JP3233306B2 - Multilayer noise absorbing element composite - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a noise absorbing element which is inserted into a power supply line or a signal line of an electronic device and cuts off high-frequency noise, and more particularly, to a noise absorbing element incorporating a plurality of inductors corresponding to a plurality of channels. The present invention relates to a laminated noise absorbing element composite formed by the above method, and more particularly to a crosstalk prevention structure thereof.

[0002]

2. Description of the Related Art Conventionally, a noise absorbing element inserted into a power supply line or a signal line is made of a cylindrical magnetic material called a bead, and a lead wire is inserted therein. It was to be inserted and used. However, in order to meet recent demands for miniaturization and thinning, a noise absorbing element has been formed of a laminated body in which a plurality of coil conductors respectively corresponding to a plurality of channels are incorporated in a magnetic body.

In such a noise-absorbing element composite, when a coil conductor corresponding to a channel is brought closer to make the device more compact and space-saving, crosstalk occurs in which a signal of one channel goes around another channel. In order to prevent such crosstalk, for example, it is conceivable to employ a crosstalk prevention structure proposed by the present applicant as Japanese Patent Application Laid-Open No. 3-159206. FIG. 5A is a cross-sectional view showing a laminated component disclosed in the publication, and FIG. 5B is a partial cross-sectional view along AA.
The laminated component is formed by laminating a composite inductor 1A having a laminated structure on a composite capacitor 5 formed by laminating a plurality of conductors 6 and a dielectric layer 7, and integrating the coil conductor 3
Conductor 6 which serves as one end of the capacitor or one electrode of the capacitor 4
Are formed on the side surfaces of the external terminals 8 to be connected.
In the composite inductor 1A, in order to prevent crosstalk between the inductor 2a and the adjacent inductor 2b, each of the inductors 2a and 2b is formed by being surrounded by a plurality of ring-shaped conductors 10 forming a closed loop. .

As described above, by surrounding each inductor 2a, 2b with a plurality of closed loop conductors 10,
For example, among the magnetic fluxes generated by energizing the coil conductor 3 constituting the inductor 2a, the magnetic flux φA directed to the adjacent inductor 2b is linked to the closed-loop conductor 10 and is consumed as an eddy current. 2b, and crosstalk can be prevented.

However, since the conductor 10 is formed so as to surround each of the inductors 2a and 2b, the composite inductor 1A configured as described above has a large external shape and is difficult to reduce in size.

In addition to the above-mentioned example, in a multilayer electronic component having a plurality of multilayer inductors, a structure for preventing the occurrence of crosstalk between each of the inductors 2a and 2b is shown in FIG. As shown in the figure, there is a type in which a nonmagnetic layer 13 is formed between inductors 2a and 2b.
With such a structure, of the magnetic flux generated by energizing the coil conductor 3 forming the inductor 2a, the magnetic flux directed to the adjacent inductor 2b passes through the portion of the nonmagnetic layer 13 provided between the inductors. And crosstalk is prevented.

[0007] However, the composite inductor 1B thus configured is advantageous for miniaturization. However, in addition to the coil conductor layer for forming the inductor and the insulating magnetic layer, the composite inductor 1B has a non-magnetic layer. Since a forming process is required, there is a problem that the manufacturing process is complicated and productivity is low. Also,
Japanese Unexamined Patent Publication No. Hei 3-60106 discloses that a plurality of
A composite having a channel noise absorbing element is constructed.
Therefore, the inductance element is configured linearly and
A green sheet with a conductance element and a channel
Conductor film (ground conductor) to prevent crosstalk between
The green sheets that have formed the
With input / output terminal and ground terminal after cutting
Have been. However, according to this structure, multiple
These inductance elements are formed
A ground conductor with the entire surface as a conductor layer is formed between the
Therefore, the ground conductor formation process is a separate process,
Increase. The inductance element is a straight conductor
Therefore, it is not possible to obtain a very high inductance.
No. Also, if the cutting position when cutting the laminated sheet
Due to the fluctuation, the internal inductance element and the upper and lower surfaces
The distance between them varies, which side is the mounting surface of the board
Depending on the inductance element and the conductor on the mounting surface of the board
The problem that the characteristics after mounting vary due to the action of
is there.

In view of the above-mentioned circumstances, the present invention can prevent crosstalk between coil conductors inserted into a line, reduce the size, and reduce the number of laminating steps.
And the dispersion of characteristics after mounting can be reduced.
And to provide a laminated type noise absorbing element complex that can.

[0009]

In order to achieve the above object, a laminated noise absorbing element composite according to the present invention has a plurality of layers corresponding to a plurality of channels by alternately laminating magnetic layers and coil conductor layers. In the laminated noise absorbing element composite formed by incorporating the coil conductors, the laminated noise absorbing element composite is configured such that the respective coil conductors are oriented in the vertical direction in which the center magnetic flux is the laminating direction, and are parallel to each other. As described above, a plate-like grounding conductor is formed by being arranged side by side in a row, and by laminating conductor layers between adjacent coil conductors in the direction in which the coil conductors are stacked (claim 1).
In addition, the laminated noise absorbing element composite of the present invention may further comprise a magnetic layer
And the coil conductor layer are alternately laminated,
Built-in multiple coil conductors corresponding to channels
In the laminated noise absorbing element composite,
The noise-absorbing-element complex is designed so that each coil conductor
The bundles face in the vertical direction, which is the stacking direction, and
So that they are built side by side in a row,
A conductor layer is overlapped between the bodies in the direction of lamination of the coil conductor, and a zigzag ground conductor is formed on the same layer as the coil conductor layer (claim 2).

[0010]

According to the present invention, of the magnetic flux generated by energizing the coil conductor, the magnetic flux directed to the adjacent coil conductor is consumed as a current flowing through the ground conductor, so that it is difficult to reach the adjacent coil conductor. Also, the presence of the ground conductor weakens the electrostatic coupling between adjacent coil conductors, so that no crosstalk occurs.

[0011]

FIG. 1 is a perspective view showing one embodiment of a laminated noise absorbing element composite according to the present invention. In FIG.
The same reference numerals indicate the same members or portions. As in the case of the conventional multilayer electronic component, the multilayer noise absorbing element composite according to the present embodiment includes a magnetic paste composed of a ferrite powder and a binder having high electrical insulation properties, for example, Ag, Ag-Pd, C
a conductor paste obtained by mixing a metal powder such as u, Ni, Pd or the like and a binder, is alternately laminated by a printing method;
Alternatively, the coil conductors 11 respectively corresponding to a plurality of (three in this example) channels are formed inside the magnetic body 4 by laminating using a sheet method or a composite method thereof. A plate-like ground conductor 13 connected to an outer ground conductor 12 is provided between the coil conductors 11. The laminated noise absorbing element
In the uniting, each coil conductor 11 has its center magnetic flux
So that they are oriented vertically and are parallel to each other,
Built-in side by side. In addition, the laminated noise absorbing element
Connect one end of each coil conductor to one side of the child composite
An input terminal 14 is provided, and the other end of each coil conductor is provided on the other side surface.
Is provided.

FIG. 2 is a view showing a manufacturing process of the laminated noise absorbing element composite. First, as shown in FIG. 2A, a magnetic layer 4a made of a sheet or layer obtained by pasting ferrite powder is prepared. . Next, as shown in FIG. 2B, three linear coil conductor layers 11a corresponding to channels made of a paste of metal powder made of the above-described material are formed by printing. These three coil conductor layers 11a also serve as a lead wire whose leading end s is connected to the input terminal 14. At the same time as the formation of the coil conductor layer 11a, the ground conductor layer 13a is printed between the coil conductor layers 11a. Next, as shown in (c), the coil conductor layer 11a
A half-surface magnetic layer 4b is formed by sheet or printing so as to cover the coil conductor layer 11a except for the terminal end and the ground conductor layer 13a. Next, as shown in (d),
The three U-shaped coil conductor layers 11b are formed so that the start ends thereof are overlapped with the ends not covered by the magnetic layer 4b of the coil conductor layer 11a, and at the same time, a ground conductor is provided between these coil conductor layers 11a. 13b is the ground conductor 13
Print it over a. Next, as shown in (e), the other half surface of the magnetic layer 4c is formed by sheet or printing so as to cover the coil conductor layer 11b except for the terminal end of the coil conductor layer 11b and the ground conductor layer 13b. . Next, as shown in (f), a U-shaped coil conductor layer 11c is formed.
Is formed by overlapping the start end with the end not covered by the magnetic layer 4b of the coil conductor layer 11b, and at the same time, printing the ground conductor 13c so as to overlap the ground conductor 13b between these coil conductor layers 11c. . Next, as shown in (g), the termination of the coil conductor layer 11c and the ground conductor layer 1c
3c so as to cover the coil conductor layer 11c,
A half-surface magnetic layer 4d is formed. Then, (d) ~
After repeating step (g) for the required number of turns, (h)
After the coil conductor layer 11d having the termination f connected to the output terminal 15 and the ground conductor layer 13d are formed as shown in FIG. 3 (a), an opening is formed in a portion corresponding to the center of each ground conductor layer 13d as shown in FIG. The magnetic layer 4e having the portions 16 is laminated by printing or a sheet. Next, as shown in (j),
The opening 16 is filled with a ground conductor 13e serving as a lead line.

The laminate thus obtained is fired at a high temperature to obtain a sintered body. Then, the peripheral surface is polished if necessary. Then, the terminals 14 and 15 and the external ground conductor 12 shown in FIG. 1 are formed by plating, baking, or the like. The ground conductor 13 is connected to the external ground conductor 12.

With this structure, of the magnetic fluxes generated by one coil conductor 4, the magnetic flux directed to the adjacent coil conductor 4 links with the ground conductor 13 and is consumed as an electric current. Is prevented. Further, since the conductor 13 between the coil conductors 4 is grounded, electrostatic coupling between the coil conductors 4 and 4 is also prevented, and crosstalk from this point is also prevented. In addition, multiple cores
The coil conductors 4 are formed, and the entire surface is
Forming and interposing ground conductors as conductor layers
For example, the process of forming the ground conductor is a separate process,
According to the present invention, the coil conductor 4 and the ground conductor 13
Since they are formed simultaneously, the number of steps is reduced. Also,
The center magnetic flux of the il conductor 4 is perpendicular to the mounting surface.
The distance between the upper and lower surfaces of the composite and the coil conductor 4 should be equal.
The upper and lower surfaces during mounting.
The distance from the coil conductor 4 to the mounting surface
The variation in characteristics after mounting is reduced, and the variation in characteristics after mounting is reduced.
Is done.

FIG. 3A is a perspective view showing another embodiment of the present invention, and FIG. 3B is a sectional view taken along the line EE of FIG. 3A. And a zigzag ground conductor 13 which forms the same layer as these coil conductors 4 at the same time.

FIG. 4 is a view showing a manufacturing process of the embodiment of FIG. 3. The difference from the embodiment of FIG.
3d is formed over a range of less than about half the width of the stacked body, and the respective layers 13a to 13d overlap each other at the center, and form a stacked structure in which the magnetic layers 4b to 4d are interposed between the respective layers.
According to this embodiment, although the magnetic flux shielding effect is somewhat inferior to the above embodiment, a sufficient effect can be obtained in preventing crosstalk.

The present invention can also be applied to those in which the coil conductors are laminated 3/4 turns or one turn at a time, and can also be applied to those in which the coil conductors are integrally laminated with a composite capacitor or the like. By mounting an IC on a substrate that constitutes the above, a hybrid integrated circuit component can be formed. It should be noted that the present invention is applied to a composite capacitor having a plurality of built-in capacitors, and even when a plate-shaped or zigzag-shaped built-in ground conductor having the laminated structure is provided between the electrodes of the adjacent capacitors, the adjacent capacitors may be provided. The effect of preventing crosstalk between them can be obtained.

[0018]

According to the present invention, the coil conductor is provided in the composite body.
Is wound around the
It goes without saying that the magnetic flux generated in the coil conductor is consumed as a current by the ground conductor, and the electrostatic coupling between the coil conductors is prevented by the built-in ground conductor. Can be prevented. Further, since the crosstalk preventing conductor is provided between the coil conductors, it is possible to contribute to downsizing as compared with the case where the crosstalk preventing conductor is provided so as to surround the coil conductor. Further, since the grounding conductor can be made of the same material as the coil conductor, the manufacturing process can be simplified as compared with the conventional structure in which a non-magnetic material layer is provided, which can contribute to cost reduction. Also, a plurality of coil conductors are formed in the stacking direction,
Form a ground conductor between these coil conductors with the entire surface as a conductor layer.
In this configuration, the ground conductor formation process is separate.
Since the number of steps is large, the number of steps is large.
And ground conductors are formed simultaneously, reducing the number of processes.
Reduced and easier to manufacture. Also, the center magnetic flux of the coil conductor
Is perpendicular to the mounting surface.
By equalizing the distance to the coil conductor,
No matter which upper or lower surface is used as the mounting surface, the coil
The variation in the distance from the conductor to the mounting surface does not change, and the mounting
Later variations in characteristics are reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a multilayer noise absorbing element composite according to the present invention.

FIG. 2 is a manufacturing process diagram of the embodiment of FIG.

FIG. 3A is a perspective view showing another embodiment of the laminated noise absorbing element composite according to the present invention, and FIG. 3B is a cross-sectional view taken along EE.

FIG. 4 is a manufacturing process diagram of the embodiment of FIG. 3;

FIG. 5A is a cross-sectional view showing an example of a conventional hybrid integrated circuit component, FIG. 5B is a partial cross-sectional view thereof taken along line AA, and FIG. 5C is a cross-sectional view showing another example of a conventional multilayer electronic component. It is.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 4 Magnetic body 4a-4e Magnetic layer 11 Coil conductor 11a-11d Coil conductor layer 12 Ground conductor on outer surface 13 Ground conductor 13a-13e Ground conductor layer 14 Input terminal 15 Output terminal

Continuation of front page (56) References JP-A-3-159206 (JP, A) JP-A-3-60106 (JP, A) JP-A-2-52409 (JP, A) JP-A-57-187930 (JP) , A) Japanese Utility Model Showa Sho 61-173167 (JP, U) Japanese Utility Model Utility Model Hei 5-21409 (JP, U)

Claims (2)

(57) [Claims] 1. A laminated noise absorbing element composite having a plurality of coil conductors corresponding to a plurality of channels built therein by alternately laminating a magnetic layer and a coil conductor layer. The element complex connects each coil conductor with
The central magnetic flux faces vertically in the stacking direction and is parallel to each other, and is built-in side by side in a row. Between adjacent coil conductors, a conductor layer is stacked in the coil conductor stacking direction to form a plate. A laminated noise absorbing element composite, wherein a ground conductor is formed. 2. A magnetic layer and a coil conductor layer are alternately laminated.
Multiple coils corresponding to multiple channels
In a laminated noise absorbing element composite formed with a built-in conductor
In the laminated noise absorbing element composite, each coil conductor
The center magnetic flux is directed in the vertical direction,
To form a parallel to have a built side by side in a row, between adjacent coil conductor, guiding the stacking direction of the coil conductor
Overlapping body layer, laminated type noise absorbing element complex, wherein the formation of the zigzag grounding conductor in the coil conductor layer and the same layer.