JPH04242911A - Manufacture of electronic parts - Google Patents

Abstract

PURPOSE:To enable electronic parts with a coil part where a coil is buried to be manufactured efficiently so that a coil axis is in parallel to a lamination surface at a coil support consisting of a laminated body. CONSTITUTION:A coil 1 is formed by laminating a conductor pattern for coil which is obtained by cutting on a cutting surface which becomes parallel to a lamination surface assuming the coil to be obtained finally. Coil supports 210-213 are formed by lamination while allowing a connection edge portion of a conductor pattern for the coil to be remained.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component including a coil portion.

0002

2. Description of the Related Art A typical prior art related to electronic components, particularly coil components, in which a coil is embedded within a coil support is disclosed in Japanese Patent Publication No. 57-39521. This conventional technology is obtained through a manufacturing process of alternately printing and laminating ferrite layers and coil conductors, and firing and sintering the laminated layers. Lamination involves the process of printing approximately half a turn of the coil conductor, the process of printing a magnetic layer on top of the printed conductor, leaving the ends of the printed conductor, and the process of creating conductivity at the remaining ends. The process of printing the remaining half turns of the conductor on the ferrite layer is repeated to form a coil conductor that is spirally displaced in the stacking direction. After the lamination process is completed, by firing, an electronic component including a highly densely integrated coil portion in which the coil is embedded inside the ferrite can be obtained.

FIG. 73 shows an example of an electronic component obtained by a conventional manufacturing method. In FIG. 73, 1 is a coil support made of ferrite, 2 is a coil, and 3 and 4 are terminal electrodes. X indicates the stacking direction, Y indicates the length direction, and O indicates the coil axis direction of the coil 2. As shown in the figure, the stacking direction X and the coil axial direction O of the coil 2 coincide. In other words, the coil axis direction O is substantially perpendicular to the laminated plane of the magnetic layer made of ferrite. In order to ensure installation stability during mounting, the shape of the electronic component is usually such that the thickness T is smaller than the length d taken in the length direction Y perpendicular to the stacking direction X. Therefore, the direction of the thickness T coincides with the coil axis direction O.

0004

[Problems to be Solved by the Invention] Incidentally, the inductance value L of an inductor is generally determined by the following formula. However, K: Coefficient μ: Magnetic permeability a; Radius of inductor cross section N; Number of coil turns n; Number of turns per unit length (n=N/d) d; Inductor length K is Nagaoka coefficient It is said to be a function of (2a/d). The Nagaoka coefficient K increases as (2a/d) decreases, that is, as the length d of the inductor increases, so when increasing the inductance value L, the number of turns per unit length n (= If N/d) is constant, it is advantageous to increase the length d of the inductor.

However, in electronic components obtained by conventional manufacturing methods, as shown in FIG. 73, the stacking direction Since the thickness T is set in a direction that is restricted from the viewpoint of installation stability, it is disadvantageous to increase the inductance value L by increasing the length d of the inductor.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above-mentioned conventional problems and efficiently produce an electronic component having a structure in which the axial direction of the coil coincides with the length direction and is advantageous for increasing the inductance value. It is an object of the present invention to provide a manufacturing method that enables the manufacturing.

[0008]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a coil portion in which a coil is embedded in a coil support made of a laminated body so that the coil axis is parallel to the laminated surface. A method for manufacturing an electronic component having a coil conductor pattern formation step and a coil support lamination step, wherein the coil conductor pattern formation step is performed on the lamination surface when assuming a coil to be finally obtained. This is a step of stacking coil conductor patterns obtained by cutting along a cutting plane parallel to the coil support layer, and the coil support layering step includes stacking support layers while leaving the connection end of the coil conductor pattern. The process is characterized by:

[0009]

[Operation] In a coil whose coil axis is parallel to the laminated plane of the magnetic layers, the coil axis direction is perpendicular to the laminated direction. The lamination direction is generally the thickness direction of the electronic component,
The direction perpendicular to this is the length direction. Therefore, since the axial direction of the coil coincides with the length direction of the electronic component, the length can be increased and a large inductance value can be obtained.

[0010] The process of forming a conductor pattern for a coil is a process of stacking conductor patterns for a coil obtained by cutting with cutting planes parallel to the laminated plane when assuming the final coil to be obtained. A coil in which the coil axis is parallel to the laminated surface of the magnetic layer can be obtained easily and efficiently.

Electronic components obtained by the manufacturing method according to the present invention include coil components alone, composite components in combination with passive circuit elements such as capacitors or resistors, and hybrid integrated circuit components in which these are combined with integrated circuit components. is included. Examples of applications for individual coil components include magnetic field generating means such as inductors, transformers, rotary transformers, mixer transformers, or motor stators; examples of applications for composite components include trap elements, low-pass filters, high-pass filters, and bandpass There are filters, equalizers, IFTs, etc., and hybrid integrated circuit components include highly integrated, high performance, and ultra-compact equalizer amplifiers, DC/
There are DC converters, active filters, etc.

0012

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 7 are diagrams showing a method of manufacturing an electronic component according to the present invention. Thick film techniques such as screen printing or plating, or thin film techniques such as sputtering or vapor deposition are used as means for forming the layer or film. In the embodiment, a case where a screen printing means is applied will be described as an example.

First, magnetic paste is printed to form the magnetic layer 21.
0 (FIG. 1), a conductive pattern 110 is printed on the magnetic layer 210 (FIG. 2). The conductive pattern 110 is formed by printing conductive paste. The conductor pattern 110 is formed so as to be a coil conductor pattern obtained by cutting along a cutting plane parallel to the surface of the magnetic layer 210, which is the laminated surface, assuming the final coil to be obtained. This principle is also followed in the conductor pattern forming process described below.

Next, a step of printing a magnetic layer 211 while leaving the end of the conductor pattern 110 in the form of a window (FIG. 3), and a step of printing the conductor pattern 111 on the connection end of the conductor pattern 110 (FIG. 4) , the steps of printing the magnetic layer 212 (FIG. 5) while leaving the ends of the conductor pattern 111 in a window shape are repeated as many times as necessary. Then, a conductive pattern 112 for connection is printed (
(FIG. 6), and then a magnetic layer 213 is laminated thereon. After this,
A finished electronic component is obtained through necessary processes such as heat treatment and terminal electrode printing.

FIG. 8 is a perspective view showing the winding state of the coil in the electronic component obtained by the manufacturing process of FIGS. 1 to 7;
FIG. 9 is a sectional view thereof as well. 1 is a coil; 11 is a coil conductor constituting the coil 1; 2 is a coil support; 31
, 32 are terminal electrodes. The coil support 2 has a magnetic layer 21
It has a structure in which 0 to 213 are stacked. Coil 1 is
The coil axis direction O is parallel to each lamination surface of the magnetic layers 210 to 213, and is perpendicular to the lamination direction X. The stacking direction X is the thickness direction, and the direction perpendicular thereto is the length direction Y. Therefore, since the direction of the coil axis O coincides with the length direction Y of the electronic component, the length can be increased and a large inductance value can be obtained.

Next, the manufacturing process shown in FIGS. 10 to 18 will be explained. After forming an insulating layer 220 by printing an insulating ceramic paste (FIG. 10), a conductive pattern 110 is printed on the insulating layer 220 (FIG. 11). Next, the magnetic layer 210 along the length direction is printed approximately in the middle part of the insulating layer 220 in the width direction (FIG. 12). The magnetic layer 210 is formed so that the ends of the conductive pattern 110 remain on both sides in the width direction.

Next, insulating layers 220 on both sides of the magnetic layer 210
so that the end of the conductive pattern 110 appears above the
After printing the insulating layer 221 (FIG. 13), the conductor pattern 1
A conductor pattern 111 is printed on the magnetic layer 10 (FIG. 14), and a magnetic layer 211 is laminated on the magnetic layer 210 formed in the intermediate portion (FIG. 15). The steps from FIG. 13 to FIG. 15 are repeated as many times as necessary. Insulating layers 221 on both sides of the magnetic layer 211
so that the end of the conductive pattern 110 appears above the
After printing the insulating layer 222 (FIG. 16), from above the insulating layer 222 and the magnetic layer 211 to the end of the conductive pattern 111,
A conductor pattern 112 for connection is printed (FIG. 17), and an insulating layer 223 is printed over it. Thereafter, a completed electronic component is obtained through necessary steps such as heat treatment and terminal electrode printing.

FIG. 19 is a sectional view of an electronic component obtained through the steps shown in FIGS. 10 to 18. The coil support 2 has magnetic layers 210 and 211 laminated on the core, and a magnetic layer 21.
0 and 211, and the coil 1 is sealed with insulating layers 220 to 223. The coil 1 is arranged so that the coil axis direction O is parallel to each laminated surface of the magnetic layers 210 to 213.

FIGS. 20 to 32 show still another embodiment of the electronic component manufacturing method according to the present invention. magnetic layer 210
, the insulating layer 220 and the magnetic layer 211 are sequentially laminated (see FIGS.
22), a conductive pattern 110 is printed on the magnetic layer 211 according to the coil pattern (FIG. 23). Next, a magnetic layer 212 is printed on the magnetic layer 211 (FIG. 24), leaving both widthwise ends of the conductor pattern 110 in the shape of a window, and then the conductor pattern exposed in the window shape from the magnetic layer 212 is printed. A conductor pattern 111 is printed on each connection end of 110 (FIG. 25).

Next, after printing an insulating layer 221 on the magnetic layer 212 (FIG. 26), leaving each connection end of the conductor pattern 111 in a window shape, the insulating layer 221 is exposed from the insulating layer 221 in a window shape. A conductor pattern 112 is printed on each connection end of the conductor pattern 111 (FIG. 27). Next, conductor pattern 1
After printing the magnetic layer 213 on the insulating layer 221 (FIG. 28), leaving each connection end of the conductor pattern 112 in the shape of a window, each connection end of the conductor pattern 112 exposed in the window shape from the magnetic layer 213 is printed. The process of printing the conductor pattern 113 on top (FIG. 29) is repeated as many times as necessary. Then, a conductor pattern 114 for connection is printed on each connection end of the conductor pattern 113 from above the magnetic layer 213 (FIG. 30), a magnetic layer 214 is laminated on top of it (FIG. 31), and an insulating layer is placed on top of it (FIG. 31). The layers are laminated, and a magnetic layer 215 is further laminated (FIG. 32). Thereafter, a completed electronic component is obtained through necessary steps such as heat treatment and terminal electrode printing.

FIG. 33 is a perspective view of the electronic component obtained by the steps shown in FIGS. 20 to 32, and FIG. 34 is a sectional view thereof. The coil support 2 includes magnetic layers 210 to 215 and insulating layers 220 to 222. The magnetic layers 210 to 215 sandwich insulating layers 220 to 222 between them,
A magnetic path partitioned by the insulating layers 220 to 222 is configured. Magnetic layers 210-215 and insulating layers 220-22
2 are stacked alternately and are integrally bonded by mutual bonding force.

In the coil 1, the coil axis direction O is the magnetic layer 21.
0 to 215 and the insulating layers 220 to 222 are wound in parallel to the laminated surfaces. Both ends of the coil 1 are electrically connected to terminal electrodes 31 and 32, respectively.

As shown in the figure, the magnetic flux φ created by the coil current
1 passes through the magnetic layers 210 to 215, an eddy current Ie tends to occur around it. Since the insulating layers 220-222 are in the direction of this eddy current Ie, the eddy current Ie is blocked by the insulating layers 220-222, and the magnetic layers 210-222 are blocked by the insulating layers 220-222.
It is not possible to flow between 215 and 215. Therefore, an electronic component with low eddy current loss, low loss, low heat generation, and high efficiency can be obtained. Although eddy currents can flow inside the magnetic layers 210 to 215,
Since each of the magnetic layers 210 to 215 has a small cross-sectional area, the path of eddy current becomes short, and eddy current loss becomes small.

FIGS. 35 to 54 show another embodiment of the manufacturing method according to the present invention. Magnetic layer 210, insulating layer 220
After sequentially laminating the magnetic layers 211 and 211 (FIGS. 35 to 37), the insulating film pattern 120 is printed on the magnetic layer 211 according to the coil pattern (FIG. 38), and then the conductive pattern 110 is printed on the insulating film pattern 120. is printed (FIG. 39), and the connecting end of this conductor pattern 110 is left, and the rest is covered with an insulating film pattern 121 (FIG. 40).

Next, after printing the conductive pattern 111 on the connection end of the conductive pattern 110 exposed from the insulating film pattern 121 (FIG. 41), the conductive pattern 111 and the surrounding insulating film pattern 121 are printed. The magnetic layer 212 is printed leaving a window shape (FIG. 42), the conductor pattern 112 is printed on the connection end of the conductor pattern 111 (FIG. 43), and the insulating film pattern 122 is printed around the conductor pattern 112 (FIG. 42). 44) Then, the insulating layer 221 is printed (FIG. 45), leaving the conductor pattern 112 and the surrounding insulating film pattern 122 in a window shape. Similarly, a step of printing a conductor pattern 113 on the connection end of the conductor pattern 112 (FIG. 46), a step of printing an insulating film pattern 123 around the conductor pattern 113 (FIG. 47), and a step of insulating the conductor pattern 113 and its surroundings. The magnetic layer 213 is formed while leaving the film pattern 123 in a window shape.
The process of printing (FIG. 48) is repeated as many times as necessary.

Next, an insulating film pattern 124 is printed around the conductor pattern 113 according to the coil pattern (FIG. 4).
9) After that, the conductor pattern 114 for connection is printed on the insulating film pattern 124 (FIG. 50), and the conductor pattern 1
14 is covered with an insulating film pattern 125 (FIG. 51), and a magnetic film 214, an insulating film 222, and a magnetic film 215 are sequentially laminated thereon (FIGS. 52 to 54). Thereafter, a finished product is obtained through necessary steps such as heat treatment and terminal electrode printing.

FIG. 55 is a perspective view of the electronic component obtained through the steps shown in FIGS. 35 to 54, and FIG. 56 is a sectional view thereof. 12 is an insulating coating film formed by insulating film patterns 120 to 125. A coil conductor 11 constituting the coil 1 is covered with this insulating coating film 12. The coil support 2 includes magnetic layers 210 to 215 and insulating layers 220 to 223. magnetic layer 2
10 to 215 sandwich the insulating portion 22 therebetween, and the insulating layer 22
It constitutes a magnetic path divided by 0 to 223. The magnetic layers 210 to 215 and the insulating layers 220 to 223 are alternately stacked and are integrally bonded by mutual bonding force.

In the coil 1, the coil axis direction O is the magnetic layer 21.
0 to 215 and the insulating layers 220 to 2 so as to be parallel to the laminated plane of the insulating layers 220 to 223.
It is wound along the direction of the boundary surface of 23. Both ends of the coil 1 are electrically connected to terminal electrodes 31 and 32, respectively.

As shown in FIG. 55, when the magnetic flux φ1 produced by the coil current passes through the magnetic layers 210 to 215, an eddy current Ie tends to occur around them. Since the insulating layers 220 to 223 are in the direction of this eddy current Ie, the eddy current Ie
are blocked by the insulating layers 220 to 223, and the magnetic layer 21
It cannot flow between 0 and 215. Therefore, an electronic component with low eddy current loss, low loss, low heat generation, and high efficiency can be obtained. Eddy currents can flow inside the magnetic layers 210 to 215, but since the individual magnetic layers 210 to 215 have small cross-sectional areas, the paths of the eddy currents are shortened, and eddy current losses are reduced.

The necessary magnetic properties can be ensured by the magnetic layers 210-215. Since eddy currents can be blocked by the insulating layers 220 to 223, the magnetic layers 210 to 215 are
By placing emphasis on improving magnetic properties rather than suppressing eddy currents, it becomes possible to use materials with excellent magnetic properties.

Moreover, since the coil 1 is coated around the conductor 11 with the insulating coating film 12, the coil support 2 may be made of not only ferrite but also permalloy, silicon steel, amorphous alloy, etc. as a main component. It can be constructed from other magnetic materials. Therefore, the degree of freedom in selecting the material for the coil support 2 is expanded, and the required electrical and
Magnetic properties can be easily satisfied.

FIGS. 57 to 69 are diagrams showing still another embodiment of the method for manufacturing electronic components according to the present invention. This embodiment shows an example of a manufacturing method for forming a plurality of coils.

After printing the magnetic layer 210 (FIG. 57), a conductor pattern 110 is printed on the magnetic layer 210 according to the coil pattern of the outer coil (FIG. 58), and the connection end of the conductor pattern 110 is formed into a window. The magnetic layer 21
1 (FIG. 59), a conductor pattern 111 is printed at the connection end of the conductor pattern 110 (FIG. 60), and a magnetic layer 212 is printed (FIG. 60), leaving the end of the conductor pattern 111 in a window shape.
Figure 61).

Next, a conductive pattern 112 is printed on the connecting end of the conductive pattern 111 and on the magnetic layer 212 between the conductive patterns 111 (FIG. 62). The magnetic layer 21 between the conductive patterns 111 of the conductive patterns 112
A conductive pattern 112 formed on the inner coil 2 is a pattern constituting an inner coil. And conductor pattern 112
The magnetic layer 213 is printed leaving the connection end of the window in the form of a window (Fig. 6
3) Then, a conductive pattern 113 is printed on the conductive pattern 112 exposed like a window (FIG. 64).

The steps of FIGS. 63 and 64 are repeated as many times as necessary to expose the connection end of the conductor pattern 113 of the magnetic layer 214 (FIG. 65), and to connect the conductor patterns 113 to 113 forming the inner coil. A conductor pattern 114 including a conductor pattern to be connected and its extraction pattern is printed (FIG. 66). This completes the inner coil.

Next, conductor pattern 1 for connecting the outer coil
After printing the magnetic layer 215 (FIG. 67), leaving only the connection end of 14 in the form of a window, a conductor pattern 115 for connecting the outer coil is printed on the magnetic layer 215 according to the coil pattern.
After printing (FIG. 68) and completing the outer coil, the conductor pattern 115 is covered with a magnetic layer 216. Thereafter, it is completed through necessary processes such as heat treatment and terminal electrode provision process.

FIG. 70 is a sectional view of an electronic component obtained through the steps shown in FIGS. 57 to 69. A plurality of coils 101 and 102 are provided inside the coil support 2. Coils 101 and 102 are connected in series so as to generate magnetic flux in the same direction. The number of coils 101 and 102 is arbitrary. Although not shown, a plurality of coils 101, 10
2 may be inductively coupled. In this case, an electronic component useful as a transformer can be obtained.

FIG. 71 shows an example of an LC composite part manufactured by the manufacturing method according to the present invention. 4 is an inductor portion, and 5 is a capacitor portion. The inductor section 4 includes a coil support 2 and a coil 1 . The inductor portion 4 is shown in FIGS. 8, 9, 19, 33, 34, and 55.
, has a structure as shown in FIGS. 56 and 70.

The capacitor portion 5 has a capacitor network 52 embedded inside a dielectric ceramic 51. The capacitor network 52 is constructed by connecting capacitors formed with electrodes facing each other via a dielectric ceramic layer to form a required capacitor circuit. The circuit configuration of the capacitor network 52 is arbitrarily selected depending on the application. The capacitor portion 5 is continuously laminated with the inductor portion 4 in an integrated state by means such as sintering or adhesion. The coil 1 of the inductor section 4 and the capacitor network 52 of the capacitor section are connected to the terminal electrode 3 so that the desired circuit is obtained.
1 and 32.

Although not shown, the capacitor portion 5 may be provided on both sides of the inductor portion 4, or the inductor portion 4 may be provided on one or both sides of the capacitor portion 5.

FIG. 72 shows a hybrid integrated circuit component. 6 is an integrated circuit component. The integrated circuit component 6 is a chip containing a transistor circuit and the like, and is mounted on the surface side of the capacitor portion. 61 is the chip body, 6
2 is a lead conductor. The lead conductor 62 is soldered to conductor patterns 63 and 64 formed on the surface of the capacitor portion, and is connected to the capacitor and the coil to form a predetermined circuit.

7 is a resistor, and 71 to 73 are conductor patterns for the resistor 7. The resistor 7 is the inductor part 4
is formed by means such as printing on at least one surface of. In addition to the examples, various electronic devices such as mixer transformers, magnetic field generating devices such as motor stators, trap elements, low-pass filters, high-pass filters, band-pass filters, equalizers or IFTs, equalizer amplifiers, DC/DC converters, and active filters are also available. parts can be realized.

[0043]

[Effects of the Invention] As described above, the method of manufacturing an electronic component according to the present invention includes a coil conductor pattern forming step and a coil support lamination step, and the coil conductor pattern forming step finally Assuming the coil to be obtained, this is the process of stacking the coil conductor patterns obtained by cutting them with cutting planes parallel to the lamination plane, and the coil support lamination process is the process of stacking the connecting ends of the coil conductor patterns. Since this is the process of laminating the magnetic layer while leaving the remaining magnetic layers, the coil support body made of a laminated body is placed so that the coil axis is parallel to the laminated surface.
It is possible to efficiently manufacture an electronic component having a coil portion in which a coil is embedded and whose inductance value is increased.

[Brief explanation of the drawing]

1 to 7 are diagrams showing a method of manufacturing an electronic component according to the present invention.

FIG. 8 is a perspective view showing a coil-wound state of the electronic component obtained by the manufacturing method shown in FIGS. 1 to 7;

9 is a cross-sectional view of an electronic component obtained by the manufacturing method shown in FIGS. 1 to 7. FIG. 10 to 18 are diagrams showing another method of manufacturing an electronic component according to the present invention.

FIG. 19 is a cross-sectional view of an electronic component obtained by the manufacturing method shown in FIGS. 10 to 18. 20 to 32 are diagrams showing other methods of manufacturing electronic components according to the present invention.

FIG. 33 is a perspective view showing a coil-wound state of the electronic component obtained by the manufacturing method shown in FIGS. 20 to 32;

34 is a cross-sectional view of an electronic component obtained by the manufacturing method shown in FIGS. 20 to 33. FIG. 35 to 54 are diagrams showing other methods of manufacturing electronic components according to the present invention.

FIG. 55 is a perspective view showing a coil-wound state of the electronic component obtained by the manufacturing method shown in FIGS. 35 to 54;

56 is a cross-sectional view of an electronic component obtained by the manufacturing method shown in FIGS. 35 to 54. FIG. 57 to 69 are diagrams showing other methods of manufacturing electronic components according to the present invention.

70 is a cross-sectional view of an electronic component obtained by the manufacturing method of FIGS. 57 to 69. FIG.

FIG. 71: LC obtained by the manufacturing method according to the present invention
FIG. 2 is a partial cross-sectional view of a composite electronic component.

FIG. 72 is a partial cross-sectional view of an electronic component as a hybrid integrated circuit component obtained by the manufacturing method according to the present invention.

FIG. 73 is a perspective view showing an example of an electronic component obtained by a conventional manufacturing method.

[Explanation of symbols]

1 coil 2
Coil supports 110-115
Conductor patterns 210 to 215 for coils
magnetic layer

Claims (8)

[Claims] 1. A method for manufacturing an electronic component having a coil part in which a coil is embedded in a coil support made of a laminate so that the coil axis is parallel to the laminate surface, the method comprising forming a conductor pattern for the coil. and a coil support lamination process, and the coil conductor pattern forming process includes a coil that is obtained by cutting with a cutting plane parallel to the lamination plane, assuming the coil to be finally obtained. 1. A method for manufacturing an electronic component, characterized in that the coil support lamination step is a step of laminating support layers while leaving connection ends of the coil conductor patterns. 2. The method of manufacturing an electronic component according to claim 1, wherein the coil support lamination step includes a magnetic layer lamination step. 3. The method of manufacturing an electronic component according to claim 1, wherein the coil support lamination step includes an insulating layer lamination step. 4. The method of manufacturing an electronic component according to claim 1, further comprising the step of applying insulation coating around the coil conductor. 5. The method of manufacturing an electronic component according to claim 1, wherein the number of coils is one. 6. The method of manufacturing an electronic component according to claim 1, wherein the number of coils is plural. 7. The method of manufacturing an electronic component according to claim 6, wherein at least one set of the plurality of coils is inductively coupled. 8. On the coil support, a capacitor,
8. The method of manufacturing an electronic component according to claim 1, further comprising at least one of a resistor and an integrated circuit.