JP2002305366A - Manufacturing method of laminated board and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated board, together with a manufacturing method of an electronic component, which is thinner than a conventional one, with no strength problem at handling. SOLUTION: A transfer film is bonded to a conductor layer which is patterned to a prescribed pattern. Then, the transfer film comprising the conductor layer which is patterned is so arranged that the conductor layer side faces a pre-preg. After the transfer film is press-fitted under heat in a pre-preg direction, it is released to provide a pre-preg which comprises the conductor layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated substrate and an electronic component using a prepreg and a substrate, and more particularly to a method for manufacturing a laminated substrate and an electronic component capable of reducing the thickness between layers.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable trend toward miniaturization and high-density mounting methods in the field of electronic devices for communication, consumer use, industrial use, and the like. Heat resistance, dimensional stability, electrical properties, and moldability are being demanded.

[0003] As a high-frequency electronic component or a high-frequency multilayer substrate, a substrate obtained by forming a sintered ferrite or sintered ceramic into a multi-layered substrate is generally known. Making these materials into a multi-layer substrate has been conventionally used because of its merit of miniaturization.

However, when these sintered ferrites and sintered ceramics are used, there are many firing steps and thick film printing steps, and there are many problems specific to sintered materials such as cracks and warpage during firing. Since there are many problems such as generation of cracks due to a difference in thermal expansion coefficient from a printed circuit board, a demand for a resin-based material is increasing year by year.

[0005] However, it is extremely difficult to obtain a sufficient dielectric constant by itself with a resin-based material, and it is also difficult to improve the magnetic permeability. For this reason, an electronic component simply using a resin material cannot obtain sufficient characteristics, is large in shape, and it is difficult to reduce the size and thickness.

[0006] Also, a method of compositing a ceramic powder with a resin material is disclosed in, for example, JP-A-10-270255, JP-A-11-192620 and JP-A-8-69712.
However, all have sufficient dielectric constants,
At the same time, no magnetic permeability has been obtained. When the filling rate of the ceramic powder is increased to increase the dielectric constant, there is a problem that the strength is reduced and the ceramic powder is liable to be broken during handling or processing.

Further, these substrates are constituted by impregnating a reinforcing material such as glass cloth with a paste. For this reason, the thickness of the constituent layers cannot be reduced below the thickness of the glass cloth, and there is also a problem such as deterioration of characteristics in terms of reliability due to moisture absorption between the glass cloth and the substrate.

[0008] An example of the configuration of a substrate not using a glass cloth is disclosed in, for example, Japanese Patent Publication No. 6-14600. In this publication, a 150 μm thick sheet is obtained by coating and drying a PET film. However, since the substrate of this publication has a sheet thickness as large as 150 μm, and furthermore, there is no description about a method of forming electrodes,
Considering that it is manufactured by an ordinary method, it is difficult to further reduce the thickness.

In particular, in recent years, with the rapid development and spread of portable devices, thinning of substrates is extremely important in realizing small and thin devices.

[0010]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a laminated substrate and an electronic component which can be made thinner than a conventional substrate and which does not cause a problem in strength during handling. .

[0011]

The above object is achieved by the following constitution of the present invention. (1) A conductor layer is adhered to a transfer film, and the conductor layer is patterned into a predetermined pattern by etching. Then, the transfer film having the patterned conductor layer is opposed to the prepreg on the conductor layer side. Then, the transfer film is heated and pressed on the prepreg, and then the transfer film is peeled off to obtain a prepreg having a conductor layer. (2) The method for producing a laminated substrate according to the above (1), wherein the thermocompression bonding is performed under the conditions of a temperature of 140 to 160 ° C, a pressure of 4.9 to 39 MPa, and a processing time of 120 to 180 minutes. (3) The method for producing a laminated substrate according to the above (1) or (2), wherein the transfer film is subjected to a heat treatment at 100 to 130 ° C. for 5 to 20 minutes before placing the prepreg. (4) The method according to any one of (1) to (3), wherein at least one of the dielectric powder and the magnetic powder is dispersed in the resin to obtain a prepreg having a thickness of 2 to 40 μm. (5) Further, another prepreg is arranged on the pattern forming surface of the prepreg, and the other prepreg is heated and pressed to obtain a laminated substrate having an internal conductor pattern. Manufacturing method of such a laminated substrate. (6) The method according to any one of (1) to (5), wherein the surface roughness Rz of the conductor layer is 1 to 6 μm. (7) The conductor layer is made of Cu, Al, Ag and Au.
The method for producing a laminated substrate according to any one of the above (1) to (5), comprising one or more elements selected from the group consisting of: (8) The method according to any one of (1) to (5), wherein the conductor layer is manufactured by an electrolytic method or a rolling method. (9) The method according to any one of the above (1) to (5), wherein the thickness of the conductor layer is 3 to 32 μm. (10) The dielectric powder includes titanium-barium-neodymium ceramics, titanium-barium-tin ceramics, lead-calcium ceramics, titanium dioxide ceramics, barium titanate ceramics, lead titanate ceramics, titanic acid. Strontium ceramics, calcium titanate ceramics, bismuth titanate ceramics, magnesium titanate ceramics, CaWO ₄ ceramics, Ba (M
g, Nb) O ₃ ceramics, Ba (Mg, Ta) O
(4) to (4) to (4) to (3), which are formed of any one or more of a ₃ series ceramic, a Ba (Co, Mg, Nb) O ₃ series ceramic, and a Ba (Co, Mg, Ta) O ₃ series ceramic. 9) The method for manufacturing a laminated substrate according to any one of the items 9). (11) The dielectric powder is any one of silica, alumina, zirconia, potassium titanate whiskers, calcium titanate whiskers, barium titanate whiskers, zinc oxide whiskers, glass chops, glass beads, carbon fibers, and magnesium oxide. The method for producing a laminated substrate according to any one of the above (4) to (9), wherein the laminated substrate is formed of a kind or two or more kinds. (12) The laminated substrate according to any one of (4) to (11), wherein the dielectric powder contains 10% by volume or more and less than 65% by volume when the total amount of the resin and the dielectric powder is 100% by volume. Manufacturing method. (13) The magnetic powder is a Mn-Mg-Zn based, Ni
Any one of -Zn-based and Mn-Zn-based ferrites
(4) to above, which are formed by species or two or more species
(12) The method for manufacturing a laminated substrate according to any of (12). (14) The magnetic powder is one or two of carbonyl iron, an iron-silicon alloy, an iron-aluminum-silicon alloy, an iron-nickel alloy, and an amorphous ferromagnetic metal.
The method for manufacturing a laminated substrate according to any one of the above (4) to (12), which is formed by at least one kind. (15) The above-mentioned (4) to (4), wherein the dielectric powder or the magnetic powder has a spherical shape having a circular projection of 0.9 to 1.0 and an average particle diameter of 0.1 to 40 μm. (14) The method for manufacturing a laminated substrate according to any of (14). (16) An electronic component element is formed by patterning at least the conductive layer of the laminated substrate of (4) to (15), and a through hole serving as a terminal of the electronic component element is formed. A method for manufacturing an electronic component, wherein the electronic component is obtained by cutting at the through hole.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION
A conductor layer is adhered to the transfer film, the conductor layer is patterned into a predetermined pattern, and then a transfer film having a patterned conductor layer is arranged such that the conductor layer side faces the prepreg, Next, after the transfer film is heated and pressed in the prepreg direction, the transfer film is peeled off to obtain a prepreg having a conductor layer.

Before the transfer, the transfer film may be heat-treated in advance at 100 to 130 ° C. for 5 to 20 minutes to foam the adhesive of the transfer film before the transfer.

According to such a manufacturing method, a constituent layer having a thickness of 40 μm or less is obtained without including a reinforcing member such as a glass cloth, and a thin laminated substrate can be provided.

By using the constituent layers thus obtained, (1) a small-sized, high-performance, well-processable, light-weight, flexible electronic component or multilayer circuit board can be obtained. (2) Even if the materials having different characteristics are multilayered, a high-performance electronic component can be obtained because of high flexibility, which is unlikely to cause problems such as cracks, peeling, and warping. (3) Since there are no processes such as firing and thick film printing, it is easy to manufacture, and a line design that does not easily cause problems can be made. (4) Since it is glass-less, the reliability is high, the degree of filling of dielectric powder and magnetic powder can be increased, and a high dielectric constant and a high magnetic permeability can be achieved. (5) Since the pattern is formed by etching, the pattern accuracy is extremely high. (6) Since no glass cloth is contained, there is little variation in characteristics between lots. (7) Further, by laminating a layer containing a glass cloth, the strength can be easily increased. (8) Since the substrate itself has not been subjected to the etching step, no etchant component remains, and the reliability of the product is improved. And the like.

More specifically, the laminated substrate of the present invention can be manufactured by a method as shown in FIGS.

First, as shown in step A of FIG. 1, a copper (Cu) foil 102 as a conductor layer having a predetermined thickness is laminated and adhered to a transfer film 103 having a predetermined thickness. In addition, pasting a sheet that protects the adhesive surface of the transfer film,
This may be removed when bonding the Cu foil. The adhesive strength of the transfer film at this time is preferably 7N / 20.
mm or less, especially 3.7 to 7.0 N / 20 mm. When the adhesive strength is 3.7 N / 20 mm or less, the conductor layer is peeled off in the etching step or the like, and the etching solution easily enters between the layers. On the other hand, when the adhesive strength is larger than the above range, the transfer film becomes difficult to peel off from the prepreg.

Next, as shown in step B, the copper foil 102 is patterned into a desired pattern shape. Next, process C
As shown in FIG. 2, a transfer film 103 having a pair of patterned copper foils 102 is vertically arranged with a prepreg 101 interposed therebetween. Note that either one of the transfer films 103 may be used. At this time, as a preheating step, the transfer film 103 was previously heated at a temperature of
Especially 110 to 120 ° C, time: 5 to 20 minutes, especially 10 to
The adhesive layer may be foamed (softened) by heat treatment for 15 minutes. This preheating step is effective when the area occupied by the pattern formed on the transfer film is 80% or less, particularly 70% or less. Therefore, the occupied pattern area is 80%
If it is too high, a preheating step is not required. When the area occupied by the pattern on the transfer film exceeds 80%, the contact between the prepreg surface and the transfer film surface is reduced, and the transfer film is easily peeled off and the transfer is facilitated.

Then, as shown in step D, the upper and lower transfer films 103 are heat-pressed (laminated) in the direction of the prepreg 101. At this time, in a preferred embodiment, the prepreg is softened by heating, and the adhesion to the copper foil pattern 102 is significantly improved. For this reason, the copper foil is easily peeled from the transfer film. The heating and pressurizing conditions at this time are as follows: temperature: 130 to 170 ° C., particularly 140 to 16 ° C.
0 ° C., pressure: 4.9 to 30 MPa, especially 9.8 to 20 MP
a, The processing time is about 120 to 180 minutes. If the treatment temperature is too high, the curing of the prepreg proceeds too much, and the flow of the resin becomes poor when the prepreg itself is multi-layered, and the adhesiveness is reduced. Further, if the processing temperature is too low, it becomes difficult to transfer the pattern. If the pressure is too high, the transfer film sticks to the prepreg and cannot be peeled off. If the pressure is too low, the resin will flow between the pattern and the film, and problems will occur in the subsequent steps, such as plating not attaching, roughening treatment and etching not being possible.

Next, as shown in step E of FIG. 2, when the transfer film 103 is peeled off, a prepreg 101 with double-sided copper foil 102 is obtained. Further, as shown in a step F, another prepreg 101a is arranged above and below the prepreg 101 as necessary, and is heat-pressed (laminated) in the direction of the prepreg 101 as shown in a step G, whereby the internal conductor pattern 102 is formed. Is obtained. In the case where the pattern is transferred only to one surface, the other prepreg 101a may be arranged only on one pattern surface.

Further, a plurality of constituent layers, specifically, two or more prepregs with double-sided copper foil and three or more prepregs are alternately arranged, and these are heated and pressurized at once.
A laminate press may be performed. As described above, by performing the laminating press at one time, the number of times of pressing can be reduced, and deterioration of the resin due to repeated heating can be prevented. The heating and pressurizing conditions at this time are as follows: temperature: 180 to 210 ° C, particularly 190 to 20 ° C.
0 ° C., pressure: 1 to 2 MPa, particularly 1.3 to 1.5 MPa, and treatment time is about 60 to 120 minutes.

In the present invention, in order to obtain a prepreg as a basis for a laminated substrate, a dielectric powder, a magnetic powder and a resin, if necessary, a flame retardant having a predetermined compounding ratio, and if necessary, a flame retardant, are kneaded with a solvent to form a slurry. The process is followed by applying the dried paste and drying (B-stage). The solvent used in this case is preferably a volatile solvent, particularly preferably a polar neutral solvent,
It is used for the purpose of adjusting the viscosity of the paste to facilitate coating. The kneading may be performed by a known method using a ball mill, stirring, or the like. The prepreg is obtained by applying the paste on the base material.

The drying (B-stage) of the prepreg may be appropriately adjusted depending on the contents of the dielectric powder, the magnetic powder, the flame retardant and the like. The thickness after drying and B-stage formation is preferably 40 μm or less, and may be adjusted to an optimum film thickness in accordance with its use and required characteristics (pattern width and precision, DC resistance) and the like.

The substrate to be a constituent layer of the laminated substrate and the prepreg can also be obtained by a coating method or by kneading materials to form a solid kneaded material.

The kneading may be performed by a known method such as a ball mill, stirring, and a kneader. At that time, a solvent may be used if necessary. Further, it may be pelletized or powdered as necessary.

The thickness of the prepreg obtained in this case is 40 μm or less. The thickness of the prepreg may be appropriately adjusted according to the desired thickness of the laminated substrate, the number of layers, and the content of the dielectric powder and the magnetic powder.

Among the constituent layers used for the laminated substrate, the constituent layers obtained by the above method have a constituent layer in which at least one of a dielectric powder and a magnetic powder is dispersed in a resin and does not contain glass cloth. And the thickness of this constituent layer is 2 to
Those having a thickness of 40 μm are preferred.

The thickness of the constituent layer is 2 to 40 μm, preferably 5 to 35 μm, more preferably 10 to 30 μm.
As the thickness of the constituent layers increases, the thickness of the laminated substrate itself increases, and it becomes difficult to obtain small and thin electronic components. Further, when a capacitor is formed, it becomes difficult to obtain a desired capacity. If the thickness is too thin, the strength is reduced, and it becomes difficult to maintain the shape.

The transfer film used for the transfer of the conductor layer is not particularly limited, and has a strength and a chemical stability that can withstand the etching step. Any material having releasability may be used.
Specifically, a structure having an adhesive layer on a support such as a resin film is preferable.

The support may be, for example, polytetrafluoroethylene, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, tetrafluoroethylene-ethylene copolymer, polychlorotrifluoroethylene, polyvinylidene fluoride, Plastic film made of fluororesin such as polyvinyl fluoride, polyethylene film, polypropylene film, polystyrene film, polyvinyl chloride film, polyester film, polycarbonate film, polyimide film, polysulfone film, polyethersulfone film, polyamide film, polyamideimide film , Polyetherketone film, polyphenylene sulfide fill Include known plastic films such as.

Among them, polyethylene terephthalate (PET) film, biaxially oriented polypropylene (OP)
P) films, methylpentene copolymer (PTX) films, fluororesin films and the like are preferred. Note that the fluororesin film is preferably a film made of ethylene fluoride (1F), ethylene trifluoride (3F), and ethylene tetrafluoride (4F).

These plastic films have a thickness of about 10 μm to 200 μm, especially about 15 μm to 150 μm.
m is preferable.

It is desirable that the adhesive layer has a characteristic that its adhesive strength is reduced particularly by heating. As such an adhesive layer, a foaming agent is compounded in a base polymer serving as a base material, and the foaming agent foams by heating.
One having the property of reducing or eliminating the adhesive force is given. The base polymer is specifically composed of a highly elastic polymer, and particularly has a dynamic elastic modulus of 5 at normal temperature to 150 ° C.
100,000 to 10,000,000 μN / cm ² , preferably 500,000 to 80
Those in the range of 100,000 μN / cm ² are preferred. When the dynamic elastic modulus is less than 500,000 μN / cm ² , the adhesive strength at room temperature is large and the re-adhesiveness is poor, and the adhesive strength by heat treatment is poor, and the adhesive strength may increase. on the other hand,
If the dynamic elastic modulus exceeds 10 million μN / cm ² , the adhesive strength at room temperature is poor, and the expansion or foaming of the foaming agent is suppressed during the heat treatment, and the adhesive strength does not decrease satisfactorily.

Further, the high elasticity polymer can be used at room temperature to 150
It is preferable that the change rate of the dynamic elastic modulus at a temperature of ° C is small. The degree of the change is preferably within 5 times, particularly preferably within 3 times. There is no particular limitation on the monomer components forming the high elasticity polymer. Any of the monomer components used in the preparation of known pressure-sensitive adhesives such as an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and a styrene / conjugated diene block copolymer-based pressure-sensitive adhesive can be used.

Specific examples thereof include methyl, ethyl, propyl, butyl, 2-ethylhexyl, isooctyl, isononyl, isodecyl, dodecyl, lauryl, tridecyl, pentadecyl, hexadecyl, Acrylic acid-based alkyl esters such as acrylic acid or methacrylic acid having an alkyl group having 20 or less carbon atoms, such as heptadecyl group, octadecyl group, nonadecyl group, and eicosyl group; Ethyl, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, N-methylolacrylamide, acrylonitrile, methacrylonitrile, glycidyl acrylate, glycidyl methacrylate, vinyl acetate, vinyl acetate Ren, isoprene, butadiene,
Isobutylene, vinyl ether and the like. In addition, natural rubber, recycled rubber, or the like that satisfies the conditions for the above-described high elasticity polymer can also be used as the base polymer.

As the foaming agent, various inorganic or organic foaming agents can be used, and the amount of the foaming agent may be appropriately determined according to the degree of reducing the adhesive strength. Generally, it is blended in an amount of 1 to 100 parts by weight, preferably 5 to 50 parts by weight, especially 10 to 40 parts by weight per 100 parts by weight of the base polymer.

Representative examples of the inorganic foaming agent include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, azides and the like.

Representative examples of organic foaming agents include water, chloroalkanes such as trichloromonofluoromethane and dichloromonofluoromethane, azobisisobutyronitrile, azodicarbonamide, and azo such as barium azodicarboxylate. Compounds, hydrazine compounds such as paratoluenesulfonylhydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis (benzenesulfonylhydrazide), allylbis (sulfonylhydrazide), p-toluylenesulfonyl semicarbazide, Semicarbazide compounds such as 4,4'-oxybis (benzenesulfonylsemicarbazide);
-Triazole compounds such as morpholyl-1,2,3,4-thiatriazole, N, N'-dinitrosopentamethylenetetramine and N, N'-dimethyl-N, N'-
And N-nitroso compounds such as dinitrosoterephthalamide. The heat-expandable microparticles in which a foaming agent is microencapsulated are preferably used because the mixing operation is easy. The thermally expandable particles include commercially available products such as microspheres (trade name, manufactured by Matsumoto Yushi Co., Ltd.). In the present invention, a foaming aid may be added as necessary. The details of the adhesive layer used in the present invention are described in Japanese Patent Application Nos. 3-22861 and 5-226527 as a heat-peelable pressure-sensitive adhesive.

The thickness of the adhesive layer is not particularly limited, but is preferably 100 μm or less, more preferably 40 μm or less. The lower limit is 2
It is about 0 μm. If the adhesive layer is too thick, the unevenness of the foamed surface is large, and the pattern is distorted. For this reason, wrinkles are formed at the time of transfer, and a regular pattern cannot be obtained.

The resin used for the constituent layers of the laminated substrate of the present invention is not particularly limited, and the moldability, workability,
It can be appropriately selected from resin materials having excellent adhesiveness and electrical characteristics at the time of lamination. Specifically, a thermosetting resin, a thermoplastic resin, or the like is preferable.

As the thermosetting resin, epoxy resin, phenol resin, unsaturated polyester resin, vinyl ester resin, polyimide resin, polyphenylene ether (oxide) resin, bismaleimide triazine (cyanate ester) resin, fumarate resin, polybutadiene resin, Polyvinyl benzyl ether resin and the like.
Examples of the thermoplastic resin include an aromatic polyester resin, a polyphenylene sulfide resin, a polyethylene terephthalate resin, a polybutylene terephthalate resin, a polyethylene sulfide resin, a polyether ether ketone resin, a polytetrafluoroethylene resin, and a graft resin. Among them, phenol resin, epoxy resin, low dielectric constant epoxy resin, polybutadiene resin, BT resin, polyvinyl benzyl ether resin and the like are particularly preferable as the base resin.

These resins may be used alone,
You may mix and use 2 or more types. When two or more kinds are used in combination, the mixing ratio is arbitrary.

The dielectric powder used in the present invention is preferably a ceramic powder, and may be any ceramic powder having a higher relative dielectric constant and Q than the resin serving as the dispersion medium in a high frequency band. Good.

In particular, the ceramic powder used in the present invention has a relative dielectric constant of 10 to 2000 at a measurement frequency of 1 to 2 GHz.
It is preferable to use those having 0 and a dielectric loss tangent of 0.05 or less.

In order to obtain a relatively high dielectric constant, it is particularly preferable to use the following materials. Titanium-barium-
Neodymium ceramics, titanium-barium-tin ceramics, lead-calcium ceramics, titanium dioxide ceramics, barium titanate ceramics, lead titanate ceramics, strontium titanate ceramics, calcium titanate ceramics, bismuth titanate Ceramics, magnesium titanate ceramics, CaWO ₄ ceramics, B
a (Mg, Nb) O ₃ ceramics, Ba (Mg, T
a) O ₃ ceramics, Ba (Co, Mg, Nb) O
₃ type ceramics, Ba (Co, Mg, Ta) O ₃ type ceramics. In addition, titanium dioxide ceramics
In addition to those containing only titanium dioxide, those containing other small amounts of additives include those in which the crystal structure of titanium dioxide is maintained. The same applies to other ceramics. In particular, the titanium dioxide ceramic preferably has a rutile structure.

In order to obtain a high Q without increasing the dielectric constant too much, it is preferable to use the following materials.

Silica, alumina, zirconia, potassium titanate whiskers, calcium titanate whiskers, barium titanate whiskers, zinc oxide whiskers, glass chops, glass beads, carbon fibers, magnesium oxide (talc).

These may be used alone or as a mixture of two or more. When two or more kinds are used in combination, the mixing ratio is arbitrary.

Specifically, the following materials are preferable when a relatively high dielectric constant is not required.

Mg_TwoSiO_Four[Ε = 7, Q = 20,000:
Measurement frequency 1 GHz or less the same], Al _TwoO_Three[Ε = 9.8,
Q = 40000], MgTiO_Three[Ε = 17, Q = 22
000], ZnTiO_Three[Ε = 26, Q = 800], Z
n_TwoTiO_Four[Ε = 15, Q = 700], TiO_Two[Ε =
104, Q = 15000], CaTiO_Three[Ε = 17
0, Q = 1800], SrTiO_Three[Ε = 255, Q =
700], SrZrO_Three[Ε = 30, Q = 1200],
BaTiO_Three[Ε = 1500-20,000], BaTi_Two
O_Five[Ε = 42, Q = 5700], BaTi_FourO₉[Ε =
38, Q = 9000], Ba_TwoTi₉O₂₀[Ε = 39, Q
= 9000], Ba_Two(Ti, Sn)₉O₂₀[Ε = 37,
Q = 5000], ZrTiO_Four[Ε = 39, Q = 700
0], (Zr, Sn) TiO_Four[Ε = 38, Q = 700
0], BaNd_TwoTi_FiveO₁₄[Ε = 83, Q = 210
0], BaSm_TwoTi_FiveO₁₄[Ε = 74, Q = 240
0], Bi_TwoO_Three-BaO-Nd_TwoO_Three-TiO_TwoThe system [ε =
88, Q = 2000], PbO-BaO-Nd_TwoO_Three-T
iO_TwoThe system [ε = 90, Q = 5200], (Bi_TwoO_Three, P
bO) -BaO-Nd_TwoO_Three-TiO_TwoThe system [ε = 105,
Q = 2500], La_TwoTi_TwoO₇[Ε = 44, Q = 40
00], Nd_TwoTi_TwoO₇[Ε = 37, Q = 1100],
(Li, Sm) TiO_Three[Ε = 81, Q = 2050],
Ba (Mg_1/3Ta_2/3) O_Three[Ε = 25, Q = 3500
0], Ba (Zn_1/3Ta_2/3) O_Three[Ε = 30, Q = 1
4000], Ba (Zn_1/3Nb_2/3) O_Three[Ε = 41,
Q = 9200], Ba (Mg_1/2W_1/2) O_Three[Ε = 2
0, Q = 1300,000], Ba (Mg_1/3Cr_2/3) O_Three
[Ε = 18, Q = 115000], Ba (Mg_1/3Nb
_2/3) O_Three[Ε = 32, Q = 115000], (Sr_0.6
Ba_0.4) (Ga_1/2Ta_1/2) O_Three[Ε = 29, Q = 11
5000], Ca (Ga_1/2Ta_1/2) O_Three[Ε = 31,
Q = 99400], Sr (Zn_1/3Nb_2/3) O_Three[Ε =
40, Q = 4000], BaWO_Four[Ε = 8, Q = 22
50], MgSiO_Three[Ε = 6, Q = 2500], 3 (A
l_TwoO_Three) (SiO_Two) [Ε = 7.8, Q = 250], Ba
(ZrTi) O_Three[Ε = 38, Q = 48800], Ba
ZrO_Three[Ε = 40, Q = 1400], (SrCa)
(TiSn) O_Three[Ε = 40, Q = 72000], Sn
O_Two-TiO_Two[Ε = 43, Q = 31500], Sm (T
iSn) NbO₆[Ε = 46, Q = 31300], Nd
(TiZr) NbO₆[Ε = 50, Q = 27600],
Nd (TiSn) NbO₆[Ε = 50, Q = 2760
0], Sr_TwoNb_TwoO₇[Ε = 52, Q = 700], (B
aSr)_FiveNb_FourO₁₅[Ε = 50, Q = 3500], Ba
_Two(TiMnNi)₉O₂₀[Ε = 50, Q = 3760
0], (SrCa) TiO_Three-La (ZnMgTi) O_Three
[Ε = 60, Q = 25100], MgTiO_Three-CaT
iO_Three[Ε = 21, Q = 45000], Ca (FeNb
Ti) O_Three[Ε = 69, Q = 4000], Ba (SmL
a)_TwoTi_FiveO₁₄[Ε = 75, Q = 9500], Ba (S
mLaCe)_TwoTi_FiveO₁₄[Ε = 76, Q = 9500],
(BaSr) Sm_TwoTi_FiveO₁₄[Ε = 80, Q = 1110
0], BaNd_Two(TiMn)_FiveO₁₄[Ε = 77, Q = 1
0200], Ba (SmNd)_TwoTi_FiveO₁₄[Ε = 77,
Q = 9000], Ba (NdSmLaBi)_TwoTi_FiveO₁₄
[Ε = 90, Q = 7500], Ba (NdBi)_Two(T
iAl)_FiveO₁₄[Ε = 92, Q = 5600], Ba (N
dBi)_TwoTi_FiveO₁₄[Ε = 93, Q = 5000], (B
aPb) Nd_TwoTi_FiveO₁₄[Ε = 93, Q = 5300],
(BaPb) (NdSmBi)_TwoTi_FiveO₁₄[Ε = 15
3, Q = 800], Ba (NdSmBi)_TwoTi_FiveO
₁₄[Ε = 147, Q = 1100], Ba (NdGd)_Two
(TiAl)_FiveO₁₄[Ε = 82, Q = 5400], (B
aPb) (NdSmBiMg)_TwoTi_FiveO₁₄[Ε = 10
7, Q = 2900], (BaPb) (NdBi)_TwoTi_Five
O₁₄[Ε = 110, Q = 2500], Ba (NdGdB
i)_TwoTi_FiveO₁₄[Ε = 115, Q = 2900], Ba
(LaSmBi)_Two(TiZr)_FiveO₁₄[Ε = 117, Q
= 3100], Ba (NdGdBi)_TwoTi_FiveO₁₄[Ε =
140, Q = 1000], (BaPb) (NdCeL
a)_TwoTi_FiveO₁₄[Ε = 98, Q = 5400], CaSm
_TwoTi_FiveO₁₄[Ε = 141, Q = 3200], CaNd_Two
Ti_FiveO₁₄[Ε = 143, Q = 3200], CaY_TwoTi
_FiveO₁₄[Ε = 137, Q = 3200], CaGd_TwoTi_Five
O₁₄[Ε = 138, Q = 3200], CaEu_TwoTi_FiveO
₁₄[Ε = 139, Q = 3200], CaPr_TwoTi_FiveO₁₄
[Ε = 140, Q = 3200], (BaSrPb) (M
gTa) O_Three[Ε = 125, Q = 2000], Pb (Z
rCe) O_Three[Ε = 140, Q = 2600], Sr (Z
nNb) O_Three[Ε = 40, Q = 36800], Ca (F
eNb) O_Three[Ε = 40, Q = 20,000], Ba (Z
nNb) O_Three[Ε = 41, Q = 86900], Ba (N
dNb) O_Three[Ε = 42, Q = 15600], Ca (N
iNbTi) O_Three[Ε = 55, Q = 12000], Ca
(CaNbTi) O_Three[Ε = 55, Q = 35000],
(PbCa) ZrO_Three[Ε = 118, Q = 3200],
(PbCa) HfO_Three[Ε = 100, Q = 4700],
(PbCa) (MgZr) O_Three[Ε = 143, Q = 15
00], (PbCa) (MgNb) O_Three[Ε = 86, Q
= 4100], (PbCa) (ZrTiSn) O_Three[Ε
= 137, Q = 1700], (PbCa) (FeNbT
i) O_Three[Ε = 132, Q = 2800], (PbCa)
(FeNbW) O_Three[Ε = 96, Q = 3800], (P
bCa) (CrNb) O_Three[Ε = 48, Q = 360
0], (PbCa) (NiNb) O_Three[Ε = 73, Q =
5100], (PbCa) (CoNb) O_Three[Ε = 7
5, Q = 1400], (PbCa) (FeNb) O
_Three[Ε = 104, Q = 3900], (PbCa) (Zr
Sn) O_Three[Ε = 146, Q = 1400], (PbC
a) (MgNiNb) O_Three[Ε = 116, Q = 180
0], (PbCa) (FeTaNb) O_Three[Ε = 11
8, Q = 1500], (PbCa) (FeNbZr) O
_Three[Ε = 144, Q = 1600], (PbCa) (Ni
NbZr) O_Three[Ε = 147, Q = 500], (PbC
a) (MgNbZr) O_Three[Ε = 151, Q = 100
0], (PbCa) (FeNbW) O_Three[Ε = 152,
Q = 1300], (PbSr) (ZnNb) O_Three[Ε =
141, Q = 1000], (PbSrCa) (FeTa
Nb) O_Three[Ε = 115, Q = 3100], (BaSr
CaPb) (ZnTaNb) O_Three[Ε = 85, Q = 80
00], (BaSrPb) (MgTaNb) O_Three[Ε =
90, Q = 6000], (NdSr) TiO_Three[Ε = 2
20, Q = 6000], (SrCa) TiO_Three[Ε = 2
66, Q = 1100], SrSnO_Three[Ε = 129, Q
= 1200], (SrCa)_ThreeTi _TwoO_Three[Ε = 77, Q
= 10200], (BaCa) TiO_Three, Ba (TiS
n) O_Three[Ε = 1500-10000], (PbSr)
TiO_Three[Ε = 300-400], Pb (ZnNb) O_Three
-Pb (FeW) O_Three[Ε = 24000], Pb-based composite
Perovskite [ε = tens of thousands] and the like.

More preferably, the following composition is a main component.
Things. TiO_Two, CaTiO_Three, SrTiO_Three,
Ba (Mg_1/3Ta_2/3) O_Three, Ba (Zn_1/3Ta_2/3)
O_Three, Sr (Zn_1/3Nb_2/3) O_Three, Al_TwoO_Three, MgTi
O_Three, Nd_TwoTi_TwoO₇, MgTiO_Three-CaTiO_Three, Ba
Sm_TwoTi_FiveO₁₄, BaNd_TwoTi _FiveO₁₄, BaO-Nd_Two
O_Three-TiO_TwoSystem, Bi_TwoO_Three-BaO-Nd_TwoO_Three-TiO
_TwoSystem, BaTiO_Three, BaTi_TwoO_Five, BaTi_FourO₉, Ba
_TwoTi₉O₂₀, (BaCa) TiO_Three, (BaSr) Ti
O_Three, Ba (TiSn) O_Three, Ba (TiZr) O_Three, B
a_Two(Ti, Sn)₉O₂₀System, MgO-TiO_TwoSystem, Zn
O-TiO_TwoSystem, MgO-SiO_TwoSystem, Al_TwoO_Three etc.

On the other hand, when a relatively high dielectric constant is required, the following materials are preferable.

BaTiO ₃ [ε = 1500: measurement frequency 1 GHz or less the same], (Ba, Pb) TiO ₃ [ε = 6
000], Ba (Ti, Zr) O ₃ system [ε = 9000]
(Ba, Sr) TiO ₃ [ε = 7000].

More preferably, it is selected from dielectric powders having the following compositions as main components. BaTiO ₃ , Ba
(Ti, Zr) O ₃ system.

The ceramic powder may be a single crystal or polycrystal powder.

The content of the ceramic powder is 10% by volume or more and less than 65% by volume, preferably 20% by volume or more and 60% by volume, when the total amount of the resin and the ceramics powder is 100% by volume. It is in the range of not more than% by volume.

If the content of the ceramic powder is 65% by volume or more, a dense composition cannot be obtained. In addition, Q may be greatly reduced as compared with the case where no ceramics powder is added. On the other hand, when the content of the ceramic powder is less than 10% by volume, the effect of containing the ceramic powder is not so much seen.

The laminated substrate of the present invention can have a dielectric constant higher than that obtained from a resin alone by appropriately setting each component within the above range, and can provide a relative dielectric constant and a high Q as required. It is possible to obtain.

The dielectric powder may be in a circular or elliptical shape or an irregular type such as crushed powder. The average particle diameter of a spherical projection having a circular shape is 0.1 to 40 μm, particularly 0.5 to 40 μm.
It is preferably 20 μm, and the sphericity is preferably 0.9 to 1.0, particularly preferably 0.95 to 1.0.

If the average particle size is smaller than 0.1 μm, the surface area of the particles increases, the viscosity during dispersion and mixing and the thixotropy increase, and it becomes difficult to increase the filling rate, and it becomes difficult to knead with the resin. Come. Conversely, if it is larger than 40 μm,
Mixing becomes difficult, sedimentation becomes severe and the mixture becomes non-uniform, and it becomes difficult to obtain a dense molded body when molding a composition having a large powder content.

When the sphericity is smaller than 0.9,
For example, when molding a molded body such as a dust core, it becomes difficult to uniformly disperse the powder, and it becomes difficult to obtain desired characteristics such as causing variations in dielectric characteristics. Will increase. The sphericity may be obtained by arbitrarily measuring a plurality of samples, and the average value may be the above value.

When crushed powder is used, the particle size is 0.01 to 4
It is preferably 0 μm, particularly preferably 0.01 to 35 μm, and the average particle size is preferably 1 to 30 μm. With such a particle size, the dispersibility of the crushed powder is improved. On the other hand, when the particle size of the crushed powder is smaller than this, the specific surface area increases, and it becomes difficult to increase the filling rate. On the other hand, if it is larger than this, it tends to settle when it is made into a paste, making it difficult to uniformly disperse it. Also, when it is attempted to form a thin substrate or prepreg, it becomes difficult to obtain a smooth surface. It is practically difficult to make the particle size too small.
The limit is about μm.

Means for making these into powder are pulverization,
A known method such as granulation may be used.

Further, crushed powder may be contained in addition to the circular dielectric powder. By containing the crushed dielectric powder, the filling rate can be further improved.

The laminated substrate of the present invention can be prepared separately from the dielectric powder.
Alternatively, one or more magnetic powders may be contained in addition to the dielectric powder.

As the ferrite which is a magnetic powder material,
Mn-Mg-Zn type, Ni-Zn type, Mn-Zn type, etc.
N-based, Ni-Zn-based and the like are preferable.

As the ferromagnetic metal which is a magnetic powder material,
Carbonyl iron, iron-silicon based alloy, iron-aluminum-silicon based alloy (trade name: Sendust), iron-nickel based alloy (trade name: Permalloy), amorphous type (iron type, cobalt type) and the like are preferable.

Means for making these into powder are pulverization,
A known method such as granulation may be used.

The particle size and shape of the magnetic powder are the same as those of the above-mentioned dielectric powder, and a material having a smooth surface is preferable like the dielectric powder, but crushed powder may be used. The effect of using the crushed powder is the same as above.

Further, two or more magnetic powders having different types and different particle size distributions may be used. The mixing ratio at this time is arbitrary, and the material used, the particle size distribution, and the mixing ratio may be adjusted depending on the application.

The magnetic permeability μ of the magnetic powder at a measurement frequency of 1 to 2 GHz is preferably 10 to 1,000,000. In addition, it is preferable that the bulk insulating property is high because the insulating property when the substrate is formed is improved.

The mixing ratio of the resin and the magnetic substance powder is preferably such that the magnetic permeability at the measurement frequency of 1 to 2 GHz of the entire constituent layer to be formed is 3 to 20.
In particular, when the ratio of the resin to the magnetic powder is indicated in the paste step of molding, the content of the magnetic powder is preferably 10 to 65% by volume, particularly preferably 20 to 60% by volume. By setting the content of the magnetic powder as described above, the magnetic permeability of the entire constituent layer becomes 3 to 20, and desired electric characteristics are easily obtained. On the other hand, when the content of the magnetic substance powder is large, it is difficult to make a slurry and apply the slurry, and it is difficult to manufacture a laminated substrate. On the other hand, if the content of the magnetic substance powder is small, it may not be possible to secure the magnetic permeability, and it may be difficult to impart magnetic properties.

As the flame retardant used in the present invention, various flame retardants usually used for making a substrate flame-retardant can be used. Specifically, halides such as halogenated phosphates and brominated epoxy resins,
Organic compounds such as phosphoric acid ester amides and inorganic materials such as antimony trioxide and aluminum hydride can be used.

As the metal foil to be used, a suitable metal may be used from metals having good conductivity such as one or more of gold, silver, copper and aluminum. Of these, copper is particularly preferred.

Various known methods such as electrolysis and rolling can be used as a method for producing a metal foil. An electrolytic foil is used when foil peel strength is desired, and an electrolytic foil is used when high frequency characteristics are emphasized. It is preferable to use a rolled foil which is less affected by the skin effect due to surface irregularities. The surface roughness of the metal foil is preferably in the range of Rz = 1 to 6 μm. In particular, Rz of the electrolytic foil is 2.5 to 6.0 μm, and Rz of the rolled foil is 1.0 to
A range of 3.0 μm is preferred.

The thickness of the metal foil is 3.0 to 32 μm
Preferably, the thickness is 3.0 to 18 μm in consideration of thickness reduction.

The laminated substrate of the present invention may have a constituent layer containing a reinforcing fiber such as glass cloth in addition to the above-mentioned glass cloth-less constituent layer. By having the constituent layer containing the reinforcing fiber, the strength of the whole laminated substrate can be improved.

The reinforcing fibers such as glass cloth used for such a glass cloth-containing constituent layer may be of various types depending on the purpose and application, and commercially available products can be used as they are. At this time, the reinforcing fiber is made of E glass cloth (ε = 7, tan δ = 0.003,
1 GHz), D glass cloth (ε = 4, tanδ = 0.00)
13, 1 GHz), H glass cloth (ε = 11, tanδ)
= 0.003, 1 GHz) or the like. Further, a coupling treatment or the like may be performed to improve interlayer adhesion. Its thickness is less than 100 μm, especially 20 to 6
It is preferably 0 μm. The cloth weight is 120
g / m ² or less, particularly preferably ²⁰ to 70 g / m ² .

The mixing ratio between the resin and the glass cloth is as follows:
The weight ratio of resin / glass cloth is preferably 4/1 to 1/1. With such a mixing ratio, the effect of the present invention is improved. On the other hand, when this ratio is reduced and the amount of resin is reduced, the adhesion to the copper foil is reduced, and a problem occurs in the smoothness of the substrate. Conversely, when this ratio increases and the amount of resin increases, it becomes difficult to select a usable glass cloth, and it becomes difficult to secure strength with a thin wall.

In the present invention, a laminated substrate using two or more different constituent layers may constitute a laminated substrate. Further, each constituent layer may contain two or more different dispersing materials. As described above, two or more kinds of different constituent layers are combined, or two or more kinds of different powders, or a mixture of the same kind with powder having different composition, electric (dielectric constant, etc.) and magnetic properties and resin is mixed. By doing so, the dielectric constant and the magnetic permeability can be easily adjusted, and the characteristics can be adjusted to suit various electronic components. In particular, by setting the permittivity and the magnetic permeability that have the wavelength shortening effect to optimal values, the device can be reduced in size and thickness. In addition, by combining a material having good electric characteristics in a relatively low frequency region and a material having good electric characteristics in a relatively high frequency region, good electric characteristics can be obtained in a wide frequency band. be able to.

When a laminated substrate, an electronic component or the like is formed by using such a hybrid layer, that is, a constituent layer in which a resin, a dielectric powder, and a magnetic powder are mixed, copper is used without using an adhesive or the like. Adhesion to foil and patterning can be realized,
In addition, multilayering can be realized. Such patterning and multi-layer processing can be performed in the same process as a normal substrate manufacturing process, so that cost reduction and improvement in workability can be achieved. Further, the laminated substrate made of the substrate obtained in this manner has high strength and improved high-frequency characteristics.

Further, a wavelength shortening effect can be obtained by increasing the dielectric constant. That is, the effective wavelength λ on the substrate is given by λ = λ0 / (εμ) ^1/2 . Here, λ0 is the actual wavelength, and ε and μ are the permittivity and the magnetic permeability of the electronic component or substrate. Therefore, for example, when designing an electronic component and a circuit of λ / 4, by increasing ε and μ of the members constituting the circuit, the portion requiring the length λ / 4 can be calculated by the square root of the product of ε and μ. It can be reduced by the divided value. Therefore, by increasing at least ε of the laminated substrate and the substrate material, the size of the laminated substrate and the substrate can be reduced.

Further, by combining a material capable of obtaining good electric characteristics in a relatively low frequency region and a material capable of obtaining good electric characteristics in a relatively high frequency region, a wide frequency band, specifically, Is a good HPF in a wide frequency band of 1 to 2000 MHz, especially 50 to 1000 MHz.
And other electrical characteristics.

Specifically, when only the wavelength shortening effect is considered, the purpose can be achieved by mixing a high dielectric constant material with a resin material. However, such high-permittivity materials are not so excellent in high-frequency characteristics, and need to be compensated for. Therefore, a high dielectric constant material such as BaTiO
_{3. By} using a magnetic material having excellent high-frequency characteristics, such as carbonyl iron, together with BaZrO ₃ or the like, desired characteristics can be obtained even in a high-frequency region.

Such electronic components requiring wavelength reduction and high frequency characteristics include a multilayer filter, a balun transformer,
Examples include a dielectric filter, a coupler, an antenna, a VCO (voltage controlled oscillator), an RF (high frequency) unit, and a resonator.

Further, when one electrical characteristic is enhanced by using a certain material, the insufficient electrical characteristic can be compensated by another material.

In order to obtain an electronic component using the laminated substrate, for example, an electronic component element is formed by patterning at least a conductor layer of the laminated substrate, and a through hole serving as a terminal of the electronic component element is formed. An electronic component may be obtained by cutting at the via hole for each component element.

The laminated electronic component of the present invention can be used in combination with a capacitor (capacitor), a coil (inductor), a filter, and the like, or a wiring pattern, an amplifying element, and a functional element. High frequency electronic circuits such as an RF amplification stage, a VCO (voltage controlled oscillation circuit), and a power amplifier (power amplification stage), and high frequency electronic components such as a superposition module used for an optical pickup can be obtained.

[0089]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to specific experimental examples and examples of the present invention.

Example 1 First, a glass clothless sheet (prepreg) was prepared. Using polyvinylbenzyl resin as a raw material, dielectric powder: 68.45 g, resin: 3
1.55 g was mixed in a ball mill.
As a coupling agent, a silane coupling agent was mixed by an integral blend method.

The obtained slurry was formed into a glass clothless prepreg having a thickness of 40 μm by a doctor blade method.

Next, as a transfer film, a heat-peelable sheet [manufactured by Nitto Denko Corporation, trade name: River Alpha (support polyester, thickness: 100 μm, thickness of adhesive layer: 45 μm)] was used, and a copper foil having a thickness of 18 μm was used. Was pasted. At this time, the adhesive force of the heat-peelable sheet was 4.9 N / 20 mm, and the pressure at the time of sticking was 1 kg / mm ² .

Next, a predetermined pattern is formed on the copper foil surface by photolithography, immersed in an etching solution (35% solution, temperature: 20 ° C.) containing ferric chloride, and etched for about 10 to 15 minutes. Was. This etching process uses a photolithography technique,
Fine patterns of about 30 to 36 μm could be clearly patterned.

Next, two sheets of the obtained thermal transfer sheet with patterned copper foil were prepared, and placed on the upper and lower sides of the prepreg obtained above with the copper foil side inside, respectively, and subjected to a thermal laminating press. The conditions at this time were 120 ° C. and 30 minutes, and the press pressure was 1.5 MPa. After pressing, the heat release sheet was peeled off to obtain a prepreg with copper foil on both sides.

Further, heat press was performed while changing the conditions of the heat lamination, and the state (transfer result) of the obtained substrate with copper foil was evaluated. Table 1 shows the results. Sample 4-1
In (2), since the transfer film had low adhesive strength and the pattern was peeled off in the etching step, the subsequent laminating operation was not performed.

[0096]

[Table 1]

Next, using a laminated substrate, a plurality of prepregs with copper foil obtained by the same operation and a prepreg arranged between them are prepared so as to constitute a predetermined circuit. Were laminated and subjected to a heat lamination press. The conditions at this time were 200 ° C. and 60 minutes, and the press pressure was 1.5 MPa. The following electronic components were produced using the obtained laminated substrate. As a means for connecting the laminated conductors, a proper method such as a through through hole or an inner via hole may be used.

<Example 2> A laminated substrate was manufactured using the glass clothless sheet of Example 1.

As the transfer film, a heat-peelable sheet [Intelimar warm-off type of Nitta Co., Ltd. (support polyester, thickness 100 μm, adhesive layer thickness about 25 to 30)
μm)], and a copper foil having a thickness of 18 μm was attached thereto. At this time, the adhesive force of the heat release sheet is 1.5 N / 25 m
m, and the pressure at the time of application was 1 kg / mm ² .

Next, a predetermined pattern is formed on the copper foil surface by photolithography, immersed in an etching solution (35% solution, temperature: 40 ° C.) containing ferric chloride, and etched for about 10 to 15 minutes. Was. This etching process uses a photolithography technique,
Fine patterns of about 30 to 36 μm could be clearly patterned.

Next, two sheets of the obtained thermal transfer sheet with patterned copper foil were prepared, and placed on the upper and lower sides of the prepreg obtained above with the copper foil side inside, respectively, and subjected to thermal laminating press. The conditions at this time were 100 ° C., a laminator speed of 0.1 m / min, and a press pressure of 1.0 MPa. After pressing, the heat release sheet was peeled off to obtain a prepreg with copper foil on both sides.

A plurality of prepregs with a copper foil obtained by the same operation, and a plurality of prepregs arranged therebetween are prepared so as to form a predetermined circuit by preparing the prepreg having the pattern configuration so as to have a predetermined design. A prepreg was prepared, and these were laminated and subjected to a heat lamination press. The conditions at this time are 200 ° C. and 60 minutes, and the pressing pressure is 1.
It was 5 MPa. The following electronic components were produced using the obtained laminated substrate.

<Embodiment 3> FIGS. 3 and 4 are views showing an inductor. FIG. 3 is a transparent perspective view, and FIG. 4 is a sectional view.

In the figure, an inductor 10 has constituent layers (prepregs or substrates) 10a to 1 having a resin of the present invention.
0e, an internal conductor (coil pattern) 13 formed on the constituent layers 10b to 10e, and an internal conductor 13
And via holes 14 for electrically connecting.
This via hole 14 can be formed by drilling, laser processing, etching or the like. The terminal ends of the formed coils are connected to the through vias 12 formed on the end faces of the inductor 10 and the land patterns 11 formed slightly in the vertical direction from the through vias 12. The through via 12 has a structure cut in half by dicing, V-cut or the like. This is because a plurality of elements are formed on the collective substrate and cut from the center of the through via 12 when finally cut into individual pieces.

The constituent layers 10a to 10a of the inductor 10
e has a thickness of at least 2 to 4
It has a glass clothless constituent layer of 0 μm. This constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and in some cases, may contain a flame retardant. Not all constituent layers need to be formed of the same material, and constituent layers formed of different materials may be combined. Note that a glass cloth may be used for a part of the component in order to improve the component strength.

For the chip inductor, it is necessary to increase the magnetic permeability of the base substrate in order to increase the L value. When beads are used as a measure against EMC, it is necessary to increase the magnetic permeability as much as possible in order to increase the impedance. The L value can be increased by reducing the leakage current by reducing the thickness of the interlayer, that is, the constituent layer, and increasing the number of turns (the number of turns) in the same shape. Therefore, by adding a magnetic powder to at least the glass clothless constituent layer having a thickness of 2 to 40 μm to adjust the electric characteristics and magnetic characteristics, it is small and has a high L value or a high impedance. A chip inductor is obtained.

Further, when considering the use as a chip inductor for high frequency, it is necessary to reduce the distributed capacitance as much as possible.
It is preferably 3.5. In addition, in the inductor forming the resonance circuit, the distributed capacitance may be positively used, and in such an application, the relative dielectric constant at 1 to 2 GHz is preferably 5 to 40. In this manner, the size of the element can be reduced and the capacitor can be omitted. Further, in this inductor, it is necessary to minimize the loss of material. Therefore, the dielectric loss tangent (tan δ) at 1 to 2 GHz is 0.0025 to 0.007.
By setting the value to 5, it is possible to obtain an inductor with a very low material loss and a high Q. Further, when considering an application for noise removal, it is necessary to increase the impedance as much as possible at the frequency of the noise to be removed.
In such a case, the magnetic permeability at 1 to 2 GHz is 3 to 2
It is preferable to adjust to 0. As a result, the effect of removing high-frequency noise can be significantly improved. The constituent layers may be the same or different, and an optimal combination may be selected.

The equivalent circuit is shown in FIG. As shown in FIG. 12A, the equivalent circuit is a multilayer electronic component (inductor) having the coil 31.

<Embodiment 4> FIGS. 5 and 6 show other inductors. FIG. 5 is a perspective view and FIG. 6 is a sectional view.

This example shows a configuration in which the coil pattern wound in the vertical direction in the third embodiment is replaced by a helical winding wound in the horizontal direction. Other components are the same as those of the third embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Embodiment 5> FIGS. 7 and 8 show other inductors. FIG. 7 is a transparent perspective view, and FIG. 8 is a sectional view.

In this example, the coil pattern wound in the vertical direction in the third embodiment is changed to a configuration in which spirals on the upper and lower surfaces are connected. Other components are the same as those of the third embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Embodiment 6> FIGS. 9 and 10 are views showing another inductor, FIG. 9 is a perspective view, and FIG. 10 is a sectional view.

In this example, the coil pattern wound up and down in the third embodiment is configured as a meander-shaped pattern formed inside. Other components are the same as those of the third embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Embodiment 7> FIG. 11 is a perspective view showing another inductor.

In this example, a mode is shown in which the coils configured independently in the third embodiment are replaced with four coils. With such a configuration, space can be saved. Other components are the same as those of the third embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted. The equivalent circuit is shown in FIG. FIG.
As shown in (b), in the equivalent circuit, the coils 31a to 31a
Reference numeral 31d denotes a laminated electronic component (inductor) provided in a quadruple arrangement.

<Eighth Embodiment> FIGS. 13 and 14 are views showing a capacitor (capacitor). FIG. 13 is a transparent perspective view and FIG. 14 is a sectional view.

In the figure, a capacitor 20 includes constituent layers (prepregs or substrates) 20a to 2 having the resin of the present invention.
0 g, the internal conductor (internal electrode pattern) 23 formed on the constituent layers 20 b to 20 g, and the internal conductor 2.
3 and a through via 22 formed on the end face of the capacitor, which is connected alternately with each other, and a land pattern 21 formed slightly in the vertical direction from the through via 22.

The constituent layers 20a to 20 of the capacitor 20
g has a thickness of at least 2 to 4
It has a glass clothless constituent layer of 0 μm. The constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and may contain a flame retardant in some cases. It is not necessary that all constituent layers are formed of the same material, and constituent layers formed of different materials may be combined. Note that a glass cloth may be used for a part of the component in order to improve the component strength.

To reduce the size of the chip capacitor, it is necessary to increase the dielectric constant between the layers of the counter electrode. Further, in order to obtain a capacity, the interlayer, that is, the constituent layer is preferably as thin as possible. Therefore, at least the thickness is 2 to 40
By adding a dielectric powder to the glass clothless constituent layer of μm to adjust the electric and magnetic characteristics, a small chip capacitor having a high C value can be obtained.

Considering the diversity of the obtained capacitance and the point of accuracy, the relative dielectric constant at 1-2 GHz is 2.6-4.
It is preferably 0 and the dielectric loss tangent is 0.0025 to 0.025. As a result, the range of the obtained capacitance is widened, and a low capacitance value can be formed with high accuracy. In addition, it is necessary to minimize material loss. Therefore, the dielectric loss tangent (tan δ) at 1 to 2 GHz is 0.0025 to 0.025.
By doing so, a capacitor with extremely small material loss can be obtained. The constituent layers may be the same or different, and an optimum combination may be selected.

The equivalent circuit is shown in FIG. As shown in FIG. 16A, the equivalent circuit is a multilayer electronic component (capacitor) having a capacitor 32.

<Embodiment 9> FIG. 15 is a perspective view showing another capacitor.

In this example, a configuration is shown in which the capacitors configured independently in the eighth embodiment are arranged in a plurality of arrays to form four units. When the capacitors are formed in an array, various capacitances may be formed with high accuracy. Therefore, it can be said that the above ranges of the dielectric constant and the dielectric loss tangent are preferable. Other components are the same as those in the eighth embodiment,
The same components are denoted by the same reference numerals and description thereof is omitted. The equivalent circuit is shown in FIG. FIG. 16 (b)
As shown in FIG.
2d is a laminated electronic component (capacitor) in which four are mounted in series.

Embodiment 10 FIGS. 17 to 20 show a balun transformer. 17 is a transparent perspective view, FIG. 18 is a sectional view, FIG. 19 is an exploded plan view of each constituent layer, FIG.
Is an equivalent circuit diagram.

17 to 19, the balun transformer 4
No. 0 has an internal GND conductor 45 disposed above, below, and in the middle of the laminated body in which the constituent layers 40a to 40o are laminated, and an internal conductor 43 formed between the internal GND conductors 45. The inner conductor 43 is formed by connecting a spiral conductor 43 having a length of λg / 4 to the coupling line 5 shown in the equivalent circuit of FIG.
They are connected by via holes 44 and the like so as to form 3a to 53d.

The balun transformer 40 has the constituent layers 40a-
At least one of 40o has a thickness of at least 2
It has a glass clothless constituent layer of ４０40 μm. This constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and in some cases, may contain a flame retardant. It is not necessary that all constituent layers are formed of the same material, and constituent layers formed of different materials may be combined. In addition,
In order to improve the strength of the parts, a glass cloth may be used for a part thereof.

When designing a balun transformer, considering the miniaturization, it is preferable that the relative dielectric constant is as high as possible. Similarly, the interlayers, that is, the constituent layers are preferably as thin as possible. Therefore, a compact and high-performance balun transformer can be obtained by further adding a dielectric powder for adjusting electric and magnetic properties to at least the glass clothless constituent layer having a thickness of 2 to 40 μm.

In some applications, the relative dielectric constant at 1-2 GHz is set to 2.6-40, and the dielectric loss tangent (tan δ)
Is preferably 0.0025 to 0.025. Further, depending on other applications, the permeability at 1-2 GHz may be 3
It is preferably set to 20. The constituent layers may be the same or different, and an optimum combination may be selected.

<Embodiment 11> FIGS. 21 to 24 show a laminated filter. Here, FIG. 21 is a perspective view, and FIG.
Is an exploded perspective view, FIG. 23 is an equivalent circuit diagram, and FIG. 24 is a transfer characteristic diagram. Note that this laminated filter is configured as a two-pole filter.

21 to 23, the laminated filter 6
No. 0 has a pair of strip lines 68 and a pair of capacitor conductors 67 at substantially the center of the stacked body in which the constituent layers 60a to 60e are stacked. The capacitor conductor 67 is formed on the lower constituent layer group 60d, and the strip line 68 is formed on the constituent layer 60c thereabove. Constituent layers 60a-60
A GND conductor 65 is formed at the upper and lower ends of e, so that the strip line 68 and the capacitor conductor 67 are sandwiched therebetween. Each of the strip line 68, the capacitor conductor 67, and the GND conductor 65 is connected to an end electrode (external terminal) 62 formed on an end surface thereof and a land pattern 61 formed slightly upward and downward from the end electrode (external terminal). The GND pattern 66 formed on both side surfaces and slightly in the vertical direction from the both sides is connected to the GND conductor 65.

The strip line 68 is a strip line 74a, 74b having a length of λg / 4 or less as shown in the equivalent circuit diagram of FIG. 23, and the capacitor conductor 67 forms an input / output coupling capacitance Ci. The strip lines 74a and 74b are coupled by a coupling capacitance Cm and a coupling coefficient M. With such an equivalent circuit, a multilayer filter having a two-pole type transfer characteristic as shown in FIG. 24 can be obtained.

The component layers 60a to 60a of the multilayer filter 60
0e has a thickness of at least 2
It has a glass clothless constituent layer of 40 μm. This constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and in some cases, may contain a flame retardant. It is not necessary that all constituent layers are formed of the same material, and constituent layers formed of different materials may be combined. In addition, a glass cloth may be used for a part of the component in order to improve the strength of the component.

In designing a multilayer filter, the relative dielectric constant should be as high as possible in consideration of miniaturization. Similarly, the interlayers, that is, the constituent layers are preferably as thin as possible. Therefore, a compact and high-performance laminated filter can be obtained by further adding a dielectric powder for adjusting electric and magnetic properties to at least the glass clothless constituent layer having a thickness of 2 to 40 μm.

The relative dielectric constant at 1-2 GHz is set to 2.
By setting the value to 6 to 40, a desired transfer characteristic can be obtained in a band of several hundred MHz to several GHz.
It is also desirable to minimize the material loss of the stripline resonator, and it is preferable that the dielectric loss tangent (tan δ) at 1 to 2 GHz be 0.0025 to 0.0075.

Embodiment 12 FIGS. 25 to 28 show another laminated filter. Here, FIG. 25 is a perspective view, FIG. 26 is an exploded perspective view, FIG. 27 is an equivalent circuit diagram, and FIG. 28 is a transfer characteristic diagram. In addition, this laminated filter is comprised as a 4-pole.

25 to 27, the laminated filter 6
No. 0 has four strip lines 68 and a pair of capacitor conductors 67 substantially at the center of the stacked body in which the constituent layers 60a to 60e are stacked. Other components are the same as those of the eleventh embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Embodiment 13> FIGS. 29 to 33 show couplers. 29 is a transparent perspective view, FIG. 30 is a sectional view, FIG. 31 is an exploded plan view of each constituent layer, FIG. 32 is an internal connection diagram, and FIG. 33 is an equivalent circuit diagram.

29 to 33, the coupler 110 is
An internal GND conductor 115 formed and arranged above and below a laminated body in which the constituent layers 110a to 110c are laminated;
It has an internal conductor 113 formed between the ND conductors 115. The internal conductor 113 is formed in a spiral shape in the via hole 11 so that a transformer is constituted by two coils.
They are linked by 4 mag. Also. As shown in FIG. 32, the end of the formed coil and the internal GND conductor 115 are
Each is connected to a through via 112 formed on the end face and a land pattern 111 formed slightly upward and downward from the through via 112. With this configuration, FIG.
As shown in the equivalent circuit diagram of FIG.
The coupler 110 to which 25b is coupled is obtained.

The constituent layers 110a-11 of the coupler 110
0c has a thickness of at least 2
It has a glass clothless constituent layer of 40 μm. This constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and in some cases, may contain a flame retardant. It is not necessary that all constituent layers are formed of the same material, and constituent layers formed of different materials may be combined. In addition, a glass cloth may be used for a part of the component in order to improve the strength of the component.

In designing a coupler, the relative dielectric constant should be as high as possible in consideration of miniaturization. Similarly, the interlayers, that is, the constituent layers are preferably as thin as possible. Therefore, a compact and high-performance coupler can be obtained by further adding a dielectric powder for adjusting electric and magnetic characteristics to at least a glass clothless constituent layer having a thickness of 2 to 40 μm. In order to realize a wide band, it is preferable that the relative permittivity is as small as possible.

Further, a material having a dielectric constant suitable for the intended use, required performance, specifications and the like may be used. Normal,
By setting the relative dielectric constant at 1 to 2 GHz to 2.6 to 40, a desired transfer characteristic can be obtained in a band of several hundred MHz to several GHz. Further, in order to increase the Q value of the internal inductor, it is preferable that the dielectric loss tangent (tan δ) at 1 to 2 GHz is 0.0025 to 0.0075. As a result, an inductor having a very small material loss and a high Q value can be formed, and a high-performance coupler can be obtained.

<Embodiment 14> FIGS. 34 to 36 show a VCO
(Voltage controlled oscillator). 34 is a transparent perspective view, FIG. 35 is a sectional view, and FIG. 36 is an equivalent circuit diagram.

In FIGS. 34 to 36, a VCO includes an electronic component 261 such as a capacitor, an inductor, a semiconductor, and a resistor formed and arranged on a laminated body in which constituent layers 210a to 210g are stacked. Conductor pattern 26 formed in 210 g and on upper and lower surfaces thereof
2,263,264. Since this VCO is constituted by an equivalent circuit as shown in FIG. 36, it has a strip line 263, a capacitor, a signal line, a semiconductor, a power supply line and the like. For this reason, it is effective to form the constituent layers with materials suitable for each function.

In this example, at least one of the constituent layers 210a to 210g has a thickness of at least 2 to 40 μm.
m having a glass clothless constituent layer. This constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and in some cases, may contain a flame retardant. It is not necessary that all constituent layers are formed of the same material, and constituent layers formed of different materials may be combined. In addition, a glass cloth may be used for a part of the component in order to improve the strength of the component.

In particular, the capacitor constituting layers 210c to 210c
By using the glass clothless constituent layer for e, the thickness of the constituent layer can be made extremely thin, and the VCO can be made smaller.

Constituent layers 210f and 210 constituting a resonator
In g, the dielectric loss tangent at 1-2 GHz is 0.0025-
It is preferable to use a constituent layer of 0.0075. The capacitor constituent layers 210c to 210e have a dielectric loss tangent of 0.0075 to 0.025 at 1-2 GHz and a relative dielectric constant of 5
It is preferable to use a constituent layer having a thickness of from 40 to 40. The wiring and the inductor constituent layers 210a and 210b include:
The dielectric loss tangent at 1-2 GHz is 0.0025-0.00
It is preferable to use a dielectric layer having a relative dielectric constant of 2.6 to 5.0.

The strip lines 263, G, which are internal conductors, are provided on the surfaces of the constituent layers 210a to 210g.
The ND conductor 262, the capacitor conductor 264, the wiring inductor conductor 265, and the terminal conductor 266 are formed. Further, the respective internal conductors are vertically connected by via holes 214, and mounted electronic components 261 are mounted on the surface to form a VCO as shown in an equivalent circuit of FIG.

With this configuration, the dielectric constant, Q, and dielectric loss tangent suitable for each function can be obtained, and high performance, small size, and thinness can be achieved.

Embodiment 15 FIGS. 37 to 39 show a power amplifier (power amplifier). Here, FIG. 37 is an exploded plan view of each constituent layer, FIG. 38 is a sectional view, and FIG. 39 is an equivalent circuit diagram.

In FIG. 37 to FIG. 39, the power amplifier
Electronic components 361 such as capacitors, inductors, semiconductors, and resistors formed and arranged on a laminated body in which the constituent layers 300a to 300e are stacked;
It has conductor patterns 313 and 315 formed in 0e and on the upper and lower surfaces thereof. Since this power amplifier is constituted by an equivalent circuit as shown in FIG. 39, the strip lines L11 to L17 and the capacitors C11 to C2
0, a signal line, a power supply line to a semiconductor, and the like. For this reason, it is effective to form the constituent layers with materials suitable for each function.

In this example, at least one of the constituent layers has a glass clothless constituent layer having a thickness of at least 2 to 40 μm. This constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and in some cases, may contain a flame retardant. It is not necessary that all constituent layers are formed of the same material, and constituent layers formed of different materials may be combined. Also, to improve the strength of the parts,
A glass cloth may be used for a part thereof.

In particular, capacitor constituent layers 300a to 300
By using the glass clothless constituent layer for c, the thickness of the constituent layer can be extremely reduced, and the power amplifier can be made more compact.

In this case, the constituent layers 300d and 300e constituting the strip line have a dielectric loss tangent of 0.0075 to 0.025 and a dielectric constant of 2.6 to 2.6 GHz at 1 to 2 GHz.
Preferably, a forty configuration is used. As the capacitor constituent layers 300a to 300c, it is preferable to use constituent layers having a dielectric loss tangent of 0.0025 to 0.025 and a relative dielectric constant of 5 to 40 at 1 to 2 GHz.

Then, these constituent layers 300a to 300a
On the surface of e, an internal conductor 313, a GND conductor 315 and the like are formed. Each internal conductor is vertically connected by a via hole 314, and mounted electronic components 361 are mounted on the surface to form a power amplifier as shown in the equivalent circuit of FIG.

With this configuration, the dielectric constant, Q, and dielectric tangent suitable for each function can be obtained, and high performance, small size, and thinness can be achieved.

Embodiment 16 FIGS. 40 to 42 show a superposition module used for an optical pickup or the like. 40 is an exploded plan view of each constituent layer, FIG. 41 is a sectional view, and FIG. 42 is an equivalent circuit diagram.

40 to 42, a superimposed module includes a capacitor, an inductor, a semiconductor, and a capacitor formed and arranged on a laminate in which constituent layers 400a to 400k are laminated.
An electronic component 461 such as a register and the constituent layers 400a to
It has conductor patterns 413 and 415 formed in 400k and on the upper and lower surfaces thereof. Since this superimposition module is configured by an equivalent circuit as shown in FIG. 42,
Inductors L21 and L23, capacitors C21 and C2
7, a signal line, a power supply line to a semiconductor, and the like. For this reason, it is effective to form the constituent layers with materials suitable for each function.

In this example, at least one of the constituent layers 400a to 400k has at least a thickness of 2 to 40 μm.
m having a glass clothless constituent layer. This constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and in some cases, may contain a flame retardant. It is not necessary that all constituent layers are formed of the same material, and constituent layers formed of different materials may be combined. In addition, a glass cloth may be used for a part of the component to improve the strength of the component.

In particular, capacitor constituent layers 400d to 400d
By using the above-mentioned glass clothless constituent layer for h, the thickness of the constituent layer can be extremely reduced, and the superposed module can be made more compact.

In this case, the capacitor constituting layers 400d-4d
In 00h, the dielectric loss tangent at 1-2 GHz is 0.007.
It is preferable to use a configuration in which the relative dielectric constant is 5 to 0.025 and the relative dielectric constant is 10 to 40. The constituent layers 400a to 400c and 400j to 400k constituting the inductor include
Dielectric tangent at 2 GHz is 0.0025 to 0.007
5. It is preferable to use a constituent layer having a relative dielectric constant of 2.6 to 5.0.

Then, these constituent layers 400a-400
On the surface of k, an internal conductor 413, a GND conductor 415, and the like are formed. The respective internal conductors are vertically connected by via holes 414, and mounted electronic components 461 are mounted on the surface to form a superimposed module as shown in the equivalent circuit of FIG.

With this configuration, the dielectric constant, Q, and dielectric tangent suitable for each function can be obtained, and high performance, small size, and thinness can be achieved.

<Embodiment 17> FIGS. 43 to 46 show an RF module. Here, FIG. 43 is a perspective view, and FIG.
Is a perspective view with the exterior member removed, FIG. 45 is an exploded perspective view of each constituent layer, and FIG. 46 is a sectional view.

43 to 46, the RF module includes a capacitor, an inductor, a semiconductor, and a capacitor formed and arranged on a laminate in which constituent layers 500a to 500i are laminated.
Electronic components 561 such as registers,
Conductor patterns 513, 515, 572 formed in and on the upper and lower surfaces of the antenna pattern
3 This RF module has an inductor, a capacitor, a signal line, a power supply line to a semiconductor, and the like as described above. For this reason, it is effective to form the constituent layers with materials suitable for each function.

In this example, at least one of the constituent layers 500a to 500i has a thickness of at least 2 to 40 μm.
m having a glass clothless constituent layer. This constituent layer may further contain a dielectric powder or a magnetic powder in order to adjust electric characteristics or magnetic characteristics, and in some cases, may contain a flame retardant. It is not necessary that all constituent layers are formed of the same material, and constituent layers formed of different materials may be combined. In addition, a glass cloth may be used for a part of the component in order to improve the strength of the component.

In particular, capacitor constituent layers 500e to 500e
By using the glass clothless constituent layer for f, the thickness of the constituent layer can be extremely reduced, and the RF module can be made smaller.

In this case, the antenna configuration, the strip line configuration, and the wiring layers 500a to 500d and 500g are:
The dielectric loss tangent at 1-2 GHz is 0.0025-0.00
75, it is preferable to use a constituent layer having a relative dielectric constant of 2.6 to 5.0. The dielectric loss tangent at 1-2 GHz is 0.0075-0.
025, it is preferable to use a constituent layer having a relative dielectric constant of 10 to 40. Power supply line layer 500h to 500i
It is preferable to use a constituent layer having a magnetic permeability of 3 to 20 at 1 to 2 GHz.

Then, these constituent layers 500a to 500a
On the surface of i, an internal conductor 513, a GND conductor 515, an antenna conductor 573, and the like are formed. Also, the respective inner conductors are vertically connected by via holes 514,
The mounted electronic component 561 is mounted on the surface, and R
An F module is formed.

With this configuration, the dielectric constant, Q, and dielectric tangent suitable for each function can be obtained, and high performance, small size, and thinness can be achieved.

According to the present invention, in addition to the electronic components exemplified above, a common mode filter and an EMC
Filter, power supply filter, pulse transformer, choke coil, DC-DC converter, delay line, antenna switch module, antenna front-end module, isolator / power amplifier module, PL
It can be applied to an L module, a front end module, a tuner unit, a directional coupler, a double balanced mixer (DBM), a power combiner, a power distributor, a PTC thermistor, and the like.

[0172]

As described above, according to the present invention, it is possible to provide a laminated substrate and an electronic component which can be made thinner than conventional substrates, have high performance, and do not cause problems in strength during handling. Can be.

[Brief description of the drawings]

FIG. 1 is a process chart showing an example of forming constituent layers of a laminated substrate of the present invention.

FIG. 2 is a process chart showing an example of forming constituent layers of a laminated substrate according to the present invention.

FIG. 3 is a diagram showing an inductor which is a configuration example of the electronic component of the present invention.

FIG. 4 is a diagram showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 5 is a diagram showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 6 is a diagram showing an inductor which is a configuration example of the electronic component of the present invention.

FIG. 7 is a diagram showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 8 is a diagram showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 9 is a view showing an inductor which is a configuration example of the electronic component of the present invention.

FIG. 10 is a view showing an inductor which is a configuration example of the electronic component of the present invention.

FIG. 11 is a diagram showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 12 is an equivalent circuit diagram showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 13 is a view showing a capacitor which is a configuration example of the electronic component of the present invention.

FIG. 14 is a view showing a capacitor which is a configuration example of the electronic component of the present invention.

FIG. 15 is a view showing a capacitor which is a configuration example of the electronic component of the present invention.

FIG. 16 is an equivalent circuit diagram showing a capacitor which is a configuration example of the electronic component of the present invention.

FIG. 17 is a diagram showing a balun transformer which is a configuration example of the electronic component of the present invention.

FIG. 18 is a diagram showing a balun transformer which is a configuration example of the electronic component of the present invention.

FIG. 19 is a diagram showing a balun transformer which is a configuration example of the electronic component of the present invention.

FIG. 20 is an equivalent circuit diagram showing a balun transformer which is a configuration example of the electronic component of the present invention.

FIG. 21 is a diagram illustrating a multilayer filter that is a configuration example of the electronic component of the present invention.

FIG. 22 is a diagram illustrating a laminated filter that is a configuration example of the electronic component of the present invention.

FIG. 23 is an equivalent circuit diagram showing a multilayer filter as a configuration example of the electronic component of the present invention.

FIG. 24 is a diagram illustrating transfer characteristics of a multilayer filter as a configuration example of the electronic component of the present invention.

FIG. 25 is a diagram showing a laminated filter which is a configuration example of the electronic component of the present invention.

FIG. 26 is a diagram illustrating a multilayer filter that is a configuration example of the electronic component of the present invention.

FIG. 27 is an equivalent circuit diagram showing a multilayer filter as a configuration example of the electronic component of the present invention.

FIG. 28 is a diagram illustrating transfer characteristics of a multilayer filter that is a configuration example of the electronic component of the present invention.

FIG. 29 is a diagram illustrating a coupler as a configuration example of the electronic component of the present invention.

FIG. 30 is a diagram illustrating a coupler that is a configuration example of an electronic component according to the invention.

FIG. 31 is a diagram illustrating a coupler that is a configuration example of an electronic component according to the invention.

FIG. 32 is a diagram showing an internal connection of a coupler which is a configuration example of the electronic component of the present invention.

FIG. 33 is a diagram showing an equivalent circuit of a coupler which is a configuration example of the electronic component of the present invention.

FIG. 34 is a diagram illustrating a VCO that is a configuration example of an electronic component according to the present invention.

FIG. 35 is a diagram illustrating a VCO that is a configuration example of an electronic component according to the invention.

FIG. 36 is an equivalent circuit diagram showing a VCO that is a configuration example of the electronic component of the present invention.

FIG. 37 is a diagram illustrating a power amplifier that is a configuration example of an electronic component according to the invention.

FIG. 38 is a diagram illustrating a power amplifier that is a configuration example of an electronic component according to the invention.

FIG. 39 is an equivalent circuit diagram showing a power amplifier which is a configuration example of an electronic component of the present invention.

FIG. 40 is a diagram showing a superposition module which is a configuration example of the electronic component of the present invention.

FIG. 41 is a diagram showing a superposition module which is a configuration example of the electronic component of the present invention.

FIG. 42 is an equivalent circuit diagram showing a superposition module which is a configuration example of an electronic component of the present invention.

FIG. 43 is a diagram showing an RF module which is a configuration example of an electronic component of the present invention.

FIG. 44 is a diagram showing an RF module as a configuration example of the electronic component of the present invention.

FIG. 45 is a diagram showing an RF module which is a configuration example of an electronic component of the present invention.

FIG. 46 is a diagram showing an RF module which is a configuration example of an electronic component of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Inductor 10a-10e Constituent layer 11 Land pattern 12 Through via 13 Internal conductor (coil pattern) 14 Via hole 20 Capacitor 20a-20g Constituent layer 21 Land pattern 22 Through via 23 Internal conductor (internal electrode pattern) 40 Balun transformer 40a-40o Layer 45 GND conductor 43 Inner conductor 60 Multilayer filter 80 Block filter 110 Coupler

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H01G 4/12 364 H01G 4/30 311Z 4/30 311 H05K 1/03 610R H01F 1/14 B H05K 1 / 03 610 CF term (reference) 5E001 AB03 AE02 AH01 AH09 AJ01 AJ02 5E041 AA11 AB02 AB04 CA10 NN06 5E082 AA01 AB03 FG26 JJ03 JJ15 PP03 PP04 PP09 5E343 AA13 BB23 BB24 BB25 BB28 DD56 DD76GG20

Claims (16)

[Claims] 1. A conductive film is adhered to a transfer film, and the conductive layer is patterned into a predetermined pattern by etching. Thereafter, a transfer film having a patterned conductive layer is formed by prepreg on the conductive layer side. After placing the transfer film on the prepreg under heat and pressure,
A method for manufacturing a laminated substrate, in which a transfer film is peeled to obtain a prepreg having a conductor layer. 2. The thermocompression bonding is performed at a temperature of 140 to 160.
° C, pressure: 4.9-39MPa, processing time 120-180
The method for producing a laminated substrate according to claim 1, wherein the method is performed under the condition of minutes. 3. The method according to claim 1, wherein the transfer film is heat-treated at 100 to 130 ° C. for 5 to 20 minutes before placing the prepreg. 4. The method according to claim 1, wherein at least one of a dielectric powder and a magnetic powder is dispersed in a resin to obtain a prepreg having a thickness of 2 to 40 μm. 5. The laminated substrate having an internal conductor pattern by arranging another prepreg on the pattern forming surface of the prepreg and heat-pressing the other prepreg. Of manufacturing a laminated substrate. 6. The conductor layer has a surface roughness Rz of 1 to 6 μm.
The method for manufacturing a laminated substrate according to any one of claims 1 to 5, wherein 7. The method according to claim 1, wherein the conductive layer is made of one or more elements selected from Cu, Al, Ag, and Au. 8. The method according to claim 1, wherein the conductor layer is manufactured by an electrolytic method or a rolling method. 9. The method according to claim 1, wherein said conductive layer has a thickness of 3 to 32 μm. 10. The dielectric powder is titanium-barium-
Neodymium ceramics, titanium-barium-tin ceramics, lead-calcium ceramics, titanium dioxide ceramics, barium titanate ceramics, lead titanate ceramics, strontium titanate ceramics, calcium titanate ceramics, bismuth titanate Ceramics, magnesium titanate ceramics, CaWO ₄ ceramics, B
a (Mg, Nb) O ₃ ceramics, Ba (Mg, T
a) O ₃ ceramics, Ba (Co, Mg, Nb) O
₃ series ceramics and Ba (Co, Mg, Ta) O ₃
The method for manufacturing a laminated substrate according to any one of claims 4 to 9, wherein the method is formed of any one or more of ceramics. 11. The dielectric powder comprises silica, alumina,
The whiskers are made of one or more of zirconia, potassium titanate whiskers, calcium titanate whiskers, barium titanate whiskers, zinc oxide whiskers, glass chops, glass beads, carbon fibers, and magnesium oxide. 9. The method for manufacturing a laminated substrate according to any one of items 1 to 9. 12. The dielectric powder, when the total amount of the resin and the dielectric powder is 100% by volume, is at least 10% by volume.
The method for producing a laminated substrate according to any one of claims 4 to 11, wherein the content is less than 5% by volume. 13. The magnetic material powder, wherein Mn—Mg—Zn
The method for manufacturing a laminated substrate according to claim 4, wherein the laminated substrate is formed of one or more of ferrite, Ni—Zn ferrite, and Mn—Zn ferrite. 14. The magnetic powder is formed of one or more of carbonyl iron, an iron-silicon alloy, an iron-aluminum-silicon alloy, an iron-nickel alloy, and an amorphous ferromagnetic metal. The method for manufacturing a laminated substrate according to any one of claims 4 to 12, wherein: 15. The dielectric powder or the magnetic powder has a spherical shape having a circular projection of 0.9 to 1.0 and an average particle diameter of 0.1 to 40 μm. ~ 14
Any one of the laminated substrates. 16. An electronic component element is formed by patterning at least a conductive layer of the laminated substrate according to claim 4; and a through hole serving as a terminal of the electronic component element is formed. A method of manufacturing an electronic component in which an electronic component is obtained by cutting at a through hole.