JPH04276609A - Electronic parts - Google Patents

Abstract

PURPOSE:To provide coil electronic parts having reduced eddy current loss, low loss, low heat generation, and high efficiency. CONSTITUTION:There is provided a coil part where a coil 1 is buried in a coil supporter 2. The coil supporter 2 includes a magnetic part 21 and an insulation part 22. The magnetic part 21 puts the insulation part 22 therebetween and constructs a magnetic path defined by the insulator part 22. The coil 1 is of a spiral shape with its direction of displacement being in the direction of a wound shaft and is disposed around a part of the magnetic path.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having a coil embedded inside a coil support.

0002

2. Description of the Related Art A typical prior art related to electronic components, particularly coil components, in which a coil is embedded within a coil support is disclosed in Japanese Patent Publication No. 57-39521.

[0003] This prior art is obtained through a manufacturing process in which ferrite layers and coil conductors are alternately printed and laminated, and after lamination, they are fired. Lamination involves the process of printing approximately half a turn of the coil conductor, the process of printing a magnetic layer on top of the printed conductor, leaving the ends of the printed conductor, and the process of creating conductivity at the remaining ends. The process of printing the remaining half turns of the conductor on the ferrite layer is repeated to form a coil conductor that is spirally displaced in the stacking direction. After completing the lamination step, by firing, a highly densely integrated coil component in which the coil is embedded inside the ferrite and a composite component thereof are obtained.

0004

[Problems to be Solved by the Invention] In the above-mentioned conventional technology, the coil is embedded inside the ferrite, so when an alternating current is passed through the coil, the magnetic flux created by the coil current inside the ferrite is eddy currents flow and eddy current losses occur. Due to this eddy current loss,
As losses increase and efficiency decreases, the heat generation temperature increases,
Further miniaturization is becoming difficult.

Eddy current can be reduced by using a material with high electrical resistance as the ferrite. However, ferrite materials with high electrical resistance tend to have poor magnetic properties, such as low magnetic permeability. For this reason, it has been difficult to obtain electronic components with low eddy current loss and excellent magnetic properties.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems and provide an electronic component with low eddy current loss, low loss, low heat generation, and high efficiency.

[0007]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides an electronic component having a coil portion in which a coil is embedded inside a coil support, wherein the coil support is insulated from the magnetic portion. The magnetic part has the insulating part in between and constitutes a magnetic path partitioned by the insulating part, and the coil has a spiral shape with a displacement direction in the winding axis direction. It is characterized in that it is arranged around a part of the magnetic path.

[0008]

[Operation] Eddy currents generated based on the magnetic flux produced by the coil current are blocked by the insulating parts arranged to fill the gaps between the magnetic parts, and cannot flow between the magnetic parts. Therefore, an electronic component with low eddy current loss, low loss, low heat generation, and high efficiency can be obtained. Eddy currents can flow inside the magnetic part, but since the magnetic part is divided into a plurality of parts and each magnetic part has a small cross-sectional area, the path of the eddy current is shortened, and eddy current loss is reduced.

Since the magnetic portion forms a magnetic path for the magnetic flux generated by the coil current, the necessary magnetic properties can be ensured by the magnetic portion.

[0010] Since the coil has a spiral shape with the displacement direction being in the direction of the winding axis, the axial direction of the coil coincides with the lamination direction, making it easy to form the coil during the lamination process.

Electronic components according to the present invention include coil components alone, composite components in combination with passive circuit elements such as capacitors or resistors, and hybrid integrated circuit components in which these components are combined with integrated circuit components. Examples of applications for individual coil components include magnetic field generating means such as inductors, transformers, rotary transformers, mixer transformers, or motor stators; examples of applications for composite components include trap elements, low-pass filters, high-pass filters, and bandpass There are filters, equalizers, IFTs, etc., and hybrid integrated circuit components include highly integrated, high performance, and ultra-small equalizer amplifiers, DC/DC converters, active filters, etc.

0012

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view showing a model of an electronic component according to the present invention. 1 is a coil, 2 is a coil support, 3
1 and 32 are terminal electrodes.

[0013] The coil 1 is embedded inside a coil support 2. The coil 1 has a spiral shape whose displacement direction is the winding axis direction O, and is arranged around a part of the magnetic path.

The coil support 2 is composed of a magnetic part 21 and an insulating part 22. The magnetic portions 21 sandwich the insulating portions 22 therebetween, and constitute a magnetic path partitioned by the insulating portions 22. The magnetic portion 21 is made of ferrite, permalloy, silicon steel, amorphous alloy, or the like. The insulating portion 22 can be constructed from an insulator such as a ceramic material.

[0015] The magnetic flux φ1 created by the coil current is the magnetic part 2
1, eddy currents tend to occur around it. Since the insulating portion 22 exists in the direction of this eddy current, the eddy current is blocked by the insulating portion 22 and cannot flow between the magnetic portions 21-21. Therefore, an electronic component with low eddy current loss, low loss, low heat generation, and high efficiency can be obtained. Although eddy currents can flow inside the magnetic portion 21,
1 has a small individual cross-sectional area, so the eddy current path becomes short and the eddy current loss becomes small.

The necessary magnetic properties can be ensured by the magnetic portion 21. Since eddy currents can be blocked by the insulating part 22, it is possible to use a material with excellent magnetic properties as the magnetic part 21, with emphasis placed on improving the magnetic properties rather than suppressing the eddy currents.

The magnetic portion 21 shown in the embodiment has a central magnetic path a.
, an outer magnetic path b, and connecting magnetic paths C1 and C2, forming a closed magnetic path. The central magnetic path a is arranged in a spiral shape on the winding axis of the coil 1, and the outer magnetic path b is arranged in a spiral shape on the outside of the coil 1, and the periphery thereof is filled with an insulating portion 22. The connecting magnetic paths C1 and C2 are arranged in layers on both sides of the coil 1 in the winding axis direction so as to connect the central magnetic path a and the outer magnetic path b to each other. Although not shown, it may be an open magnetic path type electronic component that does not include the connecting magnetic paths C1 and C2. Or, the connecting magnetic path C1
, C2 may be omitted.

FIG. 2 is a sectional view of another embodiment of the electronic component according to the present invention. In the figure, the same reference numerals as in FIG. 1 indicate the same components. A feature of this embodiment is that all of the magnetic portions 21 constituting the central magnetic path a are coupled to the connecting magnetic paths C1 and C2.

FIG. 3 shows yet another embodiment of the electronic component according to the present invention. The feature of this embodiment is that the connecting magnetic path C1
, C2 are connected to each other by a magnetic path 23 between the central magnetic path a and the outer magnetic path b.

FIGS. 4 to 7 are sectional views of still further embodiments of the electronic component according to the present invention, each of which shows an example in which a plurality of coils 1, 1 are provided. In the embodiment of FIG. 4, the coils 1, 1 have magnetic portions 21, 21 forming substantially independent magnetic paths, and an insulating portion 2 filling the gap therebetween.
2 and are arranged side by side.

In FIG. 5, the coils 1, 1 include magnetic portions 21, 21 constituting substantially independent magnetic paths, and an insulating portion 22 filling the space between them, and are arranged vertically.

6 and 7 show an example in which the magnetic path constituted by the magnetic portion 21 is shared by a plurality of coils 1, 1, and the plurality of coils 1, 1 are inductively coupled. In FIG. 6, the coils 1, 1 are arranged in the coil axial direction O, and in FIG. 7, the coil winding diameters are different, and the other coil 1 is arranged outside of one coil 1. In the embodiments shown in FIGS. 6 and 7, since the coils 1 and 1 are inductively coupled, electronic components useful as various transformers can be obtained.

FIG. 8 is an external perspective view of yet another embodiment of the electronic component according to the present invention, and FIG. 9 is a sectional view thereof. The magnetic part 21 and the insulating part 22 are connected to the axis O of the coil 1.
The conductor 101 forming the coil 1 is covered with an insulating coating 102. Insulating coating 102 can be constructed from a ceramic material.

FIG. 10 is a perspective view of yet another embodiment of the electronic component according to the present invention, and FIG. 11 is a sectional view thereof. The insulating portions 22 are arranged in a striped manner in the center and are arranged to surround the coil 1. The insulating portion 22 is buried inside the magnetic portion 21 and forms a closed magnetic path.

FIG. 12 shows an example of an LC composite part. 6 is an inductor part, 7 is a capacitor part, 51, 52
is the terminal electrode. The inductor portion 6 has a structure in which the coil 1 is embedded inside the coil support 2, as shown in FIGS. 1 to 7. The coil support 2 has a magnetic portion 2
1 and an insulating portion 22. magnetic part 21
Each of them forms a magnetic path for the magnetic flux generated by the coil current, and the insulating portion 22 is arranged to fill in the space between the magnetic portions 21.

The capacitor portion 7 has a capacitor network 72 embedded inside a dielectric ceramic 71. The capacitor network 72 is constructed by connecting capacitors formed with electrodes facing each other via a dielectric ceramic layer to form a required capacitor circuit. The circuit configuration of the capacitor network 72 is arbitrarily selected depending on the application. The capacitor portion 7 is continuously laminated with the inductor portion 6 in an integrated state by means such as sintering or adhesion. The coil 1 of the inductor section 6 and the capacitor network 72 of the capacitor section are connected to the terminal electrode 5 so that the desired circuit is obtained.
1 and 52.

FIG. 13 shows an LC composite component in which capacitor parts 7 are laminated on both sides of an inductor part 6. Although not shown, the structure may be such that the inductor portions 6 are provided on both sides of the capacitor portion 7.

FIG. 14 shows a hybrid integrated circuit component. 8 is an integrated circuit component. The integrated circuit component 8 is a chip containing a transistor circuit, etc., and is mounted on the surface side of the capacitor portion. 81 is the chip body, 8
2 is a lead conductor. The lead conductor 82 is soldered to conductor patterns 91 and 92 formed on the surface of the capacitor portion, and is connected to the capacitor and the coil to form a predetermined circuit.

10 is a resistor, and 11 to 13 are conductor patterns for the resistor 10. The resistor 10 is formed on at least one surface of the inductor portion 6 by means such as printing, and is covered with an insulating coating layer such as glass (not shown).

In addition to the examples, mixer transformers, magnetic field generators such as motor stators, trap elements, low-pass filters, high-pass filters, band-pass filters,
Equalizer or IFT, equalizer amplifier, DC/D
Various electronic components such as a C converter or an active filter can be realized.

Next, a method for manufacturing an electronic component according to the present invention will be explained. 15 to 39 show a method of manufacturing the electronic component shown in FIG. 1. The electronic components shown in FIGS. 2 to 7 can also be manufactured by the same process. In FIGS. 15 to 39, reference numeral (a) attached to each figure indicates a plan view, and reference numeral (b) indicates a front sectional view. Throughout each process, the magnetic part, the insulating part and the conductor pattern for the coil can be formed by lamination techniques using thick film techniques such as screen printing or plating or thin film techniques such as sputtering and vapor deposition. When thin film technology is used, high-precision pattern forming technology mainly based on photolithography, similar to IC manufacturing technology, is also used. This embodiment will be explained using a screen printing method as an example.

After printing the insulating layer 301 in a predetermined pattern using insulating ceramic paste (FIG. 15), a magnetic layer is printed on the surface of the insulating layer 301 in a pattern slightly smaller than the pattern of the insulating layer 301. Print layer 401 (Figure 16).

Next, insulating layers 302 and 303 are printed on the surface of magnetic layer 401 so that central magnetic layer 402 and frame-shaped outer magnetic layer 403 remain (FIG. 17). Insulating layer 302
, 303 may be printed before or after printing the central magnetic layer and the peripheral magnetic layer 403 on the magnetic layer 401. Next, a magnetic layer 404 is printed on the surface constituted by the insulating layer 302 and the central magnetic layer 402, and an insulating layer 304 is printed around the magnetic layer 404 (see FIG.
8) Do. After this, the central magnetic layer 405, the frame-shaped insulating layer 3
05, printing the magnetic layer 406, insulating layer 306, magnetic layer 407, insulating layer 307, magnetic layer 408, and insulating layer 308 (Fig. 1
9) Do. Insulating layers 305-308 and magnetic layers 405-4
08 is formed as a successive process. Next, magnetic layer 4
A so-called solid magnetic layer 409 is placed in the area inside 08.
At the same time, a frame-shaped magnetic layer 309 is printed around the periphery (FIG. 20), and then a central magnetic layer 410, frame-shaped magnetic layers 411 to 415, and these magnetic layers 410 to 410 are printed on the surface of the magnetic layer 409. Frame-shaped magnetic layers 310 to 3 filling the space between 415
14 and an insulating layer 315 filling the periphery of the magnetic layer 415 (FIG. 21).

Next, an insulating layer 500 of an appropriate width is printed so as to cover across the outer magnetic layers 413 to 415, and a magnetic layer is printed on approximately the left half of the surface (in the figure; the same applies hereinafter). Magnetic layers 416 to 4 continuous to 410 to 415
21 and insulating layers 316 to 321 filling in spaces between these magnetic layers 410 to 415 (FIG. 22).

Next, on the surfaces of the insulating layer 312 between the magnetic layer 412 and the magnetic layer 413, the insulating layer 418 between the magnetic layer 418 and the magnetic layer 419, and the insulating layer 500, the central magnetic layers 410-- 412 and the magnetic layers 416 to 4 continuous thereto
After printing the coil conductor pattern 600 in a pattern that goes around the magnetic layer 18 (FIG. 23), the magnetic layers 410 to 4 are printed.
15 and the right half of the insulating layers 310 to 315 (
In fig. (same below), conductor pattern 60 for coil
Magnetic layers 422 to 427 continuous to the magnetic layers 410 to 415 and insulating layers 322 to 327 continuous to the insulating layers 310 to 315 are printed so as to cover 0 (FIG. 24). No printing is performed on the surface where the left half of the coil conductor pattern 600 is located.

Next, in the right half, on the surface of the insulating layer 324 located between the magnetic layer 424 and the magnetic layer 426, approximately half a turn of the coil conductor pattern 601 is connected to one end of the coil conductor pattern 600. printing (FIG. 25), and then magnetic layers 428 to 433 and insulating layers 322 to 327 that are continuous to the magnetic layers 422 to 427 so as to cover the left half.
Continuous insulating layers 328 to 333 are printed (FIG. 26). After this, in the left half, the magnetic layer 430 and the magnetic layer 43
On the surface of the insulating layer 330 located between the coil conductor pattern 601 and the coil conductor pattern 602, approximately half a turn of the coil conductor pattern 602 that is continuous with one end of the coil conductor pattern 601 is printed (FIG. 27).

The steps shown in FIGS. 25 to 27 are repeated according to the required number of coil turns to form a magnetic layer 43 on the right half of the surface.
4 to 439 and insulating layers 334 to 339, and has magnetic layers 440 to 445 and insulating layers 340 to 345 continuous with magnetic layers 434 to 439 and insulating layers 334 to 339 in the left half, respectively, and a magnetic layer 436 and A laminated structure (FIG. 28) having a coil conductor pattern 602 on the surface of the insulating layer 336 between the magnetic layer 437 and the magnetic layer 437 is obtained. On this laminated structure, a coil conductor pattern 603 that will serve as the termination is printed so as to be electrically connected to one end of the coil conductor 602 (FIG. 29).
do. After that, the coil conductor pattern 603 is covered, and magnetic layers 446 to 451 are continuous to the magnetic layers 434 to 445, and insulating layers 346 to 35 are continuous to the insulating layers 334 to 345.
1 (Figure 30).

Next, a magnetic layer 452 is printed on the inner side of the magnetic layer 451, and an insulating layer 352 is printed on the outside thereof (FIG. 31), and then magnetic layers 453 to 456 are printed on the magnetic layer 452. In addition to printing the insulating layers 353 to 355, an insulating layer 356 is printed on the insulating layer 352 (FIG. 32
)do. After this, the magnetic layers 453 to 456 and the insulating layer 35
A magnetic layer 457 is placed on top of 3 to 355, and an insulating layer 356 is placed on top of 3 to 355.
An insulating layer 357 is printed on top of the magnetic layer 457 (FIG. 33).
Magnetic layers 458, 459 and an insulating layer 358 are printed on the insulating layer 357, and an insulating layer 359 is printed on the insulating layer 357 (FIG. 34).

Next, the magnetic layer 4 is placed in the inner region of the magnetic layer 459.
60, an insulating layer 360 is printed on the outside thereof (FIG. 35), and an insulating layer 361 is printed on the magnetic layer 460 and the insulating layer 360 (FIG. 36). Thereafter, a finished product is obtained through necessary steps such as heat treatment and provision of terminal electrodes. L
C composite parts (Fig. 12, Fig. 13) and hybrid integrated circuit parts diagram (
In order to obtain such as those shown in FIG. 14), further specific steps are added.

FIGS. 37 to 57 show a method of manufacturing the electronic component shown in FIGS. 8 and 9. First, the magnetic layers 401 are printed in stripes at intervals (FIG. 37), and then the insulating layers 301 are printed to fill the gaps between the magnetic layers 401-401.
1 (Figure 38). Next, from above the magnetic layer 401 on one end side, an insulating layer 501 is printed in an inverted L shape (FIG. 39) in the arrangement direction of the magnetic layer 401 and the insulating layer 301 so as to reach approximately the middle thereof. A coil conductor pattern 601 is printed within the plane of the layer 501 (FIG. 40), and the insulating layer 5 is then printed, leaving a small tip of the coil conductor pattern 601.
02 (Figure 41).

Next, a magnetic layer 402 is printed (FIG. 42) on the surface of the magnetic layer 401 located in the lower half (in the figure; the same applies hereinafter), and an insulating layer 302 is formed in the space between the magnetic layers 402-402. After printing, half a turn of the insulating layer 503 is printed so as to be continuous with the insulating layer 502 (FIG. 43), and another coil conductor pattern that is continuous with the coil conductor pattern 601 is printed within the plane of the insulating layer 503. Print 602 (Figure 44)
do. After that, an insulating layer 504 is printed continuously from the connection part with the coil conductor pattern 601 to cover most of the coil conductor pattern 602 and leave the tip of the coil conductor pattern 602 (FIG. 45). .

Next, a magnetic layer 403 is printed (FIG. 46) on the magnetic layer 401 located in the upper half area (in the figure; the same applies hereafter), and then the space between the magnetic layers 403 to 403 is filled. After printing the insulating layer 303 (FIG. 47), half a turn of the insulating layer 50 is printed so as to be continuous with the insulating layer 503.
5 (FIG. 48), and another coil conductor pattern 603 that is continuous with the coil conductor pattern 602 is printed within the plane of the insulating layer 505 (FIG. 49). Thereafter, an insulating layer 506 is printed continuously from the connection part with the coil conductor pattern 602 so as to cover most of the coil conductor pattern 603 and leave the tip thereof (FIG. 50). The steps in FIGS. 44 to 50 are repeated depending on the number of coil turns required.

Next, the magnetic layer 40 located in the lower half region
A magnetic layer 404 is printed on the surface of the magnetic layer 4 (FIG. 51).
Print an insulating layer 304 in the interval between 04 and 404 (Figure 52)
After that, a half-turn of the insulating layer 507 is printed so as to be continuous with the insulating layer 505 (FIG. 53), and a terminal coil is printed so as to be continuous with the coil conductor pattern 603 within the plane of the insulating layer 507. Print the conductor pattern 604 (Figure 54)
do. After that, an insulating layer 508 is printed continuously from the connection part with the coil conductor pattern 603 so as to cover most of the coil conductor pattern 604 (FIG. 55), and then a magnetic layer 405 is printed in a stripe shape (see FIG. 55). Figure 56) and magnetic layer 4
An insulating layer 305 is printed to fill the gap between 05 and 405 (FIG. 57). Thereafter, a finished product is obtained through heat treatment, a terminal electrode provision process, and the like.

FIGS. 58 to 89 are diagrams showing the manufacturing process of the electronic component shown in FIGS. 10 and 11. First, magnetic layer 4
00 (FIG. 58), a frame-shaped outer peripheral magnetic layer 401 and a window-shaped central magnetic layer 402 are placed on this magnetic layer 400.
The insulating layer 301 is printed so that it remains (FIG. 59). Next, on the insulating layer 301, an insulating layer 302 along the outer periphery of the central magnetic layer 402 and an insulating layer 303 along the inner periphery of the outer magnetic layer 401 are printed (FIG. 60), and the insulating layers 302, 3
Magnetic layers 403 to 404 are printed on the inner and outer regions of 03 (Fig. 61
)do.

Next, an insulating layer 304 is printed on the insulating layer 302, and an insulating layer 305 is printed on the magnetic layer 404 at a distance from the insulating layer 304.
An insulating layer 306 is printed on top of the insulating layer 306 (FIG. 62). As a result, from the inside, the window-shaped magnetic layer 403 and the magnetic layer 404 are
A pattern having frame-shaped magnetic layers 406, 407, and 405 is obtained. Next, an insulating layer 307 is placed on the insulating layer 304 surrounding the magnetic layer 403, a frame-shaped insulating layer 308 is placed on the insulating layer 305 at a distance from the insulating layer 307, and a frame-shaped insulating layer 308 is placed on the insulating layer 305 at a distance from the insulating layer 308. An insulating layer 309 with a shape of
Figure 63). After this, magnetic layers 408 to 412 are printed on the inside and outside of the insulating layers 307 to 310 (FIG. 64).

Next, the insulating layer 501 is printed in an inverted L shape from one end side to approximately the middle thereof (FIG. 65), and a coil conductor pattern 601 is printed within the plane of the insulating layer 501 (see FIG. 65).
(FIG. 66), and then print an insulating layer 502 (FIG. 67), leaving a small portion of the tip of the coil conductor pattern 601. Next, the magnetic layer 413 is printed in stripes at intervals in the lower half region (in the figure; the same applies hereafter) (FIG. 68).
), and after printing the insulating layer 311 in the space between the magnetic layers 413 and 413 (FIG. 69), half a turn of the insulating layer 503 is printed so as to be continuous with the insulating layer 501 (FIG. 70). 503, print another coil conductor pattern 602 that is continuous with the coil conductor pattern 601 (FIG. 71)
do. After that, an insulating layer 504 is printed continuously from the connection part with the coil conductor pattern 601 to cover most of the coil conductor pattern 602 and leave the tip of the coil conductor pattern 602 (FIG. 72). .

Next, the magnetic layer 414 is printed in stripes at intervals (FIG. 73) in the upper half region (in the figure; the same applies hereafter), and then the magnetic layers 414 are printed to fill the gaps between the magnetic layers 414. After printing the insulating layer 312 (FIG. 74), half a turn of the insulating layer 505 is printed (FIG. 75) so as to be continuous with the insulating layer 503, and a conductor pattern for the coil is formed within the plane of the insulating layer 505. Another coil conductor pattern 603 that is continuous with 602 is printed (FIG. 76). Thereafter, an insulating layer 506 is printed continuously from the connection part with the coil conductor pattern 602 so as to cover most of the coil conductor pattern 603 and leave the tip thereof (FIG. 77). Figure 71
- Repeat the steps in FIG. 77 according to the number of coil turns required.

Next, the magnetic layer 41 located in the lower half region
A magnetic layer 415 is printed on the surface of the magnetic layer 4 (FIG. 78).
Print an insulating layer 313 in the interval between 15 and 415 (Figure 79)
After that, a half-turn of the insulating layer 507 is printed so as to be continuous with the insulating layer 505 (FIG. 80), and a terminal coil is printed so as to be continuous with the coil conductor pattern 603 within the plane of the insulating layer 507. Print the conductor pattern 604 (Fig. 81)
do. After that, an insulating layer 508 is printed continuously from the connection part with the coil conductor pattern 603 so as to cover most of the coil conductor pattern 604 (FIG. 82), and the magnetic layers 416 to 420 are further printed at intervals. (Figure 83). The subsequent steps are steps that follow in reverse order from the step in FIG. 63 to the step in FIG. 58. That is, the magnetic layers 416 to 420
Insulating layers 314 to 317 are printed so as to fill the inside and outside of the area (Fig. 84, corresponding to Fig. 63), and insulating layers 318 to 32
0 is printed to form magnetic layers 416 to 420 (FIG. 85, corresponding to FIG. 62), and magnetic layers 421 to 423 are printed (FIG. 8
6. (corresponding to FIG. 61) and print the insulating layers 321 and 322 (corresponding to FIG.
Figure 87. (corresponding to FIG. 60) and print an insulating layer 421 (corresponding to FIG.
8. (corresponding to FIG. 59), and the magnetic layer 424 is printed in a solid state (FIG. 89, corresponding to FIG. 58). Thereafter, a finished product is obtained through heat treatment, a terminal electrode provision process, and the like.

[0049]

[Effects of the Invention] As described above, according to the present invention, the following effects can be obtained. (a) The coil support body is composed of a magnetic part and an insulating part, and since the magnetic part forms a magnetic path divided by the insulating part with the insulating part in between, the eddy current loss is small. It is possible to provide electronic components with low loss, low heat generation, high efficiency, and excellent magnetic properties. (b) Since the coil has a spiral shape with the direction of displacement being the direction of the winding axis, it is possible to easily stack layers and provide an electronic component that is easy to manufacture.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a model of an electronic component according to the present invention.

FIG. 2 is a sectional view showing a model of another embodiment of the electronic component according to the present invention.

FIG. 3 is a sectional view showing a model of another embodiment of the electronic component according to the present invention.

FIG. 4 is a sectional view showing a model of another embodiment of the electronic component according to the present invention.

FIG. 5 is a cross-sectional view showing a model of another embodiment of the electronic component according to the present invention.

FIG. 6 is a cross-sectional view showing a model of another embodiment of the electronic component according to the present invention.

FIG. 7 is a sectional view showing a model of another embodiment of the electronic component according to the present invention.

FIG. 8 is a perspective view of another embodiment of the electronic component according to the present invention.

FIG. 9 is a cross-sectional view of the embodiment shown in FIG. 8;

FIG. 10 is a perspective view of another embodiment of the electronic component according to the present invention.

FIG. 11 is a sectional view of the embodiment shown in FIG. 10;

FIG. 12 is a cross-sectional view showing a model of another embodiment of the electronic component according to the present invention.

FIG. 13 is a sectional view showing a model of another embodiment of the electronic component according to the present invention.

FIG. 14 is a partial sectional view showing a model of another embodiment of the electronic component according to the present invention. 15 to 36 are diagrams showing a method of manufacturing an electronic component according to the present invention. Figures 37 to 5
7 is a diagram showing another example of the method for manufacturing an electronic component according to the present invention. 58 to 89 are diagrams showing still other examples of electronic components according to the present invention.

[Explanation of symbols]

1 Coil 2 Coil support 21 Magnetic part 22 Insulating part

Claims (10)

[Claims] 1. An electronic component having a coil part in which a coil is embedded inside a coil support, the coil support including a magnetic part and an insulating part, and the magnetic part being connected to the insulating part. sandwiched between them to form a magnetic path partitioned by the insulating portion, and the coil has a spiral shape with a displacement direction in the winding axis direction, and is arranged around a part of the magnetic path. An electronic component characterized by: 2. The electronic component according to claim 1, wherein the magnetic portion constitutes an open magnetic path. 3. The magnetic portion constitutes a central magnetic path and an outer magnetic path, the central magnetic path is arranged on the winding axis of the coil, and the outer magnetic path is arranged on the winding axis of the coil. The electronic component according to claim 2, wherein the electronic component is located outside the electronic component. 4. The electronic component according to claim 1, wherein the magnetic portion constitutes a closed magnetic path. 5. The magnetic portion constitutes a central magnetic path, an outer magnetic path, and a connecting magnetic path, and the central magnetic path is disposed on the winding axis of the coil, and the magnetic portion is arranged on the winding axis of the coil. The magnetic path is
The connecting magnetic path is arranged outside the coil, and the connecting magnetic path is arranged outside the coil.
5. The electronic component according to claim 4, wherein the central magnetic path and the outer magnetic path are connected to each other on at least one side in the winding axis direction of the coil. 6. The electronic component according to claim 1, wherein the number of coils is one. 7. The electronic component according to claim 1, wherein a plurality of said coils are provided. 8. The electronic component according to claim 7, wherein the plurality of coils are independent of each other. 9. The electronic component according to claim 7, wherein at least one set of the plurality of coils is inductively coupled. 10. The coil support according to claim 1, wherein at least one of a capacitor, a resistor, and an integrated circuit is provided on the coil support. electronic components.