WO2003100970A1

WO2003100970A1 - Lc series resonance circuit, board incorporating lc series resonance circuit, and production methods therefor

Info

Publication number: WO2003100970A1
Application number: PCT/JP2003/006649
Authority: WO
Inventors: Yuichi Ichikawa; Kouichirou Sagawa; Masahiko Oshimura
Original assignee: Ajinomoto Co.,Inc.
Priority date: 2002-05-29
Filing date: 2003-05-28
Publication date: 2003-12-04
Also published as: AU2003241821A1; JP2005347782A; TW200400523A

Abstract

A small LC series resonance circuit, and its producing method, in which a series resonance frequency can be set readily and the number of turns can be set substantially arbitrarily. The LC series resonance circuit comprises a coil being formed integrally with a multilayer board and including a winding part parallel with the multilayer board and a winding part perpendicular thereto, and a capacitor being formed integrally with the multilayer board and being connected electrically in series with the coil characterized in that the coil and the capacitor are supported in the multilayer board, adjacent unit windings of the coil, have spiral patterns turning in the opposite directions as viewed from the same direction and the sets of adjacent unit windings of the coil are connected alternately at the forward end or the end of the spiral pattern.

Description

Specification

LC series resonance circuit, substrate with built-in LC series resonance circuit, and methods of manufacturing them

(Technical field)

The present invention relates to an LC series resonance circuit and a method of manufacturing the same, and more particularly, the number of turns and the forming direction of a coil can be set almost arbitrarily, and a capacitance component is positively applied and connected in series with the coil. The present invention relates to a small LC series resonance circuit formed in a multilayer capable of controlling a series resonance frequency, and a method for manufacturing the same. The LC series resonance circuit is not only a replacement for the chip capacitors conventionally used, but also a semiconductor chip in which composite parts such as LC filters and VCOs, multi-layer boards, and interposers that incorporate the circuit are laminated on the outer surface. It can also be suitably used.

(Background technology)

In recent years, high-performance and small-sized electric devices using high frequency, such as personal computers and mobile phones, have been widely used. These devices use a large number of so-called laminated LC filters that combine an inductor (coil) and a capacitor to remove unnecessary signals.

In these high-frequency circuits, a coupling capacitor, which cuts a DC signal and passes only a high-frequency signal, is used for connection between the circuits.

Furthermore, a capacitor called a decoupling capacitor having a low impedance with respect to a used frequency is also used. The decoupling capacitor works to drop the signal that has passed through high impedance components to GND.

Many proposals for these capacitors and components containing capacitors have been made. The basic structure of a capacitor is a structure in which a dielectric is sandwiched between opposing conductors. Various structures have been used by connecting them in series or in parallel. As the capacitor-containing component, for example, in the case of an LC filter, as described in Japanese Patent Application Laid-Open No. Hei 6-20939, an inductor having a helical structure and a capacitor having opposing electrodes are all circuits. It is general that the formation direction is parallel to the opposite plane and an electrode for connecting the substrate is provided outside the plane. However, these methods are structurally inevitably large and difficult to miniaturize.

Similarly, there are many proposals for VCO as a combination of a capacitor and an inductor. The structure is the same as that of the LC filter, and miniaturization is also difficult.

As for these composite parts, in addition to widely used ceramic parts, many proposals using organic materials such as printed circuit board materials have been made in recent years. However, as for the structure and manufacturing method, as in the case of ceramics, the inductor having a helical structure and the capacitor having opposing electrodes are arranged so that all circuit formation directions are parallel to the substrate plane, and Only proposals have been made for those provided with anti-connection electrodes.

On the other hand, with the recent development of multilayer substrate manufacturing technology such as the build-up method, so-called component-embedded substrates, in which various active / passive substrates are built inside the substrate, are being actively researched. However, as for the method of forming a capacitor in a substrate, there has been no publication other than that of a method of sandwiching a dielectric between opposing conductors as before.

In addition, ICs with inductors, capacitors, and resistors are widely used as the heart of various devices. The IC circuit is a high-frequency circuit more than a general board, and the filter and capacitor as described above are indispensable and built into the circuit. However, as for the individual capacitors, as before, there has been no publication other than that of a structure in which a dielectric is sandwiched between opposing conductors.

As an invention similar to the LC series resonance circuit of the present invention, for example, Japanese Patent Application Laid-Open No. 58-187 There is a proposal of a chip inductor having a circuit formed like a chip. Further, Japanese Patent Application Laid-Open Nos. Sho 62-187970 and JP-A-Hei 437-1706 disclose a circuit similar to the coil portion of the present invention in the direction perpendicular to the opposite plane. A coil having a plurality of surfaces is formed in a spiral shape in a plurality of layers, and adjacent circuits via an insulating layer have a spiral pattern wound in opposite directions when viewed from the same direction. An inductor component using a coil characterized by being connected has been proposed. However, none of these proposals mentions a method of controlling the series resonance frequency by positively adding a capacitance component.

The present invention provides a small-sized LC series resonance circuit suitable for use as a chip capacitor, a capacitor built-in component, a capacitor built-in substrate and a capacitor component for a capacitor built-in Ic chip, which can easily control the series resonance frequency, and a method of manufacturing the same. The task is to do so.

(Disclosure of the Invention)

The above object is achieved by the present invention having the following features. That is, the invention described in claim 1 is a coil formed integrally with a multilayer substrate, the coil including a winding portion parallel to the multilayer substrate and a winding portion perpendicular to the multilayer substrate. And a capacitor formed integrally with the multilayer substrate, the capacitor being electrically connected in series with the coil, wherein the coil and the capacitor are supported in the multilayer substrate, Each of the unit windings of the coil has a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings. The sets are characterized by being connected alternately at the tips or ends of the spiral pattern.

The invention described in claim 2 is a coil formed integrally with the multilayer substrate, wherein the coil includes a winding portion parallel to the multilayer substrate and a winding portion perpendicular to the multilayer substrate. A capacitor formed integrally with the multilayer substrate, wherein the coil is And a core structure made of a columnar magnetic material penetrating the inside of the coil, and the coil, the capacitor and the core structure are supported in the multilayer substrate. It is characterized by being performed.

The invention described in claim 3 has the feature of the invention described in claim 2 in addition to the case where the unit winding of the coil is viewed from the same direction as another adjacent unit winding. Each of the coils has a spiral pattern that turns in the opposite direction, and the sets of adjacent unit windings of the coil are connected alternately at the tips of the spiral pattern or at the ends thereof. Characterized by

The invention described in claim 4 has the feature that, in addition to the features of the invention described in any one of claims 1 to 3, the coil has a winding portion parallel to the multilayer substrate. It is formed as a part of a stacked conductive layer, and a winding portion perpendicular to the multilayer substrate is formed as a bump connecting the adjacent conductive layer via the insulating layer.

The invention set forth in claim 5 is characterized in that, in addition to the features of the invention set forth in any one of claims 1 to 3, the coil is formed parallel to the multilayer substrate by a build-up method. A winding portion is formed as a part of the stacked conductive layers, and a winding portion perpendicular to the multilayer substrate is formed as a via or a through hole connecting the adjacent conductive layers through the insulating layer. It is characterized by the following.

The invention described in claim 6 is characterized in that, in addition to the features of the invention described in any one of claims 1 to 5, an organic material is used for the insulating layer of the multilayer substrate. And

The invention set forth in claim 7 provides, in addition to the features of the invention set forth in any one of claims 1 to 6, the use of ceramic for the dielectric constituting the capacitor. Features.

The invention described in claim 8 is defined in any one of claims 1 to 7 In addition to the features of the invention described in PC so-called back 49, the dielectric constituting the capacitor is made of fired high dielectric ceramic.

The invention described in claim 9 is characterized in that, in addition to the features of the invention described in any one of claims 1 to 6, the dielectric constituting the capacitor is a powder of high dielectric ceramic or It is made of an organic material containing whisker.

The invention described in claim 10 is characterized in that, in addition to the features of the invention described in claim 8 or 9, the high dielectric ceramic is at least one of barium titanate and strontium titanate. It is characterized by containing.

The invention described in claim 11 is formed integrally with the LC series resonance circuit according to any one of claims 1 to 10, the multilayer substrate, and the multilayer substrate. And another circuit supported in the multilayer substrate. The invention described in claim 12 includes the LC series resonance circuit in a multilayer substrate according to any one of claims 1 to 10, and is laminated on an outer surface of a semiconductor chip. The semiconductor chip is electrically connected to a specific portion of the semiconductor chip.

The invention set forth in claim 13 is characterized in that, in addition to the features of the invention described in claim 3 of claim 11, the invention is laminated on the outer surface of the semiconductor chip, and is arranged between a specific portion of the semiconductor chip. And are electrically connected.

The invention described in claim 14 is a step of forming one insulating layer constituting the multilayer substrate, a step of forming a capacitor inside the multilayer substrate, and a winding of a coil parallel to the multilayer substrate. Forming at least a portion of the portion on the insulating layer in the multilayer substrate; and forming a vertical connection portion for electrically connecting at least a portion of the winding portion of the coil parallel to the multilayer substrate between the insulating layers. Forming at least a part of a winding portion of a coil perpendicular to the multilayer substrate, and connecting the capacitor and the coil so that they are electrically connected in series. Electrically connecting;

The step of forming an insulating layer, the step of forming at least a part of a winding portion of a coil parallel to the multilayer substrate, and at least a part of a winding portion of a coil perpendicular to the multilayer structure. A predetermined coil supported in the multilayer substrate is formed by a coil winding portion parallel to the multilayer substrate and a coil winding portion perpendicular to the multilayer substrate in at least one of the forming steps. And repeating steps as appropriate for the part of the multilayer substrate formed up to that point.

The unit windings of the predetermined coil each have a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings, and the unit windings of the predetermined coil are adjacent to each other. The set of unit windings is characterized by being connected alternately at the ends or ends of the spiral pattern.

The invention according to claim 15 includes a step of forming one insulating layer constituting the multilayer substrate, a step of forming a capacitor in the multilayer substrate, and a winding of a coil parallel to the multilayer substrate. Forming at least a portion of the portion on an insulating layer in the multilayer substrate; and a vertical connection portion for electrically connecting at least a portion of the winding portion of the multilayer antiparallel coil between the insulating layers. Forming at least a part of a winding portion of a coil perpendicular to the multilayer substrate; and forming a capacitor between the capacitor and the coil so as to be electrically connected in series. Electrically connecting to each other; and forming a core structure made of a columnar magnetic material so as to be disposed inside the coil.

The step of forming an insulating layer, the step of forming at least a part of a coil winding part parallel to the multilayer substrate, and the forming of at least a part of a coil winding part perpendicular to the multilayer substrate. A predetermined coil supported in the multilayer substrate is formed by the winding portion of the coil parallel to the multilayer substrate and the winding portion of the coil perpendicular to the multilayer substrate. Until it is formed Repeating the steps as appropriate for the portion of the multi-layer substrate. The invention set forth in claim 16 may include, in addition to the features of the invention set forth in claim 14 or 15, the vertical connection portion may be adjacent to the conductive layer via the insulating layer. Are connected to each other.

The invention described in Claim 17 provides, in addition to the features of the invention described in Claims 14 or 15, at least one of the steps is performed by a build-up method, and

The vertical connection portion is a via or a through hole connecting the adjacent conductive layers through the insulating layer.

The invention described in claim 18 uses an organic material for the insulating layer of the multilayer substrate in addition to the features of the invention described in any one of claims 14 to 17. It is characterized by the following.

The invention described in claim 19 is characterized in that, in addition to the features of the invention described in any one of claims 14 to 18, a ceramic is used for the dielectric material constituting the capacitor. It is characterized by doing.

The invention set forth in claim 20 is characterized in that, in addition to the features of the invention set forth in any one of claims 14 to 19, the dielectric material constituting the capacitor is fired. It is characterized by being made of dielectric ceramic.

The invention described in claim 21 is characterized in that, in addition to the features of the invention described in any one of claims 14 to 18, the dielectric constituting the capacitor is a high dielectric ceramic. Or an organic material containing whisker. The invention set forth in claim 22 is the invention according to claim 20 or 21, wherein the high dielectric ceramic is made of barium titanate or sodium titanium titanate. It is characterized by containing at least one of the above.

The invention described in claim 23 is any one of claims 14 to 22. 2. The method according to claim 1, further comprising the step of forming another circuit supported in the multilayer substrate integrally with the multilayer substrate. It is characterized by the following.

The invention described in claim 24 includes a step of the method for manufacturing an LC series resonance circuit according to any one of claims 14 to 22, wherein the LC series resonance circuit is provided. The substrate with a built-in circuit is laminated on the outer surface of the semiconductor wafer, and a step for electrically connecting the substrate with a built-in LC series resonance circuit to a specific portion of the semiconductor chip; Separating the semiconductor wafer on which the substrate with a built-in resonance circuit is laminated in units of semiconductor chips. The invention described in claim 25 has the feature of the invention described in claim 23, and furthermore, the substrate with a built-in LC series resonance circuit is laminated on the outer surface of the semiconductor wafer. A step of electrically connecting the substrate with a built-in LC series resonance circuit to a specific portion of the semiconductor chip; and a step of electrically connecting the substrate with a built-in LC series resonance circuit to the semiconductor. And a step of dividing into semiconductor chip units.

The invention set forth in claim 26 includes a step of the method for manufacturing an LC series resonance circuit according to any one of claims 14 to 22, wherein the LC series resonance circuit is provided. The circuit is stacked on the outer surface of the semiconductor chip, and further includes a step of electrically connecting the LC series resonance circuit to a specific portion of the semiconductor chip.

The invention set forth in claim 27 includes a step of the method for manufacturing a multilayer substrate with built-in LC series resonance circuit according to claim 23, wherein the substrate with built-in LC series resonance circuit is a semiconductor. A step of being stacked on the outer surface of the chip, further comprising: a step of electrically connecting the built-in LC series resonance circuit to a specific portion of the semiconductor chip. Note that the terms tip and end in this specification refer to either one end of the spiral pattern, here the innermost end is the tip, and the outermost end is the end, based on the innermost end. I do. Further, in the present specification, terms representing positional relationships such as parallel and vertical are not required to be strictly geometrical, and have a meaning that such positional relationships are sufficient.

As is clear from the structure, the LC series resonance circuit of the present invention has an active component added to it, and its size can be freely adjusted. As a result, the series connection of such LC series resonance circuit The resonance frequency can be easily controlled.

(Brief description of drawings)

FIG. 1A is a perspective conceptual view of an LC series resonance circuit according to the first embodiment of the present invention, and FIG. 1B is a perspective conceptual view of the LC series resonance circuit according to the second embodiment of the present invention. Fig. 1 (c) is a perspective conceptual view of an LC series resonance circuit according to a third embodiment of the present invention, and Figs. 1 (d) and 1 (e) show the structure of another coil. It is a figure showing an example.

FIG. 2A is a perspective conceptual view of the LC series resonance circuit according to the fourth embodiment of the present invention, and FIG. 2B is a perspective conceptual view of the LC series resonance circuit according to the fifth embodiment of the present invention. FIG. 2C is a conceptual perspective view of an LC series resonance circuit according to a sixth embodiment of the present invention.

FIG. 3 is a conceptual perspective view of an LC series resonance circuit according to the first embodiment of the present invention at an initial stage of manufacturing.

FIG. 4 is a conceptual perspective view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 5 is a conceptual perspective view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 6 shows an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

9 FIG. 6649 is a perspective conceptual view.

FIG. 2 is a schematic perspective view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 8 is a conceptual perspective view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 9 is a perspective conceptual view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 10 is a conceptual perspective view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 11 is a perspective conceptual view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 12 is a conceptual perspective view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 13 is a perspective conceptual view showing an example of a method for manufacturing an LC series resonance circuit according to the first embodiment of the present invention.

FIG. 14 is a cross-sectional view of an LC series resonance circuit according to the first embodiment of the present invention at an initial stage of manufacturing on an IC chip.

FIG. 15 is a cross-sectional view for explaining via formation.

FIG. 16 is a cross-sectional view for explaining formation of a conductive pattern for forming a circuit. FIG. 17 is a cross-sectional view for explaining the formation of the second insulating layer. '.

FIG. 18 is a cross-sectional view for explaining the formation of the second conductive pattern.

FIG. 19 is a cross-sectional view for explaining formation of the third layer.

FIG. 20 is a conceptual sectional view of an LC series resonance circuit formed on an IC chip according to the first embodiment of the present invention.

FIG. 21 is a conceptual diagram of a cross section of a via. FIG. 22 is a conceptual sectional view showing an example of an LC series resonance circuit formed on an IC chip according to the first embodiment of the present invention.

FIG. 23 is a conceptual cross-sectional view showing an example of an LC series resonance circuit formed on an IC chip according to the first embodiment of the present invention.

FIG. 24 is a plan view of a coil and a capacitor of the LC series resonance circuit according to the embodiment of the present invention.

FIG. 25 is a cross-sectional view of the LC series resonance circuit according to the embodiment of the present invention, taken along the line AA.

FIG. 26 is a perspective view of a coil of the LC series resonance circuit according to the embodiment of the present invention. FIG. 27 is a graph illustrating a frequency characteristic of a reactance component of a coil of the LC series resonance circuit according to the embodiment of the present invention.

FIG. 28 is a perspective view of a capacitor of the LC series resonance circuit according to the embodiment of the present invention.

FIG. 29 is a graph showing the frequency characteristic of the reactance component of the capacitor of the LC series resonance circuit according to the embodiment of the present invention.

FIG. 30 is a plan view of the LC series resonance circuit according to the embodiment of the present invention.

FIG. 31 is a perspective view of the LC series resonance circuit according to the embodiment of the present invention.

FIG. 32 is a graph illustrating a frequency characteristic of a reactance component of the LC series resonance circuit according to the example of the present invention.

FIG. 33 is a circuit diagram of an LC series resonance circuit and a graph showing frequency characteristics of a current.

(Best mode for carrying out the invention)

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The advantages of using the LC series resonance circuit of the present invention in a high-frequency circuit or the like will also be described. The configuration of the LC series resonance circuit 100 according to the first embodiment of the present invention will now be described. The back of the picture 649 will be described. FIG. 1A is a conceptual perspective view showing a schematic configuration of the LC series resonance circuit 100. The LC series resonance circuit 100 is composed of a coil 100a, a capacitor 100c, connection points 100f and 100g, and a multilayer substrate 100h. The coil 100a is a component that gives an inductance and is formed as a part of the conductive layer in each step of forming the plurality of insulating layers and conductive layers in the multilayer. Such a coil whose central axis is parallel to the multilayer substrate is called a “vertical coil”. The coil 100a is preferably configured in such a manner that a unit winding 100 Ob having a repeating pattern of a conducting wire having a rectangular or circular cross section is electrically and continuously connected in series. Is done. The form of the coil 100a and the unit winding 100b in the present specification is intended to broadly include any form for providing inductance. Preferably, a winding portion of the coil 100a parallel to the multilayer is formed as a part of a conductive layer to be stacked, and a winding portion perpendicular to the multilayer substrate is adjacent to the multilayer substrate via an insulating layer. It is formed as a bump, a via, a through hole, or the like connecting the conductive layers. By forming the coil 100a in this manner, the coil 100a is formed in a multilayer board manufacturing process by using a known multilayer board (printed board) forming technique such as a build-up method. At the same time. The coil 100a includes a winding portion parallel to the multilayer substrate 100h and a winding portion perpendicular to the multilayer substrate. The capacitor 100c is composed of two opposing electrode plates 100d and a dielectric material 100e sandwiched therebetween. When it is necessary to further increase the capacitance of the capacitor, the electrode plate consisting of opposing comb-shaped electrodes and a multi-layer dielectric sandwiched between them, as used in a general multilayer capacitor, are used. It may be a configured capacitor. The electrode plate 100d is preferably formed as a part of the conductive layer in the step of forming each of the plurality of insulating layers and the conductive layer in the multilayer substrate. The dielectric 100 e may be the same material as the insulating material composing the multilayer fiber 100 h, and in consideration of the dielectric constant, cost, manufacturing process, etc., the multilayer substrate 100 h May be different from the insulating material constituting the material. The connection point 100Of is a contact point for electrically connecting one end of the coil 100a and one of the electrode plates 100d. Connection point 100 gl This is a contact for electrically connecting the wiring going to the outside and the other of the electrode plates 100 d. When connected in this way, the capacitor 100c and the coil 100a are electrically connected in series, and together form an LC series resonance circuit. The other end of the coil 100a is connected to a wire extending from the LC series resonance circuit to the outside. The multilayer substrate 10 Oh is a substrate configured by laminating insulating layers. In the actual step of forming the multilayer substrate 10 Oh, insulating layers and conductive layers are alternately laminated. The portion of the conductive layer becomes a part of the coil 100a, and the portion of the other insulating layer becomes the multilayer substrate 100 Oh. The LC series resonance circuit 100 does not mean the entire multilayer substrate including such an LC series resonance circuit, but is characterized by being held in the multilayer substrate. Means

Next, the configuration of the LC series resonance circuit 120 according to the second embodiment of the present invention will be described. FIG. 1B is a conceptual perspective view showing a schematic configuration of the LC series resonance circuit 120. The LC series resonance circuit 120 has a structure in which the capacitor 100c is arranged outside the coil 100a in the LC series resonance circuit 100. Each component of the LC series resonance circuit 120 corresponds to a component of the LC series resonance circuit 100 whose reference numeral is changed from 100 to 120. In the structure where the capacitor 100c is placed inside the coil 100a, as in the LC series resonance circuit 100, it is said that the overall thickness is thinner and thinner by increasing the degree of integration. There are advantages. In addition, there is an advantage that the area of the unit winding 100b is increased to easily form the coil 100a having a larger inductance. On the other hand, in a structure such as the LC series resonance circuit 120 in which the capacitor 120c is disposed outside the coil 120a, the process of laminating the coil 120c is omitted. The advantage is that it can be simplified. In addition, the capacitor 120 c is located near the outer surface of the multilayer substrate 12 Oh. Since it is located, it is possible to fine-tune the capacitance by trimming the electrode plate 120c with laser or the like and adjusting the area.

Next, the configuration of the LC series resonance circuit 140 according to the third embodiment of the present invention will be described. FIG. 1C is a perspective conceptual view showing a schematic configuration of the LC series resonance circuit 140. The LC series resonance circuit 140 has a structure in which the magnetic body 140i is arranged inside the coil 120a in the LC series resonance circuit 120. Each component of the LC series resonance circuit 140 corresponds to a component of the LC series resonance circuit 120 in which the numeral portion of the code is changed from 120 to 140. As described above, since the magnetic body 140i is disposed inside the coil 140a, there is an advantage that the inductance of the coil 140a can be increased. Note that a configuration in which a magnetic material is disposed inside the coil 100a of the LC series resonance circuit 100 according to the first embodiment of the present invention is also possible. In this case, a magnetic body can be arranged on the upper side, the lower side, or both sides of the capacitor. Figures 1 (d) and (e) are examples of other coil structures. In these examples, the coil is constituted only by the winding portion in the direction parallel or perpendicular to the center axis of the coil.

Next, the configuration of an LC series resonance circuit 200 according to a fourth embodiment of the present invention will be described. FIG. 2A is a perspective conceptual view showing a schematic configuration of the LC series resonance circuit 200. The LC series resonance circuit 200 includes a coil 200a, a capacitor 200c, connection points 200f and 200g, and a multilayer substrate 200h. The structure of these components is almost the same as that of the above-mentioned LC series resonance circuit 100, and the sign is also changed only from “100” to “200j” in the numerals. The unit windings 200 Ob of the coil 200a each have a helical pattern that turns in the opposite direction when viewed from the same direction as other adjacent unit windings. The configuration of the coil 100a is different from that of the coil 100a in that the lines are connected to each other at the tips or ends of the spiral pattern. With this configuration, the number of turns in the unit winding can be made larger than one, and when a current flows through the coil 200a, all the unit windings generate a magnetic field in the same direction. Therefore, the inductance can be increased. A coil having such a structure is distinguished from a single-layer coil such as the coil 100a, and is hereinafter referred to as a multilayer coil.

Next, the configuration of the LC series resonance circuit 220 according to the fifth embodiment of the present invention will be described. FIG. 2B is a schematic perspective view showing a schematic configuration of the LC series resonance circuit 220. The LC series resonance circuit 220 has a structure in which the capacitor 200c is arranged outside the coil 200a in the LC series resonance circuit 200. Each component of the LC series resonance circuit 220 corresponds to a component of the LC series resonance circuit 200 in which the numeral portion of the reference numeral is changed from 200 to 220. In a structure where the capacitor 200c is placed inside the coil 200a, as in the LC series resonance circuit 200, it is said that the overall thickness is thinner and thinner by increasing the degree of integration. There are advantages. In addition, there is an advantage that the area interlinking the magnetic field of the unit winding 200 Ob is increased to form a coil 200 a having a larger inductance. On the other hand, in a structure in which the capacitor 220c is disposed outside the coil 220a, such as the LC series resonance circuit 220, the process of laminating the coil 220c is simplified. In addition, there is an advantage that a capacitor 220c having a larger electrode plate area can be selected. Further, similarly to the above-described LC series resonance circuit 120, the capacitance of the capacitor 220c can be finely adjusted.

Next, the configuration of the LC series resonance circuit 240 according to the sixth embodiment of the present invention will be described. FIG. 2C is a conceptual perspective view showing a schematic configuration of the LC series resonance circuit 240. The LC series resonance circuit 240 has a structure in which the magnetic body 240i is arranged inside the coil 220a in the LC series resonance circuit 220. Each component of the LC series resonance circuit 240 is [0306649] Corresponds to the component in which the numeral part of the code is changed from 220 to 240. As described above, since the magnetic material 240i is disposed inside the coil 240a, there is an advantage that the inductance of the coil 240a can be increased. Note that a configuration in which a magnetic body is disposed inside the coil 200a of the LC series resonance circuit 200 according to the fourth embodiment of the present invention is also possible. In this case, a magnetic body can be arranged on the upper side, the lower side, or both sides of the capacitor.

The operation of the LC series resonance circuits 100, 120, 140, 200, 220 and 240 will now be described. The multilayer substrate 100 h, 12 Oh, 14 Ohs 200 Ti, 22 Oh or 24 Oh is preferably used as an interposer for mounting a semiconductor chip constituting a monolithic IC or the like thereon. Also, the multilayer board 100 h, 120 h, 140 h, 200 h, 220 h or 240 h can have other circuit elements formed inside or mounted outside, and such other circuit elements can be mounted. It is possible to configure a semiconductor package in which the function of a circuit composed of a semiconductor chip and the LC series resonance circuit 100, 120, 140, 200, 220 or 240 is added to the function of the semiconductor chip itself. In such a semiconductor package, if the series resonance frequency of the LC series resonance circuit 100, 120, 140, 200, 220, or 240 can be freely controlled, the characteristics of the semiconductor package can be flexibly set. become. In the present invention, the capacitance can be changed by changing the configuration of the capacitor (the plate area, the distance between the plates, the dielectric constant of the dielectric, etc.), and the degree of the decrease in the series resonance frequency can be controlled. That is, the series resonance frequency can be easily controlled while keeping the coil portion common. Further, by adjusting the extension direction of the coil, the number of windings can be set easily and almost arbitrarily, and the inductance can be changed. Also, the inductance can be set flexibly by adjusting the area where the unit winding interlinks with the magnetic field as a whole or partially. In this way, the static of the capacitor can be changed easily and freely. Therefore, the series resonance frequency can be set easily and freely. Thus, when an AC voltage is applied from an external circuit to the LC series resonance circuit, the frequency band through which the current is passed or blocked, and the degree thereof can be flexibly set. First, the replacement of the coupling capacitor that is used for the connection between circuits and that cuts the DC signal and passes the high-frequency signal will be described. As will be described later, in the LC series resonance circuit of the present invention, the inductance component can be easily and almost arbitrarily added, so that the series resonance frequency can be easily controlled. Therefore, in addition to the effect of the coupling capacitor, a so-called band-pass filter effect that allows only a necessary frequency region to pass can be exhibited.

Next, the application to a decoupling capacitor, that is, a capacitor that plays a role of dropping a high impedance signal to GND is described. If the LC series resonance circuit of the present invention having a series resonance frequency according to the operating frequency is used in place of the decoupling capacitor by adjusting the intagter component, the intended signal in the operating frequency band is more reliably dropped to GND. It is possible.

In the LC series resonance circuit of the present invention, a coil-shaped circuit is actively added. With such a structure, the series resonance frequency can be controlled. In other words, it is possible to control the series resonance frequency while keeping the capacitor portion common, or to control the coil-shaped portion as it is. Furthermore, in the coil-shaped circuit part, the inductance component can be set almost arbitrarily by adjusting the number of turns and the length. Next, a method of manufacturing the LC series resonance circuits 100, 120, 200, and 220 of the present invention will be described together with advantages compared with the prior art. In order to form such a structure, there is a method in which a pattern formed in a direction perpendicular to the substrate plane (coil-shaped circuit) and a pattern formed in a direction parallel to the substrate (capacitor-shaped circuit) are collectively performed. It is necessary. In a method of forming a coil that has been widely used in the past, that is, a method of forming a spiral pattern in a direction parallel to the plane of the substrate, a method perpendicular to the plane of the substrate is used. This requires complicated processes such as sitting and gluing to form a capacitor component, which is practically impossible.

On the other hand, in the present invention, a part of the coil is formed in parallel with the opposite plane by sequentially forming an insulating layer, forming a hole, and forming a conductive pattern in parallel with the plane of the substrate. By making the connection, a coil-shaped circuit having unit windings on a plane perpendicular to the opposite plane can be formed in a spiral shape. If necessary, adjacent unit windings have a spiral pattern wound in opposite directions when viewed from the same direction, and the leading ends or the trailing ends of the spiral pattern are viewed from the same direction. , Coils that are electrically connected to each other can be formed. By forming the capacitors on a plane parallel to the substrate plane when these coils are created, it is possible to integrally form circuits that extend in both the vertical direction and the plane direction with the substrate plane.

Further, by using the method of the present invention, a coil having a desired number of turns can be easily obtained. In the conventional method of forming a spiral pattern on a plane parallel to the plane of the substrate, it is necessary to increase the number of layers in order to increase the number of windings, resulting in a large cost increase. However, in the method of the present invention, the number of layers is not changed. It only needs to be stretched in the coil extension direction, and there is little cost increase.

It is also advantageous from the point of noise suppression. In the conventional method of forming a spiral pattern on a plane parallel to the plane of the substrate, main lines of magnetic force are generated in a direction perpendicular to the plane of the substrate, which adversely affects the upper or lower part of the wiring. For example, Ic used in the high-frequency region, which has become popular in recent years, is a very serious problem, and this problem is avoided by making the distance between the spiral pattern and the transistor as large as possible. In this regard, the conventional method of forming a spiral pattern on a plane parallel to a plane has a very small degree of freedom in design. On the other hand, in the coil formed by the method of the present invention, the main magnetic field lines are generated in a direction parallel to the substrate, so that the transistor The effect is small in the direction perpendicular to the substrate. Therefore, the degree of freedom in design becomes very high. Further, in the method of the present invention, since the extension direction of the coil can be set to any direction in the plane of the substrate, the coil can be formed in the same process in any direction as necessary.

Next, examples of the present invention will be described. FIG. 24 is a plan view of a coil and a capacitor of the LC series resonance circuit according to the embodiment of the present invention. FIG. 25 is a cross-sectional view of the LC series resonance circuit according to the example of the present invention, taken along the line AA. The unit of the numerical value of the length in FIGS. 24 and 25 is mm. The simulation was performed assuming that the conductors of the circuit, the bottom and side surfaces of the board were perfect conductors, and the permittivity between conductors was 2.0. The LC series resonance circuit in which the coil and the capacitor are in such a positional relationship was analyzed using three-dimensional electromagnetic field simulation (Sonnet).

First, the coil was analyzed. FIG. 26 is a perspective view of a coil of the LC series resonance circuit according to the embodiment of the present invention. When the frequency dependence of the reactance component of this coil was determined by simulation, the graph shown in Fig. 27 was obtained. Based on these results, the inductance values corresponding to 500 MHz, 1000 MHz, and 2000 MHz are obtained as shown in the table below.

In the graph shown in Fig. 27, the self-resonant frequency is seen near 3150MHz. This resonance frequency is considered to be due to the parasitic capacitance existing in parallel with the coil. This parasitic capacitance is calculated from the resonance frequency formula f = l / 2ΤΓ (L * C0) using the inductance value of 14.33 nH in the above table at 500 MHz where the effect of the parasitic capacitance is small. Then, the parasitic capacitance C0 became 0.178 pF. Next, the capacitor was subjected to angular analysis. FIG. 28 shows an LC series according to the embodiment of the present invention. It is a perspective view of the condenser of a resonance circuit. When the frequency dependence of the reactance component of this capacitor was determined by simulation, the graph shown in Fig. 29 was obtained. Based on these results, the capacitance values corresponding to 500MHz, 1000MHz, and 200.0MHz were obtained as shown in the table below.

Equation for resonance frequency of series resonant circuit based on inductance value and capacitance value at 50 OMHz

When the series resonance frequency was calculated from (ί * (C + CO)), it was 2119 MHz.

On the other hand, when these coils and capacitors are connected in series as shown in Figs. 30 and 31, and the resonance frequency of this series circuit is determined by a three-dimensional electromagnetic field simulation, it can be seen from the graph shown in Fig. 32. became. The resonance frequency of this series circuit appears around 2200 MHz, and this value is calculated from the equation of the resonance frequency of the series resonance circuit, f = 12 共振 (L * (C + CO)), as shown in the table below. It is in good agreement with the series resonance frequency of 2 119MHz. FIG. 33 shows a circuit diagram of the LC series resonance circuit and a graph showing the frequency characteristics of the current.

The method for manufacturing the LC series resonance circuit of the present invention will be specifically described below with reference to the drawings. FIG. 1 and FIG. 2 are diagrams according to a typical embodiment of the LC series resonance circuit of the present invention. FIG. 1 shows an embodiment in which a single-layer coil and a multilayer coil are provided with a capacitor pattern.

A case in which the LC series resonance circuit 100 using a single-layer coil shown in FIG. 1A is manufactured using an organic material as an insulator will now be described. First, shown in Figure 3 A core substrate 1 having a through hole 1a which will later be a part of a coil and a capacitor plate 1c formed on both sides of the insulator lh is prepared. The two plates Id sandwich the dielectric 1e, and they constitute a capacitor 1c. On each of the electrode plates 1d, connection points 1f and 1g to which wiring to an external circuit is connected are formed. As the core substrate 1, a copper-clad laminate using a known and common organic material as the insulator 1 h can be used.For the insulator lh, for example, a glass epoxy tree S, a bismaleimide-triazine substrate, or a dielectric Polyphenylene ether resin, polyether ether ketone resin S, benzocyclobutene resin and the like having excellent properties can be used. The same material as the insulator lh can be used as the dielectric 1e between the electrode plates lb.However, the dielectric 1e is replaced by a high dielectric filler such as barium titanate or strontium titanate. By blending it in the material, a capacitor layer with high capacity and low dielectric loss can be obtained. In particular, a high-dielectric material composed of a cyanate ester and an epoxy resin can fill a high-dielectric film at a high level, and is suitable as a high-capacity capacitor material. In addition, a dielectric 1e is formed by firing a ceramic mainly composed of a high dielectric ceramic such as barium titanate or strontium titanate, and a core substrate 1 having electrode plates lb formed on both surfaces thereof is formed. By using it, it is possible to obtain a small and high-capacity capacitor. Drilling of the through hole 1a can be performed by a widely used method such as a drill or a carbon dioxide laser or a YAG laser. Patterning of the conductor can be performed by a known and commonly used method such as a subtractive method or an additive method. Subsequently, outermost layers are laminated and formed on both surfaces of the core substrate 1 as shown in FIG. The same material and method as the core 1 can be used as a material of the insulating layer 1i, a hole forming method, a conductor patterning method, and an electrical connection method between layers.

The outermost layer can be formed by forming an insulating layer li on both sides of the inner layer material, and further forming a conductive layer outside the inner layer material, and performing power connection and electrical connection. In several ways A specific example will be given below.

The case of the so-called build-up method will be described. An insulating layer is formed on a substrate made of the above inner layer material. As the insulating layer, a prepreg such as a glass epoxy type or an aramide resin type, a liquid or film-like thermoplastic or thermosetting resin composition, or a copper foil with a resin generally called a copper foil and an insulating resin layer One that integrates can be used.

The formation of the insulating layer is performed, for example, as follows. As shown in Fig. 5 (a), the core substrate 1 has a pre-predder 2 on both sides, an unpatterned copper foil 3,

As shown in (b), a resin-coated copper foil 4 is placed, and as shown in Fig. 6, these are collectively laminated and cured by a lamination press method to create an integrated insulating layer and conductive layer. . Alternatively, as shown in FIG. 8, a liquid composition is applied onto the core substrate 1 by a known and common method such as screen printing, force coating, spray coating, etc., and cured by UV, electron beam, heat, or the like. Let it. Alternatively, a film-like composition is pasted on the substrate by a method such as rolling or laminating, and cured by a predetermined method to obtain an insulating layer 5.o

Subsequently, a via is formed. A via 6 is formed at a predetermined position of the obtained by the above method using a drill, a laser or the like. Fig. 8 (a) shows the case where prepreg 7 and copper foil 8 were used as the insulating layer and the conductive layer. Similarly, Fig. 8 (b) shows the copper foil with resin 9 and Fig. 8

(c) is a liquid or film-like thermoplastic, and (c) is a description using a thermosetting resin composition 10. If a conductive layer is formed together with the insulating layer using prepregs or resin-coated copper foil, use a carbon dioxide gas laser widely used for forming blind vias. A so-called masking process may be performed to remove the conductor at a predetermined position by etching.

When a conductive layer is formed together with an insulating layer using a pre-preda or resin-coated copper foil, for example, conductive powder such as silver or copper is mixed in the via as shown in Fig. 9 (a). The conductive paste 11 is embedded by a method such as printing or dispensing, and is hardened by a predetermined method. Alternatively, as shown in FIG. 9 (b), a normal through-hole plating, that is, an electroless plating is performed after a plating catalyst is applied in a via, and then a plating layer 1 is formed by performing an electrolytic plating. Electrical connection is also achieved by the method of forming 2. When the insulating layer is formed using a liquid or film-like composition, as shown in FIG. 9 (c), for example, a copper foil 13 is pressed to form a conductive layer outside the insulating layer, and After performing mask processing at the position, the blind via is made conductive by the conductive paste 11 or the plating layer 12 and connected. In this case, the blind via may be made conductive first. Also, as shown in FIG. 9 (d), a catalyst is applied to the reaction where the insulating layer and the blind via are formed, and the electroless plating is performed. The formation of 14 and the conductivity of the blind via can also be performed at once. In this case, the blind vias can be made conductive by a conductive paste. Next, as shown in FIG. 9 (e), the copper foil 3, 8, or 13 or the conductive layer 14 is patterned to form a coil.

Alternatively, the insulating layer, the conductive layer, and the electrical connection can be collectively performed by the following method. That is, as shown in FIG. 10, after a conductive bump 15 having a sharp tip is formed at a predetermined location on the core substrate 1 using a conductive paste or the like, a prepreg 2 and a copper foil 3 (FIG. 10 (a)) or press work after placing the film-shaped insulator 5 and copper foil 3 (Fig. 10 (b)), or copper foil 4 with resin (Fig. 10 (c)). As a result, the pointed conductive bumps 15 penetrate the insulating layer to realize connection with the conductive layer.

When a through-hole board connected by plating is used and the above liquid or film-like insulating material is used, or when it is further laminated on an insulating layer having a blind via once formed by a build-up method, the hole is filled. Fill the through holes or blind vias with a finning or plating process and clean the surface You may perform smoothing.

Alternatively, they can be collectively laminated by the following method. The case of a four-layer structure using glass epoxy prepreg as the insulating layer will be described. That is, as shown in FIG. 11, a predetermined position on the base material 16 side of the copper-clad single-sided glass epoxy substrate is drilled using a laser or the like. Subsequently, electric plating is performed using the copper foil 17 as an electrode, and the formed hole is filled with the plating 18. On top of this, low melting point metal bumps 19 are successively formed by the plating method. The copper foil 17 is etched into a predetermined pattern as shown in FIG. On the bump side, a composition 20 similar to that used for the insulating layer is thinly applied and is semi-hardened. The one manufactured from this single-sided substrate is the outermost layer, that is, the first and fourth layers.

Subsequently, as shown in FIG. 13, the core substrate 1 and the outermost layer of FIG. 13 are aligned, and the composition that has been semi-cured by pressing is removed from the bump portion, and the insulating layer between the layers is removed. At the same time as the bumps are formed, the bumps are electrically connected to the conductors in the inner layer, producing an LC series resonant circuit with a four-layer structure. By applying this method, further multilayering can be easily performed.

As shown in FIG. 1 (b), the LC series resonance circuit 120 using a single-layer coil in which a capacitor 120c is arranged outside the three coils 120a is also the LC series resonance circuit 1 described above. It can be manufactured by appropriately performing the same steps as those of the manufacturing method 100 according to the configuration. In this case, it is preferable that the manufacturing process of the LC series resonance circuit 120 be started with one layer constituting the multilayer substrate 120h as an initial material or with the capacitor 120c as an initial material.

In the embodiment in which the magnetic body is formed inside the coil, the magnetic body is arranged in the step of laminating the multilayer substrate so that the magnetic body is arranged inside the coil. Thereby, a core structure made of a columnar magnetic material penetrating the inside of the coil can be formed. In order to make the spiral pattern denser, further multilayering is required. Further multilayering is possible using any of the above methods. In other words, a series of steps including the provision of an insulating layer, the provision of a conductive layer, the electrical connection between conductive layers (formation of through holes and encapsulation of a conductive material, the contact of bumps, etc.), and the patterning of the conductive layer are repeated. By returning, it can be multi-layered. At this time, the position of the through hole in each layer and the pattern of the conductive layer are preferably the coil 200a as shown in FIG. 2 (a) or the coil 220a as shown in FIG. 2 (b). It is configured so that a is formed.

By applying these methods, the LC series resonant circuit including the multilayer coil shown in Fig. 2 (a) and (b) can be easily manufactured.

Further, when manufacturing the various substrates by the above-described various laminating methods, if the above method is applied at a predetermined position, a component with a built-in LC series resonance circuit containing the LC series resonance circuit of the present invention, a substrate with a built-in LC series resonance circuit, Can also be easily manufactured.

In any of the above-described LC series resonance circuits, a ceramic material can be used as the insulating material. Also in this case, it can be manufactured by basically forming a part of the coil and a capacitor-like pattern on each layer in the same process as the organic material, and laminating them. The LC series resonance circuit in the multilayer substrate of the present invention can be formed by sequentially performing a method of forming a hole in a green sheet, filling a hole with a conductive paste, and printing, laminating, and firing in a conventional manner. As mentioned earlier, it is possible to use ceramic material only for the insulating layer that constitutes the capacitor, and to use organic material for the other parts. -In addition, any of the above-mentioned LC series resonance circuits can be formed by integrally forming other circuits, for example, circuits such as ICs, memories, resistors, or high-frequency elements in a multi-layered circuit. It can be a multilayer substrate with a built-in circuit. Such other circuits may be electrically connected to the LC series resonant circuit and may not be directly connected. Is also good. This multi-layer substrate with built-in LC series resonance circuit is formed integrally with the LC series resonance circuit, so that it can be easily manufactured in the same manufacturing process, and has the advantage that the degree of integration of elements can be improved. is there. .

Further, any of the above-described LC series resonance circuits or the multilayer substrate with a built-in LC series resonance circuit can be formed on a semiconductor chip constituting a monolithic IC or the like. With such a configuration, elements such as an LC series resonance circuit can be incorporated in the semiconductor package with a high degree of integration. From now on, the process of forming a coil having unit windings on a surface perpendicular to the plane of the substrate and forming a capacitor-like pattern parallel to the plane of the substrate will be described below. As a typical example, an example is shown in which an LC series resonance circuit 100 shown in FIG. 1A is formed in a so-called electrode wiring layer on an upper layer of a silicon wafer in which a transistor is formed and an electrode portion is formed with tungsten or the like. By applying this method, the number of turns, the number of rows (layers), the formation direction, etc. can be set arbitrarily. Note that the semiconductor is not limited to silicon, and any known semiconductor material such as gallium arsenide can be used.

First, as shown in FIG. 14, a lowermost insulating layer 22 is formed on a silicon wafer 21 on which transistors and electrode portions are formed. The silicon oxide film can be formed by a vapor phase method such as CVD, or by spin-coating an organic material such as polyimide or benzocyclobutene, which has recently attracted attention, and then performing bast baking. Subsequently, as shown in FIG. 15, holes 23 are drilled in necessary places using various lasers. The hole 23 is a specific portion of the semiconductor wafer 21 or a portion for making an electrical connection with the lower electrode portion. Subsequently, as shown in FIG. 16, a conductive pattern 24 is formed. A commonly used aluminum sputtering or copper layer is formed by a vapor phase method such as CVD or a wet method such as plating. Next, it is exposed, etched and patterned. In this case, the conductive layer may be formed after forming the resist layer that has been patterned in advance. In this process, as shown in Figure 15 The holes 23 formed in the process are also made conductive, and the first layer and the second layer are electrically connected. Before the exposure step, the surface is usually planarized by physical polishing or a method called chemical mechanical polishing (CMP) that combines physical polishing and physical polishing. Next, as shown in FIG. 17, a second insulating layer 25 is formed. Next, as shown in FIG. 18, a hole is formed again, and a second conductive pattern 26 is formed by forming a conductive pattern. At this time, a capacitor-shaped capacitor can be formed at the same time. Next, as shown in FIG. 19, a third insulating layer 27 is formed by the above-described method, a hole is formed, the conductive layer is formed, and a third conductive pattern 28 is formed. Take the third layer conduction.

Thereafter, this operation is repeated to form a fourth insulating layer 29, as shown in FIG. 19, and then perform drilling, conducting, and patterning to form a fourth conductive pattern 30. At this stage, an LC series resonance circuit as shown in FIG. 1 can be formed on the semiconductor. By applying this operation, it is possible to easily increase or decrease the number of evenings, increase or decrease the number of rows (layers), or form multiple coils having different extension directions.

When forming a conductive layer after forming an insulating layer and drilling holes and making electrical connections between wires, as shown in Fig. 21, the hole (via hole) 31 is filled with a conductor 32. As shown in the figure, a structure generally called a stacked via, that is, a structure having a via hole on a filled via hole can be formed again, and the side of the coil can be made straight.

In addition, a stacked via structure cannot be formed by a commonly used method, that is, a method in which a via hole is not filled with a conductor. At that time, the manufactured coil has a cross-section in which the via-hole connection portion is stepped as shown in FIG. Even with such a structure, there is no practical problem particularly when used in a high frequency range.

After a desired LC series resonance circuit is formed in the multilayer substrate on the silicon wafer 21, the silicon substrate 21 and the multilayer substrate including the LC series resonance circuit are separated into semiconductor chip units. Before laminating the LC series resonant circuit or the multilayer substrate incorporating the same on the silicon wafer 21, the silicon wafer 21 may be divided into chips. In this case, an LC series resonance circuit or a multilayer substrate incorporating the same may be laminated on the outer surface of the semiconductor chip that has been cut in advance in the same manner as in the above-described process. As described above, the LC series resonance circuit manufactured by the method of the present invention can control the series resonance frequency more easily than the conventional one by adding a capacitor-like pattern to the inductor (coil) pattern. It can be used for a wide range of purposes despite its small size. In addition, the number of turns of the coil and the direction in which the coil extends can be set freely, greatly improving the degree of freedom in design. Furthermore, it is also effective for noise suppression.

Claims

The scope of the claims

1. a coil formed integrally with the multilayer substrate, the coil including a winding portion parallel to the multilayer substrate and a winding portion perpendicular to the multilayer substrate;

A capacitor formed integrally with the multilayer substrate, the capacitor being electrically connected in series with the coil;

The coil and the capacitor are supported in the multilayer substrate,

The unit windings of the coil each have a spiral pattern that turns in opposite directions when viewed from the same direction as the other adjacent unit windings; and

The LC series resonance circuit, wherein sets of adjacent unit windings of the coil are connected alternately at the leading end or the trailing end of the spiral pattern.

2. a coil formed integrally with the multilayer substrate, the coil including a winding portion parallel to the multilayer substrate and a winding portion perpendicular to the multilayer substrate;

And a core structure made of a columnar magnetic material penetrating the inside of the coil, wherein the coil, the capacitor and the core structure are supported in the multilayer substrate.

3. Each of the unit windings of the coil has a spiral pattern that turns in the opposite direction when viewed from the same direction as the other adjacent unit windings, and

3. The LC series resonance circuit according to claim 2, wherein sets of adjacent unit windings of the coil are connected alternately at the leading end or the trailing end of the spiral pattern.

4. In the coil, a winding portion parallel to the multilayer substrate is formed as a part of a stacked conductive layer, and a winding portion perpendicular to the multilayer substrate is adjacent via the insulating layer. The LC series resonance circuit according to any one of claims 1 to 3, wherein the LC series resonance circuit is formed as a bump connecting the conductive layers.

5. In the coil, a winding portion parallel to the multilayer is formed as a part of a stacked conductive layer by a build-up method, and a winding portion perpendicular to the multilayer substrate is adjacent to the multilayer substrate through the insulating layer. The LC series resonance circuit according to any one of claims 1 to 3, wherein the LC series resonance circuit is formed as a via or a through hole connecting the conductive layers.

6. The LC series resonance circuit according to any one of claims 1 to 5, wherein an organic material is used for an insulating layer of the multilayer substrate.

7. The LC series resonance circuit according to any one of claims 1 to 6, wherein ceramic is used for a dielectric material constituting the capacitor.

8. The LC series resonance circuit according to any one of claims 1 to 7, wherein the dielectric constituting the capacitor is made of fired high dielectric ceramic.

9. The LC series according to any one of claims 1 to 6, wherein the dielectric constituting the capacitor is made of a high dielectric ceramic powder or an organic material containing wisdom. Resonant circuit.

10. The LC series resonance circuit according to claim 8 or 9, wherein the high dielectric ceramic contains at least one of barium titanate and strontium titanate.

11. The LC series resonance circuit according to any one of claims 1 to 10, and the multilayer,

A multi-layer board with a built-in LC series resonance circuit, comprising: another circuit formed integrally with the multi-layer board and supported in the multi-layer board.

12. The LC series in the multilayer substrate according to any one of claims 1 to 10. In a multilayer board with built-in LC series resonance circuit including a resonance circuit,

Laminated on the outer surface of the semiconductor chip,

A multilayer substrate with a built-in LC series resonance circuit, which is electrically connected to a specific portion of the semiconductor chip.

13. The multilayer substrate with a built-in LC series resonance circuit according to claim 11, which is laminated on an outer surface of a semiconductor chip,

A multilayer substrate with a built-in LC series resonance circuit, wherein the multilayer substrate is electrically connected to a specific portion of the semiconductor chip.

1 4. A step of forming one insulating layer constituting a multilayer substrate;

Forming a capacitor in the multilayer substrate;

Forming at least a part of a winding portion of a coil parallel to the multilayer substrate on an insulating layer in the multilayer substrate;

A vertical connecting portion is formed to electrically connect at least a part of the winding portion of the coil parallel to the multilayer substrate between insulating layers, thereby forming a winding portion of the coil perpendicular to the multilayer substrate. Steps forming at least a part thereof;

Electrically connecting the capacitor and the coil so that they are electrically connected in series; and

The step of forming an insulating layer; the step of forming at least a part of a winding part of the coil parallel to the multilayer; and forming at least a part of a winding of a coil perpendicular to the multilayer substrate. A predetermined coil supported in the multilayer substrate is formed by a coil winding portion parallel to the multilayer substrate and a coil winding portion parallel to the multilayer substrate. And optionally repeating steps for the previously formed multi-layer part.

The unit windings of the predetermined coil each have a helical pattern that turns in opposite directions when viewed from the same direction as the other adjacent unit windings; and A method of manufacturing an LC series resonance circuit, wherein sets of unit windings adjacent to each other of the predetermined coil are alternately connected at the tips or ends of the spiral pattern.

1 5. A step of forming one insulating layer constituting the multilayer substrate;

Forming a capacitor in the multilayer substrate;

A vertical connecting portion is formed to electrically connect at least a part of the winding portion of the coil parallel to the multilayer substrate between insulating layers, thereby forming a winding portion of the coil perpendicular to the multilayer substrate. Forming at least a part of;

Forming a core structure made of a columnar magnetic body so as to be arranged inside the coil;

The step of forming an insulating layer; the step of forming at least a part of a coil winding part parallel to the multilayer substrate; and the forming of at least a part of a coil winding part perpendicular to the multilayer substrate. At least one of the steps is performed until a predetermined coil supported in the multilayer substrate is formed by the coil winding portion parallel to the multilayer substrate and the coil winding portion perpendicular to the multilayer substrate. And a step of appropriately repeating the multi-layered portion formed so far, and a method of manufacturing an LC series resonance circuit.

16. The manufacturing of the LC series resonant circuit according to claim 14 or 5, wherein the vertical connection portion is a bump connecting the adjacent conductive layers via the insulating layer. Method.

17. At least one of the above steps is performed by the build-up method. 16. The LC series resonance according to claim 14, wherein the vertical connection portion is a via or a through hole connecting the adjacent conductive layers through the insulating layer. Circuit manufacturing method.

18. The method for manufacturing an LC series resonance circuit according to any one of claims 14 to 17, wherein an organic material is used for the multilayer insulating layer.

19. The method for manufacturing an LC series resonance circuit according to any one of claims 14 to 18, wherein ceramic is used for a dielectric material constituting the capacitor.

20. The manufacturing of the LC series resonance circuit according to any one of claims 14 to 19, wherein the dielectric constituting the capacitor is made of fired high dielectric ceramic. Method.

21. The method according to any one of claims 14 to 18, wherein the dielectric constituting the capacitor is made of an organic material containing high dielectric ceramic powder or whiskers. Method of manufacturing LC series resonance circuit.

22. The method for manufacturing an LC series resonance circuit according to claim 20 or 21, wherein said high dielectric ceramic contains at least one of barium titanate and strontium titanate.

23. The method according to any one of claims 14 to 22, comprising a step of a method of manufacturing an LC series resonance circuit,

A step of forming another circuit supported in the multilayer substrate integrally with the multilayer substrate;

A method of manufacturing a multilayer substrate with a built-in LC series resonance circuit, further comprising:

24. A method for manufacturing an LC series resonance circuit according to any one of claims 14 to 22, The LC series resonance circuit is laminated on an outer surface of a semiconductor wafer, and electrically connecting the LC series resonance circuit to a specific portion of the semiconductor wafer;

Isolating the semiconductor wafer on which the LC series resonance circuit is stacked in units of semiconductor chips;

L C. A method for manufacturing a series resonant circuit.

25. The method for manufacturing a multilayer substrate with a built-in LC series resonance circuit according to claim 23, comprising:

The LC series resonance circuit built-in substrate is laminated on an outer surface of a semiconductor wafer,

Electrically connecting the substrate with a built-in LC series resonance circuit to a specific portion of the semiconductor screen;

Dividing the semiconductor wafer on which the LC series resonance circuit built-in substrate is laminated into semiconductor chips;

A method for manufacturing a multilayer substrate with a built-in LC series resonance circuit, further comprising:

26. The method according to any one of claims 14 to 22, comprising a step of manufacturing the LC series resonance circuit according to any one of claims 1 to 22,

The LC series resonance circuit is laminated on an outer surface of a semiconductor chip, and electrically connecting the LC series resonance circuit to a specific portion of the semiconductor chip;

A method of manufacturing an LC series resonance circuit, further comprising:

27. The method of manufacturing a multilayer substrate with a built-in LC series resonance circuit according to claim 23, comprising:

The built-in LC series resonance circuit is laminated on the outer surface of the semiconductor chip, and electrically connects the substrate with built-in LC series resonance circuit to a specific portion of the semiconductor chip. Step to connect,

A method of manufacturing a multilayer with a built-in LC series resonance circuit.