JP2003273520A - Laminate module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact and high performance laminate module whose constraint on an assembled back pattern is small, and whose electric characteristics are excellent. <P>SOLUTION: Configuring layers 101 to 109 are provided with hybrid materials. Active elements MMIC1 and MMIC2 are disposed on the surface of a multilayer substrate 100. A passive element includes a conductor pattern 50 inside the multilayer substrate 100. An outside connecting terminal and a ground pattern GND are disposed on a backside of the multilayer substrate 100. A blind via hole 30 connects conductor patterns formed on the surface/backside of the multilayer substrate 100 and a conductor pattern in the next layer, and made conductive to the back external connecting terminal or the ground pattern GND with a through-via hole 40. An inner via hole 20 connects conductor patterns 50 inside the multilayer substrate 100. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a laminated module. Specifically, it relates to a laminated module used in a communication device using a microwave band.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable tendency toward miniaturization and high density of mounting methods in the field of electronic equipment for communication, consumer use, industrial use, etc. Heat resistance, dimensional stability, electrical properties and moldability are being demanded.

As a high-frequency laminated module or a high-frequency multilayer substrate, it is already known that a required number of a plurality of constituent layers made of sintered ferrite or sintered ceramic are laminated to form a multilayer. By constructing a multilayer substrate using these materials, there is an advantage that miniaturization can be achieved.

However, when a sintered ferrite substrate or a sintered ceramic substrate is used, the number of manufacturing steps such as a firing step and a thick film printing step is large, and cracks and warps generated during firing are peculiar to the firing material. There are many problems,
Since there are many problems such as cracks due to the difference in thermal expansion coefficient from the printed circuit board, etc.,
The demand for organic resin materials is increasing year by year.

On the other hand, a multi-layered structure in which a constituent layer is made of an organic resin material and a plurality of such layers are laminated is also known. In this multi-layered structure, a sufficient dielectric constant or a sufficient magnetic permeability is obtained. Is also difficult. For this reason, a laminated module simply using an organic resin material has a problem that sufficient characteristics cannot be obtained, the shape becomes large, and it is difficult to reduce the size and thickness.

As a means for solving such a problem,
For example, JP-A-8-69712 and JP-A-11-1
Japanese Patent No. 92620 discloses a method of forming a constituent layer by using a hybrid material in which a functional material powder is mixed with an organic material. However, none of them have obtained sufficient high frequency characteristics and magnetic characteristics.

Further, Japanese Patent Publication No. 6-14600 discloses that
Although an example in which a plurality of materials is formed into multiple layers by the sheet construction method is shown, there are problems such as a large number of steps. Moreover, the frequency considered here is about several hundred MHz, which is several GH.
No consideration has been given to the performance in the high frequency region of z or higher.

Further, in the case of adopting a multi-layered structure, since a conductor pattern is formed inside the laminated substrate and a passive element such as a capacitor or an inductor is constituted by the internal conductor pattern, the conductor pattern is formed inside the laminated substrate. Must be connected. To realize this structure, a through via hole has been conventionally used.

However, the through via hole opens not only on the front surface of the laminated substrate, but also on the back surface. For this reason, a power supply terminal, a signal terminal and a grounding pattern are provided on the back surface,
In the case of a laminated module in which the back surface is mounted face-to-face with a motherboard or the like, there is a problem in that the shape and arrangement of the power supply terminal, the signal terminal, and the grounding pattern are limited due to the through via hole opened in the back surface.

Further, there is a problem that the dead space not connected to the internal conductor pattern increases and the shape and arrangement of the internal conductor pattern are limited.

[0011]

SUMMARY OF THE INVENTION An object of the present invention is to provide a laminated module which is small in size, high in performance, has less restrictions on a back surface pattern to be faced, and has excellent electric characteristics.

[0012]

In order to solve the above-mentioned problems, a laminated module according to the present invention has a laminated substrate, an active element, a passive element, an external connection terminal, a grounding pattern, and a through via hole. , A blind via hole and an inner via hole.

The laminated substrate is formed by laminating a plurality of constituent layers. At least a part of the plurality of constituent layers is made of a hybrid material in which an organic resin material and a functional material powder are mixed.

The active element is disposed on the surface of the laminated substrate, and at least a part of the passive element includes a conductor pattern formed inside the laminated substrate. The external connection terminal and the grounding pattern are provided on the back surface of the laminated substrate.

The through via hole penetrates the laminated substrate in the thickness direction, and one end thereof is electrically connected to the external connection terminal or the ground pattern on the back surface of the laminated substrate.

The blind via hole connects between the conductor pattern provided on the front surface or the back surface of the laminated substrate and the conductor pattern of the next layer, and is electrically connected to the external connection terminal or the ground pattern.

The inner via hole connects the conductor patterns formed inside the laminated substrate.

The laminated module according to the present invention includes a laminated substrate. The laminated substrate is formed by laminating a plurality of constituent layers. At least a part of the constituent layer is made of a hybrid material in which an organic resin material and a functional material powder are mixed. Unlike conventional laminated substrates that use sintered ferrite substrates or sintered ceramic substrates, laminated substrates made of hybrid materials are less prone to cracking and delamination in the processing process, and have excellent mechanical strength. As excellent in reliability. Further, the insulation resistance between the layers does not deteriorate due to cracks, which is convenient for forming a capacitor.

Moreover, the laminated substrate composed of the hybrid material in which the organic resin material and the functional material powder are mixed can be easily punched with holes such as through via holes, inner via holes, blind via holes and thermal via holes by using a punch or a drill. Can be formed into The holes formed in this manner can be filled with a conductive paste (Ag or the like) to form an electrical connection conductor and a heat radiation path. Therefore, various vias can be surely formed without causing positional deviation between layers.

Further, the laminated substrate made of the hybrid material can have desired electrical and magnetic characteristics by selecting the kind of the functional material powder. For example, when the dielectric powder is used as the functional material powder, the dielectric constant can be easily adjusted by selecting the material of the dielectric powder, and unlike the laminated substrate using the sintered ceramic,
A low dielectric constant is possible, and the Q value is higher than that of a laminated substrate using an organic resin material.
z or more, particularly 100 MHz or more and 10 GHz or less)
It is possible to realize the one suitable for use in.

Further, by selecting and using ferrite powder, metal magnetic powder, etc. as the functional material powder, it is possible to freely deal with the use of excellent magnetic properties and the use for the purpose of magnetic shielding.

Further, by selecting the functional material powder, it is possible to obtain a relatively high Q and dielectric constant ε in the high frequency band. Such characteristics are required, for example, when forming a strip line, an impedance matching circuit, a delay circuit, an antenna circuit, and the like. Moreover, it is possible to obtain a laminated substrate having excellent mechanical strength.

Further, as the hybrid material, a copper clad plate to which a copper foil is previously attached can be used. When a copper clad plate is used, a laminated module can be realized by patterning a copper foil and making it into multiple layers.
Since the patterning and the multi-layering process can be performed in the same process as a normal laminated substrate manufacturing process, cost reduction and workability improvement can be achieved. Further, the laminated substrate for a laminated module thus obtained has excellent mechanical strength,
It can have excellent high-frequency characteristics.

In the laminated module according to the present invention, the laminated substrate includes the external connection terminal and the ground pattern.
The external connection terminal includes, for example, a power supply terminal or a signal terminal. The external connection terminal and the grounding pattern are provided on the back surface of the laminated substrate. Therefore, it is possible to obtain a laminated module in which the back surface side opposite to the front surface side on which the active element is provided is faced to the motherboard or the like.

In the laminated module according to the present invention, the laminated substrate includes a through via hole. The through via hole is
The laminated substrate penetrates in the thickness direction, and one end thereof is electrically connected to the external connection terminal or the grounding pattern.

Moreover, in the laminated module according to the present invention, the laminated substrate includes blind via holes in addition to the through via holes. The blind via hole connects between the conductor pattern provided on the front surface or the back surface of the laminated substrate and the conductor pattern of the next layer, and is electrically connected to the external connection terminal or the ground pattern.

Therefore, when it is mounted on a mother board or the like, it can be connected to an external circuit on the back surface side and its electric circuit can be guided to the inside of the laminated substrate and the surface of the laminated substrate through the through via hole and the blind via hole.

Further, by using the through via holes and the blind via holes, the conductor patterns for the active elements mounted on the surface of the laminated board and the passive elements formed inside the laminated board are used for external connection terminals or grounding. Can be connected with patterns.

The present invention further includes an inner via hole. The inner via hole connects the conductor patterns formed inside the laminated substrate and does not appear on the back surface of the laminated substrate. After all, only through via holes, blind via holes, and ground patterns are present on the back surface of the laminated substrate.

Therefore, the numerical aperture on the back surface side of the laminated substrate can be set to the minimum necessary number, the degree of freedom of the arrangement and shape of the terminals on the back surface is increased, and the area of the ground pattern can be secured. Further, the conductor pattern forming region of the inner layer can be effectively used, and the width of the inner conductor pattern can be expanded and a high Q value can be secured while reducing the area of the laminated substrate.

Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely exemplary.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION 1. Laminated Substrate Used in Laminated Module According to the Present Invention In the laminated module according to the present invention, the laminated substrate includes a plurality of constituent layers. At least a part of the plurality of constituent layers is made of a hybrid material in which an organic resin material and a functional material powder are mixed.

The organic resin material is not particularly limited, and can be appropriately selected and used from organic resin materials excellent in moldability, workability, adhesiveness during lamination, and electrical characteristics. Specifically, a thermosetting organic resin material, a thermoplastic organic resin material and the like are preferable.

As the thermosetting organic resin material, epoxy resin, phenol resin, unsaturated polyester resin, vinyl ester resin, polyimide resin, polyphenylene ether (oxide) resin, bismaleimide triazine (cyanate ester) resin, fumarate resin, polybutadiene Examples thereof include resins and vinylbenzyl resins.

As the thermoplastic organic resin material, aromatic polyester resin, polyphenylene sulfide resin, polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene sulfide resin, polyether ether ketone resin, polytetrafluoroethylene resin, graft resin, polyarylate. Resin etc. are mentioned.

Of these, phenol resin, epoxy resin, low dielectric constant epoxy resin, polybutadiene resin, BT resin and the like are particularly preferable as the base resin.

These organic resin materials may be used alone or in combination of two or more. When two or more kinds are mixed and used, the mixing ratio is arbitrary.

In the laminated module according to the present invention, the laminated substrate is formed of the above organic resin material as a constituent layer and has a relative dielectric constant of 2.4 to 4.5 and a dielectric loss tangent of 0.002.
It is preferable to use an organic resin material having a thickness of about 0.03 and have at least one layer. Such an organic resin material is
Since the distributed capacitance can be reduced, it is particularly suitable for forming an inductor element such as a coil.

The particle size of the functional material powder is preferably 0.1 to 100 μm, particularly 0.2 to 100 μm, in view of kneading properties with the organic resin material. When the particle size is small, the surface area of the powder is increased, the viscosity at the time of dispersion and mixing, and the thixotropy are increased, making it difficult to achieve a high filling rate and making it difficult to knead with the organic resin material. Also, as the particle size increases,
It becomes difficult to carry out uniform dispersion and mixing, and sedimentation becomes intense, resulting in non-uniformity, resulting in poor processability when molding a composition containing a large amount of powder.

Generally, the content of the functional material powder is 10% by volume or more and 65% by volume, when the total amount of the organic resin material and the functional material powder is 100% by volume.
It is less than volume%, preferably in the range of 20 volume% or more and 60 volume% or less.

In the laminated module according to the present invention, the laminated substrate has a functional material powder made of a dielectric powder dispersed in the organic resin material as a constituent layer, and the dielectric constant of the dielectric powder is 5 to 5. 10,000, dielectric loss tangent is 0.01
To 0.00002, the content is 10 to 65% by volume, the overall dielectric constant is 5 to 20, and the dielectric loss tangent is 0.00.
It is preferable to use the first hybrid material having a thickness of 25 to 0.0075 and to have at least one layer. With such a structure, an appropriate dielectric constant and a high Q value can be obtained, the transmission loss is reduced, and it is particularly suitable for forming electronic circuits such as balun transformers and power amplifiers.

In the laminated module according to the present invention, the laminated substrate is such that the functional material powder made of dielectric powder is dispersed in the organic resin material, the dielectric powder has a relative dielectric constant of 20 to 20,000, and a dielectric loss tangent. Is 0.05 to 0.000
1, the content is 10 to 65% by volume, the overall dielectric constant is 10 to 40, and the dielectric loss tangent is 0.0075 to 0.0.
It is preferred to use a second hybrid material of 25 and have at least one layer. With such a configuration, it is possible to obtain an appropriate Q value and a high dielectric constant, and it is particularly suitable for forming capacitors, patch antennas, or electronic circuits such as VCOs (voltage controlled oscillators) and power amplifiers.

In the laminated module according to the present invention, the laminated substrate has, as a constituent layer, functional material powder made of magnetic material powder dispersed in the organic resin material, and the content of the magnetic material powder is 10 to 65. It is preferable to use a hybrid material having a volume% and an overall magnetic permeability of 3 to 20 and having at least one layer. With such a configuration, a low dielectric constant is achieved while ensuring an appropriate magnetic permeability, and a high frequency region (100 MHz or more, particularly 100 MHz or more 1
Since it can be used in a range of 0 GHz or less) and the content of the magnetic powder can be increased, it is suitable for a magnetic shield utilizing magnetic characteristics.

The hybrid materials as the constituent layers differ in at least one of the dielectric constant, Q and magnetic permeability. In particular, if two or more of the above constituent layers are contained, it is possible to obtain the characteristics according to the intended structure and function of the laminated module.

The dielectric powder used in the present invention may be any dielectric powder having a relative dielectric constant and Q higher than that of the organic resin material serving as a dispersion medium in the high frequency band, and two or more kinds may be used. . In particular, the dielectric powder used in the present invention preferably has a relative dielectric constant of 10 to 20,000 and a dielectric loss tangent of 0.05 or less. In order to obtain a relatively high dielectric constant, it is preferable to obtain the following materials.

Titanium-barium-neodymium ceramics, titanium-barium-tin ceramics, lead-calcium ceramics, titanium dioxide ceramics, barium titanate ceramics, lead titanate ceramics, strontium titanate ceramics,
Calcium titanate based ceramics, bismuth titanate based ceramics, magnesium titanate based ceramics, CaWO ₄ based ceramics, Ba (Mg, Nb) O ₃
Series ceramics, Ba (Mg, Ta) O ₃ series ceramics, Ba (Co, Mg, Nb) O ₃ series ceramics, B
a (Co, Mg, Ta) O ₃ based ceramics. Titanium dioxide-based ceramics include those containing only titanium dioxide and those containing small amounts of other additives,
It means that the crystal structure of titanium dioxide is retained.
The same applies to other ceramics. In particular, the titanium dioxide ceramics preferably have a rutile structure.

In order to obtain a high Q without increasing the dielectric constant so much, the following materials are preferably used.

Silica, alumina, zirconia, potassium titanate whiskers, calcium titanate whiskers, barium titanate whiskers, zinc oxide whiskers, glass chops, glass beads, carbon fibers, magnesium oxide (talc).

These may be used alone or in combination of two or more. When two or more kinds are mixed and used, the mixing ratio is arbitrary.

The dielectric powder contained in the first hybrid material needs to have a high Q and a certain dielectric constant. In particular, the relative dielectric constant at 2 GHz is 5 to 100
00, and the dielectric loss tangent is preferably 0.01 to 0.00002. With such a structure, it is possible to obtain a hybrid material containing a dielectric powder having a high Q and a relative dielectric constant. The dielectric powder used for the first hybrid material has a relative permittivity of 5 to 2 for the entire first hybrid material.
0, and the dielectric loss tangent may be contained so as to be 0.0025 to 0.0075.

The dielectric powder may be a single crystal powder such as sapphire or a polycrystalline alumina powder, and the type of functional material powder including these is, for example, a dielectric powder having the following composition as a main component. It is preferable. 2 GHz in total
2 shows the relative permittivity ε and Q value in.

Mg₂SiO_Four[Ε = 7, Q = 2000
0], Al₂O₃[Ε = 9.8, Q = 40000], Mg
TiO₃[Ε = 17, Q = 22000], ZnTiO
₃[Ε = 26, Q = 800], Zn₂TiO_Four[Ε = 1
5, Q = 700], TiO₂[Ε = 104, Q = 150
00], CaTiO₃[Ε = 170, Q = 1800],
SrTiO₃[Ε = 255, Q = 700], SrZrO₃
[Ε = 30, Q = 1200], BaTi₂O_Five[Ε = 4
2, Q = 5700], BaTi_FourO₉[Ε = 38, Q = 9
000], Ba₂Ti₉O₂₀[Ε = 39, Q = 900
0], Ba₂(Ti, Sn)₉O₂₀[Ε = 37, Q = 50
00], ZrTiO_Four[Ε = 39, Q = 7000],
(Zr, Sn) TiO_Four[Ε = 38, Q = 7000],
BaNd₂Ti_FiveO₁₄[Ε = 83, Q = 2100], Ba
Sm₂Ti O₁₄[Ε = 74, Q = 2400], Bi₂O ₃
-BaO-Nd₂O₃-TiO₂System [ε = 88, Q = 20
00], PbO-BaO-Nd₂O₃-TiO₂System [ε =
90, Q = 5200], (Bi₂O₃, PbO) -BaO
-Nd₂O₃-TiO₂System [ε = 105, Q = 250
0], La₂Ti₂O₇[Ε = 44, Q = 4000], N
d₂Ti₂O₇[Ε = 37, Q = 1100], (Li, S
m) TiO₃[Ε = 81, Q = 2050], Ba (Mg
_1/3Ta_2/3) O₃[Ε = 25, Q = 35000], Ba
(Zn_1/3Ta_2/3) O₃[Ε = 30, Q = 1400
0], Ba (Zn_1/3Nb_2/3) O₃[Ε = 41, Q = 9
200], Sr (Zn_1/3Nb_2/3) O₃[Ε = 40, Q
= 4000] etc.

More preferably, the following composition is the main component.

TiO ₂ , CaTiO ₃ , SrTiO ₃ , B
aO-Nd ₂ O ₃ -TiO _{2 system, Bi 2 O 3 -BaO-Nd} 2
O ₃ -TiO _{2 system, BaTi 4 O 9, Ba 2} Ti 9 O 20, Ba
₂ (Ti, Sn) ₉ O ₂₀ system, MgO-TiO ₂ system, ZnO
-TiO ₂ system, MgO-SiO ₂ system, Al ₂ O ₃ or the like.

In the laminated module according to the present invention, the first hybrid material constituting the laminated substrate is mainly composed of the organic resin material and the dielectric powder, but the organic resin material and the dielectric powder are used. When the total amount of and is 100% by volume, the content of the dielectric powder is 10% by volume or more 6
It is less than 5% by volume, preferably 20% by volume or more and 60% by volume or less.

If the amount of the dielectric powder is 65% by volume or more, the workability becomes poor. On the other hand, when the content of the dielectric powder is less than 10% by volume, the effect of containing the dielectric powder is not so remarkable.

The first hybrid material according to the present invention is
By appropriately setting each component within the above range, it is possible to make it larger than the dielectric constant obtained from the organic resin material alone, and it is possible to obtain a relative dielectric constant and a high Q as required.

The dielectric powder contained in the second hybrid material needs to have a particularly high dielectric constant.

Preferably, the relative dielectric constant is 20 to 20,000,
The dielectric loss tangent is preferably 0.5 to 0.0001. By dispersing such a dielectric powder in the organic resin material, it is possible to obtain a hybrid material having a higher relative dielectric constant.

The dielectric powder used in the second hybrid material can have a relative permittivity of 10 to 40 and a dielectric loss tangent of 0.0075 to 0.025 in the entire second hybrid material in a high frequency band, particularly 2 GHz. Any powder may be used, and two or more types may be used, but a powder selected from dielectric powders having the following composition as a main component is preferable. The relative permittivity ε at 2 GHz is also shown.

BaTiO ₃ [ε = 1500], (Ba,
Pb) TiO ₃ system [ε = 6000], Ba (Ti, Z
r) O ₃ system [ε = 9000], (Ba, Sr) TiO ₃ system [ε = 7000].

More preferably, BaTiO ₃ , Ba (T
i, Zr) O ₃ -based composition is selected as a dielectric powder.

The dielectric powder may be single crystal or polycrystal powder. The particle size of the dielectric powder is preferably about 0.2 to 100 μm in terms of kneading properties with the organic resin material, and when the particle size is small, kneading with the organic resin material becomes difficult. Further, when the particle size becomes large, it becomes non-uniform, and it is not possible to carry out uniform dispersion, resulting in poor workability during molding of a composition having a large powder content.

In the laminated module according to the present invention, the hybrid material forming the laminated substrate is mainly composed of the organic resin material and the functional material powder made of magnetic powder.
100% by volume of the total amount of organic resin material and functional material powder
, The content of the functional material powder is 10% by volume or more 6
It is less than 5% by volume, preferably 20% by volume or more and 60% by volume or less.

Ferrite powder and metal magnetic powder can be used as the magnetic powder. As the ferrite powder, Mn-Mg-Zn system, Ni-Zn system, Mn-
Zn-based and the like, and Mn-Mg-Zn-based and Ni-Zn-based are preferable.

As the magnetic metal powder, carbonyl iron,
Iron-silicon type alloys, iron-aluminum-silicon type alloys (trade name: Sendust), iron-nickel type alloys (trade name: Permalloy), amorphous type (iron type, cobalt type) and the like are preferable. Means for making these powders may follow known methods such as pulverization and granulation.

The particle size of the magnetic powder is 0.01 to 100 μm.
m, particularly preferably 0.01 to 50 μm, and the average particle size is preferably 1 to 50 μm. With such a particle size, the dispersibility of the magnetic substance powder is improved, and the effect of the present invention is improved. On the other hand, if the particle size of the magnetic powder is smaller than this, the specific surface area becomes large and it becomes difficult to achieve a high filling rate. On the other hand, if it is larger than this, it tends to settle when made into a paste, and it becomes difficult to disperse it uniformly. Further, when it is attempted to form a thin constituent layer or prepreg, it becomes difficult to obtain surface smoothness. It is practically difficult to make the particle size too small, and the limit is about 0.01 μm.

The particle size of the magnetic powder is preferably uniform, and if necessary, the particle size may be adjusted by sieving. The shape of the magnetic powder may be spherical, flat, or elliptical, and may be selected depending on the application. Further, if necessary, the surface may be subjected to treatments such as oxidation, coupling, and coating with an insulating material.

Further, two or more kinds having different kinds and particle size distributions may be used. The mixing ratio at that time is arbitrary, and the materials used, the particle size distribution, and the mixing ratio may be adjusted depending on the application.

The magnetic permeability μ of the magnetic powder is 10 to 1000.
It is preferably 000. In addition, the bulk insulating property is preferably higher because the insulating property as a constituent layer is improved.

In the present invention, the mixing ratio of the organic resin material and the magnetic powder may be such that the magnetic permeability of the entire hybrid material is 3 to 20. In particular,
When the ratio of the organic resin material to the magnetic powder is shown in the paste stage applied to glass cloth or the like, the content of the magnetic powder is preferably 10 to 65% by volume, and more preferably 20 to 60% by volume. By setting the content of such magnetic powder, the magnetic permeability of the entire hybrid material becomes 3 to 20, and the effect according to the present invention is improved. On the other hand, when the content of the magnetic powder is large, it becomes difficult to apply the powder in a chiller, and it becomes difficult to produce the constituent layer and the prepreg. On the other hand, when the content of the magnetic powder is small, the magnetic permeability may not be ensured, and the magnetic characteristics are deteriorated.

In the present invention, the organic resin material and the functional material powder may contain a flame retardant. As the flame retardant used in the present invention, various flame retardants used for flame retardation can be used. In particular,
Halides such as halogenated phosphoric acid esters and brominated epoxy resins, organic compounds such as phosphoric acid ester amides, and inorganic materials such as antimony trioxide and aluminum hydroxide can be used.

In the present invention, reinforcing fibers such as glass cloth may be used. Various kinds of reinforcing fibers may be used depending on the purpose and application, and commercially available products can be used as they are. At this time, the reinforcing fibers are E
Glass cloth (ε = 7, tanδ = 0.0013, 1G
Hz), D glass cloth (ε = 4, tan δ = 0.00
13, 1 GHz), H glass cloth (ε = 11, tan
δ = 0.003, 1 GHz) or the like may be used properly. In addition, a coupling treatment or the like may be performed to improve the interlayer adhesion. Its thickness is 100 μm or less, especially 20
It is preferably ˜60 μm. The cloth weight is 1
20 g / m ² or less, in particular 20 to 70 g / m ² is preferred.

The compounding ratio of the organic resin material and the glass cloth is 4 / weight of the organic resin material / glass cloth.
It is preferably 1 to 1/1. With such a blending ratio, the effects of the present invention are improved. On the other hand, when this ratio is reduced and the amount of the organic resin material is reduced, the adhesion with the copper foil is reduced and the smoothness of the constituent layers becomes a problem. On the other hand, when this ratio becomes large and the amount of the organic resin material becomes large, it becomes difficult to select the glass cloth that can be used, and it becomes difficult to secure the strength with a thin wall.

The metal foil to be used may be a metal foil having a good conductivity such as gold, silver, copper or aluminum. Of these, copper is particularly preferable.

As a method for producing the metal foil, various known methods such as electrolysis and rolling can be used. In this respect, an electrolytic foil is preferably used when the foil peel strength is desired, and a rolled foil which is less affected by the skin effect due to surface irregularities is preferably used when high frequency characteristics are important.

The thickness of the metal foil is preferably 8 to 70 μm, particularly preferably 12 to 35 μm.

The dielectric constants ε and Q of the hybrid materials obtained by preparing the organic resin materials shown in Table 1 and mixing the functional material powder shown in Table 1 at a predetermined ratio were measured. Further, the dielectric constants ε and Q of the dielectric powder used as the raw material of the functional material powder and the organic resin material were also measured. The results are shown in Table 1. Table 2 shows the press conditions at this time.

As is clear from Table 1, the dielectric constant and Q can be adjusted to predetermined values depending on the organic resin material used and the type and content of the dielectric powder contained as the functional material powder.

Next, the organic resin materials shown in Table 3 were prepared,
The magnetic powder shown in Table 3 was used as the functional material powder.
The dielectric constant ε and the magnetic permeability of the hybrid material obtained by mixing at a predetermined ratio were measured. Further, the dielectric constant ε and the magnetic permeability of the magnetic powder used as the functional material powder and the organic resin material were also measured. The results are shown in Table 3.

As is clear from Table 3, the permittivity and magnetic permeability can be adjusted to predetermined values depending on the organic resin material used and the kind and content of the magnetic material powder contained therein as the functional material powder. Recognize.

2. Example of Mobile Communication Device Using Laminated Module According to Present Invention FIG. 1 is a block diagram showing an example of mobile communication device using a laminated module according to the present invention, which is a GSM / DC.
The high frequency circuit part in the mobile communication equipment corresponding to S dual band is shown. The circuit itself is well known.
Depending on the mobile communication device, instead of the DCS band,
Some use the PCS band, and the present invention includes such a case.

The mobile communication device shown in FIG. 1 has an antenna ANT.
, Front end unit FE, transmission unit Tx, and reception unit R
x and. Furthermore, phase. Lock. Loop PLL,
Voltage controlled oscillator VCO3, mixer MIX3, phase.
Detector PHD, Loop Filter (Loop Fil)
ter) etc. are included.

The transmitter Tx is divided into a transmitter GSM / Tx and a transmitter DCS / Tx. Transmitter DCS / T
x is a voltage controlled oscillator VCO1 and a power amplifier PA
1, a coupler COP1, a power detection unit APC1, a low pass filter LPF1 and the like.

Similarly, the transmitter GSM / Tx also has a voltage controlled oscillator VCO2, a power amplifier PA2, and a coupler COP.
2, power detection unit APC2 and low-pass filter LPF2
And so on.

The receiving section Rx is divided into a receiving section GSM / Rx and a receiving section DCS / Rx. Receiver DCS / R
x includes a bandpass filter BPF1 including a surface acoustic wave element (SAW element), a balloon BAL1, a linear amplifier LNA1, a mixer MIX1 and the like. Receiver GSM
Similarly, / Rx also includes a bandpass filter BPF2 including a surface acoustic wave element (SAW element), a balloon BAL2, a linear amplifier LNA2, a mixer MIX2, and the like.

The front end FE is a diplexer D
It includes IP and transmission / reception switchers SW1 and SW2. The transmission / reception switch SW1 is controlled by a control signal supplied from the outside, and is transmitted by the transmission unit DCS / Tx or the reception unit DCS.
/ Rx selectively connects to the diplexer DIP.

The transmission / reception switch SW2 is also controlled by a control signal supplied from the outside, and selectively connects the transmitter GSM / Tx or the receiver GSM / Rx to the diplexer DIP.

Therefore, the transmitter GSM / Tx, the receiver GSM / Rx, the transmitter DCS / Tx and the receiver DCS /
Rx receives the antenna ANT via the diplexer DIP.
Selectively connected to.

The present invention, in the mobile communication device shown in FIG. 1, is a PA laminated module in which power amplifiers PA1 and PA2 included in the transmitters GSM / Tx and DCS / Tx are laminated into a module, a voltage controlled oscillator VCO1, VCO
A specific example of a VCO laminated module in which 2 or VCO 3 is formed into a laminated module, and an FE laminated module in which the front end FE is formed into a laminated module is disclosed.

3. Power amplifier laminated module (PA
Laminated Module) FIG. 2 illustrates an example of a circuit diagram of the power amplifier unit PA1 included in the transmission unit DCS / Tx illustrated in FIG.
In the figure, the Vapc1 terminal is a terminal provided for output control, and the output of the power amplifier unit PA1 is Vapc1.
It is controlled by the voltage level applied to the terminals. Vap
The voltage applied to the c1 terminal is the coupler C in FIG.
It is a power detection signal detected by the power detection unit APC1 via OP1.

The power amplifier unit PA1 is composed of semiconductor elements 3
Multi-stage MMIC (Microwave Monolithic IC) 1
An input matching circuit unit IM1 and an output matching circuit unit OM1
And a bias circuit section BC1.

The MMIC1 plays a role of amplifying the signal input from the Pin1 terminal, and the input matching circuit section IM1 is
Impedance (50Ω) at Pin1 terminal is MMIC
It has the role of matching the input impedance of 1 and transmitting the signal input from the Pin1 terminal to the input of the MMIC1 without loss due to impedance mismatch.

The output matching circuit section OM1 matches the output impedance of the MMIC1 with the impedance (50Ω) seen at the Pout1 terminal, and transmits the signal output from the MMIC1 to the Pout1 terminal without causing loss due to impedance mismatch. The bias circuit portion BC1 plays a role of operating the semiconductor included in the MMIC 1 as an amplification element.

The input matching circuit section IM1 includes an inductor L1
And a capacitor C1 are connected in an L-shape. Furthermore, the input matching circuit unit IM1 is provided with a capacitor C2.

In the output matching circuit section OM1, the first stage is an L-type circuit including an inductor L2 and a capacitor C3, the second stage is an L-type circuit including an inductor L3 and a capacitor C4, and the third stage is an L-type circuit including an inductor L4 and a capacitor C5. It is a type circuit. A capacitor C6 is connected to the output terminal of the output matching circuit OM1.

Further, the inductors L5 to L7 of the bias circuit portion BC1 are ideally required to have infinite impedance so as not to leak the signal amplified by the MMIC1 to the Vcc terminal. For this reason, (λ
/ 4) long pattern or (λ / 4) long pattern. Ground capacitors C8 to C10 are connected to the inductors L5 to L7, respectively.

FIG. 3 shows the transmitter GSM / T shown in FIG.
The specific circuit diagram of the power amplifier part PA2 contained in x is shown. In the figure, the Vapc2 terminal is a terminal provided for output control, and the output of the power amplifier unit PA2 is controlled by the voltage level applied to the Vapc2 terminal. Further, the voltage applied to the Vapc2 terminal is the power detection unit APC via the coupler COP2 in FIG.
2 is a power detection signal detected by 2.

The power amplifier section PA2 is composed of semiconductor elements 3
An MMIC2 having a stage configuration, an input matching circuit unit IM2,
The output matching circuit section OM2 and the bias circuit section BC2 are included.

The MMIC2 plays a role of amplifying the signal input from the Pin2 terminal, and the input matching circuit IM2 is
Impedance (50Ω) at Pin2 terminal is MMIC
It has the role of matching the input impedance of 2 and transmitting the signal input from the Pin 2 terminal to the input of the MMIC 2 without loss due to impedance mismatch.

The output matching circuit section OM2 matches the output impedance of the MMIC2 with the impedance (50Ω) seen at the Pout2 terminal, and transmits the signal output from the MMIC2 to the Pout2 terminal without causing loss due to impedance mismatch. The bias circuit portion BC2 plays a role of operating the semiconductor included in the MMIC 2 as an amplification element.

The input matching circuit section IM2 includes an inductor L9
And a capacitor C11 are connected in an L-shape. Further, the input matching circuit unit IM2 has a capacitor C12.
Is provided.

In the output matching circuit section OM2, the first stage is an L-type circuit including the inductor L10 and the capacitor C13, the second stage is an L-type circuit including the inductor L11 and the capacitor C14, and
The stage is an L-type circuit including an inductor L2 and a capacitor C15. A capacitor C is provided at the output terminal of the output matching circuit OM2.
16 are connected.

Further, the inductors L13 to L15 of the bias circuit portion BC2 are ideally required to have infinite impedance so as not to leak the signal amplified by the MMIC2. Therefore, it is usually composed of an inductor element having an impedance corresponding to the (λ / 4) long pattern or the (λ / 4) long pattern. Ground capacitors C18 to C20 are connected to the inductors L13 to L15, respectively.

FIG. 4 is an exploded perspective view of a PA laminated module in which the power amplifier units PA1 and PA2 shown in FIGS. 2 and 3 are formed into a laminated module, and FIG. 5 is a perspective view of the PA laminated module shown in FIG. 4 in a completed state. 6 is a sectional view schematically showing the internal connection structure. Laminated substrate 100
There is no particular limitation on the arrangement of the passive elements in the above.
4 to 6 show only one example that can be adopted. Reference numeral 90 is a shield.

The illustrated embodiment shows a PA laminated module compatible with GSM / DCS dual band. On the GSM side, the frequency range is 880 to 915 MHz and the output power is, for example, 35.0 dBm, whereas on the DCS side, the frequency range is 1710 to 1785 MHz, and the output power is, for example, 32.0 dBm, Since the specifications are different from each other, GSM
Side and DCS sides are independent of each other and are divided into two circuits for GSM and DCS and arranged in parallel.

The PA laminated module of the illustrated embodiment includes a laminated substrate 100 and active elements MMIC1 and MMIC2.
, Passive elements, power supply terminals (Vcc1, Vcc2), signal terminals (Vapc1, Vapc2), (Pin1, Pi
n2), (Pout1, Pout2) (see FIG. 2, the same applies hereinafter), the grounding pattern GND, and the through via hole 4
0, a blind via hole 30, and an inner via hole 20.

As shown in FIG. 4, the laminated substrate 100 has 9 layers.
Includes a number of constituent layers 101-109. Constituent layers 101 to 10
9 are sequentially laminated. The constituent layers 101 to 109 are
It is a hybrid material in which an organic resin material and a functional material powder are mixed.

MMIC1 and MMIC2 which are active elements
Are arranged on the constituent layer 101 located on the front surface side of the laminated substrate 100. The electrodes of MMIC1 and MMIC2 are connected to the conductor pattern formed on the constituent layer 101 by wire bonding or the like.

Power supply terminals (Vcc1, Vcc2), signal terminals (Vapc1, Vapc2), (Pin1, Pin)
2) and (Pout1, Pout2) are as shown in FIG.
It is connected to the conductor pattern 50 formed on the back surface of the constituent layer 109 which is the lowermost layer of the laminated substrate 100. The details will be described later.

The through via hole 40 penetrates the laminated substrate 100 in the thickness direction, and one end of the through via hole 40 is provided on the back surface of the laminated substrate 100 as a power supply terminal (Vcc1, Vcc2) and a signal terminal (Vcc).
apc1, Vapc2), (Pin1, Pin2),
Conductor pattern 5 forming (Pout1, Pout2)
It is connected to 0 or is electrically connected to the ground pattern GND.

The blind via hole 30 is formed in the laminated substrate 1
Conductor pattern 50 provided on the front surface or the back surface of 00
And the conductor pattern 50 of the next layer are connected. The inner via hole 20 connects the conductor pattern 50 formed inside the laminated substrate 100. One end of the blind via hole 30 is terminated inside the laminated substrate 100, and both ends of the inner via hole 20 are terminated inside the laminated substrate 100.

As described above, in the PA laminated module according to the present invention, the laminated substrate 100 has a plurality of constituent layers 1.
It is configured by laminating 01 to 109. Composition layer 101
˜109 are made of a hybrid material in which an organic resin material and a functional material powder are mixed. Since the constituent layers 101 to 109 made of the hybrid material are different from the conventional laminated substrate using ferrite or the like, cracks and delamination are unlikely to occur in the processing step, and they are excellent in mechanical strength, so that reliability as a product is high. Is excellent. Further, the insulation resistance between the layers does not deteriorate due to cracks, which is convenient for forming a capacitor.

Moreover, the constituent layers 101 to 1 made of the hybrid material in which the organic resin material and the functional material powder are mixed.
In 09, the through via hole 40, the inner via hole 20, the blind via hole 30, and the thermal via hole 41 can be easily formed by using a punch or a drill. The holes formed in this manner can be filled with a conductive paste (Ag or the like) to form an electrical connection conductor and a heat radiation path. Therefore, various vias can be surely formed without causing positional deviation between layers.

Further, the constituent layer 10 made of a hybrid material.
Nos. 1 to 109 can have desired electrical and magnetic characteristics by selecting the type of functional material powder. For example, when the dielectric powder is used as the functional material powder, the dielectric constant can be easily adjusted by selecting the dielectric powder material, and the dielectric constant can be made lower than that of the sintered ceramic substrate. Higher Q than organic resin material substrate
Is obtained, and high frequency region (100 MHz or more, especially 100
It is possible to realize the one suitable for use in the range from MHz to 10 GHz).

Further, by selecting and using a magnetic substance powder or the like as the functional material powder, it is possible to freely deal with the use of excellent magnetic characteristics and the use for the purpose of magnetic shield.

Furthermore, by selecting the functional material powder, it is possible to obtain a relatively high Q and dielectric constant ε in the high frequency band. Such characteristics are required, for example, when forming a strip line, an impedance matching circuit, a delay circuit, an antenna circuit, and the like. Moreover, it is possible to realize the laminated substrate 100 having excellent mechanical strength.

As the hybrid material for the constituent layers 101 to 109, it is possible to use a copper-clad plate to which a copper foil has been pasted. When a copper-clad board is used, a PA laminated module can be realized by patterning a copper foil and forming multiple layers. Since the patterning and the multi-layering process can be performed in the same process as the normal constituent layer manufacturing process, the cost can be reduced and the workability can be improved. Further, the PA laminated module thus obtained can have high strength and excellent high frequency characteristics.

In the PA laminated module according to the present invention, the power supply terminals (Vcc1, Vcc2) and the signal terminals (Vapc).
1, Vapc2), (Pin1, Pin2), (Pou
The conductor pattern 50 and the ground pattern GND that form t1 and Pout2) are provided on the back surface of the laminated substrate 100. Therefore, it is possible to obtain the PA laminated module in which the back surface side opposite to the front surface side on which the MMIC1 and MMIC2 are provided faces the motherboard or the like.

In the PA laminated module according to the present invention, the through via hole 40 penetrates the laminated substrate 100 in the thickness direction, and one end thereof is the power supply terminal (Vcc1, Vcc2),
Signal terminals (Vapc1, Vapc2), (Pin1, P
in2) and (Pout1, Pout2) are electrically connected to the conductor pattern 50 or the ground pattern GND.
Therefore, when it is mounted on a mother board or the like, it can be connected to an external circuit on the back surface side and its electric circuit can be guided to the inside of the laminated substrate 100 and the surface of the laminated substrate 100 through the through via hole 40.

Further, the MMIC1 and MMIC mounted on the surface of the laminated substrate 100 using the through via holes 40.
2 and conductive patterns 50 for passive elements formed inside the laminated substrate 100 are connected to the power supply terminals (Vcc1, Vcc).
cc2), signal terminals (Vapc1, Vapc2), (P
in1, Pin2), (Pout1, Pout2) or the grounding pattern GND.

In the present invention, in addition to the through via hole 40,
The blind via hole 30 is included. The blind via hole 30 includes the conductor pattern 50 provided on the front surface of the constituent layer 101 or the back surface of the constituent layer 109, and the constituent layer 10 of the next layer.
2 and 109 are connected to the conductor pattern 50 provided. Therefore, the blind via hole 30 can be used to connect the conductor pattern 50 formed inside the laminated substrate 100 to the signal terminal or the ground pattern GND provided as the conductor pattern 50 on the back surface.

The laminated substrate 100 according to the present invention further includes an inner via hole 20. Inner beer hole 2
0 is a conductor pattern 5 formed inside the laminated substrate 100.
It connects between 0 and does not appear on the back surface of the laminated substrate 100. Therefore, the through-hole via hole 40 and the blind via hole 30 are appropriately arranged so that the laminated substrate 10 can be formed.
The degree of freedom in the shape and arrangement of the terminals on the back side of 0 can be increased, and the area of the ground pattern GND can be secured. It is possible to realize a PA laminated module in which the grounding pattern occupies 80% or more of the area of the back surface.

Next, referring to FIGS. 7 to 16, the constituent layer 1
An example of the pattern arrangement of 01 to 109 will be specifically described. 7 is a plan view of the PA laminated module shown in FIGS. 4 and 5 viewed from the surface side, FIG. 8 is a plan view of the constituent layer 102 viewed from the surface side, and FIG. 9 is a constituent layer 103 viewed from the surface side. A plan view, FIG. 10 is a plan view of the constituent layer 104 seen from the front surface side, and FIG. 11 is a plan view of the constituent layer 105 seen from the front surface side.
FIG. 12 is a plan view of the constituent layer 106 seen from the front side, and FIG.
Is a plan view of the constituent layer 107 seen from the front surface side, FIG. 14 is a plan view of the constituent layer 108 seen from the front surface side, and FIG. 15 is a constituent layer 10
9 is a plan view seen from the front surface side, and FIG. 16 is a view seen from the back surface side of the constituent layer 109.

First, referring to FIG. 7, ground conductor patterns GND1 and GND2 are formed in the mounting regions of the MMIC1 and MMIC2 on the surface of the constituent layer 101, and the ground conductor patterns GND1 and GND2 are formed in the plane. A group of thermal via holes 41 is provided. The thermal via hole 41 is provided so as to continuously penetrate between the constituent layers 101 to 109 in the mounting region of the MMIC1 and MMIC2. The thermal via hole 41 is filled with a filler made of a conductive paste such as Ag paste. As long as the filler filled in the thermal via hole 41 has excellent thermal conductivity,
It may be a non-conductive material.

The passive element is a transmitter DCS / shown in FIG.
In the Tx power amplifier unit PA1, capacitors C1 to C are provided.
10 and inductors L1 to L8, and the capacitor C1 in the power amplifier unit of the transmitter GSM / Tx shown in FIG.
1 to C20 and inductors L9 to L16.

Referring to FIG. 7, these capacitors (C1 to C20) and inductors (L1 to L16).
Among them, the capacitors C2 and C6 to C10 of the power amplifier unit PA1 of the transmission unit DCS / Tx are chip capacitors 70.
As shown in FIG. 4 and FIG. 5, the laminated substrate 100 is mounted on the surface of the constituent layer 101 constituting the surface layer. The dotted line in FIG. 7 is
The placement of the chip capacitors on the surface of the constituent layer 101 is displayed. The chip capacitor is connected to a conductor pattern (land shown by the diagonal lines in FIG. 7) provided on the surface of the constituent layer 101 by means of soldering or the like.

In the embodiment of FIG. 7, the inductors L1 and L
2, L8 are also formed as conductor patterns on the surface of the constituent layer 101. Further, a capacitor electrode C1a and the like which form the capacitor C1 are also formed.

Power amplifier PA of transmitter GSM / Tx
2, the capacitors C12, C are provided on the surface of the constituent layer 101.
16 to C20 are mounted as a chip capacitor 70 (see FIGS. 4 and 5), and inductors L9, L10, L
16 is formed as a conductor pattern. Capacitor C11
The capacitor electrode C11a and the like that configure the above are also formed.

Other passive elements are formed inside the laminated substrate 100. In FIG. 2 and FIG. 3, passive elements that are not surrounded by a dotted circle are arranged inside and on the surface of the laminated substrate 100. L1, L2, L8, L9, L10, and L16 are conductor patterns on the surface.

Next, referring to FIG. 8, on the surface of the constituent layer 102, the ground conductor pattern G is formed over almost the entire surface.
ND3 is formed. A through via hole 40, a blind via hole 30, and an inner via hole 20 are formed in the surface of the ground conductor pattern GND3. These are provided in an insulating gap represented by a white circle. Further, a thermal via hole 41 continuous with the thermal via hole 41 (see FIG. 7) formed in the ground conductor patterns GND1 and GND2 in the arrangement area of the MMIC1 and MMIC2 is formed. Part of the through via hole 40 is connected to the ground conductor pattern GND3.

The capacitor electrodes C1a and C11a shown in FIG. 7 are connected to the ground conductor pattern GND3 by a predetermined capacitor C.
1 and C11.

Next, referring to FIG. 9, ground conductor patterns GND4 and GND5 are formed on the surface of the constituent layer 103, and a group of thermal via holes 41 is formed in the surface of the ground conductor patterns GND4 and GND5. It is provided.

On the surface of the constituent layer 103, the transmitter D
A capacitor electrode C4 forming a capacitor C4 together with the inductor L3 of the CS / Tx power amplifier unit PA1
a and the like are formed.

Power amplifier PA of transmitter GSM / Tx
2, the inductor L11, the capacitor electrode C12a configuring the capacitor C12, and the like are formed on the surface of the constituent layer 103.

Further, through-hole via holes 40 and inner via holes 20 are formed in the constituent layer 103.

Next, referring to FIG. 10, the constituent layer 104
A ground conductor pattern GND6 is formed on almost the entire surface of the. Ground conductor pattern GND6
A through via hole 40 and an inner via hole 20 are formed in the plane. These are provided in an insulating gap represented by a white circle. In addition, MMIC1,
The ground conductor pattern GND1 in the arrangement area of the MMIC2,
A thermal via hole 41 continuous with the thermal via hole 41 (see FIG. 7) formed in the GND 2 is formed. A part of the through via hole 40 has a ground conductor pattern G.
It is connected to ND6.

The capacitor electrodes C4a and C12a in FIG. 9 are connected to the ground conductor pattern GND6 by a predetermined capacitor C.
4 and C12.

Next, referring to FIG. 11, the constituent layer 105
Ground conductor patterns GND7 and GND8 are formed on the surface of, and a group of thermal via holes 41 is provided in the surface of the ground conductor patterns GND7 and GND8.

Further, a conductor pattern forming the inductor L4 of the power amplifier PA1 of the transmitter DCS / Tx, a capacitor electrode C5a forming the capacitor C5, etc. are formed.

Power amplifier PA of transmitter GSM / Tx
In No. 2, the conductor layer forming the inductor L12, the capacitor electrode C15a forming the capacitor C15, and the like are formed on the surface of the constituent layer 105. Further, a through via hole 40 and an inner via hole 20 are formed in the constituent layer 105.

Next, referring to FIG. 12, the constituent layer 106
A grounding conductor pattern GND9 is formed on almost the entire surface of the. Ground conductor pattern GND9
A through via hole 40 and an inner via hole 20 are formed in the plane. These are provided in an insulating gap represented by a white circle. In addition, MMIC1,
The ground conductor pattern GND1 in the arrangement area of the MMIC2,
A thermal via hole 41 continuous with the thermal via hole 41 (see FIG. 7) formed in the GND 2 is formed. A part of the through via hole 40 has a ground conductor pattern G.
It is connected to ND9.

Capacitor electrodes C5a and C15a in FIG.
Form predetermined capacitors C5 and C15 with the ground conductor pattern GND9.

Next, referring to FIG. 13, the constituent layer 107
On the surface of the ground conductor pattern GND10, GND11
Are formed, and the ground conductor patterns GND10 and GN are formed.
A group of thermal via holes 41 is provided in the plane of D11.

Further, a conductor pattern forming the inductor L7 of the power amplifier PA1 of the transmitter DCS / Tx and a conductor pattern forming the inductor L15 of the power amplifier PA2 of the transmitter GSM / Tx are formed. . Further, through via holes 40 and inner via holes 20 are formed in the constituent layer 107.

Next, referring to FIG. 14, the constituent layers 108
A ground conductor pattern GND12 is formed on almost the entire surface of the. Ground conductor pattern GND
A through via hole 40 and an inner via hole 20 are formed in the plane of 12. These are provided in an insulating gap represented by a white circle. Also, MMIC
1. Ground conductor pattern GND in the arrangement area of MMIC2
1, thermal via holes 41 connected to the thermal via holes 41 (see FIG. 7) formed in GND2 are formed. Part of the through via hole 40 is connected to the ground conductor pattern GND12.

Next, referring to FIG. 15, the constituent layer 109
On the surface of the ground conductor pattern GND13, GND14
Are formed, and the ground conductor patterns GND13 and GN are formed.
A group of thermal via holes 41 is provided in the plane of D14.

Further, the conductor patterns forming the inductors L5 and L6 of the power amplifier section PA1 of the transmitter DCS / Tx, and the power amplifier section PA2 of the transmitter GSM / Tx.
Conductor patterns and the like that form the inductors L13 and L14 are formed. Further, a through via hole 40 is formed in the constituent layer 109.

Further, on the back surface of the constituent layer 109, power supply terminals (Vcc1, Vcc2) and signal terminals (Vapc1, Vapc).
pc2), (Pin1, Pin2), (Pout1, P
out2) and the grounding pattern GND15 are provided. The ground pattern GND15 preferably occupies 80% or more of the back surface area of the constituent layer 109. Power supply terminals (Vcc1, Vcc2) and signal terminals (Vapc
1, Vapc2), (Pin1, Pin2), (Pou
t1, Pout2) is around the constituent layer 109,
It is arranged so as to be electrically insulated from the ground pattern GND15.

The through via hole 40 penetrates the laminated substrate 100 in the thickness direction, and one end thereof is connected to the ground pattern GND15 on the back surface of the laminated substrate 100, or
Power supply terminals (Vcc1, Vcc2), signal terminals (Vapc
1, Vapc2), (Pin1, Pin2), (Pou
It conducts to t1 and Pout2). In this embodiment, the blind via hole 30 is not formed on the back surface side (constituent layer 109) of the laminated substrate 100, but the through via hole 40 is formed.
You may make it connect to the external connection terminal which is not connected.

Therefore, when it is mounted on a mother board or the like, it is connected to an external circuit on the back surface side, and the electric circuit is connected to the through via hole 40 and the blind via hole 30.
Through, to the inside of the laminated substrate 100 and the surface of the laminated substrate 100.

Further, using the through via hole 40 and the blind via hole 30, the MMIC1 and MMIC2 mounted on the surface of the laminated substrate 100, and the laminated substrate 100.
Conductive pattern for passive elements formed inside the
Power supply terminals (Vcc1, Vcc2), signal terminals (Vapc
1, Vapc2), (Pin1, Pin2), (Pou
t1, Pout2) or the grounding pattern GND15.

The inner via hole 20 is the laminated substrate 100.
Does not appear on the back side of. Therefore, on the back surface, the degree of freedom in the shape and arrangement of the terminals is increased, and the area of the ground pattern can be secured.

In the present invention, the constituent layers 101 to 109 are made of a hybrid material in which an organic resin material and a functional material powder are mixed. The organic resin material and the functional material powder constituting the hybrid material have already been described in detail, the dielectric constant can be easily adjusted, and the dielectric constant can be reduced as compared with the laminated substrate made of sintered ceramics. ,
High Q is obtained compared to a laminated substrate made of an organic resin material, and a high frequency region (100 MHz or more, especially 100 MHz) is obtained.
It is suitable for use in the range of 10 GHz or less).

Further, the hybrid material containing the magnetic powder is suitable for the purpose of utilizing excellent magnetic properties and the purpose of magnetic shield. Further, the hybrid material containing the magnetic powder can obtain a relatively high Q or ε in a high frequency band, and is used in applications requiring such characteristics, such as strip lines, impedance matching circuits, and delay circuits. It is a hybrid material suitable for PA laminated modules such as, and has high strength.

When a constituent layer or a laminated substrate is formed by using a hybrid material containing a magnetic powder or a hybrid material containing a dielectric powder, adhesion with a copper foil or a pattern can be performed without using an adhesive or the like. Can be realized, and multi-layering can be realized. Since such patterning and multi-layering treatment can be performed in the same process as a normal component layer manufacturing process, cost reduction and workability improvement can be achieved. Further, the PA laminated module having the constituent layers thus obtained has excellent mechanical strength and improved high frequency characteristics.

4. Method for Manufacturing PA Laminated Module Next, a method for manufacturing the PA laminated module will be described with reference to FIGS. 17 to 36. First, as shown in FIG. 17, a constituent layer 105 serving as a core layer is prepared. The constituent layer 105 is
It is a copper-clad plate having copper foils 500 attached on both sides in advance. The thickness of the copper foil 500 is, for example, 18 μm.

Next, the copper foils 500 on both surfaces of the constituent layer 105 are patterned to form conductor patterns 50, 50 of copper foil on both surfaces, as shown in FIG. The patterns of the conductor patterns 50, 50 are determined by the circuit configurations shown in FIGS. 2 and 3, for example. Moreover, in patterning, a well-known photolithography process is performed.

Next, as shown in FIG. 19, the constituent layer 105
The constituent layer 104 and the constituent layer 106 are thermocompression-bonded to both surfaces thereof. The constituent layers 104 and 106 are previously formed on one surface side of the copper foil 50.
It is a constituent layer (hereinafter referred to as an RCC constituent layer) made of a semi-cured hybrid material to which 0 is attached, and is hardened by thermocompression bonding to the constituent layer 105. Copper foil 50
The thickness of 0 is, for example, 18 μm.

Next, the copper foil 500 of the constituent layers 104 and 106
And patterning the constituent layer 10 as shown in FIG.
Conductor patterns 50, 5 made of copper foil on one surface of each of 4, 106
Form 0. In patterning, a photolithography process is performed.

Next, as shown in FIG. 21, the constituent layer 104
The constituent layer 104 is thermocompression bonded to the side having the conductor pattern 50, and the constituent layer 107 is thermocompression bonded to the side of the constituent layer 106 having the conductor pattern 50. As the constituent layers 103 and 107, RCC constituent layers having a copper foil 500 attached to one surface side are used. Then, the other surface side without the copper foil 500 is thermocompression bonded to the constituent layer 105. The thickness of the copper foil 500 is, for example, 18 μm.

Next, the copper foil 500 of the constituent layers 103 and 107
And the constituent layer 10 is patterned as shown in FIG.
Conductor patterns 50, 5 made of copper foil on one surface of each of 3, 107
Form 0. In patterning, a photolithography process is performed.

Next, as shown in FIG. 23, the constituent layer 103
The constituent layer 102 is thermocompression bonded to the side having the conductor pattern 50, and the constituent layer 108 is thermocompression bonded to the side of the constituent layer 107 having the conductor pattern 50. As the constituent layers 102 and 108, RCC constituent layers having a copper foil 500 attached to one surface side are used.
Then, with the other surface side without the copper foil 500, the constituent layer 10
3 and 107 are thermocompression bonded. The thickness of the copper foil 500 is, for example, 18 μm.

Next, as shown in FIG. 24, the inner via hole 20 is formed in the laminated body which has undergone the process of FIG. The inner via hole 20 can be formed by drilling, punching or laser by numerical control processing (hereinafter referred to as NC processing). The inner via hole 20 at this stage has no conductor, and in that sense, it is different from the inner via hole 20 (FIGS. 4 to 16) as a finished product.

Next, as shown in FIG. 25, a plating film 201 is attached to the inner surface of the inner via hole 20. The plating film adheres also on the copper foil 500, but is omitted in FIG. 25. The plating film 201 is typically a copper plating film, but other materials may be used.

Next, as shown in FIG. 26, the inside of the inner via hole 20 is filled with a conductive paste 202.
The conductive paste 202 is not particularly limited as long as it is a material that can be used for permanent filling. Typically, Ag paste can be used. After that, the surfaces of the constituent layers 102 and 108 are polished by a mechanical or chemical method to remove the conductive paste 202 rising on the surfaces. As a result, as shown in FIG. 27, the surfaces of the constituent layers 102 and 108 are flattened.

Next, as shown in FIG. 28, the constituent layer 10
The plating film 203 is attached on the copper foil 500 formed on the layers 2 and 108 to close the inner via hole 20, the plating film 201 and the conductive paste 202 existing in the plane of the copper foil 500. The plating film 203 can be formed by Cu plating, Au plating, Ni plating, or the like.

Next, the copper foil 500 and the plated film 2 thereon
03 is patterned to form a conductor pattern 50 having a predetermined pattern as shown in FIG. Patterning is by photolithography.

Next, as shown in FIG. 30, the constituent layer 102
The constituent layer 101 is thermocompression bonded to the side having the conductor pattern 50, and the constituent layer 109 is thermocompression bonded to the side of the constituent layer 108 having the conductor pattern 50. The constituent layers 101 and 109 are R
The thickness of the copper foil 500 is, for example, 18
μm.

Next, as shown in FIG. 31, the constituent layer 1
Blind via holes 30 are formed at 01 and 109.
The blind via hole 30 can be formed by drilling by NC processing, punching, or laser.

Next, as shown in FIG. 32, the constituent layer 101
Through via holes 40 are formed so as to penetrate through to 109. The through via hole 40 is also formed by NC processing.

Next, as shown in FIG. 33, the plating films 301 and 401 are attached to the inner surfaces of the blind via hole 30 and the through via hole 40. Plating film 301, 401
Also adheres on the copper foil 500. Plating film 301, 40
1 is typically a copper plating film.

Next, as shown in FIG. 34, the blind via hole 30 and the through via hole 40 are filled with conductive pastes 302 and 402. Conductive paste 30
2, 402 is typically Ag paste. After that, the surfaces of the constituent layers 101 and 109 are polished by a mechanical or chemical method to remove the conductive pastes 302 and 402 rising on the surfaces. As a result, FIG.
As shown in FIG. 5, the surfaces of the constituent layers 101 and 109 are flattened.

Next, as shown in FIG. 36, the constituent layer 10
The plating film 303 is attached on the copper foil 500 formed on the first and the 109, and the blind via hole 30, the through via hole 40, and the plating film 3 existing in the plane of the copper foil 500.
01 and 401 and the conductive pastes 302 and 402 are closed.

After that, the copper foil 500 formed on the constituent layers 101 and 109 is patterned by applying photolithography to form the conductor pattern 50, the ground pattern GND and the like. Further, by mounting the MMIC1, MMIC2 and various chip components on the surface of the uppermost constituent layer 101 of the laminated substrate 100 and soldering, a predetermined PA laminated module can be obtained.

5. Voltage controlled oscillator stacked module (VC
O Stacked Module) FIG. 37 shows an example of a circuit configuration of a VCO (voltage controlled oscillator). The illustrated VCO is used to configure at least one of VCO1 to VCO3 in the circuit shown in FIG. 1, for example. In the figure, the power supply terminal Vcc
The operating voltage supplied to No. 3 is divided by the resistors R31 to R33 and supplied to the oscillator circuit 6. Power supply terminal Vcc
A capacitor C37 is connected to 3.

The voltage control signal supplied to the signal terminal Vin3 passes through the inductor L31 and the capacitor C32,
It is supplied to the varicap diode D31. The capacitor C32 is connected to the output terminal of the inductor L31.

The resonance circuit 5 is connected to the rear stage of the varicap diode D31 via the capacitor C33, and the oscillation circuit 6 is connected to the rear stage of the resonance circuit 5. The resonance circuit 5 has a resonance frequency determined by the capacitor C34 and the strip line L32.

The oscillator circuit 6 includes transistors T31 and T3.
2 and so on. The oscillation circuit 6 is biased by the voltage divided by the resistors R31 to R33, and the resonance circuit 5
The circuit constant, the capacitance value of the varicap diode D31, the capacitors C33, C35, C36, C39, and the inductor L33 are used as oscillation constants for oscillation, and the oscillation signal is output from the signal terminal Vout3 via the capacitor C40. To do.

FIG. 38 is an exploded perspective view of a VCO laminated module in which the VCO circuit as shown in FIG. 37 is modularized, and FIG. 39 is an enlarged sectional view schematically showing the internal structure of the VCO laminated module shown in FIG. FIG. 40 is a bottom view showing the terminal arrangement on the bottom side of the VCO laminated module shown in FIG. 39. The arrangement of the passive elements on the laminated substrate 100 is not particularly limited. The figure only shows one example that can be adopted.

As shown in FIGS. 38 and 39, the laminated substrate 100 is formed by sequentially laminating eight constituent layers 101 to 108. The constituent layers 101 to 108 are made of a hybrid material in which an organic resin material and a functional material powder are mixed.

Transistors T31 and T3 which are active elements
2, the varicap diode D31, and the resistors R31 to R33 are arranged on the constituent layer 101 located on the front surface side of the laminated substrate 100. Other circuit elements are embedded inside the laminated substrate 100.

The power supply terminal Vcc3, the signal terminal Vin3, and the signal terminal Vout3 shown in FIG. 37 are the same as those shown in FIGS.
In the structure substrate 108, which is the lowermost layer of the laminated substrate 100,
Is connected to the conductor pattern 50 formed on the back surface of the. Further, the ground line of FIG. 37 is connected to the ground pattern GND.

The through via hole 40 penetrates the laminated substrate 100 in the thickness direction, and one end thereof is connected to the conductor pattern 50 constituting the power supply terminal Vcc3, the signal terminal Vin3, and the signal terminal Vout3 on the back surface of the laminated substrate 100. .

The blind via hole 30 is formed in the laminated substrate 1
Conductor pattern 50 provided on the front surface or the back surface of 00
And the conductor pattern 50 of the next layer are connected. The inner via hole 20 connects the conductor pattern 50 formed inside the laminated substrate 100. One end of the blind via hole 30 is terminated inside the laminated substrate 100, and both ends of the inner via hole 20 are terminated inside the laminated substrate 100.

Also in the VCO laminated module, the constituent layers 101 to 108 constituting the laminated substrate 100 are made of a hybrid material in which an organic resin material and a functional material powder are mixed. Constituent layers 101 to 108 made of hybrid material
In the processing step, since cracks and delamination are unlikely to occur and mechanical strength is excellent, the product has excellent reliability as a product. Further, the insulation resistance between the layers does not deteriorate due to cracks, which is convenient for forming a capacitor.

Moreover, in the laminated substrate composed of the hybrid material in which the organic resin material and the functional material powder are mixed, the through via hole 40, the inner via hole 20, the blind via hole 30, and the thermal via hole 41 can be easily formed by using a punch or a drill. Can be formed into For this reason,
Various vias can be reliably formed without causing positional displacement between layers.

Further, the constituent layer made of the hybrid material is
By selecting the type of functional material powder, desired electrical and magnetic properties can be provided. For example, when a dielectric powder is used as the functional material powder, the dielectric constant can be easily adjusted by selecting the material of the dielectric powder, and the dielectric constant can be made lower than that of a laminated substrate made of sintered ceramics. . Since these materials have already been described in detail, the details are omitted.

In the VCO laminated module, the power supply terminal Vc
c3, the signal terminal Vin3, the conductor pattern 50 and the grounding pattern GND forming the signal terminal Vout3 are provided on the back surface of the laminated substrate 100. Therefore, the back surface side of the laminated substrate 100 can be attached to a motherboard or the like.

In the VCO laminated module according to the present invention, the through via hole 40 penetrates the laminated substrate 100 in the thickness direction, and one end thereof has the power supply terminal Vcc3 and the signal terminal Vin.
3. Conducting to the conductor pattern 50 forming the signal terminal Vout3. Therefore, when it is mounted on a mother board or the like, it can be connected to an external circuit on the back surface side and its electric circuit can be guided to the inside of the laminated substrate 100 and the surface of the laminated substrate 100 through the through via hole 40.

Also, the components mounted on the surface of the laminated substrate 100 and the laminated substrate 1 using the through via holes 40.
The conductor pattern 50 for the passive element formed inside 00 can be connected to the power supply terminal Vcc3, the signal terminal Vin3, and the signal terminal Vout3.

In the present invention, in addition to the through via hole 40,
Blind via hole 30 and inner via hole 20
Including and The blind via hole 30 includes the constituent layer 101.
The conductor pattern 50 provided on the front surface or the back surface of the constituent layer 109 and the conductor pattern 50 provided on the next constituent layer 102 or 109 are connected. The inner via hole 20 connects the conductor pattern 50 formed inside the laminated substrate 100.

The through via hole 40, the blind via hole 30, the power supply terminal Vcc3, and the signal terminal Vin.
3, used for the signal terminal Vout3 or the ground pattern GND. The inner via hole 20 used for connection between the conductor patterns inside does not appear on the back surface of the laminated substrate 100. Therefore, by appropriately combining the through via hole 40, the blind via hole 30, and the inner via hole 20, it is possible to give flexibility to the shape and arrangement of the terminals on the back surface side of the laminated substrate 100 and also to secure the area of the ground pattern.

6. Method for Manufacturing VCO Laminated Module FIGS. 41 to 50 are views showing a method for manufacturing a VCO laminated module according to the present invention.

First, as shown in FIG. 41, a constituent layer 104 to be a core layer is prepared. The constituent layer 104 is a copper-clad plate having copper foils 500 attached on both sides in advance. Copper foil 50
The thickness of 0 is 12 μm, for example.

Next, the copper foils 500 on both surfaces of the constituent layer 104 are patterned to form conductor patterns 50, 50 of copper foil on both surfaces, as shown in FIG. The patterns of the conductor patterns 50, 50 are determined by, for example, the circuit configuration shown in FIG. Moreover, in patterning, a well-known photolithography process is performed.

Next, as shown in FIG. 43, the constituent layer 104
The constituent layer 103 and the constituent layer 105 are thermocompression-bonded to both surfaces thereof. The constituent layers 103 and 105 are made of copper foil 50 on one side in advance.
0 is attached to the RCC constituent layer, and the constituent layer 104
It is hardened by heating and pressing. The thickness of the copper foil 500 is, for example, 18 μm.

Next, the copper foil 500 of the constituent layers 103 and 105
And patterning the constituent layers 10 as shown in FIG.
Conductor patterns 50, 5 made of copper foil on one surface of each of 3, 105
Form 0. In patterning, a photolithography process is performed.

Next, as shown in FIG. 45, the constituent layer 103
The prepreg constituting layer 102 made of the hybrid material and the copper foil 500 are arranged on the side having the conductor pattern 50 of 1. and the two prepreg constituting layers 106 made of the hybrid material are made on the side of the constituting layer 105 having the conductor pattern 50. , 107 and the copper foil 500 are arranged, and the whole is thermocompression bonded. Here, two layers of prepreg constituting layer 106,
The reason for overlapping 107 is to increase the thickness of the resonator portion. The thickness of the copper foil 500 is, for example, 35 μm.

Next, as shown in FIG. 46, after forming the inner via hole 20 by NC processing, as shown in FIG. 47, a plating process is performed to carry out the inner via hole 2.
0, a plating film 201 is formed, and as shown in FIG. 48, the inner via hole 20 is filled with a conductive paste 202.

Next, the surfaces of the constituent layers 102 and 107 are surface-polished and planarized, and then the copper foil 500 is patterned to form a copper foil on each surface of the constituent layers 102 and 107 as shown in FIG. To form the conductor patterns 50, 50. In patterning, a photolithography process is performed.

Next, as shown in FIG. 50, the constituent layer 102
The constituent layer 101 is thermocompression bonded to the side having the conductor pattern 50, and the constituent layer 108 is thermocompression bonded to the side of the constituent layer 107 having the conductor pattern 50. As the constituent layers 102 and 108, RCC constituent layers having a copper foil 500 attached to one surface side are used.
Then, with the other surface side without the copper foil 500, the constituent layer 10
3 and 107 are thermocompression bonded. The thickness of the copper foil 500 is, for example, 35 μm.

Next, as shown in FIG. 51, the constituent layer 1
Blind via holes 30 are formed at 01 and 108.
The blind via hole 30 can be formed by drilling by NC processing, punching, or laser.

Next, as shown in FIG. 52, the constituent layer 101
Through via holes 40 are formed so as to penetrate through to 109. The through via hole 40 is also formed by NC processing.

Next, after depositing a plating film on the inner surfaces of the blind via hole 30 and the through via hole 40, the blind via hole 30 and the through via hole 40 are filled with a conductive paste, and the constituent layers 101 and 108 are further filled. The surface of (1) is polished by a mechanical or chemical method to remove the conductive paste rising on the surface, and the surfaces of the constituent layers 101 and 108 are flattened.

Next, a plating film is attached on the copper foil 500 formed on the constituent layers 101 and 108, and the copper foil 500 is formed.
The blind via hole 30 and the through via hole 40 existing in the plane of are closed. The plating process of the blind via hole 30 and the through via hole 40, the flattening process, and the plating process for the surface of the copper foil 500 are the same as the corresponding processes described in the method for manufacturing the PA laminated module, and thus are not shown.

Thereafter, the copper foil 500 formed on the constituent layers 101 and 108 is patterned by applying photolithography to obtain the laminated substrate 100 for VCO laminated module shown in FIG. Then, on the surface of the uppermost constituent layer 101 of the laminated substrate 100, the varicap diode D31 and the transistors T31 and T32 are formed.
(See FIG. 37), etc. are mounted and soldered. As a result, a VCO laminated module is obtained.

7. Front end laminated module (F
E Laminated Module) FIG. 55 shows an example of a circuit configuration of the FE laminated module according to the present invention. The FE layered module shown in the drawing is, for example, in the circuit shown in FIG.
And low pass filters LPF1 and LPF2 of the transmitter Tx
It has a circuit configuration in which

In the circuit of the FE laminated module shown in FIG. 55, the low pass filter LPF1 includes an inductor L41 and capacitors C41 to C43.
The low pass filter LPF2 includes an inductor L51 and capacitors C51 to C53.

The transmission / reception switch SW1 has a diode D61, a resistor R61, and a capacitor C61 on the DCS / Rx side.
And an inductor L61, and one end of the resistor R61 is connected to the switching signal terminal VC3. Also, DCS / T
The x side includes a diode D62, a capacitor C62, an inductor L62, and an inductor L63, and the connection point of the capacitor C62 and the inductor L63 is connected to the switching signal terminal VC4.

The transmission / reception switch SW2 has a diode D71, a resistor R71, and a capacitor C on the GSM / Rx side.
71 and an inductor L71, one end of the resistor R71 is connected to the switching signal terminal VC1. Also, GSM
The / Tx side has a diode D72 and a capacitor C72.
Including an inductor L72 and an inductor L73,
The connection point of the capacitor C72 and the inductor L73 is connected to the switching signal terminal VC2.

The diplexer DIP includes capacitors C81, C82 and C83 on the DCS side and an inductor L81, and capacitors C84 and C85 and an inductor L82 on the GSM side.

The antenna ANT is located outside the FE laminated module and is connected to a connection point between the DCS side capacitor C82 and the parallel circuit of the GSM side capacitor C85 and the inductor L82.

The circuit diagram of FIG. 55 is an example, and it goes without saying that the FE laminated module according to the present invention is not limited to the circuit of FIG. 55.

FIG. 56 is a perspective view showing a completed state of the FE laminated module in which the front end circuit as shown in FIG. 55 is modularized, FIG. 57 is an exploded perspective view of the FE laminated module shown in FIG. 56, and FIG. 56 is an enlarged sectional view schematically showing the internal structure of the FE laminated module shown in FIG. 56, and FIG. 59 is a bottom view showing the terminal arrangement of the FE laminated module shown in FIGS. 55 to 58. The arrangement of the passive elements on the laminated substrate 100 is not particularly limited. The figure only shows one example that can be adopted.

As shown in FIGS. 57 and 58, the laminated substrate 100 is formed by sequentially laminating 13 constituent layers 101 to 113. The constituent layers 101 to 113 are made of a hybrid material in which an organic resin material and a functional material powder are mixed.

Diodes D61, D62, D7 of FIG.
1, D72 and resistors R61 and R71 are the laminated substrate 1
00 is arranged on the constituent layer 101 located on the surface side. Other circuit elements are embedded inside the laminated substrate 100.

Signal terminals ST1 to ST4 shown in FIG.
58 and 59, the switching signal terminals VC1 to VC4 are connected to the conductor pattern 50 formed on the back surface of the lowermost constituent layer 113 of the laminated substrate 100. Further, the ground line of FIG. 55 is connected to the ground pattern GND.

The through via hole 40 penetrates the laminated substrate 100 in the thickness direction, and one end thereof is connected to the conductor pattern 50 on the back surface of the laminated substrate 100. In FIG. 59, seven through via holes 40 are present on the back surface of the lowermost constituent layer 113 of the laminated substrate 100, and four through via holes 40 are signal terminals ST1 to ST4.
And four switching signal terminals VC1 to VC4.

The blind via hole 30 is formed in the laminated substrate 1
Conductor pattern 50 provided on the front surface or the back surface of 00
And the conductor pattern 50 of the next layer are connected. FIG. 59.
Then, the four blind via holes 30 are the laminated substrate 1
00 exists on the back surface of the lowermost constituent layer 113. The four conductor patterns 50 connecting these four blind via holes 30 have signal terminals ST1 to ST4.
And the remaining 4 of the switching signal terminals VC1 to VC4 that are not connected to the conductor pattern 50 of the through via hole 40.
Used to connect two.

The inner via hole 20 serves as the laminated substrate 10.
The conductor pattern 50 formed inside 0 is connected. One end of the blind via hole 30 is terminated inside the laminated substrate 100, and both ends of the inner via hole 20 are terminated inside the laminated substrate 100.

Also in the FE laminated module, the constituent layers 101 to 113 constituting the laminated substrate 100 are made of a hybrid material in which an organic resin material and a functional material powder are mixed. The constituent layers 101 to 113 made of a hybrid material are
In the processing process, cracks and delamination are less likely to occur,
Since it has excellent mechanical strength, it is highly reliable as a product. Further, the insulation resistance between the layers does not deteriorate due to cracks, which is convenient for forming a capacitor.

Moreover, the through-hole via hole 40, the inner via hole 20, and the blind via hole 30 can be easily formed by using a punch or a drill or the like in the laminated substrate made of the hybrid material in which the organic resin material and the functional material powder are mixed. Therefore, various vias can be surely formed without causing positional deviation between layers.

Further, the constituent layer made of the hybrid material is
By selecting the type of functional material powder, desired electrical and magnetic properties can be provided. For example, when the dielectric powder is used as the functional material powder, the dielectric constant can be easily adjusted and the dielectric constant can be lowered by selecting the material of the dielectric powder. Since these materials have already been described in detail, the details are omitted.

In the FE laminated module, the signal terminal ST1
To ST4, the switching signal terminals VC1 to VC4, and the ground pattern GND are provided on the back surface of the laminated substrate 100. Therefore, the back surface side of the laminated substrate 100 can be attached to a motherboard or the like.

In the FE laminated module according to the present invention, the through via hole 40 penetrates the laminated substrate 100 in the thickness direction, and one end thereof has the signal terminals VC1 to VC4 and ST1 to ST1.
Connected to any of ST4. Also, the grounding pattern G
Conducts to either ND. Therefore, when imposing on a motherboard, etc., connect to the external circuit on the back side,
The electric circuit can be guided to the inside of the laminated substrate 100 and the surface of the laminated substrate 100 through the through via hole 40.

Further, the blind via hole 30 is used to connect the conductor pattern 50 for the passive element to the signal terminal S.
It can be connected to T1 to ST4 or switching signal terminals VC1 to VC4.

The inner via hole 20 is the laminated substrate 100.
The conductor patterns 50 formed inside are connected.
The through via hole 40 is not used for these internal connections. Therefore, the degree of freedom in the shape and arrangement of the terminals on the back surface side of the laminated substrate 100 is increased, and the area of the ground pattern can be secured.

8. Method for Manufacturing FE Laminated Module FIGS. 60 to 73 are views showing a method for manufacturing an FE laminated module according to the present invention.

First, as shown in FIG. 60 (a), a constituent layer 104 to be a core layer is prepared. The constituent layer 104 is a copper-clad plate having copper foils 500 previously attached to both surfaces. Copper foil 5
The thickness of 00 is 12 μm, for example.

On the other hand, as shown in FIG. 60 (b), a constituent layer 110 to be a core layer is prepared. The constituent layer 110 is also a copper-clad plate having copper foils 500 previously attached to both surfaces. The thickness of the copper foil 500 is, for example, 12 μm.

Next, the copper foils 500 on both surfaces of the constituent layers 104 and 110 are patterned, and as shown in FIGS. 61 (a) and 61 (b), the conductor patterns 50, 50 made of copper foil are formed on both surfaces.
To form. The patterns of the conductor patterns 50, 50 are determined by the circuit configuration shown in FIG. 55, for example. Moreover, in patterning, a well-known photolithography process is performed.

Next, as shown in FIG. 62A, the constituent layers 103 and 105 are thermocompression bonded to both surfaces of the constituent layer 104. The constituent layers 103 and 105 have copper foil 500 attached to one surface in advance, and are hardened by heating and pressure bonding to the constituent layer 104. The thickness of the copper foil 500 is, for example,
It is 12 μm.

On the other hand, for the constituent layer 110, FIG.
As shown in (b), the constituent layer 10 is formed on both surfaces of the constituent layer 110.
9 and the constituent layer 111 are thermocompression bonded. The constituent layer 109,
The copper foil 500 is attached to one surface of 111 in advance and is hardened by heating and pressure bonding to the constituent layer 110. The thickness of the copper foil 500 is, for example, 12 μm.

Next, the constituent layers 103, 105 and the copper foils 500 of the constituent layers 109, 111 are patterned to form the constituent layers 103, 10 as shown in FIGS. 63 (a) and 63 (b).
5, and the conductor patterns 50, 50 made of copper foil are formed on the respective surfaces of the constituent layers 109, 111. In patterning, a photolithography process is performed.

Next, as shown in FIG. 64A, the constituent layer 102 is provided on the side of the constituent layer 103 having the conductor pattern 50.
And the conductor pattern 50 of the constituent layer 105.
The constitutional layer 106 is arranged on the side having, and the whole is thermocompression bonded. The constituent layers 102 and 106 have a copper foil 500 on their surfaces. The thickness of the copper foil 500 of the constituent layer 102 is, for example, 3
The thickness of the copper foil 500 of the constituent layer 106 is 5 μm, for example,
It is 12 μm.

On the other hand, as shown in FIG. 64B, the constituent layer 108 is provided on the side of the constituent layer 109 having the conductor pattern 50.
And the conductor pattern 50 of the constituent layer 111.
The constituent layer 112 is disposed on the side having the, and the whole is thermocompression bonded. The constituent layers 108 and 112 have a copper foil 500 on their surfaces. The thickness of the copper foil 500 is, for example, 12 μm.

Next, the laminated body of the constituent layers 102 to 106 is subjected to the steps of NC processing, plating treatment, conductive paste filling and surface polishing to obtain the structure shown in FIG.
As shown in, the inner via hole 20 is formed. Since each of these steps has already been described, illustration and description thereof will be omitted.

Next, as shown in FIG. 66A, the copper foil 500 on the surface of the constituent layer 106 is patterned to form conductor patterns 50, 50 of copper foil. In addition, FIG.
As shown in (b), the copper foil 500 on the surface of the constituent layer 108.
Is patterned, and the conductor patterns 50, 5 made of copper foil are patterned.
Form 0. In patterning, a photolithography process is performed.

Next, as shown in FIG. 67, the constituent layer 102
To 106 and the laminated body of laminated bodies 108 to 112, the constituent layer 106 and the constituent layer 108 face each other, and the constituent layer 107 of the prepreg made of a hybrid material is arranged therebetween, and the whole is thermocompression bonded. Let

Next, as shown in FIG. 68, the inner via hole 20 is subjected to the steps of NC processing, plating processing, conductive paste filling and surface polishing for the laminated body of the constituent layers 102 to 112. To form. Since each of these steps has already been described, illustration and description thereof will be omitted.

Next, as shown in FIG. 69, the constituent layer 10
2, the copper foil 500 of the constituent layer 112 is patterned, and as shown in FIG. 69, the conductor patterns 50, 50 made of copper foil are formed on the respective surfaces of the constituent layer 102 and the constituent layer 112. In patterning, a photolithography process is performed.

Next, as shown in FIG. 70, the constituent layer 1
02, the constituent layer 101 is overlaid, the constituent layer 112 is overlaid with the constituent layer 113, and the whole is thermocompression bonded. Constituting layer 10
1, 113 have a copper foil 500 on the surface. Copper foil 500
Has a thickness of, for example, 35 μm.

Next, as shown in FIG. 71, the constituent layer 1
Blind via holes 30 are formed at 01 and 113.
The blind via hole 30 can be formed by drilling by NC processing, punching, or laser. The blind via hole 30 is completed by performing the steps of plating, filling with a conductive paste, and surface polishing after NC processing. This point has already been described.

Next, as shown in FIG. 72, the constituent layer 101
A through via hole 40 penetrating through ˜113 is formed. The through via hole 40 is also formed by NC processing. Also,
As described above, the through via hole 40 is also completed by performing the plating process, the conductive paste filling process, and the surface polishing process after the NC processing.

Thereafter, the copper foil 500 formed on the constituent layers 101 and 113 is patterned by applying photolithography to obtain the FE laminated module laminated substrate 100 shown in FIG. After that, the diodes D61, D62, D71, D72 and the resistor R61,
R71 and the like are mounted on the surface of the laminated substrate 100. As a result, the FE laminated module is completed.

[0247]

As described above, according to the present invention, it is possible to provide a laminated module which is small in size, high in performance, has less restrictions on a rear surface pattern to be faced, and has excellent electric characteristics. it can.

[Brief description of drawings]

FIG. 1 is a block diagram showing an example of a mobile communication device in which a laminated module according to the present invention is used.

FIG. 2 is a circuit diagram of a DCS-side power amplifier unit included in a PA laminated module (power amplifier laminated module) according to the present invention.

FIG. 3 shows G included in a PA laminated module according to the present invention.
It is a circuit diagram of a SM side power amplifier section.

FIG. 4 is an exploded perspective view of a PA laminated module according to the present invention.

5 is a perspective view of the PA laminated module shown in FIG. 4 in a completed state.

FIG. 6 is an enlarged cross-sectional view showing the internal structure of the PA laminated module according to the present invention.

FIG. 7 is a plan view of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

8 is a plan view of the constituent layer 102 of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

9 is a plan view of the constituent layer 103 of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

10 is a plan view of the constituent layer 104 of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

FIG. 11 is a plan view of the constituent layer 105 of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

12 is a plan view of the constituent layer 106 of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

FIG. 13 is a plan view of the constituent layer 107 of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

FIG. 14 is a plan view of the constituent layer 108 of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

15 is a plan view of the constituent layer 109 of the PA laminated module shown in FIGS. 4 and 5 as seen from the front surface side.

16 is a view of the constituent layer 109 of the PA laminated module shown in FIGS. 4 and 5 as viewed from the back surface side.

FIG. 17 is a diagram showing a manufacturing process of the PA laminated module shown in FIGS. 4 to 16;

FIG. 18 is a diagram showing a step that follows the step shown in FIG. 17.

FIG. 19 is a diagram showing a step that follows the step shown in FIG.

20 is a diagram showing a step that follows the step shown in FIG. 19. FIG.

21 is a diagram showing a step that follows the step shown in FIG. 20. FIG.

22 is a diagram showing a step that follows the step shown in FIG.

23 is a diagram showing a step that follows the step shown in FIG.

FIG. 24 is a diagram showing a step that follows the step shown in FIG.

25 is a diagram showing a step that follows the step shown in FIG. 24. FIG.

FIG. 26 is a diagram showing a step that follows the step shown in FIG.

27 is a diagram showing a step that follows the step shown in FIG. 26. FIG.

28 is a diagram showing a step that follows the step shown in FIG. 27. FIG.

29 is a diagram showing a step that follows the step shown in FIG. 28. FIG.

30 is a diagram showing a step that follows the step shown in FIG. 29. FIG.

31 is a diagram showing a step that follows the step shown in FIG. 30. FIG.

32 is a diagram showing a step that follows the step shown in FIG. 31. FIG.

FIG. 33 is a diagram showing a step that follows the step shown in FIG. 32.

FIG. 34 is a diagram showing a step that follows the step shown in FIG. 33.

FIG. 35 is a diagram showing a step that follows the step shown in FIG. 34.

FIG. 36 is a diagram showing a step that follows the step shown in FIG. 35.

FIG. 37 shows an example of a circuit configuration of a VCO (voltage controlled oscillator).

38 is an exploded perspective view of a VCO laminated module in which the VCO circuit as shown in FIG. 37 is modularized.

39 is an enlarged cross-sectional view schematically showing the internal structure of the VCO laminated module (voltage-controlled oscillator laminated module) shown in FIG. 38.

40 is a bottom view showing the terminal arrangement on the bottom side of the VCO laminated module shown in FIG. 39. FIG.

41 is a diagram showing a manufacturing process of the VCO laminated module shown in FIGS. 38 to 40. FIG.

42 is a diagram showing a step that follows the step shown in FIG. 41. FIG.

43 is a diagram showing a step that follows the step shown in FIG. 42. FIG.

FIG. 44 is a diagram showing a step that follows the step shown in FIG. 43.

45 is a diagram showing a step that follows the step shown in FIG. 44. FIG.

FIG. 46 is a diagram showing a step that follows the step shown in FIG. 45.

47 is a diagram showing a step that follows the step shown in FIG. 46. FIG.

48 is a diagram showing a step that follows the step shown in FIG. 47. FIG.

FIG. 49 is a diagram showing a step that follows the step shown in FIG. 48.

FIG. 50 is a diagram showing a step that follows the step shown in FIG. 49.

51 is a diagram showing a step that follows the step shown in FIG. 50. FIG.

52 is a diagram showing a step that follows the step shown in FIG. 51. FIG.

53 is a diagram showing a step that follows the step shown in FIG. 52. FIG.

54 is a diagram showing a step that follows the step shown in FIG. 53. FIG.

FIG. 55 is a circuit diagram of a front end laminated module (FE laminated module) according to the present invention.

FIG. 56 is a perspective view showing a completed state of the FE laminated module.

57 is an exploded perspective view of the FE laminated module shown in FIG. 56. FIG.

58 is an enlarged cross-sectional view schematically showing the internal structure of the FE laminated module shown in FIG. 56.

59 is a bottom view showing the terminal arrangement of the FE laminated module shown in FIGS. 55 to 58. FIG.

FIG. 60 is a diagram showing a manufacturing process of the FE laminated module shown in FIGS. 55 to 59.

FIG. 61 is a diagram showing a step that follows the step shown in FIG. 60.

FIG. 62 is a diagram showing a step that follows the step shown in FIG. 61.

FIG. 63 is a diagram showing a step that follows the step shown in FIG. 62.

FIG. 64 is a diagram showing a step that follows the step shown in FIG. 63.

FIG. 65 is a diagram showing a step that follows the step shown in FIG. 64.

66 is a diagram showing a step that follows the step shown in FIG. 65. FIG.

67 is a diagram showing a step that follows the step shown in FIG. 66. FIG.

68 is a diagram showing a step that follows the step shown in FIG. 67. FIG.

69 is a diagram showing a step that follows the step shown in FIG. 68. FIG.

70 is a diagram showing a step that follows the step shown in FIG. 69. FIG.

71 is a diagram showing a step that follows the step shown in FIG. 70. FIG.

72 is a diagram showing a step that follows the step shown in FIG. 71. FIG.

73 is a diagram showing a step that follows the step shown in FIG. 72. FIG.

[Explanation of symbols]

20 Inner beer hole 30 blind beer hall 40 through via holes 100 laminated substrate 101 to 113 constituent layers

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Minoru Takatani             1-13-1, Nihonbashi, Chuo-ku, Tokyo             -In DC Inc. (72) Inventor Toshikazu Endo             1-13-1, Nihonbashi, Chuo-ku, Tokyo             -In DC Inc. F-term (reference) 5E346 AA02 AA12 AA13 AA33 AA36                       AA43 BB04 CC04 CC09 CC10                       CC12 CC13 CC14 CC21 CC32                       CC34 CC38 CC39 DD07 DD12                       DD22 DD32 EE06 EE20 EE32                       EE39 FF04 FF18 FF45 GG06                       GG07 GG15 GG22 HH06 HH22                       HH33 HH40

Claims (3)

[Claims] 1. A laminated substrate, an active element, a passive element,
An external connection terminal, a ground pattern, a through via hole, a blind via hole, an inner via hole, a laminated module, wherein the laminated substrate is configured by laminating a plurality of constituent layers, the plurality of At least a part of the constituent layer is made of a hybrid material in which an organic resin material and a functional material powder are mixed, the active element is arranged on the surface of the laminated substrate, and at least a part of the passive element is A conductive pattern formed inside the laminated substrate; the external connection terminal and the grounding pattern are provided on the back surface of the laminated substrate; and the through via hole penetrates the laminated substrate in the thickness direction. The one end of the laminated substrate is electrically connected to the external connection terminal or the ground pattern on the back surface of the laminated substrate. Is connected between the conductor pattern provided on the front surface or the back surface of the laminated substrate and the conductor pattern of the next layer, and is electrically connected to the external connection terminal or the ground pattern, and the inner via hole is A laminated module for connecting the conductor patterns formed inside the laminated substrate. 2. The laminated module according to claim 1, wherein the grounding pattern has a thermal via in its surface to form a heat dissipation pattern. 3. The laminated module according to claim 2, wherein the ground pattern has a surface area of 80
A laminated module that occupies an area of at least%.