JP2004221603A - Coupler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized, high-performance electronic component, especially a coupler, having a dielectric constant higher than those of conventional materials, which does not deteriorate in strength and is superior in overall electric characteristics, to provide an electronic component, especially a coupler, in which the variations of the electrical characteristics between the production lots, especially the dielectric constant of a using material is restrained, and further wearing of a metal mold at formation of the material is restrained, and to provide an electronic component, especially a coupler of high breakdown voltage. <P>SOLUTION: This coupler is provided with a structure, in which constituent layers containing resin are laminated to form a multi-layer. At least one layer of the constituent layers is a composite dielectric material layer, in which circular, flat-circular or elliptical dielectric materials are dispersed inside the resin. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention relates to an electronic component and a laminated circuit using a prepreg and a substrate, and more particularly to an electronic component using a prepreg and a substrate excellent in dielectric constant, particularly suitable for use in a high frequency region (100 MHz or more), and particularly to a coupler. .

  In recent years, there has been a remarkable trend toward miniaturization and high-density mounting methods in the field of electronic devices for communication, consumer use, industrial use, and so on. Properties, electrical properties, and moldability are being demanded.

  As a high-frequency electronic component or a high-frequency multilayer substrate, a substrate in which sintered ferrite or sintered ceramic is multilayered and formed on a substrate is generally known. Making these materials into a multi-layer substrate has been conventionally used because of its merit of miniaturization.

  However, when these sintered ferrites and sintered ceramics are used, there are many firing steps and thick film printing steps, and there are many problems specific to sintered materials, such as cracks and warpage during firing, and there are many problems with printed circuit boards. There are many problems such as generation of cracks due to the difference in thermal expansion coefficient of the resin, and the demand for resin-based materials is increasing year by year.

  However, it is extremely difficult to obtain a sufficient dielectric constant by itself with a resin-based material, and it is also difficult to improve the magnetic permeability in conjunction with this. For this reason, an electronic component that simply uses a resin material cannot obtain sufficient characteristics and has a large shape, making it difficult to reduce the size and thickness.

  Also, a method of compositing a ceramic powder with a resin material is disclosed in, for example, JP-A-10-270255, JP-A-11-192620, and JP-A-8-69712. In each case, no sufficient dielectric constant or magnetic permeability is obtained. If the filling rate of the ceramic powder is increased to increase the dielectric constant, there is a problem that the strength is reduced and the powder is liable to be broken during handling or processing.

  In addition, since the material used in these documents is crushed powder, there is a drawback that a mold is quickly worn during kneading and molding. In addition, in the case of crushed powder, since the shape and size of the particles are varied, the dispersibility and the filling rate are not stable, it is difficult to increase the dielectric constant, and the dielectric constant and the magnetic permeability are difficult to stabilize. was there. Further, when crushed powder is used, there is a disadvantage that the withstand voltage is reduced due to the shape of the particles.

As attempts to disperse the spherical magnetic powder in the resin, Patent Document 4 (Japanese Patent Publication No. 7-56846), Patent Document 5 (Patent No. 2830071), Patent Document 6 (Patent No. 2876088), and Patent Document 7 (Japanese Patent No. 2893531) and the like. However, only the ferrite magnetic powder is disclosed in these documents, and no studies have been made on other materials or on magnetic powder and other materials.
JP-A-10-270255 JP-A-11-192620 JP-A-8-69712 Japanese Patent Publication No. 7-56846 Patent No. 2830071 Patent No. 2876088 Patent No. 2893531

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component, particularly a coupler, which has a higher dielectric constant than conventional materials, does not decrease in strength, is compact, has high performance, and is excellent in overall electric characteristics.
Another object of the present invention is to provide an electronic component, particularly a coupler, which can suppress variation between lots of electrical characteristics of a material used, particularly a dielectric constant, and can suppress abrasion of a mold during material formation.
Another object of the present invention is to provide an electronic component having a high withstand voltage, particularly a coupler.

The above object is achieved by the following configuration of the present invention.
(1) A structure in which constituent layers having a resin are laminated to form a multilayer, and at least one of the constituent layers is formed by dispersing at least a dielectric material having a projected shape of a circle, a flat circle, or an ellipse in a resin. The coupler is a layer of a composite dielectric material.
(2) The coupler according to the above (1), further comprising a conductor layer.
(3) The coupler according to the above (1) or (2), wherein the dielectric having a circular projected shape has an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0.
(4) The coupler according to any one of (1) to (3), wherein the composite dielectric material contains a magnetic powder.
(5) The coupler according to any one of (1) to (4), wherein the composite dielectric material contains crushed powder.
(6) The coupler according to any one of (1) to (5), wherein the composite dielectric material has a glass cloth embedded therein.
(7) The coupler according to any one of (1) to (6), wherein the coupler has two or more different composite dielectric materials.
(8) The coupler according to any one of (1) to (7) above, wherein at least one composite dielectric material layer contains one or more flame retardants.

  According to the present invention, there is provided an electronic component, particularly a coupler, which has a higher dielectric constant than conventional materials, does not decrease in strength, is small in size, has high performance, and has excellent overall electrical characteristics, and provides electrical characteristics of materials used. In particular, it is possible to provide an electronic component, particularly a coupler, which can suppress a lot-to-lot variation in dielectric constant and suppress abrasion of a mold during material formation, and to provide an electronic component having a high withstand voltage, particularly a coupler.

Hereinafter, the present invention will be described in detail.
The electronic component of the present invention has a composite dielectric material in which at least a dielectric material having a projected shape of a circle, a flat circle, or an ellipse is dispersed in a resin.

  As described above, by setting the projected shape of the dielectric dispersed in the resin to be a circle, a flat circle, or an ellipse, the surface of the dielectric particles becomes smooth, the filling rate is improved, and the dispersibility is improved. In addition, the resin material is uniformly present around the dielectric, so that the withstand voltage and strength of the hybrid material are improved. In addition, damage to the mold during molding is reduced, and the life of the mold is extended.

  In particular, the dielectric is preferably a spherical one in which the projected shape is a circle. The average particle size is preferably from 0.1 to 50 µm, particularly preferably from 0.5 to 20 µm, and the sphericity is preferably from 0.9 to 1.0, particularly preferably from 0.95 to 1.0.

  If the average particle size is smaller than 0.1 μm, the surface area of the particles increases, the viscosity during dispersion and mixing and the thixotropy increase, and it becomes difficult to increase the filling rate, and it becomes difficult to knead with the resin. On the other hand, if it is larger than 50 μm, it becomes difficult to perform uniform dispersion and mixing, sedimentation becomes severe, and the mixture becomes uneven, and it becomes difficult to obtain a dense molded body when molding a composition having a large powder content. .

  Further, when the sphericity is less than 0.9, for example, when molding a molded body such as a dust core, it becomes difficult to uniformly disperse the powder, and desired characteristics such as causing a variation in dielectric characteristics are obtained. It becomes difficult to obtain, and variation between lots and products increases. The sphericity may be obtained by arbitrarily measuring a plurality of samples, and the average value may be the above value.

  In the present invention, the term “spherical” in which the “projected shape is circular” includes not only a spherical shape with a smooth surface but also a polyhedron that is very close to a perfect circle. That is, the sphere includes a polyhedron having isotropic symmetry surrounded by a stable crystal plane represented by a Wulff model and having a sphericity close to one. The "sphericity" in the present invention is represented by Wadell's practical sphericity, that is, the ratio of the diameter of a circle equal to the projected area of a particle to the diameter of the smallest circle circumscribing the projected image of the particle.

  In the present invention, even if the sphericity of the dielectric material is smaller than 0.9, it is effective as long as the particles have a smooth surface and a projected shape of a circle, a flat circle, or an ellipse. By having such a smooth surface, the wear of the mold can be reduced. In this case, the sphericity is larger than 0.9, which is more effective than a shape having sharp projections (sharp edges).

  In the present invention, crushed powder may be further contained in addition to the dielectric having the above-mentioned shape. By containing the crushed dielectric powder, the filling rate can be further improved. In this case, although the effect of suppressing the abrasion of the mold is slightly inferior, the electrical characteristics such as the dielectric characteristics can be improved by improving the filling rate. Therefore, a suitable mode may be selected according to the required characteristics.

  When crushed powder is used, the particle size is preferably 0.01 to 100 μm, particularly preferably 0.01 to 50 μm, and the average particle size is preferably 1 to 50 μm. With such a particle size, the dispersibility of the crushed powder is improved, and the effect of the present invention is improved. On the other hand, when the particle size of the crushed powder is smaller than this, the specific surface area increases, and it becomes difficult to increase the filling rate. On the other hand, if it is larger than this, it tends to settle when it is made into a paste, making it difficult to uniformly disperse it. Also, when it is attempted to form a thin substrate or prepreg, it becomes difficult to obtain a smooth surface. It is practically difficult to make the particle size too small, and the limit is about 0.01 μm.

  The dielectric material powder used in the present invention is preferably a ceramic powder, and may be a ceramic powder having a higher relative dielectric constant and Q than a resin serving as a dispersion medium in a high frequency band, and may be used in two or more types.

  In particular, the ceramic powder used in the present invention preferably has a relative dielectric constant of 10 to 20,000 and a dielectric loss tangent of 0.05 or less.

In order to obtain a relatively high dielectric constant, it is particularly preferable to use the following materials.
Titanium-barium-neodymium ceramics, titanium-barium-tin ceramics, lead-calcium ceramics, titanium dioxide ceramics, barium titanate ceramics, lead titanate ceramics, strontium titanate ceramics, calcium titanate ceramics , Bismuth titanate ceramics, magnesium titanate ceramics, CaWO ₄ ceramics, Ba (Mg, Nb) O ₃ ceramics, Ba (Mg, Ta) O ₃ ceramics, Ba (Co, Mg, Nb) O ₃ Ceramics, Ba (Co, Mg, Ta) O ₃ ceramics. The titanium dioxide-based ceramics include those containing only a small amount of additives in addition to those containing only titanium dioxide, and are those in which the crystal structure of titanium dioxide is maintained. The same applies to other ceramics. In particular, the titanium dioxide ceramic preferably has a rutile structure.

  In order to obtain high Q without increasing the dielectric constant too much, it is preferable to use the following materials.

  Silica, alumina, zirconia, potassium titanate whiskers, calcium titanate whiskers, barium titanate whiskers, zinc oxide whiskers, glass chops, glass beads, carbon fibers, magnesium oxide (talc).

  These may be used alone or as a mixture of two or more. When two or more kinds are used as a mixture, the mixing ratio is arbitrary.

  Specifically, when a relatively high dielectric constant is not required, the following materials are preferable.

Mg ₂ SiO ₄ [ε = 7, Q = 20000], Al ₂ O ₃ [ε = 9.8, Q = 40000], MgTiO ₃ [ε = 17, Q = 22000], ZnTiO ₃ [ε = 26, Q = 800], Zn ₂ TiO ₄ [ε = 15, Q = 700], TiO ₂ [ε = 104, Q = 15000], CaTiO ₃ [ε = 170, Q = 1800], SrTiO ₃ [ε = 255, Q = 700], SrZrO ₃ [ε = 30, Q = 1200], BaTi ₂ O ₅ [ε = 42, Q = 5700], BaTi ₄ O ₉ [ε = 38, Q = 9000], Ba ₂ Ti ₉ O ₂₀ [Ε = 39, Q = 9000], Ba ₂ (Ti, Sn) ₉ O ₂₀ [ε = 37, Q = 5000], ZrTiO ₄ [ε = 39, Q = 7000], (Zr, Sn) TiO ₄ [ ε = 38, Q = 7000] , BaNd 2 Ti 5 O 14 [ε = 83, Q = _{100], BaSm 2 TiO 14 [} ε = 74, Q = 2400], Bi 2 O 3 -BaO-Nd 2 O 3 -TiO 2 system [ε = 88, Q = 2000 ], PbO-BaO-Nd 2 O 3 -TiO ₂ system [ε = 90, Q = 5200], (Bi ₂ O ₃ , PbO) -BaO-Nd ₂ O ₃ -TiO ₂ system [ε = 105, Q = 2500], La ₂ Ti ₂ O ₇ [ ε = 44, Q = 4000], Nd ₂ Ti ₂ O ₇ [ε = 37, Q = 1100], (Li, Sm) TiO ₃ [ε = 81, Q = 2050], Ba (Mg _1/3 Ta _{2) / 3} ) O ₃ [ε = 25, Q = 35000], Ba (Zn _1/3 Ta _2/3 ) O ₃ [ε = 30, Q = 14000], Ba (Zn _1/3 Nb _2/3 ) O ₃ [ε = 41, Q = 9200], Sr (Zn _1/3 Nb _2/3 ) O ₃ [ε = 40, Q = 4000] and the like.

More preferably, the composition has the following composition as a main component.
TiO ₂ , CaTiO ₃ , SrTiO ₃ , BaO—Nd ₂ O ₃ —TiO ₂ system, Bi ₂ O ₃ —BaO—Nd ₂ O ₃ —TiO ₂ system, BaTi ₄ O ₉ , Ba ₂ Ti ₉ O ₂₀ , Ba ₂ (Ti, Sn) ₉ O ₂₀ system, MgO-TiO ₂ system, ZnO-TiO ₂ system, MgO-SiO ₂ system, Al ₂ O _{3 and the} like.

  On the other hand, when a relatively high dielectric constant is required, the following materials are preferable.

BaTiO ₃ [ε = 1500], (Ba, Pb) TiO ₃ [ε = 6000], Ba (Ti, Zr) O ₃ [ε = 9000] (Ba, Sr) TiO ₃ [ε = 7000].

More preferably, it is selected from a dielectric powder having the following composition as a main component.
BaTiO ₃ , Ba (Ti, Zr) O ₃ system.

  The ceramics powder may be a single crystal or polycrystalline powder.

  The content of the ceramics is, when the total amount of the resin and the ceramics powder is 100% by volume, the content of the ceramics powder is 10% by volume or more and less than 65% by volume, preferably 20% by volume or more and 60% by volume or less. Range.

  If the amount of the ceramic powder is 65% by volume or more, a dense composition cannot be obtained. In addition, Q may be greatly reduced as compared with the case where no ceramics powder is added. On the other hand, when the content of the ceramic powder is less than 10% by volume, the effect of containing the ceramic powder is not so much seen.

  In the electronic component of the present invention, by appropriately setting each component within the above range, the dielectric constant obtained from the resin alone can be increased, and a relative dielectric constant and a high Q can be obtained as required. It becomes possible.

  In order to granulate the ceramic powder into a spherical shape or the like, a known spray dryer granulation method or the like can be used. Specifically, the mixed powder for formation is dispersed and mixed in a dispersion medium, prepared into a slurry of a predetermined concentration, then spray-dried into a spherical granulated product, and then obtained by firing the granulated product. .

  The resin used for the electronic component of the present invention is not particularly limited, and can be appropriately selected from resin materials having excellent moldability, workability, adhesiveness at the time of lamination, and electrical characteristics. Specifically, a thermosetting resin, a thermoplastic resin, or the like is preferable.

  Examples of the thermosetting resin include epoxy resin, phenol resin, unsaturated polyester resin, vinyl ester resin, polyimide resin, polyphenylene ether (oxide) resin, bismaleimide triazine (cyanate ester) resin, fumarate resin, polybutadiene resin, and polyvinyl benzyl ether. Resins. Examples of the thermoplastic resin include an aromatic polyester resin, a polyphenylene sulfide resin, a polyethylene terephthalate resin, a polybutylene terephthalate resin, a polyethylene sulfide resin, a polyether ether ketone resin, a polytetrafluoroethylene resin, and a graft resin. Among these, phenol resin, epoxy resin, low dielectric constant epoxy resin, polybutadiene resin, BT resin, polyvinyl benzyl ether resin and the like are particularly preferable as the base resin.

  These resins may be used alone or as a mixture of two or more. The mixing ratio when using two or more kinds in combination is arbitrary.

  In the present invention, an electronic component may be configured by a laminate using two or more different composite dielectric materials. Further, two or more different dispersion materials may be contained. As described above, two or more kinds of different composite dielectric materials are combined, and two or more kinds of different powders, or even the same kind of powder having different composition, electric (dielectric constant, etc.) and magnetic properties and resin are mixed. By mixing, it is easy to adjust the dielectric constant and the magnetic permeability, and the characteristics can be adjusted to various electronic components. In particular, by setting the dielectric constant and the magnetic permeability that have the wavelength shortening effect to optimal values, the device can be reduced in size and thickness. In addition, by combining a material having good electric characteristics in a relatively low frequency region and a material having good electric characteristics in a relatively high frequency region, good electric characteristics can be obtained in a wide frequency band. be able to.

  Further, when a substrate or an electronic component is formed using such a hybrid layer, adhesion and patterning with a copper foil can be realized without using an adhesive or the like, and multilayering can be realized. Such patterning and multi-layering can be performed in the same process as a normal substrate manufacturing process, so that cost reduction and workability can be improved. Further, the electronic component using the substrate thus obtained has high strength and improved high-frequency characteristics.

The wavelength shortening effect can be obtained by increasing the dielectric constant. That is, the effective wavelength λ on the substrate is
λ = λ0 / (ε · μ) ^1/2
Given by Here, λ0 is the actual wavelength, and ε and μ are the permittivity and the magnetic permeability of the electronic component or substrate. Therefore, for example, when designing an electronic component and a circuit of λ / 4, by increasing ε and μ of the members constituting the circuit, a portion requiring the length λ / 4 can be calculated by the square root of the product of ε and μ. It can be reduced by the divided value. Therefore, the size of the electronic component and the substrate can be reduced by increasing at least ε of the material of the electronic component and the substrate.

  Further, by combining a material having good electric characteristics in a relatively low frequency region and a material having good electric characteristics in a relatively high frequency region, a wide frequency band, specifically 1 to Good electrical characteristics such as HPF can be obtained in a wide frequency band of 2000 MHz, particularly 50 to 1000 MHz.

Specifically, when only the wavelength shortening effect is considered, the purpose can be achieved by mixing a high dielectric constant material with a resin material. However, such high-permittivity materials are not so excellent in high-frequency characteristics, and therefore need to be compensated for. Therefore, by using a magnetic material having excellent high-frequency characteristics, for example, carbonyl iron, together with a high dielectric constant material, for example, BaTiO ₃ , BaZrO _3, etc., desired characteristics can be obtained even in a high-frequency region.

  Such electronic components requiring wavelength reduction and high frequency characteristics include a multilayer filter, a balun transformer, a dielectric filter, a coupler, an antenna, a VCO (voltage controlled oscillator), an RF (high frequency) unit, and a resonator. Can be.

  In addition, when one material is used to enhance one electrical characteristic, the other material can compensate for the insufficient electrical characteristic.

  In the electronic component of the present invention, the composite dielectric material of the dielectric and the resin may further include one or more magnetic substances.

  Ferrite which is a magnetic material is a Mn-Mg-Zn-based, Ni-Zn-based, Mn-Zn-based or the like, and particularly a single crystal thereof, or a Mn-Mg-Zn-based or Ni-Zn-based is preferable. .

  Examples of the ferromagnetic metal that is a magnetic material include carbonyl iron, an iron-silicon alloy, an iron-aluminum-silicon alloy (trade name: Sendust), an iron-nickel alloy (trade name: Permalloy), and an amorphous (iron And cobalt-based).

  Means for turning these into powder may be in accordance with known methods such as pulverization and granulation.

  The particle diameter and shape of the magnetic material powder are the same as those of the above-described dielectric material, and a material having a smooth surface is preferable as in the case of the dielectric, but crushed powder may be used. The effect of using the crushed powder is the same as above.

  Further, two or more magnetic material powders having different types and particle size distributions may be used. The mixing ratio at that time is arbitrary, and the material used, the particle size distribution, and the mixing ratio may be adjusted depending on the application.

  The magnetic material powder preferably has a magnetic permeability μ of 10 to 1,000,000. Further, it is preferable that the bulk insulating property is higher because the insulating property when the substrate is formed is improved.

  The mixing ratio between the resin and the magnetic material powder is preferably such that the magnetic permeability of the entire constituent layer to be formed is 3 to 20. In particular, when the ratio of the resin to the magnetic material powder is indicated in the paste step of applying to the glass cloth or the like, the content of the magnetic material powder is preferably 10 to 65% by volume, particularly preferably 20 to 60% by volume. With such a content of the magnetic material powder, the magnetic permeability of the entire constituent layer becomes 3 to 20, and desired electric characteristics are easily obtained. On the other hand, when the content of the magnetic material powder increases, the dielectric constant decreases, making it difficult to apply a slurry and apply it, and to manufacture electronic components, substrates, and prepregs. On the other hand, when the content of the magnetic material powder is small, it may not be possible to secure the magnetic permeability, and it is difficult to impart magnetic properties.

  As the flame retardant used in the present invention, various flame retardants usually used for making a substrate flame-retardant can be used. Specifically, halides such as halogenated phosphoric acid esters and brominated epoxy resins, organic compounds such as phosphoric acid ester amides, and inorganic materials such as antimony trioxide and aluminum hydride can be used.

The reinforcing fibers such as glass cloth used in the present invention may be of various types depending on purposes and applications, and commercially available products can be used as they are. The reinforcing fibers at this time are E glass cloth (ε = 7, tan δ = 0.003, 1 GHz), D glass cloth (ε = 4, tan δ = 0.0013, 1 GHz), and H glass according to the electrical characteristics. Crosses (ε = 11, tan δ = 0.003, 1 GHz) or the like may be used properly. Further, a coupling treatment or the like may be performed to improve interlayer adhesion. The thickness is preferably 100 μm or less, particularly preferably 20 to 60 μm. The cloth weight is preferably 120 g / m ² or less, particularly preferably ²⁰ to 70 g / m ² .

  Further, the mixing ratio of the resin and the glass cloth is preferably from 4/1 to 1/1 in weight ratio of the resin / glass cloth. With such a mixing ratio, the effects of the present invention are improved. On the other hand, when this ratio is reduced and the amount of epoxy resin is reduced, the adhesion to the copper foil is reduced, and a problem occurs in the smoothness of the substrate. Conversely, when this ratio increases and the amount of epoxy resin increases, it becomes difficult to select a glass cloth that can be used, and it is difficult to secure strength with a thin wall.

  As the metal foil to be used, any suitable metal having good conductivity such as gold, silver, copper, and aluminum may be used. Of these, copper is particularly preferred.

  As a method for producing a metal foil, various known methods such as electrolysis and rolling can be used.However, if it is desired to obtain a foil peel strength, the electrolytic foil is used. It is good to use the rolled foil which is less affected by the skin effect.

  The thickness of the metal foil is preferably from 8 to 70 μm, particularly preferably from 12 to 35 μm.

  In the present invention, in order to obtain a prepreg serving as a basis of an electronic component, a paste containing a dielectric material and a resin having a predetermined compounding ratio, a magnetic material as necessary, and a flame retardant, and kneaded in a solvent to form a slurry is used. Follow the steps of applying and drying (B-stage). The solvent used in this case is preferably a volatile solvent, particularly preferably the above-mentioned polar neutral solvent, and is used for the purpose of adjusting the viscosity of the paste to facilitate coating. The kneading may be performed by a known method using a ball mill, stirring, or the like. It can be formed by coating a paste on a metal foil or impregnating on a glass cloth.

  The drying of the prepreg (B stage) may be appropriately adjusted depending on the content of the dielectric material powder to be contained, the magnetic material powder if necessary, and the content of the flame retardant. The thickness after drying and B-stage formation is preferably about 50 to 300 μm, and may be adjusted to an optimum film thickness according to the use and required characteristics (pattern width and precision, DC resistance) and the like.

  The prepreg can be manufactured by a method as shown in FIG. 72 or 73. In this case, the method of FIG. 72 is relatively suitable for mass production, and the method of FIG. 73 is characterized in that the film thickness can be easily controlled and the characteristics can be adjusted relatively easily. In FIG. 72, as shown in FIG. 72 (a), the glass cloth 101a wound in a roll shape is unwound from the roll 90 and transported to the coating tank 92 via the guide roller 91. In this coating tank 92, a dielectric material powder dispersed in a solvent, a magnetic material powder, a flame retardant and a resin are adjusted in a slurry state as required. When a glass cloth passes through this coating tank 92, The glass cloth is immersed in the slurry and applied to the glass cloth, and the gap therein is filled.

  The glass cloth that has passed through the coating tank 92 is introduced into the drying oven 120 via guide rollers 93a and 93b. The resin-impregnated glass cloth introduced into the drying oven is dried at a predetermined temperature and for a predetermined time, is B-staged, and is turned around by a guide roller 95 and wound around a winding roller 99.

  Then, when cut into a predetermined size, as shown in (b), a prepreg in which a dielectric material powder, a magnetic material powder as needed, and a resin 102 containing a flame retardant are disposed on both surfaces of the glass cloth 101. Is obtained.

  Further, as shown in (c), a metal foil 100 such as a copper foil is placed on both upper and lower surfaces of the obtained prepreg, and is pressed by heating and pressing to obtain a double-sided metal foil as shown in (d). A substrate is obtained. The molding can be performed in a plurality of stages under different conditions. When no metal foil is provided, heating and pressing may be performed without disposing the metal foil.

  Next, the manufacturing method of FIG. 73 will be described. In FIG. 73, as shown in FIG. 73 (a), a dielectric material powder, a magnetic material powder as needed, a slurry 102a in which a flame retardant and a resin are dispersed in a solvent, a copper foil or the like are kept while the clearance is kept constant by a doctor blade 96 or the like. On the metal foil.

  Then, when cut into a predetermined size, as shown in (b), a prepreg in which a dielectric material powder, a magnetic material powder as needed, and a resin 102 containing a flame retardant are disposed on the upper surface of the metal foil 100 Is obtained.

  Further, as shown in (c), the prepregs 102 obtained on the upper and lower surfaces of the glass cloth 101 are respectively arranged with the resin 102 side as the inner surface, and are pressed by heating and pressing, as shown in (d). A substrate with double-sided metal foil is obtained. The heating and pressing conditions may be the same as described above.

  The substrate and the prepreg constituting the electronic component can also be obtained by kneading a material and molding a kneaded material in a solid state in addition to the above-mentioned coating method. In this case, since the raw material is solid, it is easy to take a thickness, and is suitable as a method for forming a relatively thick substrate or prepreg.

  The kneading may be performed by a known method such as a ball mill, stirring, and a kneader. At that time, a solvent may be used if necessary. Further, it may be pelletized or powdered as required.

  The thickness of the prepreg obtained in this case is about 0.05 to 5 mm. The thickness of the prepreg may be appropriately adjusted according to the desired plate thickness, the content of the dielectric material powder and the content of the magnetic material powder.

  Further, a metal foil such as a copper foil is placed on the upper and lower surfaces of the prepreg obtained in the same manner as described above, and then heated and pressed to obtain a substrate with a double-sided metal foil. The molding can be performed in a plurality of stages under different conditions. When no metal foil is provided, heating and pressing may be performed without disposing the metal foil.

  The substrate (organic composite material) as a molding material thus obtained is excellent in high-frequency characteristics of magnetic permeability and dielectric constant. In addition, it has excellent insulation properties that can be endured as an insulating material. Furthermore, when a substrate with a copper foil is used as described later, the adhesive strength with the copper foil is large. Also, it has excellent heat resistance such as solder heat resistance.

  The prepreg of the present invention can form a substrate with a copper foil by laminating on a copper foil and molding by heating and pressing. In this case, the thickness of the copper foil is about 12 to 35 μm.

  Examples of such a substrate with a copper foil include a double-sided patterned substrate and a multilayer substrate.

  74 and 75 show process diagrams of an example of forming a double-sided patterned substrate. As shown in FIG. 74 and FIG. 75, a prepreg 216 having a predetermined thickness and a copper (Cu) foil 217 having a predetermined thickness are overlaid and molded by applying pressure and heating (step A). Next, a through hole 218 is formed by drilling (step B). Copper (Cu) plating is performed on the formed through hole 218 to form a plating film 225 (step C). Further, the copper foil 217 on both surfaces is patterned to form a conductor pattern 226 (step D). Thereafter, as shown in FIG. 74, plating for connecting external terminals and the like is performed (step E). In this case, plating is performed by a method of further plating Pd after Ni plating, a method of further plating Au after Ni plating (plating is electrolytic or electroless plating), or a method using a solder leveler.

  76 and 77 are process diagrams of an example of forming a multilayer substrate, and show an example in which four layers are stacked. As shown in FIGS. 76 and 77, a prepreg 216 having a predetermined thickness and a copper (Cu) foil 217 having a predetermined thickness are stacked, and are formed by applying pressure and heating (step a). Next, the copper foil 217 on both sides is patterned to form a conductor pattern 224 (step b). A prepreg 216 and a copper foil 217 each having a predetermined thickness are further laminated on both sides of the double-sided patterned substrate thus obtained, and are simultaneously molded by applying pressure and heat (step c). Next, a through hole 218 is formed by drilling (step d). Copper (Cu) plating is applied to the formed through hole 218 to form a plating film 219 (step e). Further, the copper foil 217 on both sides is patterned to form a conductor pattern 224 (step f). Thereafter, as shown in FIG. 76, plating for connection to external terminals is performed (step g). In this case, plating is performed by a method of further plating Pd after Ni plating, a method of further plating Au after Ni plating (plating is electrolytic or electroless plating), or a method using a solder leveler.

  In the present invention, not limited to the above example, various substrates can be formed. For example, it is also possible to use a substrate as a molding material or a substrate with a copper foil and a prepreg, and use the prepreg as an adhesive layer to form a multilayer.

  Further, in an embodiment in which a substrate as a prepreg or a molding material is bonded to a copper foil, the above-described dielectric material powder, magnetic material powder, dielectric-coated metal powder, insulator-coated magnetic metal powder, and a flame retardant and a resin as required. A hybrid material paste obtained by kneading a high-boiling point solvent such as butyl carbitol acetate may be formed on a patterned substrate by screen printing or the like, whereby the characteristics can be improved.

  An electronic component can be obtained by combining such a prepreg, a substrate with a copper foil, a laminated substrate, and the like with an element configuration pattern and a configuration material.

  The electronic component according to the present invention includes an antenna and an RF module (RF amplification stage) in combination with a capacitor (capacitor), a coil (inductor), a filter, and the like, or a wiring pattern, an amplifying element, and a functional element. , A high frequency electronic circuit such as a VCO (voltage controlled oscillation circuit) and a power amplifier (power amplification stage), and a high frequency electronic component such as a superposition module used for an optical pickup.

Hereinafter, the present invention will be described in more detail by showing specific experimental examples and examples of the present invention.
<Experimental example 1>
Hybrid materials obtained by preparing materials shown in Tables 1-1 and 1-2 as resin materials, and mixing dielectric material powders and magnetic material powders shown in Tables 1-1 and 1-2 at a predetermined ratio. The dielectric constant ε of each material was measured. The results are shown in Tables 1-1 and 1-2. In addition, a decrease in dielectric constant when a magnetic material is included is shown together with a comparative sample. In Table 1-1, a sample having a dielectric material powder content of 50% by volume represents a conventional comparative sample, and a sample having a dielectric material powder content of 60% by volume represents a sample of the present invention. In Table 1-1, (ε × μ) ^1/2 was calculated as μ = 1 because no magnetic material powder was contained.

As is clear from Tables 1-1 and 1-2, the maximum content of the dielectric material powder and the magnetic material powder contained in the resin used is 50 to 60% by volume as compared with the conventional dielectric material powder. %, And the dielectric constant also increases. It can also be seen that (ε × μ) ^1/2 is rather increased when the magnetic material powder is mixed.

<Example 1>
1 and 2 are views showing an inductor according to a first embodiment of the present invention. FIG. 1 is a transparent perspective view, and FIG. 2 is a sectional view.

  In the figure, an inductor 10 includes a constituent layer (prepreg or substrate) 10a to 10e having the resin of the present invention, an internal conductor (coil pattern) 13 formed on the constituent layers 10b to 10e, and an internal conductor 13 And a via hole 14 for electrical connection. This via hole 14 can be formed by drilling, laser processing, etching or the like. The terminal ends of the formed coils are connected to the through vias 12 formed on the end faces of the inductor 10 and the land patterns 11 formed slightly in the vertical direction from the through vias 12. The through via 12 has a structure cut in half by dicing, V-cut or the like. This is because a plurality of elements are formed on the collective substrate and cut from the center of the through via 12 when finally cut into individual pieces.

  At least one of the constituent layers 10a to 10e of the inductor 10 has at least a projected shape of a circle, a flat circle, or an ellipse, and particularly has an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material in which a certain dielectric is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  When considering the use of this composite dielectric material as a chip inductor for high frequency use, it is necessary to reduce the distributed capacitance as much as possible, so that the relative dielectric constant is preferably set to 2.6 to 3.5. In some cases, the distributed capacitance is positively used in the inductor forming the resonance circuit. In such an application, the relative dielectric constant is preferably set to 5 to 40. In this manner, the size of the element can be reduced and the capacitor can be omitted. In addition, in this inductor, it is necessary to minimize material loss. For this reason, by setting the dielectric loss tangent (tan δ) to 0.0025 to 0.0075, it is possible to obtain an inductor with very low material loss and high Q. Further, when considering an application for removing noise, it is necessary to increase the impedance as much as possible at the frequency of the noise to be removed. In such a case, it is preferable to adjust the magnetic permeability to 3 to 20. As a result, the effect of removing high-frequency noise can be significantly improved. The constituent layers may be the same or different, and an optimum combination may be selected.

  The equivalent circuit is shown in FIG. As shown in FIG. 10A, the equivalent circuit is an electronic component (inductor) having the coil 31.

<Example 2>
FIGS. 3 and 4 are views showing an inductor according to a second embodiment of the present invention. FIG. 3 is a transparent perspective view, and FIG. 4 is a sectional view.

  In this example, a configuration in which the coil pattern wound in the vertical direction in the first embodiment is replaced by a helical winding wound in the horizontal direction is shown. Other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Example 3>
5 and 6 are views showing an inductor according to a third embodiment of the present invention. FIG. 5 is a transparent perspective view, and FIG. 6 is a sectional view.

  In this example, the coil pattern wound in the up-down direction in the first embodiment has a configuration in which spirals on the upper and lower surfaces are connected. Other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Example 4>
7 and 8 are views showing an inductor according to a fourth embodiment of the present invention. FIG. 7 is a transparent perspective view, and FIG. 8 is a sectional view.

  In this example, the coil pattern wound in the vertical direction in the first embodiment is configured as a meander-shaped pattern formed inside. Other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Example 5>
FIG. 9 is a perspective view showing an inductor according to a fifth embodiment of the present invention.

  In this example, an embodiment is shown in which the coils configured independently in the first embodiment are replaced with four coils. With such a configuration, space can be saved. Other components are the same as those in the first embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted. The equivalent circuit is shown in FIG. As shown in FIG. 10B, the equivalent circuit is an electronic component (inductor) in which four coils 31a to 31d are provided in series.

<Example 6>
11 and 12 are views showing a capacitor (capacitor) according to a sixth embodiment of the present invention. FIG. 11 is a perspective perspective view, and FIG. 12 is a sectional view.

  In the figure, a capacitor 20 includes constituent layers (prepreg or substrate) 20a to 20g having the resin of the present invention, an internal conductor (internal electrode pattern) 23 formed on the constituent layers 20b to 20g, And a via pattern 22 formed on the end face of the capacitor, which is alternately connected to each other, and a land pattern 21 formed slightly upward and downward from the through via 22.

  At least one of the constituent layers 20a to 20g of the capacitor 20 has at least a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle size of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material in which a certain dielectric is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  This composite dielectric material preferably has a relative permittivity of 2.6 to 40 and a dielectric loss tangent of 0.0025 to 0.025 in consideration of the variety and accuracy of the obtained capacitance. As a result, the range of the obtained capacitance is widened, and a low capacitance value can be formed with high accuracy. In addition, it is necessary to minimize material loss. Therefore, by setting the dielectric loss tangent (tan δ) to 0.0025 to 0.025, a capacitor with extremely low material loss can be obtained. The constituent layers may be the same or different, and an optimum combination may be selected.

  The equivalent circuit is shown in FIG. As shown in FIG. 14A, the equivalent circuit is an electronic component (capacitor) having the capacitor 32.

<Example 7>
FIG. 13 is a perspective view showing a capacitor according to a seventh embodiment of the present invention.

  In this example, an embodiment is shown in which the capacitors configured independently in the sixth embodiment are arranged in a plurality of arrays to form four units. When the capacitors are formed in an array, various capacitances may be formed with high accuracy. Therefore, it can be said that the above ranges of the dielectric constant and the dielectric loss tangent are preferable. Other components are the same as those in the sixth embodiment, and the same components are denoted by the same reference numerals and description thereof is omitted. The equivalent circuit is shown in FIG. As shown in FIG. 14B, the equivalent circuit is an electronic component (capacitor) in which four capacitors 32a to 32d are provided in series.

Example 8
FIGS. 15 to 18 show a balun transformer according to an eighth embodiment of the present invention. 15 is a transparent perspective view, FIG. 16 is a sectional view, FIG. 17 is an exploded plan view of each constituent layer, and FIG. 18 is an equivalent circuit diagram.

  15 to 17, the balun transformer 40 includes an internal GND conductor 45 disposed above, below, and in the middle of a laminated body in which the constituent layers 40 a to 40 o are laminated, and an internal conductor 43 formed between the internal GND conductors 45. Having. The internal conductor 43 connects the spiral conductor 43 having a length of λg / 4 with a via hole 44 or the like so as to form the coupling lines 53a to 53d shown in the equivalent circuit of FIG.

  At least one of the constituent layers 40a to 40o of the balun transformer 40 has at least a projected shape of a circle, a flat circle, or an ellipse, particularly an average particle diameter of 1 to 50 μm, and a sphericity of 0.9 to 1.0. A composite dielectric material in which a dielectric material is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  This composite dielectric material preferably has a relative dielectric constant of 2.6 to 40 and a dielectric loss tangent (tan δ) of 0.0025 to 0.025. Further, the magnetic permeability is preferably set to 3 to 20 depending on the use. The constituent layers may be the same or different, and an optimal combination may be selected.

<Example 9>
19 to 22 show a laminated filter according to a ninth embodiment of the present invention. 19 is a perspective view, FIG. 20 is an exploded perspective view, FIG. 21 is an equivalent circuit diagram, and FIG. 22 is a transfer characteristic diagram. Note that this laminated filter is configured as a two-pole filter.

  19 to 21, the multilayer filter 60 has a pair of strip lines 68 and a pair of capacitor conductors 67 substantially at the center of the stacked body in which the constituent layers 60a to 60e are stacked. The capacitor conductor 67 is formed on the lower constituent layer group 60d, and the strip line 68 is formed on the constituent layer 60c thereabove. GND conductors 65 are formed at the upper and lower ends of the constituent layers 60a to 60e, and sandwich the strip line 68 and the capacitor conductor 67 therebetween. The strip line 68, the capacitor conductor 67, and the GND conductor 65 are respectively connected to an end electrode (external terminal) 62 formed on an end face and a land pattern 61 formed slightly upward and downward from the end electrode (external terminal). In addition, GND patterns 66 formed on both side surfaces thereof and slightly upward and downward are connected to the GND conductor 65.

  The strip line 68 is a strip line 74a, 74b having a length of λg / 4 or less as shown in the equivalent circuit diagram of FIG. 21, and the capacitor conductor 67 forms an input / output coupling capacitance Ci. The strip lines 74a and 74b are coupled by a coupling capacitance Cm and a coupling coefficient M. With such an equivalent circuit, a multilayer filter having a two-pole type transfer characteristic as shown in FIG. 22 can be obtained.

  At least any one of the constituent layers 60a to 60e of the laminated filter 60 has at least a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material in which a dielectric material is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  By setting the relative dielectric constant of the composite dielectric material to 2.6 to 40, desired transfer characteristics can be obtained in a band of several hundred MHz to several GHz. Further, it is desirable to minimize the material loss of the stripline resonator, and it is preferable to set the dielectric loss tangent (tan δ) to 0.0025 to 0.0075. The constituent layers may be the same or different, and an optimal combination may be selected.

<Example 10>
23 to 26 show a laminated filter according to a tenth embodiment of the present invention. Here, FIG. 23 is a perspective view, FIG. 24 is an exploded perspective view, FIG. 25 is an equivalent circuit diagram, and FIG. 26 is a transfer characteristic diagram. In addition, this laminated filter is comprised as a 4-pole.

  23 to 26, the laminated filter 60 has four strip lines 68 and a pair of capacitor conductors 67 at substantially the center of the laminated body in which the constituent layers 60a to 60e are laminated. Other components are the same as those of the ninth embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Example 11>
FIGS. 27 to 32 show a block filter according to an eleventh embodiment of the present invention. 27 is a transparent perspective view, FIG. 28 is a front view, FIG. 29 is a side sectional view, FIG. 30 is a plan sectional view, FIG. 31 is an equivalent circuit diagram, and FIG. 32 is a transparent side view showing the structure of a mold. is there. This block filter is configured as a two-pole filter.

  27 to 32, the block filter 80 has a pair of coaxial conductors 81 and a capacitor coaxial conductor 82 formed in a constituent block 80a. The coaxial conductor 81 and the capacitor coaxial conductor 82 are formed of a conductor formed in a hollow shape so as to hollow out the constituent block 80a. Further, a surface GND conductor 87 is formed around the constituent block 80a so as to cover the constituent block 80a. A capacitor conductor 83 is formed at a portion corresponding to the capacitor coaxial conductor 82. Further, the capacitor conductor 83 and the surface GND conductor 87 are also used as input / output terminals and component fixing terminals. In addition, the coaxial conductor 81 and the capacitor coaxial conductor 82 form a transmission path by attaching a conductive material to the inside of a hollow hole formed so as to cut out the constituent block 80a by electroless plating, vapor deposition, or the like.

  The coaxial conductor 81 is a coaxial line 94a, 94b having a length of λg / 4 or less shown in the equivalent circuit diagram of FIG. 31, and a GND conductor 87 is formed so as to surround them. The capacitor coaxial conductor 82 and the capacitor conductor 83 constitute an input / output coupling capacitance Ci. The coaxial conductors 81 are coupled by a coupling capacitance Cm and a coupling coefficient M. With such a configuration, an equivalent circuit as shown in FIG. 31 is obtained, and a block filter having a two-pole type transfer characteristic can be obtained.

  FIG. 32 is a schematic sectional view showing an example of a mold for forming the constituent blocks 80a of the block filter 80. In the figure, the mold has a resin base 104 and a resin base 106 formed in a metal base 103 such as iron, and is connected to these to form part forming parts 105a and 105b. The composite resin material for forming the constituent block 80a is injected in a liquid state from the resin injection port 104, and reaches the component forming portions 105a and 105b through the injection hole 106. Then, with the inside of the mold filled with the composite resin, cooling or heat treatment is performed to solidify the composite resin, take out from the mold, and cut unnecessary portions hardened at an injection port or the like. Thus, the configuration block 80a shown in FIGS. 27 to 30 is formed.

  The component block 80a thus formed is subjected to plating, etching, printing, sputtering, vapor deposition, and other processes to form a surface GND conductor 87 and a coaxial conductor 81 formed of copper, gold, palladium, platinum, aluminum, or the like. The capacitor coaxial conductor 82 and the like are formed.

  The constituent block 80a of the block filter 80 has at least a dielectric material having a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0 in a resin. Is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  By setting the relative permittivity of the constituent block 80a of the block filter 80 to 2.6 to 40, desired transfer characteristics can be obtained in a band of several hundred MHz to several GHz. Further, it is desirable to minimize the material loss of the coaxial resonator, and it is preferable to set the dielectric loss tangent (tan δ) to 0.0025 to 0.0075.

<Example 12>
33 to 37 show a coupler according to a twelfth embodiment of the present invention. 33 is a transparent perspective view, FIG. 34 is a sectional view, FIG. 35 is an exploded plan view of each constituent layer, FIG. 36 is an internal connection diagram, and FIG. 37 is an equivalent circuit diagram.

  33 to 37, a coupler 110 includes an internal GND conductor 115 formed and arranged above and below a laminated body in which constituent layers 110 a to 110 c are laminated, and an internal conductor 113 formed between the internal GND conductors 115. Have. The internal conductor 113 is spirally connected by a via hole 114 or the like so that a transformer is constituted by two coils. Also. As shown in FIG. 36, the end of the formed coil and the internal GND conductor 115 are connected to the through via 112 formed on the end face and the land pattern 111 formed slightly upward and downward from the through via 112, respectively. . With this configuration, the coupler 110 in which the two coils 125a and 125b are coupled can be obtained as shown in the equivalent circuit diagram of FIG.

  At least one of the constituent layers 110a to 110c of the coupler 110 has at least a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material in which a certain dielectric is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  In order to realize a wider band, it is preferable that the relative permittivity of this composite dielectric material be as small as possible. Further, considering the miniaturization, it is better that the relative permittivity is as high as possible. Therefore, a material having a dielectric constant suitable for the application, required performance, specifications, and the like may be used. Usually, by setting the relative permittivity to 2.6 to 40, a desired transfer characteristic can be obtained in a band of several hundred MHz to several GHz. In order to increase the Q value of the internal inductor, the dielectric loss tangent (tan δ) is preferably set to 0.0025 to 0.0075. As a result, an inductor having a very small material loss and a high Q value can be formed, and a high-performance coupler can be obtained. The constituent layers may be the same or different, and an optimal combination may be selected.

<Example 13>
38 to 40 are views showing an antenna according to a thirteenth embodiment of the present invention. FIG. 38 is a transparent perspective view, FIG. 39 (a) is a plan view, FIG. c) is a front sectional view, and FIG. 40 is an exploded perspective view of each constituent layer.

  In the figure, the antenna 130 has constituent layers (prepregs or substrates) 130a to 130c having the resin of the present invention, and internal conductors (antenna patterns) 133 formed on the constituent layers 130b and 130c, respectively. The end of the internal conductor 133 is connected to a through via 132 formed on the end face of the antenna and a land pattern 131 formed slightly in the vertical direction from the through via 132. In this example, the internal conductor 133 is configured as a reactance element having a length of about λg / 4 with respect to a used frequency, and is formed in a meander shape.

  At least one of the constituent layers 130a to 130c of the antenna 130 has at least a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material in which a certain dielectric is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  In order to realize a wider band, it is preferable that the relative permittivity of this composite dielectric material be as small as possible. Further, considering the miniaturization, it is better that the relative permittivity is as high as possible. Therefore, a material having a dielectric constant suitable for the application, required performance, specifications, and the like may be used. Usually, it is preferable that the relative dielectric constant is 2.6 to 40 and the dielectric loss tangent is 0.0025 to 0.025. Thereby, the range of the frequency is widened, and the frequency can be formed with high accuracy. In addition, it is necessary to minimize material loss. Therefore, by setting the dielectric loss tangent (tan δ) to 0.0025 to 0.025, an antenna with extremely small material loss can be obtained. Further, the magnetic permeability is preferably set to 3 to 20 depending on the use. The constituent layers may be the same or different, and an optimum combination may be selected.

<Example 14>
FIGS. 41 and 42 show an antenna according to a fourteenth embodiment of the present invention. FIG. 41 is a transparent perspective view, and FIG. 42 is an exploded perspective view. The antenna of this example is configured as an antenna having a helical internal electrode.

  41 and 42, an antenna 140 includes constituent layers (prepregs or substrates) 140a to 140c having the resin of the present invention and internal conductors (antenna patterns) 143a and 143b formed on the constituent layers 140b and 140c, respectively. Having. The upper and lower internal conductors 143a and 143b are connected via a via hole 144 to form a helical inductance element. Other components are the same as those of the thirteenth embodiment, and the same components are denoted by the same reference numerals and description thereof is omitted.

<Example 15>
43 and 44 are views showing a patch antenna according to a fifteenth embodiment of the present invention. FIG. 43 is a transparent perspective view, and FIG. 44 is a sectional view.

  In the figure, a patch antenna 150 faces a constituent layer (prepreg or substrate) 150a having the composite resin of the present invention, a patch conductor 159 (antenna pattern) formed on the constituent layer 150a, and the patch conductor 159. Conductor 155 formed on the bottom surface of component layer 150a as described above. A power supply through conductor 154 is connected to the patch conductor 159 at a power supply portion 153, and a gap 156 is provided between the through conductor 154 and the GND conductor 155 so that the through conductor 154 is not connected to the GND conductor 155. For this reason, power is supplied from below the GND conductor 155 through the through conductor 154.

  The constituent layer 150a of the patch antenna 150 includes at least a dielectric material having a projected shape of a circle, a flat circle, or an ellipse, in particular, having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material dispersed therein is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  In order to realize a wider band, it is preferable that the relative permittivity of this composite dielectric material be as small as possible. Further, considering the miniaturization, it is better that the relative permittivity is as high as possible. Therefore, a material having a dielectric constant suitable for the application, required performance, specifications, and the like may be used. Usually, it is preferable that the relative dielectric constant is 2.6 to 40 and the dielectric loss tangent is 0.0025 to 0.025. Thereby, the range of the frequency is widened, and the frequency can be formed with high accuracy. In addition, it is necessary to minimize material loss. For this reason, by setting the dielectric loss tangent (tan δ) to 0.0025 to 0.025, an antenna with extremely low radiation loss and high radiation efficiency can be obtained.

  Further, in a frequency band of several hundred MHz or less, a magnetic substance can have the same wavelength shortening effect as a dielectric substance, and can further increase the inductance value of the radiating element. Also, by matching the frequency peak of Q, a high Q can be obtained even at a relatively low frequency. For this reason, the magnetic permeability is preferably set to 3 to 20 depending on the use. As a result, high characteristics and miniaturization can be realized in a frequency band of several hundred MHz or less. The constituent layers may be the same or different, and an optimum combination may be selected.

<Example 16>
45 and 46 are views showing a patch antenna according to a sixteenth embodiment of the present invention. FIG. 45 is a transparent perspective view, and FIG. 46 is a sectional view.

  In the figure, a patch antenna 160 faces a constituent layer (prepreg or substrate) 160a having the composite resin of the present invention, a patch conductor 169 (antenna pattern) formed on the constituent layer 160a, and the patch conductor 169. And a GND conductor 165 formed on the bottom surface of the constituent layer 160a. Further, a power supply conductor 161 for power supply is arranged near the patch conductor 169 so as not to come into contact with the patch conductor 169, and power is supplied from the power supply terminal 162 via the power supply terminal 162. The power supply terminal 162 can be formed of copper, gold, palladium, platinum, aluminum, or the like by performing a process such as plating, termination, printing, sputtering, or vapor deposition. Other components are the same as those of the fifteenth embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Example 17>
47 and 48 are views showing a multi-layered patch antenna according to a seventeenth embodiment of the present invention. FIG. 47 is a transparent perspective view, and FIG. 48 is a sectional view.

  In the figure, a patch antenna 170 includes constituent layers (prepregs or substrates) 150a and 150b having the composite resin of the present invention, patch conductors 159a and 159e formed on the constituent layers 150a and 150b, and patch conductors 159a and 159e. And GND conductor 155 formed on the bottom surface of component layer 150b so as to face 159e. A power supply through conductor 154 is connected to the patch conductor 159a at a power supply portion 153a. The through conductor 154 is connected between the GND conductor 155 and the patch conductor 159e so as not to be connected to the GND conductor 155 and the patch conductor 159e. A gap 156 is provided. For this reason, power is supplied to the patch conductor 159a from the lower portion of the GND conductor 155 through the through conductor 154. At this time, power is supplied to the patch conductor 159e by capacitive coupling with the patch conductor 159a and capacitance formed by a gap with the through conductor 154. Other components are the same as those of the fifteenth embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

<Example 18>
FIGS. 49 and 50 are views showing a multiple patch antenna according to the eighteenth embodiment of the present invention. FIG. 49 is a perspective view, and FIG. 50 is a sectional view.

  This example shows a mode in which the patch antennas configured independently in the seventeenth example are arranged in a plurality of arrays to form four patches. In the figure, constituent layers 150a and 150b having the composite resin of the present invention, patch conductors 159a, 159b, 159c and 159d formed on the constituent layer 150a, and patch conductors 159e formed on the constituent layer 150b 159f, 159g, 159h, and a GND conductor 155 formed on the bottom surface of the constituent layer 150b so as to face the patch conductors 159a, 159e. Other components are the same as those of the eighteenth embodiment, and the same components are denoted by the same reference numerals and description thereof will be omitted.

  By forming the array in this manner, the size of the set can be reduced and the number of components can be reduced.

<Example 19>
FIGS. 51 to 53 show a VCO (voltage controlled oscillator) according to a nineteenth embodiment of the present invention. 51 is a transparent perspective view, FIG. 52 is a sectional view, and FIG. 53 is an equivalent circuit diagram.

  51 to 53, the VCO includes an electronic component 261 such as a capacitor, an inductor, a semiconductor, and a resistor formed and arranged on a laminate in which the constituent layers 210a to 210g are stacked, and a VCO in the constituent layers 210a to 210g and It has conductor patterns 262, 263, 264 formed on its upper and lower surfaces. Since this VCO is configured by an equivalent circuit as shown in FIG. 53, it has a strip line 263, a capacitor, a signal line, a semiconductor, a power supply line, and the like. For this reason, it is effective to form the constituent layers with materials suitable for each function.

  In this example, at least one of the constituent layers 210a to 210g has at least a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material in which a certain dielectric is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  It is preferable to use a dielectric layer having a dielectric loss tangent of 0.0025 to 0.0075 for the constituent layers 210f and 210g constituting the resonator. It is preferable to use a composite dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 5 to 40 for the capacitor constituent layers 210c to 210e. It is preferable to use a dielectric layer having a dielectric loss tangent of 0.0025 to 0.0075 and a relative dielectric constant of 2.6 to 5.0 for the wiring and the inductor constituent layers 210a and 210b.

  On the surfaces of the constituent layers 210a to 210g, a strip line 263, a GND conductor 262, a capacitor conductor 264, a wiring inductor conductor 265, and a terminal conductor 266, which are internal conductors, are formed. Each internal conductor is vertically connected by a via hole 214, and a mounted electronic component 261 is mounted on the surface to form a VCO as shown in an equivalent circuit of FIG.

  With this configuration, the dielectric constant, Q, and dielectric loss tangent suitable for each function can be obtained, and high performance, small size, and thinness can be achieved.

<Example 20>
FIGS. 54 to 56 show a power amplifier (power amplifier) according to a twentieth embodiment of the present invention. Here, FIG. 54 is an exploded plan view of each constituent layer, FIG. 55 is a sectional view, and FIG. 56 is an equivalent circuit diagram.

  54 to 56, the power amplifier includes electronic components 361 such as capacitors, inductors, semiconductors, and resistors formed and arranged on a stacked body in which the constituent layers 300a to 300e are stacked, and the power amplifiers in the constituent layers 300a to 300e. And conductive patterns 313 and 315 formed on the upper and lower surfaces thereof. Since this power amplifier is constituted by an equivalent circuit as shown in FIG. 56, it has strip lines L11 to L17, capacitors C11 to C20, signal lines, power supply lines to semiconductors, and the like. For this reason, it is effective to form the constituent layers with materials suitable for each function.

  In this example, at least one of the constituent layers has at least one of a dielectric material having a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. Are dispersed in a resin. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  In this case, it is preferable to use a composite dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 2.6 to 40 for the constituent layers 300d and 300e constituting the strip line. It is preferable to use a composite dielectric layer having a dielectric loss tangent of 0.0025 to 0.025 and a relative dielectric constant of 5 to 40 for the capacitor constituent layers 300a to 300c.

  On the surfaces of these constituent layers 300a to 300e, an internal conductor 313, a GND conductor 315 and the like are formed. Each internal conductor is vertically connected by a via hole 314, and mounted electronic components 361 are mounted on the surface to form a power amplifier as shown in an equivalent circuit of FIG.

  With this configuration, the dielectric constant, Q, and dielectric loss tangent suitable for each function can be obtained, and high performance, small size, and thinness can be achieved.

<Example 21>
FIGS. 57 to 59 show a superposition module used in an optical pickup or the like according to a twenty-first embodiment of the present invention. Here, FIG. 57 is an exploded plan view of each constituent layer, FIG. 58 is a sectional view, and FIG. 59 is an equivalent circuit diagram.

  In FIGS. 57 to 59, the superimposed module includes electronic components 461 such as capacitors, inductors, semiconductors, and resistors formed and arranged on a stacked body in which the constituent layers 400a to 400k are stacked. And conductive patterns 413 and 415 formed on the upper and lower surfaces thereof. Since this superimposition module is configured by an equivalent circuit as shown in FIG. 59, it has inductors L21 and L23, capacitors C21 to C27, signal lines, power supply lines to semiconductors, and the like. For this reason, it is effective to form the constituent layers with materials suitable for each function.

  In this example, at least one of the constituent layers 400a to 400k has at least a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material in which a certain dielectric is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  In this case, it is preferable to use a composite dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 10 to 40 for the capacitor constituent layers 400d to 400h. It is preferable to use a composite dielectric layer having a dielectric loss tangent of 0.0025 to 0.0075 and a relative dielectric constant of 2.6 to 5.0 for the constituent layers 400a to 400c and 400j to 400k that constitute the inductor. .

  On the surfaces of these constituent layers 400a to 400k, an internal conductor 413, a GND conductor 415, and the like are formed. The respective internal conductors are vertically connected by via holes 414, and mounted electronic components 461 are mounted on the surface to form a superimposed module as shown in the equivalent circuit of FIG.

  With this configuration, the dielectric constant, Q, and dielectric loss tangent suitable for each function can be obtained, and high performance, small size, and thinness can be achieved.

<Example 22>
FIGS. 60 to 63 show an RF module according to a twenty-second embodiment of the present invention. Here, FIG. 60 is a perspective view, FIG. 61 is a perspective view with the exterior member removed, FIG. 62 is an exploded perspective view of each constituent layer, and FIG. 63 is a cross-sectional view.

  60 to 63, the RF module includes electronic components 561 such as a capacitor, an inductor, a semiconductor, and a resistor formed and arranged on a stacked body in which the constituent layers 500a to 500i are stacked. And conductor patterns 513, 515, 572 formed on the upper and lower surfaces thereof and an antenna pattern 573. This RF module has an inductor, a capacitor, a signal line, a power supply line to a semiconductor, and the like as described above. For this reason, it is effective to form the constituent layers with materials suitable for each function.

  In this example, at least one of the constituent layers 500a to 500i has at least a projected shape of a circle, a flat circle, or an ellipse, particularly an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material in which a certain dielectric is dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  In this case, it is preferable to use a composite dielectric layer having 0.0025 to 0.0075 and a relative permittivity of 2.6 to 5.0 for the antenna configuration, the strip line configuration, and the wiring layers 500a to 500d and 500g. It is preferable to use a composite dielectric layer having a dielectric loss tangent of 0.0075 to 0.025 and a relative dielectric constant of 10 to 40 for the capacitor constituent layers 500e to 500f. It is preferable to use a composite dielectric layer having a magnetic permeability of 3 to 20 for the power supply line layers 500h to 500i.

  On the surfaces of these constituent layers 500a to 500i, an internal conductor 513, a GND conductor 515, an antenna conductor 573, and the like are formed. The respective internal conductors are vertically connected by via holes 514, and mounted electronic components 561 are mounted on the surface to form an RF module.

  With this configuration, the dielectric constant, Q, and dielectric loss tangent suitable for each function can be obtained, and high performance, small size, and thinness can be achieved.

<Example 23>
FIGS. 64 and 65 show a resonator according to a twenty-third embodiment of the present invention. Here, FIG. 64 is a transparent perspective view, and FIG. 65 is a cross-sectional view.

  64 and 65, the resonator has a through-hole-shaped coaxial conductor 641 formed in a base material 610. The forming method is the same as that of the block filter of the eleventh embodiment. That is, a process such as plating, etching, printing, sputtering, or vapor deposition is performed on the molded base material 610, and a surface GND conductor 647 formed of copper, gold, palladium, platinum, aluminum, or the like, and the surface GND A coaxial conductor 641 connected to the conductor 647 by the end electrode 682 and a resonator HOT terminal 681 connected to the coaxial conductor 641 are formed. The coaxial conductor 641 is a coaxial line having a certain characteristic impedance, and a surface GND conductor 647 is formed so as to surround these.

  The base material 610 of this resonator includes at least a dielectric material having a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0 in a resin. Is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  By setting the relative dielectric constant of the base material 610 of the resonator to 2.6 to 40, desired resonance characteristics can be obtained in a band of several hundred MHz to several GHz. Further, it is desirable to suppress the material loss of the resonator as much as possible, and it is preferable to set the dielectric loss tangent (tan δ) to 0.001 to 0.0075.

<Example 24>
FIGS. 66 and 67 show a strip resonator according to a twenty-fourth embodiment of the present invention. Here, FIG. 66 is a transparent perspective view, and FIG. 67 is a cross-sectional view.

  66 and 67, the strip resonator has a rectangular strip conductor 784 and a rectangular GND conductor 783 arranged so as to sandwich it from above and below via a constituent layer 710. Further, a HOT terminal 781 for a resonator and a GND terminal 782 are formed and connected to both ends of the strip conductor 784. Other forming methods are the same as those of the inductor of the first embodiment.

  The material of the constituent layer 710 of this resonator includes at least a dielectric material having a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  By setting the relative permittivity of the composite dielectric material to 2.6 to 40, desired resonance characteristics can be obtained in a band of several hundred MHz to several GHz. Further, it is desirable to suppress the material loss of the resonator as much as possible, and it is preferable to set the dielectric loss tangent (tan δ) to 0.001 to 0.0075.

<Example 25>
FIG. 68 is a transparent perspective view showing a resonator according to the twenty-fifth embodiment of the present invention.

  In FIG. 68, as in the twenty-third embodiment, two through-hole coaxial conductors 841 and 842 are formed in a base member 810 as in the twenty-third embodiment. The surface GND conductor 847, the coaxial conductor 842 connected to the surface GND conductor 847 by the end electrode 882, the coaxial conductor 841 connected to the coaxial conductor 842 via the connection electrode 885, and the coaxial conductor A resonator HOT terminal 881 and the like connected to 841 are formed. The coaxial conductors 841 and 842 are coaxial lines having a certain characteristic impedance, and a surface GND conductor 847 is formed so as to surround them.

  In the base material 810 of this resonator, at least a dielectric material having a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0 is contained in a resin. Is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  By setting the relative permittivity of the composite dielectric material to 2.6 to 40, desired resonance characteristics can be obtained in a band of several hundred MHz to several GHz. Further, it is desirable to suppress the material loss of the resonator as much as possible, and it is preferable to set the dielectric loss tangent (tan δ) to 0.001 to 0.0075.

<Example 26>
FIG. 69 is a transparent perspective view showing a strip resonator according to a twenty-sixth embodiment of the present invention.

  In FIG. 69, as in the twenty-fourth embodiment, the strip resonator includes a U-shaped strip conductor 884 and a rectangular GND conductor 883 arranged so as to sandwich the strip conductor 884 from above and below via a constituent layer 810. Have. A resonator HOT terminal 881 and a GND terminal 882 are formed and connected to both ends of the strip conductor 884. Other forming methods are the same as those of the inductor of the first embodiment.

  The material of the constituent layer 810 of this resonator includes at least a dielectric material having a projected shape of a circle, a flat circle, or an ellipse, particularly having an average particle diameter of 1 to 50 μm and a sphericity of 0.9 to 1.0. A composite dielectric material dispersed in a resin is used. The composite dielectric material may further contain a magnetic powder for adjusting magnetic properties, and in some cases, may contain these crushed powders.

  By setting the relative permittivity of the composite dielectric material to 2.6 to 40, desired resonance characteristics can be obtained in a band of several hundred MHz to several GHz. Further, it is desirable to suppress the material loss of the resonator as much as possible, and it is preferable to set the dielectric loss tangent (tan δ) to 0.001 to 0.0075.

  FIG. 70 shows an equivalent circuit diagram of the resonators of Examples 23 to 26. In the figure, a resonator HOT terminal 981 is connected to one end of a resonator 984, 941 composed of a coaxial path or a strip line, and a GND terminal 982 is connected to the other end.

<Example 27>
FIG. 71 is a block diagram showing a high-frequency unit of a portable terminal device according to a twenty-seventh embodiment of the present invention.

  In the figure, a transmission signal transmitted from a baseband unit 1010 is mixed by a mixer 1001 with an RF signal from a hybrid circuit 1021. The hybrid circuit 1021 is connected to a voltage control transmission circuit (VCO) 1020, which forms a synthesizer circuit together with the phase lock loop circuit 1019 so that an RF signal of a predetermined frequency is supplied.

  The transmission signal subjected to the RF modulation by the mixer 1001 passes through a band-pass filter (BPF) 1002 and is amplified by a power amplifier 1003. A part of the output of the power amplifier 1003 is taken out from the coupler 1004, adjusted to a predetermined level by the attenuator 1005, and then input to the power amplifier 1003 again to adjust the gain of the power amplifier to be constant. You. The transmission signal transmitted from the coupler 1004 is input to the duplexer 1008 via the isolator 1006 for backflow prevention and the low-pass filter 1007, and is transmitted from the antenna 1009 connected thereto.

  The received signal input to the antenna 1009 is input from the duplexer 1008 to the amplifier 1011 and is amplified to a predetermined level. The received signal output from the amplifier 1011 is input to the mixer 1013 via the band pass filter 1012. The RF signal from the hybrid circuit 1021 is input to the mixer 1013, where the RF signal component is removed and demodulated. The reception signal output from the mixer 1013 is input to the mixer 1016 after being amplified by the amplifier 1015 through the SAW filter 1014. A local transmission signal of a predetermined frequency is input to a mixer 1016 from a local transmission circuit 1018, and the received signal is converted into a desired frequency, amplified by an amplifier 1017 to a predetermined level, and transmitted to a baseband unit. .

  In the present invention, an antenna front-end module 1200 including the antenna 1009, the duplexer 1008, the low-pass filter 1007, an isolator 1006, a coupler 1004, an attenuator 1005, an isolator power amplifier module 1100 including a power amplifier 1003, and the like are provided in the same manner as described above. Thus, a hybrid module can be configured. In addition, it is already shown in Embodiment 22 that components including other components can be configured as an RF unit, and the BPF, VCO, etc. should be configured in accordance with the method shown in Embodiments 9 to 12 and 19. Can be.

  The present invention provides, in addition to the electronic components exemplified above, a coil core, a toroidal core, a disc capacitor, a feedthrough capacitor, a clamp filter, a common mode filter, an EMC filter, a power supply filter, a pulse transformer, a deflection coil, Choke coil, DC-DC converter, delay line, radio wave absorption sheet, thin radio wave absorber, electromagnetic shield, diplexer, duplexer, antenna switch module, antenna front end module, isolator / power amplifier module, PLL module, front end module, tuner Unit, directional coupler, double balanced mixer (DBM), power combiner, power distributor, toner sensor, current sensor, actuator, sounder (piezoelectric sound generator), microphone, laser Over bar, buzzer, PTC thermistors, thermal fuse, can be applied to ferrite magnet or the like.

  In each of the above embodiments, if necessary, halides such as halogenated phosphates and brominated epoxy resins, and organic compounds such as phosphate ester amides, and inorganic materials such as antimony trioxide and aluminum hydride. A flame retardant may be added to each constituent layer.

FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating an inductor that is a configuration example of an electronic component of the present invention. FIG. 3 is an equivalent circuit diagram illustrating an inductor that is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a capacitor that is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a capacitor that is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a capacitor that is a configuration example of the electronic component of the present invention. FIG. 3 is an equivalent circuit diagram illustrating a capacitor that is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a balun transformer which is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a balun transformer which is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a balun transformer which is a configuration example of the electronic component of the present invention. FIG. 2 is an equivalent circuit diagram showing a balun transformer which is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a multilayer filter that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating a multilayer filter that is a configuration example of an electronic component of the present invention. FIG. 3 is an equivalent circuit diagram illustrating a multilayer filter that is a configuration example of the electronic component of the present invention. FIG. 5 is a diagram illustrating transfer characteristics of a multilayer filter that is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a multilayer filter that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating a multilayer filter that is a configuration example of an electronic component of the present invention. FIG. 3 is an equivalent circuit diagram illustrating a multilayer filter that is a configuration example of the electronic component of the present invention. FIG. 5 is a diagram illustrating transfer characteristics of a multilayer filter that is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating a block filter that is a configuration example of an electronic component according to the present invention. FIG. 3 is a diagram illustrating a block filter that is a configuration example of an electronic component according to the present invention. FIG. 3 is a diagram illustrating a block filter that is a configuration example of an electronic component according to the present invention. FIG. 3 is a diagram illustrating a block filter that is a configuration example of an electronic component according to the present invention. FIG. 3 is a diagram showing an equivalent circuit of a block filter which is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating a mold of a block filter which is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a coupler that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a coupler that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a coupler that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram showing internal connections of a coupler which is a configuration example of an electronic component according to the present invention. FIG. 3 is a diagram illustrating an equivalent circuit of a coupler that is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating an antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating an antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating an antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating an antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating an antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a patch antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a patch antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a patch antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a patch antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a patch antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a patch antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a patch antenna that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a patch antenna that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating a VCO that is a configuration example of an electronic component of the present invention. FIG. 3 is a diagram illustrating a VCO that is a configuration example of an electronic component of the present invention. FIG. 2 is an equivalent circuit diagram illustrating a VCO that is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating a power amplifier that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a power amplifier that is a configuration example of an electronic component of the present invention. FIG. 3 is an equivalent circuit diagram illustrating a power amplifier that is a configuration example of the electronic component of the present invention. It is a figure showing the superposition module which is the example of composition of the electronic parts of the present invention. It is a figure showing the superposition module which is the example of composition of the electronic parts of the present invention. FIG. 3 is an equivalent circuit diagram illustrating a superposition module that is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating an RF module that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating an RF module that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating an RF module that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating an RF module that is a configuration example of an electronic component of the present invention. FIG. 2 is a diagram illustrating a resonator that is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating a resonator that is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating a resonator that is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating a resonator that is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating a resonator that is a configuration example of the electronic component of the present invention. FIG. 2 is a diagram illustrating a resonator that is a configuration example of the electronic component of the present invention. FIG. 3 is a diagram illustrating an equivalent circuit of a resonator that is a configuration example of the electronic component of the present invention. FIG. 3 is a block diagram illustrating a high-frequency unit of a portable device that is a configuration example of an electronic component according to the invention. It is a flowchart showing the example of formation of the board with copper foil used for the present invention. It is another process drawing which shows the example of formation of the board | substrate with copper foil used for this invention. It is process drawing which shows the example of formation of a board | substrate with a copper foil. It is another process drawing which shows the example of formation of a board | substrate with a copper foil. FIG. 4 is a process diagram illustrating an example of forming a multilayer substrate. FIG. 4 is a process diagram illustrating an example of forming a multilayer substrate.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 10 Inductor 10a-10e Constituent layer 11 Land pattern 12 Through via 13 Internal conductor (coil pattern)
Reference Signs List 14 via hole 20 capacitor 20a to 20g constituent layer 21 land pattern 22 through via 23 internal conductor (internal electrode pattern)
40 balun transformer 40a to 40o constituent layer 45 GND conductor 43 inner conductor 60 multilayer filter 80 block filter 110 coupler 130, 140 antenna 150, 160, 170 patch antenna

Claims (8)

A composite having a structure in which constituent layers having a resin are laminated to form a multilayer, and at least one of the constituent layers is a composite in which at least a dielectric substance having a projected shape of a circle, a flat circle, or an ellipse is dispersed in a resin. A coupler that is a layer of dielectric material. The coupler of claim 1 further comprising a conductor layer. 3. The coupler according to claim 1, wherein said dielectric substance having a circular projected shape has an average particle diameter of 1 to 50 [mu] m and a sphericity of 0.9 to 1.0. The coupler according to claim 1, wherein the composite dielectric material further contains a magnetic powder. 5. The coupler according to claim 1, wherein said composite dielectric material contains crushed powder. 6. The coupler according to claim 1, wherein said composite dielectric material has a glass cloth embedded therein. 7. The coupler according to claim 1, comprising two or more different composite dielectric materials. The antenna according to any one of claims 1 to 7, wherein at least one composite dielectric material layer contains one or more flame retardants.

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