JPH03159206A - Structure of hybrid integrated circuit part - Google Patents

Abstract

PURPOSE:To prevent the cross-talk between each inductor without impairing the strength of the base material by a method wherein each inductor is surrounded by a plurality of closed loop conductors, or a nonmagnetic layer is provided between each inductor. CONSTITUTION:Among the magnetic flux generated by applying a current on the coil of inductors 2a and 2b, the magnetic flux proceeding to the adjacent inductor interlinks to the conductor 10 of a closed loop when the inductors 2a and 2b are surrounded by the conductor 10 of a plurality of closed loops. As the above-mentioned magnetic flux is consumed as an eddy current, its arrival at the adjacent inductor is made difficult, and no crosstalk is generated. Also, when a non-magnetic layer 13 is provided between the inductors 2a and 2b, the magnetic flux generated on the inductors 2a and 2b becomes difficult to proceed to the adjacent inductor by the above-mentioned non-magnetic layer 13, and the cross-talk is not generated.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a hybrid integrated circuit mainly comprising a plurality of laminated inductors manufactured by alternately laminating and sintering a coil-forming conductor and a magnetic material. Regarding the structure of parts.

(Prior art and problems to be solved by the invention) FIG. 7 shows an example of a conventional hybrid integrated circuit component including a laminated composite inductor l, in which each inductor 2a, 2b
1 For example, ferrite powder with high electrical insulation properties is made into a paste using a binder, and conductive powder for coil formation is made into a paste using a binder, so that a plurality of eight-fiber coils are formed on one laminated surface. A laminate is formed into a coil shape by alternately laminating layers using a printing method so that the pattern of the coil conductor 3 is sequentially connected from the layer 4 made of a magnetic material (hereinafter referred to as the magnetic layer) to the next layer. It is manufactured by making and firing it. 5 is a composite capacitor formed by laminating a plurality of conductors 6 and a dielectric layer 7, and the composite capacitor 5 is composed of the composite inductor l
They are integrated by laminating them and firing them. 8 is an external terminal formed on the side surface of this hybrid integrated circuit component;
A conductor 6 that becomes one end of a conductor 3 formed as a coil or one electrode of a capacitor 4 is connected.

However, in the hybrid integrated circuit component configured in this way, for example, a portion of the magnetic flux φ8 generated by the current flowing through the coil conductor 3 constituting the inductor 2a reaches the adjacent inductor 2b, causing crosstalk. For example, inductor 2a and inductor 2b mutually indance,
When a current 1 flows through the conductor 3 of the inductor 2a, crosstalk noise v11 expressed by the following equation is generated in the inductor 2b.

VN=J　ωL,I.

When crosstalk occurs between inductors 2a and 2b,
In the case of transmission filters, the transmission characteristics cannot be obtained as per theory,
Further, abnormal oscillation occurs in high frequency circuits such as tuners.

In order to prevent such losstalk from occurring, a structure has been devised in which grooves 9 are provided between the inductors 2a to 2d, as shown in FIGS. 8 and 9.

However, if grooves 9 are provided as shown in FIGS. 8 and 9,
The strength of the hybrid integrated circuit component is significantly weakened, and it may break when external force is applied to it.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a structure of a hybrid integrated circuit component that can prevent crosstalk between inductors without impairing the strength of the element body.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a composite inductor including a plurality of alternately laminated magnetic materials and coil conductors, or a composite inductor and a composite capacitor. A hybrid integrated circuit component formed by laminating at least one of resistors is characterized in that each inductor is surrounded by a plurality of closed loop conductors or a nonmagnetic layer is provided between each inductor.

(Function) By surrounding each inductor with a plurality of closed-loop conductors, out of the magnetic flux generated by energizing the coil of the inductor, the magnetic flux directed toward the adjacent inductor interlinks with the closed-loop conductor and is generated as an eddy current. Because it is consumed, it does not reach the adjacent inductor and no crosstalk occurs.

Furthermore, when a nonmagnetic layer is provided between the inductors, the magnetic flux generated in the inductor becomes difficult to pass to the adjacent inductor due to the nonmagnetic layer, and crosstalk does not occur.

(Embodiment) FIG. 1 is a sectional view showing an embodiment of a hybrid integrated circuit component according to the present invention, FIG. 2 is a partial sectional view taken along the line AA in FIG. 1, and FIG. 3 is a manufacturing process diagram thereof. In FIGS. 1 to 3, the same reference numerals as in FIGS. 7 to 9 indicate the same members or parts.

In FIGS. 1 and 2, IA is a composite inductor according to the present invention, and each inductor 2a, 2b constituting the composite inductor IA is surrounded by conductors lO constituting a plurality of closed loops.

Next, with reference to FIG. 3, the manufacturing process of the composite inductor IA of this embodiment will be described with reference to an example in which one composite inductor IA includes four inductors 2a to 2d. First, Figure 3 (1
), an insulating paste made of ferrite powder with high electrical insulation and a binder is applied onto the composite capacitor 5 to form a base 4a which is a magnetic layer.

Next, as shown in FIG. 3(2), the lower lead-out conductor 12a connected to the external terminal 8, and the first
The conductor 3a which becomes the eight-fold coil of the layer is formed by printing a conductor paste.

The conductor paste forming the conductor 3a, the lead-out conductor 12a, etc. is made of, for example, Ag, ^g-Pd, Cu, Ni.
, Pd, or other metal powder mixed with a binder.

Next, as shown in FIG. 3(3), a magnetic layer 4b is formed on the base 4a and the conductor 3a by printing the insulating paste, leaving the inner end of the conductor 3a.

Next, as shown in FIG. 3(4), on the magnetic layer 4b,
A conductor 3b serving as a second layer half coil wound in the opposite direction of the first layer conductor 3a is formed so that its inner end overlaps the inner end of the first layer conductor 3a. Moreover, at the same time, a conductor lO constituting a closed loop is formed so as to surround each conductor 3a, 3b. This conductor 10 is also conductor 3a, 3b
The same material is used.

Next, as shown in FIG. 3(5), a magnetic layer 4C is formed by printing the insulating paste so as to cover the magnetic layer 4b and half (inner side) of the conductor IO and the conductor 3b.

Next, as shown in FIG. 3(6), the magnetic layers 4b, 4C
Above, a third conductor 3b is wound in the opposite direction of the second layer conductor 3b.
The outer end of the conductor 3c which becomes the half coil of the layer is the second layer.
It is formed so as to overlap the inner end of the conductor 3b of the layer.

Next, as shown in FIG. 3(7), the conductor 3b.

3C and so as to cover the exposed portion of the conductor IO,
A magnetic layer 4d is formed by printing the insulating paste on the inner end of the conductor 3C.

After repeating the steps (4) to (7) below as many times as necessary, the conductor 3d connected to the conductor 3C and the upper lead-out conductor 12b are formed as shown in FIG. 3(8).

Next, as shown in FIG. 3 (9), the base 4 which is the magnetic layer
The entire surface was covered with e.g., to obtain an 81-layer body.

Next, this laminate is cut and fired, and external terminals 8 connected to the lead-out conductors 12a and 12b are formed by baking a conductive paste to obtain a multilayer inductor IA.

With such a structure, as shown in FIG. 1, out of the magnetic flux generated by a certain inductor 2a.

The magnetic flux φ^ directed toward the adjacent inductor 2b interlinks with the closed-loop conductor lO provided around the inductor 2a and is consumed as an eddy current flowing through the conductor 10, thereby preventing crosstalk.

FIG. 4 is a sectional view showing another embodiment of the hybrid integrated circuit component according to the present invention, FIG. 5 is a perspective view thereof, and FIG. 6 is a manufacturing process diagram thereof. An example is shown in which IB includes four inductors 2a to 2d.

As shown in FIGS. 4 and 5, this composite inductor IB has a nonmagnetic layer 13 made of nonmagnetic and insulating ferrite or the like between each inductor 2a to 2d.

As shown in FIG. 6 (1), this composite inductor IB is first made by applying an insulating paste made of ferrite powder with high electrical insulation properties and a binder onto a substrate (not shown) to form a magnetic layer. Form 4a.

Next, as shown in FIG. 6(2), the lower lead-out conductor 12a connected to the external terminal 8 and the first
The conductor 3a which becomes the half coil of the layer is formed by printing conductor paste.

Next, as shown in FIG. 6(3), the magnetic layer 4b is printed on the four corners of the base 4a so as to cover the outer ends of the lead-out conductor 12a and the conductor 3a. Form.

Next, as shown in FIG. 6(4), a paste containing non-magnetic ferrite is printed between the upper and lower magnetic layers 4b, which form a pair in the drawing on the magnetic layer 4a serving as the base, to form a non-magnetic layer. 13a is formed.

Next, as shown in FIG. 6(5), the first layer conductor 3
A second layer of conductor 3b, which is wound in the opposite direction of a, is formed so that its inner end overlaps the inner end of the first layer of conductor 3a.

Next, as shown in FIG. 6(6), magnetic layers 4C are formed in four regions by printing the insulating paste so as to cover half (inner side) of the conductor 3b. A portion a where the magnetic layer 4C is not formed is formed between these regions 4C.

Next, as shown in FIG. 6(7), a paste containing non-magnetic ferrite is printed on the cross-shaped portion a where the magnetic layer 4C is not formed to form a non-magnetic layer 13b.

Next, as shown in FIG. 6 (8), a conductor 3 that becomes a third layer half coil is wound in the opposite direction of the second layer conductor 3b.
C is formed so that its outer end overlaps the inner end of the second layer conductor 3b.

Next, as shown in FIG. 6(9), the magnetic layer 4 is printed with the insulating paste so as to cover the outer end of the conductor 3C.
form d.

Next, as shown in FIG. 6(10), a nonmagnetic layer 13c is formed between the upper and lower magnetic layers 4d, which form a pair in the drawing, by printing a paste containing nonmagnetic ferrite.

After repeating the steps (5) to (10) below as many times as necessary, the conductor 3d connected to the conductor 3C and the upper lead-out conductor 12b are formed as shown in FIG. 6(11).

Next, as shown in FIG. 6(11), the entire surface is covered with a base 4e, which is a magnetic layer, to obtain a laminate.

With such a structure, in FIG. 4, out of the magnetic flux generated in a certain inductor 2a, the adjacent inductor
The magnetic flux directed toward b becomes difficult to pass through due to the nonmagnetic layer 13 provided between the inductors 2a, and crosstalk is prevented.

The above explanation was about an example in which an insulator paste and a conductor paste containing magnetic material powder were printed and formed one on top of the other. The present invention can also be applied to the case where a laminate is manufactured by doing so. The present invention also provides composite capacitors or composite inductors lA, lB.
The present invention can also be applied to devices in which a composite resistance layer is formed on the substrate, and devices in which electronic components are mounted.

(Effects of the Invention) As described above, according to the present invention, crosstalk can be prevented because the magnetic flux to adjacent inductors is made difficult to pass through the closed loop conductor or the nonmagnetic layer. Also according to the invention.

Since the crosstalk preventing portion is formed integrally with the magnetic layer of the inductor, the strength of the hybrid integrated circuit component is not reduced.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of a hybrid integrated circuit component according to the present invention, FIG. 2 is a partial sectional view taken along the line A-A in FIG. 1, FIG. 3 is a manufacturing process diagram of the embodiment, and FIG. 5 is a perspective view of the embodiment, FIG. 6 is a manufacturing process diagram of the embodiment, and FIG. 7 is a conventional hybrid integrated circuit component. 8 is a sectional view showing another example of a conventional hybrid integrated circuit component, and FIG. 9 is a perspective view of FIG. 8.

Claims (2)

[Claims] 1. In a composite inductor comprising a plurality of alternately laminated magnetic materials and coil conductors, or a hybrid integrated circuit component comprising a composite inductor laminated with at least one of a composite capacitor and a composite resistor, each inductor is A structure of a hybrid integrated circuit component characterized in that it is surrounded by a closed loop conductor. 2. In a hybrid integrated circuit component that includes a plurality of composite inductors that have a plurality of alternately laminated magnetic materials and coil conductors, or a composite inductor that is laminated with at least one of a composite capacitor and a composite resistor, there is no contact between each inductor. A structure of a hybrid integrated circuit component characterized by providing a magnetic layer.