-hole conductor 2 and the wiring circuit layer 3 are formed.
A capacitor element having a dielectric layer 6 disposed between a pair of electrodes 4 and 5 is formed on the surface of the capacitor element. As a method for forming the capacitor element, for example, the capacitor element can be formed by transferring an electrode 4 made of a metal foil to the surface of an insulating sheet, and then forming a dielectric layer 6 and an electrode 5 made of a metal foil. It is. However, in such a method, since the capacitor element is formed directly on the surface of the insulating sheet 1, the insulating sheet 1 may be adversely affected, and there are many restrictions on the design of the capacitor element.

Therefore, according to the present invention, it is desirable to separately manufacture a capacitor element and transfer the capacitor element to the surface of the insulating sheet 1 to form the capacitor element. The specific method is shown in FIGS. 1 (c1) to 1 (c4). According to this method,
For example, after the metal foil is etched on the surface of the resin film 7 to form the electrode 4 (FIG. 1 (c1)), the dielectric layer 6 is formed on the surface of the electrode 4 (FIG. 1 (c2)). Alternatively, a material in which the dielectric layer 6 is formed on the surface of the electrode 4 made of a metal foil is attached to a resin film.

The formation of the dielectric layer 6 is desirable in that a physical vapor deposition method such as sputtering can be formed at a low temperature. For example,
A portion other than the dielectric layer forming portion of the copper foil is masked and set in a vacuum vessel, a known high dielectric constant material such as barium titanate is set as a vapor deposition source, and sputtering is performed to form a dielectric layer on the electrode surface. . When a capacitor element having a higher capacity is required, a high-dielectric-constant material and a metal such as copper can be alternately sputtered to form a thin-film multilayer capacitor element.

As another method of forming a dielectric layer, a solution such as an alkoxide made of a dielectric material is applied to the surface of an electrode made of a metal foil, and heat treatment is performed to form the dielectric layer. it can.

Then, the capacitor element A can be formed by forming the electrode 5 on the surface of the dielectric layer 6 (FIG. 1 (c3)). The electrode 5 is formed by, for example, sputtering a metal such as copper at a predetermined location by a physical vapor deposition method such as sputtering, or applying a metal foil on the surface of the dielectric layer 6. Further, the electrodes 5 can be formed on the side of the insulating sheet to be transferred as described later, and the electrodes 4 and the dielectric layer 6 can be formed by transferring them to the surface of the electrodes 5 formed on the insulating sheet 1. .

Thereafter, the resin film 7 on which the capacitor element A is formed is laminated on the insulating sheet 1 (FIG. 1 (c)).
4)) After the compression bonding, the resin film 7 is peeled off, and the capacitor element A is transferred to the surface of the insulating sheet 1 so that the through-hole conductor 2, the wiring circuit layer 3, and the capacitor element as shown in FIG. A single wiring layer S1 on which A is formed can be formed. At this time, when the capacitor element A is pressed on the surface of the insulating sheet 1, the insulating sheet 1
Is in an uncured or semi-cured state and is soft, so that the capacitor element A can be embedded in the surface of the insulating sheet 1.

When the wiring circuit layer 3 is formed on the surface of the insulating sheet 1 by a transfer method from a resin film, the wiring circuit layer 3 and the capacitor element A are formed on the surface of the resin film, and these are formed on the insulating sheet. Simultaneous transfer to one surface can simplify the process.

The wiring circuit layer 3 is made of, for example, at least one selected from the group consisting of copper, silver, aluminum, and gold;
It is desirable to include a low resistance metal mainly composed of at least one kind of alloy, and particularly copper or an alloy containing copper is most desirable. In some cases, a high-resistance metal such as a Ni—Cr alloy may be mixed or alloyed as the conductor composition for adjusting the resistance of the circuit. Further, for lowering the resistance of the wiring layer, a metal having a lower melting point than the low-resistance metal, for example,
A low melting point metal such as solder or tin may be contained in the metal component in the conductor composition at a ratio of 2 to 20% by weight.

Next, a single wiring layer S2 or S3 manufactured in the same manner as in FIGS. 1A and 1B is aligned and laminated and pressed, and the insulating sheets in the wiring layers S1 to S3 are formed. By heating to a temperature sufficient to cure the thermosetting resin therein and performing complete curing at once, a multilayer printed wiring board incorporating a capacitor element as shown in FIG. 1 (e) can be formed. .

At this time, as shown in FIG. 1E, surface electrodes 8 and 9 are formed on the surface of the wiring layer 2, and further, the surface electrodes 8 and 9 and the electrodes 4 and 5 of the capacitor element A are respectively connected. By forming the through-hole conductors 10 and 11 at positions where they can be electrically connected, it is possible to take out the capacitance from the capacitor element A from the surface electrodes 8 and 9 via the through-hole conductors 10 and 11 after lamination and pressure bonding. it can.

Next, according to the second manufacturing method of the present invention,
As shown in FIG. 2A, a film-shaped capacitor element B in which the high dielectric layer 12 is sandwiched between a pair of electrodes 13 and 14 such as a copper foil is formed.

On the other hand, the wiring circuit layers 18, 20, 21 and the through-hole conductors 16, 16 are formed on the surface of the uncured or semi-cured insulating sheet 15 by the method shown in FIGS.
The wiring layers S4, S5 and S6 on which the layers 17 and 19 are formed are prepared, and as shown in FIG. 2B, the capacitor element B prepared in FIG. 2A is positioned between the wiring layers S5 and S6. And laminate.

Thereafter, by pressing the laminate while applying pressure, the capacitor element B is embedded between the soft insulating sheets 15 of the wiring layers S5 and S6. And
This laminate is heated to a temperature sufficient to cure the thermosetting resin in the insulating sheet 15 and completely cured at once, so that the capacitor element is embedded between the insulating layers as shown in FIG. A multi-layer wiring board can be manufactured.

According to FIG. 2C, the wiring layer S5,
In S6, through-hole conductors 16 and 17 electrically connected to the electrodes 13 and 14 of the capacitor element B are formed, and the through-hole conductor 16 is connected to the wiring circuit layer 18 and the through-hole conductor 19.
The capacitance of the capacitor element B can be taken out by the surface electrodes 20 and 21 by connecting the through-hole conductor 17 to the surface electrode 21 by connecting the through hole conductor 17 to the surface electrode 21 via the surface electrodes 20 and 21.

In FIGS. 1 and 2, the surface electrode may be formed on either one of the surfaces of the wiring board, or on the front surface and the back surface.
The electrodes may be electrically connected to each other using a through-hole conductor or the like.

As described above, according to the present invention, between the insulating layers of the insulating substrate formed by laminating a plurality of insulating layers,
As a result of forming a capacitor element in which a dielectric layer is sandwiched between a pair of electrodes, a wiring board with a built-in capacitor element can be formed in a simple manner without specially changing the characteristics of the insulating substrate and the structure of the wiring board. Can be produced.

[0042]

【Example】

Example 1 A prepreg in a semi-cured state in which 50% by volume of an imide resin was impregnated with 50% by volume of a nonwoven fabric of an aramid resin was used to form a through hole having a diameter of 0.1 mm with a carbon dioxide gas laser.
The holes were filled with a copper paste containing copper powder plated with silver to form through-hole conductors (insulating sheet A).

Also, a resin in a varnish state consisting of 50% by volume of imide resin and 50% by volume of silica powder and powder were mixed, and punched into an insulating sheet by a doctor blade method to form a through hole having a diameter of 0.1 mm. The holes were filled with a copper paste containing copper powder plated with silver to form through-hole conductors (insulating sheet B).

On the other hand, polyethylene terephthalate (PE)
T) An adhesive is applied to the surface of a resin film made of a resin to impart tackiness, and the thickness is 12 μm and the surface roughness is 0.8 μm.
Was adhered to one surface. Thereafter, a region other than the capacitor element forming portion was masked, the resin film was placed in a vacuum vessel, and a 10 μm-thick dielectric layer made of barium titanate was formed on the surface by sputtering. Further, an electrode made of copper having a thickness of 1 μm was formed on the surface of the dielectric layer.

Thereafter, a photoresist was applied to the metal foil, exposed and developed, and then immersed in a ferric chloride solution to remove non-pattern portions by etching to form a wiring circuit layer. The manufactured wiring circuit layer has a line width of 60 μm.
m, a fine pattern with a distance between wirings of 60 μm.

Then, the resin film on which the capacitor element and the wiring circuit layer are formed is positioned on the insulating sheet A on which the through-hole conductor is formed, and laminated and pressed under a pressure of 50 kg / cm ² to peel off only the resin film. Then, the capacitor element and the wiring circuit layer were simultaneously transferred to the prepreg to form a wiring layer A1. Similarly, a wiring circuit layer was formed on each of the insulating sheets A, and wiring layers A2 and A3 were produced.

In the same manner as described above, a wiring circuit layer made of copper foil was transferred to and formed on the insulating sheet B on which the through-hole conductor was formed, and wiring layers B1 and B2 were produced.

Then, the wiring layers B1 and B2 are stacked on both sides of the laminate of the wiring layers A1, A2 and A3, respectively, and the two layers are laminated and pressed under a pressure of 50 kg / cm ^2.
The laminate was heated at 0 ° C. for one hour to completely cure the laminate at once, thereby producing a multilayer wiring board.

As a result of observing the vicinity of the formation of the wiring circuit layer and the through-hole conductor in the cross section of the obtained multilayer wiring board, the wiring circuit layer and the through-hole conductor were in a good connection state, and the As a result of the continuity test, no disconnection of the wiring was observed.

The characteristics as a capacitor element were also good.

The obtained multilayer wiring board was left for 100 hours in a high-temperature and high-humidity atmosphere at a humidity of 85% and a temperature of 85 ° C., but no change was observed to the extent that it could be visually discriminated. 1000
After leaving for a while, slight peeling of the layer was observed at the periphery.

Example 2 Copper having a diameter of 0.1 mm was formed in a prepreg composed of 55% by volume of polyaminobismaleimide resin and 45% by volume of aramid non-woven fabric by a carbon dioxide laser, and silver having a particle size of about 5 μm was plated in the hole. A copper paste made of powder was filled (insulating sheet A).

The polyaminobismaleimide resin 50
A varnished resin and powder were mixed so that the volume ratio was 50% by volume and the silica powder was 50% by volume, and a through hole having a diameter of 0.1 mm was formed by punching in a sheet-like insulating layer produced by a doctor blade method. The inside was filled with a copper paste containing copper powder plated with silver to form a through-hole conductor (insulating sheet B).

An alkoxide solution of barium titanate is applied to the surface of a copper foil having a thickness of 18 μm, and after repeating drying and application, a heat treatment is performed at 500 ° C. to form a dielectric layer. Total thickness 100μm with electrodes attached
Was prepared and cut to a predetermined capacity.

Then, the above-described film capacitor element is disposed between the insulating sheet A and the insulating sheet B, sandwiched from above and below, and laminated and pressed at a pressure of 50 kg / cm ² at 200 ° C. The laminate was heated for one hour and completely cured at once to produce a multilayer wiring board.

As a result of observing the vicinity of the formation of the wiring circuit layer and the through-hole conductor in the cross section of the obtained multilayer wiring board, the wiring circuit layer and the through-hole conductor were in a good connection state, and the connection between each wiring was good. As a result of the continuity test, no disconnection of the wiring was observed.

The capacitor element also has good characteristics,
The desired volume was obtained. The obtained multilayer wiring board was subjected to a humidity of 8
It was left in a hot and humid atmosphere of 5% and a temperature of 85 ° C. for 100 hours, but no change that could be visually recognized was generated.

[0058]

As described in detail above, according to the present invention,
Capacitor elements in which a dielectric layer is sandwiched between a pair of electrodes can be formed between insulating layers of an insulating substrate in which a plurality of insulating layers are stacked. As a result, the characteristics of the insulating substrate and the structure of the wiring substrate are exceptionally improved. A wiring board incorporating a capacitor element can be manufactured by a simple method without any change.

[Brief description of the drawings]

FIG. 1 is a process chart for explaining a method for manufacturing a multilayer wiring board of the present invention.

FIG. 2 is a process diagram for forming a capacitor element in the method for manufacturing a multilayer wiring board of the present invention.

FIG. 3 is a schematic cross-sectional view for explaining the structure of a conventional multilayer wiring board having a built-in capacitor element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulation sheet 2 Through-hole conductor 3 Wiring circuit layer 4,5 Electrode 6 Dielectric layer 7 Resin film 8,9 Surface electrode 10,11 Through-hole conductor

Claims (6)

[Claims] 1. A multilayer wiring board comprising: an insulating substrate formed by laminating a plurality of insulating layers containing at least an organic resin; and a wiring circuit layer provided at least between the insulating layers of the insulating substrate. A multilayer wiring board comprising a capacitor element in which a dielectric layer is sandwiched between a pair of electrodes between insulating layers. 2. A method according to claim 1, wherein a pair of surface electrodes is provided on the surface of the substrate, and the surface electrodes and the pair of electrodes of the capacitor element are electrically connected by at least a pair of through-hole conductors. 2. The multilayer wiring board according to 1. 3. A step of forming a capacitor element having a dielectric layer sandwiched between a pair of electrodes on a surface of a film, and a step of forming a wiring circuit on an uncured or semi-cured insulating sheet containing a thermosetting resin. Forming a layer, transferring the capacitor element formed on the film surface to the insulating sheet surface while applying pressure, and embedding the capacitor element on the insulating sheet surface; and embedding the capacitor element in the insulating sheet surface. On the surface of the insulating sheet, a step of laminating and pressing another insulating sheet containing an uncured or semi-cured state containing a thermosetting resin, and a step of heat-treating the laminate to collectively cure the laminate, A method for manufacturing a multilayer wiring board, comprising: 4. The wiring circuit layer is formed by etching a metal foil applied to a film surface to form a wiring circuit layer.
4. The method according to claim 3, wherein the film is transferred from the film to the insulating sheet. 5. The method according to claim 4, wherein the transfer of the wiring circuit layer to the insulating sheet and the transfer of the capacitor element to the insulating sheet are simultaneously performed. 6. A step of forming a wiring circuit layer on the surface of an uncured or semi-cured first insulating sheet containing a thermosetting resin, and a step of forming a second uncured or semi-cured state containing a thermosetting resin. Forming a wiring circuit layer on the surface of the insulating sheet,
The first insulating sheet and the second insulating sheet on which a wiring circuit layer is formed are laminated while pressing a capacitor element having a dielectric layer sandwiched between a pair of electrodes at a predetermined position, and laminating the first insulating sheet and the second insulating sheet. A method for manufacturing a multilayer wiring board, comprising: a step of embedding a capacitor element between the insulating sheets; and a step of heat-treating the laminate to collectively cure the laminate.