JP2002175921A - Electronic component and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component, such as a laminated electronic component or the like which is small in size, high in performance, and superior in overall electrical properties. SOLUTION: Spherical single crystals of ferrite of an average grain diameter in the range of 0.1 to 30 μm are dispersed into resin for the formation of a composite magnetic material, and an electronic component is formed of the above composite magnetic material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a multilayer electronic component or a multilayer circuit using a prepreg and a substrate, and relates to a prepreg and a substrate suitable for use utilizing magnetic characteristics and for magnetic shielding. The present invention relates to a laminated electronic component used or an electronic component configured by a method such as casting or molding.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable trend toward miniaturization and high-density mounting methods in the field of electronic devices for communication, consumer use, industrial use, and the like. Heat resistance, dimensional stability, electrical properties, and moldability are being demanded.

[0003] As a high-frequency electronic component or a high-frequency multilayer substrate, a substrate obtained by forming a sintered ferrite or sintered ceramic into a multi-layered substrate is generally known. Making these materials into a multi-layer substrate has been conventionally used because of its merit of miniaturization.

[0004] However, the number of steps, such as the firing step and thick film printing, is large, and there are many problems specific to sintered materials such as cracks and warpage during firing. There are many problems such as cracks due to
The demand for resin-based soft materials is increasing year by year.

[0005] However, there is a problem in that the resin-based material cannot increase the magnetic permeability, so that the electronic component using them cannot provide sufficient characteristics or the shape becomes very large. there were.

[0006] Also, a method of compositing a ceramic magnetic material powder with a resin material is disclosed in JP-A-10-270255, JP-A-11-192620 and the like, but all of them can obtain a sufficient magnetic permeability. Not done.

[0007] Therefore, in order to further improve the characteristics of the electronic component, it is necessary to study materials and the like.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component such as a laminated electronic component having a small size, high performance, and excellent overall electrical characteristics.

[0009]

The above object is achieved by the present invention described below. (1) An electronic component using a composite magnetic material in which a spherical single crystal ferrite having an average particle size of 0.1 to 30 μm is dispersed in a resin. (2) The electronic component according to (1), wherein the composite magnetic material contains a reinforcing fiber. (3) The electronic component according to (1), wherein the content of the single crystal ferrite is 5 vol% or more and less than 70 vol%, when the total amount of the single crystal ferrite and the resin in the composite magnetic material is 100 vol%. (4) the solvent has an average particle size of 0.1 to 30 μm;
A slurry containing a spherical single crystal ferrite powder, a resin and, if necessary, a flame retardant was prepared, coated on a glass cloth, and dried to obtain a prepreg as a resin-impregnated glass cloth, and a metal foil was applied to the prepreg. A method for manufacturing an electronic component in which a substrate with a foil is obtained by superimposing heating and pressing. (5) the solvent has an average particle size of 0.1 to 30 μm;
Prepare a slurry containing spherical single-crystal ferrite powder, resin and, if necessary, a flame retardant, apply this slurry on a metal foil, and dry to obtain a prepreg with a metal foil. And a method of manufacturing an electronic component in which a substrate with a foil is obtained by heating and pressing to obtain a substrate with a foil.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. The electronic component of the present invention has an average particle size of 0.1 to 30 μm.
m, a composite magnetic material in which a spherical single crystal ferrite is dispersed in a resin. Usually, a composite magnetic layer (including a substrate) composed of such a composite magnetic material is used. Have.

Since the composite magnetic material used in the present invention uses the above-mentioned single crystal ferrite, the magnetic permeability and the loss can be greatly improved, and a high Q can be obtained. Therefore, when an electronic component is used, higher power and higher performance can be achieved. Further, the above-mentioned single crystal ferrite has good dispersibility in a resin, enables high-density filling, and makes the most of the characteristics of the above-mentioned single crystal ferrite when used as a composite magnetic material.

The ferrite used in the present invention has an average particle size of 0.1 to 30 μm, preferably 0.3 to 30 μm, has a spherical particle shape, and is a single crystal. In other words, a spherical fine powder having a single crystal structure less affected by crystal grain boundaries and impurities, having no cohesiveness, and having excellent dispersibility and filling properties is obtained. When the average particle size is about 0.1 to 30 μm, particularly when the average particle size is in the range of 0.3 to 30 μm, a spherical single crystal with little aggregation, fine, uniform particle size and shape, and low surface activity is obtained. It becomes a powder, and the powder itself has excellent magnetic properties and can be uniformly dispersed, so that variations in properties are reduced and the packing density can be further increased.

On the other hand, if the average particle size is less than 0.1 μm, it is difficult to increase the molding density, and the average particle size is 30 μm.
If it exceeds m, it is difficult to produce particles. In addition, when a conventional amorphous powder is used, the dispersibility deteriorates. For example, when crushing is performed to obtain particles having a predetermined particle size, the surface activity is increased and the powder is likely to aggregate.

The average particle size can be determined, for example, by applying light scattering theory (Mie scattering). That is, when light is incident on a single particle having a diameter D, the scattered light intensity observed from the particle is determined by the perimeter of the particle and the incident light wavelength λ.
Particle size parameter α (α = πD / λ) defined by the ratio
And the refractive index m of the particles. When the particle diameter is large, the scattered light is concentrated forward, and when the particle diameter is smaller than the incident wavelength, the scattered light is scattered in all directions. In this case, the scattered light intensity changes depending on the scattering angle θ (the angle between the incident direction and the scattering direction). Therefore, the particle size distribution can be calculated by obtaining the angle distribution of the scattered light intensity.

It is preferable to obtain the average diameter of the spheres (average volume diameter). That is, spherical average diameter (average volume diameter) = (Σnd ³ / Σn) ^1/3
[D: particle diameter, n: number of samples]. Further, the particle diameter (Xvm) at 50% accumulation may be determined from the particle diameter-cumulative volume distribution curve.

The term "spherical" as used in the present invention includes not only a perfect spherical shape having a smooth surface but also a polyhedron very close to a true sphere. That is, the spherical fine powder of the present invention also includes polyhedral particles having isotropic symmetry surrounded by a stable crystal face as represented by the Wulff model and having a sphericity close to 1.

The sphericity is preferably in the range from 0.95 to 1. Here, the “sphericity” is represented by Wadell's practical sphericity, that is, the ratio of the diameter of a circle equal to the projected area of a particle to the diameter of the smallest circle circumscribing the projected image of the particle. As the sphericity decreases, the dispersibility tends to deteriorate.

The sphericity is determined by polishing the cross section of a particle (embedding the resin in the resin and polishing the resin together), and then taking in the particle shape (outer peripheral shape) (as image information using an OCR or the like) and performing image processing. To calculate the area, and calculate the diameter by calculation. Further, after a circumscribed circle is drawn on the particle shape so that the diameter becomes minimum, the diameter is obtained. The sphericity can be calculated from the two diameters obtained by using the Wadell's practical sphericity. Note that Wadell's practical sphericity Ψ0 is defined as ＝ 0 = diameter of a circle equal to the projected area of the particle / diameter of the smallest circle circumscribing the projected image of the particle.

The ferrite used in the present invention is an iron oxide or a composite oxide containing iron and a metal other than iron. The metal constituting ferrite together with iron is not particularly limited as long as it usually produces ferrite, and for example, nickel, zinc, manganese, magnesium, strontium,
Barium, cobalt, copper, lithium, yttrium and the like can be mentioned. The ferrite of the present invention also includes a solid solution of two or more ferrites.

Typical ferrites include Fe3O4, NiF
e2O4, MnFe2O4, CuFe2O4, (Ni, Zn) Fe2O4, (Mn, Zn) Fe2O
4, (Mn, Mg) Fe2O4, CoFe2O4, Li0.5Fe2.5O4 and the like.

[0021] The ferrite fine powder of the present invention is advantageously produced by a spray pyrolysis method. That is, a solution or suspension containing a compound of at least one metal constituting ferrite is formed into fine droplets, and the droplets are heated at a high temperature of about 1400 ° C. or higher to thermally decompose the metal compound. , 0.1
A ferrite single crystal fine powder having an average particle size of about 30 μm, a shape very close to a true sphere, and a uniform particle size without aggregation is obtained. If desired, an annealing treatment may be further performed. The particle size of the produced powder can be easily controlled by process control such as spraying conditions. The heating temperature depends on the composition, but if it is lower than 1400 ° C., spherical and single crystal powder cannot be obtained. The heating temperature is generally selected from a temperature in the range of 1400-1700C.

In order to obtain a single crystal fine powder having higher sphericity, it is desirable to carry out the thermal decomposition at a temperature near or above the melting point of ferrite for the purpose of thermal decomposition. According to the present method, a spherical single crystal ferrite fine powder having an average particle diameter of about 0.3 to 30 μm and individual particles having a sphericity of 0.95 to 1 can be easily produced.

Examples of the starting metal compound include nitrates, sulfates, chlorides, carbonates, ammonium salts, phosphates, carboxylates, metal alcoholates, resinates, double salts thereof, and the like. A thermally decomposable compound such as a complex salt or an oxide colloid can be appropriately selected and used. These compounds are dissolved or suspended in water, an organic solvent such as alcohol, acetone, or ether, or a mixed solvent thereof, and the solution or suspension is sprayed by an ultrasonic or two-fluid nozzle. To form finer droplets. As the atmosphere during the thermal decomposition, an oxidizing atmosphere, a reducing atmosphere, or an inert atmosphere is appropriately selected depending on the type of the target ferrite.

The magnetic permeability μ of the ferrite thus obtained is 2 to 20,000.

The resin used in the present invention is not particularly limited, and examples thereof include an epoxy resin, a phenol resin, a rubber-based resin, an acrylic resin, and a Teflon (registered trademark) resin.
Epoxy resins and the like are preferably used. These resins may be used alone or in combination of two or more.

In addition, ferrite can be dispersed using glass or the like in addition to resin.

The ratio of the resin and the ferrite in the composite magnetic material of the present invention is such that the total amount of the resin and the ferrite is 1
When it is set to 00 vol%, the ferrite content is preferably 5 vol% or more and less than 70 vol%, more preferably 10 to 65 vol%.
vol%, particularly preferably 20 to 60 vol%.

By setting the content of ferrite within the above range, sufficient magnetic properties can be obtained, and the workability of the composite magnetic material into a use form such as a substrate becomes easy. On the other hand, when the content of ferrite is large, it becomes difficult to prepare a substrate and a prepreg, for example, it is difficult to form a slurry and apply the slurry. On the other hand, if the content of ferrite is small, it may not be possible to secure the magnetic permeability, and the magnetic properties will be reduced.

The magnetic permeability of the composite magnetic material of the present invention is 1.0
Preferably it is 1 to 50.

The composite magnetic material of the present invention preferably contains a flame retardant to make it flame-retardant.

As the flame retardant, various flame retardants usually used for making a substrate flame-retardant can be used.
Specifically, halides such as halogenated phosphoric acid esters and brominated epoxy resins, organic compounds such as phosphoric acid ester amides, and inorganic materials such as antimony trioxide and aluminum hydride can be used. Of these, halogenated phosphoric acid esters and phosphoric acid ester amides are preferred, and halogenated phosphoric acid esters are particularly preferred.

The content of the flame retardant in the composite magnetic material is preferably such that the ratio of resin / flame retardant is from 90/10 to 10/90 when the mixing ratio of the resin and the flame retardant is represented by mass ratio. Preferably it is 60/40 to 40/60.
As a result, a sufficient effect can be obtained, such as satisfying the UL standard of 94V-0, and the characteristics as a composite magnetic material can be sufficiently ensured.

In the electronic component of the present invention, such a composite magnetic material is generally used as a layered body (composite magnetic layer) including a substrate and the like. The substrate can be in various forms, such as a prepreg using reinforcing fibers, a molded one, and a metal foil, and can be selected according to the purpose.

In the present invention, to obtain a prepreg,
The reinforcing fiber is impregnated or coated with a paste containing a ferrite powder having a predetermined compounding ratio, a resin, and, if necessary, a flame retardant and kneaded with a solvent to form a slurry, followed by drying (B-stage). The solvent used in this case is preferably a volatile solvent, particularly preferably a polar neutral solvent (for example, methyl ethyl ketone), and is used for the purpose of adjusting the viscosity of the paste to facilitate coating. The kneading may be performed by a known method using a ball mill, stirring, or the like.

The reinforcing fibers used in the present invention may be of various types depending on the purpose and application, and commercially available products can be used as they are. The reinforcing fiber at this time is generally a glass cloth, for example, E glass cloth,
There are D glass cloth, H glass cloth and the like. In addition, glass cloth is used to improve interlayer adhesion when laminating.
Coupling treatment or the like may be performed. Its thickness is 10
It is preferably 0 μm or less, particularly preferably 20 to 60 μm. The weight of the fabric is 120 g / m ² or less, especially 20 to 7
0 g / m ² is preferred.

The mixing ratio of the resin and the glass cloth is as follows:
In consideration of securing strength, smoothness as a substrate, adhesion to a metal foil, and the like, the weight ratio of resin / glass cloth is preferably 4/1 to 1/1.

The drying (B-stage) conditions of the prepreg may be appropriately adjusted depending on the content of the ferrite powder and the flame retardant added as necessary.
１２０120 ° C. and 0.5-3 hours. The thickness after drying and B-stage formation is preferably about 50 to 300 μm, and may be adjusted to an optimum film thickness in accordance with its use and required characteristics (pattern width and precision, DC resistance) and the like.

The reinforcing fiber such as glass cloth can be used not only as a prepreg but also as a reinforcing material by interposing itself between layers.

In preparing the substrate, it is preferable to prepare a metal foil coated product obtained by coating the above-mentioned paste or the like on the metal foil.

As the metal foil to be used, any suitable metal having good conductivity such as gold, silver, copper and aluminum may be used. Of these, copper is particularly preferred.

As a method for producing a metal foil, various known methods such as electrolysis and rolling can be used. However, when a foil peel strength is desired, an electrolytic foil is used. It is preferable to use a rolled foil which is less affected by the skin effect due to surface irregularities.

The thickness of the metal foil is preferably from 8 to 70 μm, particularly preferably from 12 to 35 μm.

The prepreg can be manufactured by a method as shown in FIG. 1 or FIG. These are examples using a glass cloth as the reinforcing fiber, and further using a metal foil. In this case, the method of FIG. 1 is relatively suitable for mass production, and the method of FIG.
It has the characteristic that the characteristics can be adjusted relatively easily. In FIG. 1, as shown in FIG. 1A, a glass cloth 101 wound in a roll shape is unwound from the roll 101a, and is applied to a coating tank 1 via a guide roller 111r.
It is transported to 10t. The coating tank 110t contains a slurry containing a ferrite powder, a resin and, if necessary, a flame retardant in a solvent. When a glass cloth passes through the coating tank 110t, the slurry is immersed in the slurry, The cloth is coated and the gaps in it are filled.

The glass cloth that has passed through the coating tank 110t is introduced into the drying oven 120 via the guide rollers 112a and 112b. The resin-impregnated glass cloth introduced into the drying oven is dried at a predetermined temperature and for a predetermined time, is B-staged, and is turned around by a guide roller 121 and wound around a winding roller 130r.

When cut into a predetermined size,
As shown in (b), a resin layer 102 containing a ferrite powder and, if necessary, a flame retardant on both sides of a glass cloth 101.
Is obtained.

Further, as shown in (c), a metal foil 103f such as a copper foil is placed on both upper and lower surfaces of the obtained prepreg, and this is heated and pressed to obtain a two-sided metal as shown in (d). A substrate with a metal foil is obtained. Heating and pressing conditions are 1
Temperature of 00 to 200 ° C., 9.8 × 10 ^{5 to} 7.84 × 1
Well if the pressure of ^{0 6 Pa (10~80kgf / cm 2} ), it is preferably molded about 0.5 to 20 hours under these conditions. The molding can be performed in a plurality of stages under different conditions. In the case where no metal foil is provided, heating and pressing may be performed without disposing the metal foil.

Next, the manufacturing method of FIG. 2 will be described.
In FIG. 2, as shown in FIG.
Slurry 1 containing resin and, if necessary, flame retardant in solvent
02a is coated on a metal foil such as a copper foil while keeping the clearance constant by a doctor blade 150d or the like. Then, the winding roller 160r is passed through the drying furnace 151.
Wound around.

Then, when cut into a predetermined size,
As shown in (b), a metal foil coating having a resin layer 102 containing ferrite powder and, if necessary, a flame retardant disposed on the upper surface of the metal foil 103f is obtained.

Further, as shown in (c), the coated metal foils obtained on the upper and lower surfaces of the glass cloth 101 are respectively arranged with the resin layer 102 side as the inner surface, and these are heated and press-pressed. A substrate with a double-sided metal foil as shown in (d) is obtained. The heating and pressing conditions may be the same as described above.

The substrate constituting the electronic component can also be obtained by kneading materials and molding a solid kneaded material, in addition to the above-mentioned coating method. In this case, since the raw material is in a solid state, it is easy to take a thickness and is suitable as a method for forming a relatively thick substrate.

The kneading needs to be at least the melting point of the resin used. The kneading may be performed by a known method such as a ball mill or a stirring / kneading machine. At that time, a solvent may be used if necessary. Further, it may be pelletized or powdered as necessary.

The obtained kneaded material, such as pelletized or powdered, is subjected to heat and pressure molding using a mold. As the molding conditions, 100 to 200 ° C., 0.5 to 3 hours, 4.9 × 1
The pressure may be in the range of 0 ^{5 to} 7.84 × 10 ⁶ Pa ( ^{5 to} 80 kgf / cm ² ).

The thickness of the molded substrate obtained in this case is about 0.05 to 5 mm. The thickness of the molded substrate may be appropriately adjusted according to the desired thickness and ferrite content.

Further, a metal foil such as a copper foil is placed on the upper and lower surfaces of the molded substrate obtained in the same manner as described above, and this is heated and pressed to obtain a substrate with a double-sided metal foil. The heating and pressurizing condition is a temperature of 100 to 200 ° C. and 9.8 × 10 ⁵ to
The pressure may be 7.84 × 10 ⁶ Pa (10 to 80 kgf / cm ² ), and it is preferable to mold under such conditions for about 0.5 to 20 hours. The molding can be performed in a plurality of stages under different conditions. In the case where no metal foil is provided, heating and pressing may be performed without disposing the metal foil.

Next, an example of forming a substrate with a copper foil by laminating a prepreg and a copper foil and applying heat and pressure to form the substrate will be described with reference to the drawings, taking a double-sided patterned substrate and a multilayer substrate as an example.

FIGS. 3 and 4 show process diagrams of an example of forming a double-sided patterned substrate. As shown in FIGS. 3 and 4, a prepreg 1 having a predetermined thickness and a copper (Cu) foil 21m having a predetermined thickness are formed.
And a resin film 2m with a copper foil having the above is superposed and molded by pressurizing and heating to obtain a substrate 10z with a double-sided copper foil (Step A). Next, a through hole 3 is formed by drilling (step B). The formed through hole 3 is plated with copper (Cu) to form a plating film 23m (step C). Further, the copper foil 21m on both sides is patterned to form a conductor pattern 21.
1 is formed (step D). Thereafter, as shown in FIG. 3, plating for connecting external terminals and the like is performed (step E). In this case, plating is performed by a method of further plating Pd after Ni plating, a method of further plating Au after Ni plating (plating is electrolytic or electroless plating), or a method using a solder leveler.

FIGS. 5 and 6 are process diagrams of an example of forming a multilayer substrate, and show an example in which four layers are stacked. As shown in FIG. 5 and FIG. 6, a prepreg 1 having a predetermined thickness and a copper (Cu) foil 2 having a predetermined thickness are stacked, pressed and heated to form (step a). Next, the copper foil 2 on both sides is patterned to form a conductor pattern 21p (step b). A prepreg 1 and a copper foil 2 each having a predetermined thickness are further laminated on both surfaces of the double-sided patterned substrate thus obtained, and are simultaneously molded by applying pressure and heat (step c). Next, through holes 3 are formed by drilling (step d). Copper (Cu) plating is applied to the formed through hole 3 to form a plating film 4 (step e). Further, patterning is performed on the copper foils 2 on both sides to form a conductor pattern 21p (step f). Thereafter, as shown in FIG. 5, plating for connection to external terminals is performed (step g). In this case, plating is performed by a method of further plating Pd after Ni plating, a method of further plating Au after Ni plating (plating is electrolytic or electroless plating), or a method using a solder leveler.

The molding conditions of the heating and pressing are 100 to 2
At a temperature of 00 ° C., 9.8 × 10 ^{5 to} 7.84 × 10 ⁶ Pa (1
Preferably, the pressure is 0 to 80 kgf / cm ² ) for 0.5 to 20 hours.

In the present invention, not limited to the above example, various substrates can be formed. For example, it is also possible to use a molded substrate or a substrate with a copper foil and a prepreg, and make the prepreg an adhesive layer to form a multilayer.

In an embodiment in which a prepreg or a molded substrate is bonded to a copper foil, it is obtained by kneading the above-mentioned ferrite powder, a resin, if necessary, a flame retardant, and a high boiling solvent such as butyl carbitol acetate. The composite magnetic material paste may be formed on a patterned substrate by screen printing or the like.

An electronic component can be obtained by combining such a prepreg, a molded substrate, a laminated substrate, a reinforcing fiber and the like with an element constitution pattern and a constitution material.

The electronic component of the present invention is suitable for use in the frequency range of 1 MHz to 3 GHz, and includes, for example, a coil (inductor),
A filter, etc., and an antenna obtained by combining a wiring pattern, an amplifying element, and a functional element with these or other elements, an RF unit (RF amplification stage),
There are high-frequency electronic circuits such as a VCO (voltage controlled oscillation circuit) and a power amplifier (power amplification stage), and high-frequency electronic components such as a superposition module used for an optical pickup and the like.

As described above, the addition of the flame retardant can be performed not only for the composite magnetic material but also for the constituent materials of other electronic parts.

Hereinafter, specific examples of the electronic component of the present invention will be described with reference to the drawings.

<Inductor> FIGS. 7 and 8 are views showing a chip inductor according to the first embodiment of the present invention. FIG. 7 is a transparent perspective view, and FIG. 8 is a sectional view.

In the figure, a chip inductor 10 includes constituent layers 10a to 10e as base materials and constituent layers 10a to 10e.
It has an internal conductor (coil pattern) 13 (comprising 13a to 13d) formed on b to 10e and an inner via 14 for electrically connecting the internal conductor 13. The inner conductor 13 such as copper, gold, silver, palladium, platinum, aluminum or a compound thereof is etched,
The inner via 14 can be formed by drilling, laser processing, etching, or the like by printing, sputtering, vapor deposition, plating, or the like. The internal conductors 13 are connected in upper and lower layers by inner vias 14 and are horizontally formed so as to form a helical inductor that is wound up in the stacking direction as a whole.

Further, the terminal ends of the coil-shaped conductors are connected to the through vias 12, and the land patterns 11 for forming them are used as terminals for connecting and fixing components. At this time, the through vias 12 are cut in half by dicing, V-cut, or the like. This is due to the method of making the parts, and usually, such parts are constituted by a collective board, and are finally cut into individual pieces. It is constructed by cutting in half.

In such a component, it is preferable to use the composite magnetic material of the present invention for the constituent layers 10a to 10e as the base material, and all the constituent layers may be the same material according to the purpose. However, different materials may be combined, and further, other materials may be combined.

When the composite magnetic material of the present invention is used, it is suitable for noise removal. That is, when used for EMC countermeasures, it is necessary to increase the magnetic permeability as much as possible in order to obtain a high impedance. However, the use of the composite magnetic material of the present invention results in a small and high impedance.

FIGS. 9 and 10 show a chip inductor according to a second embodiment of the present invention. FIG.
FIG. 10 shows a cross-sectional view.

This example shows a configuration in which the coil pattern wound in the vertical direction in FIGS. 7 and 8 is replaced by a helical winding wound in the horizontal direction. In other words, the inductor is a helical inductor, and its coil travels in a plane perpendicular to the stacking direction. The other components are the same as those in FIGS. 7 and 8, and the same components are denoted by the same reference numerals and description thereof will be omitted. The same applies to the method of using the composite magnetic material of the present invention, and similar effects can be obtained.

FIGS. 11 and 12 are views showing a chip inductor according to a third embodiment of the present invention. FIG. 11 is a transparent perspective view, and FIG. 12 is a sectional view of a layer structure.

In this example, the coil pattern wound in the vertical direction in FIGS. 7 and 8 has a configuration in which spirals on the upper and lower surfaces are connected. That is,
The inner conductor 13 is formed in a spiral shape, and in order to obtain a larger inductance value, the spiral conductor 13 formed in the outermost layer above and below the lamination surface is connected by a through hole 14 formed around the component. is there. The other components are the same as in FIGS. 7 and 8, and the same components are denoted by the same reference numerals and description thereof will be omitted. The same applies to the method of using the composite magnetic material of the present invention, and similar effects can be obtained.

FIGS. 13 and 14 show a chip inductor according to a fourth embodiment of the present invention. FIG. 13 is a transparent perspective view, and FIG. 14 is a sectional view.

In this example, the coil pattern wound up and down in FIGS. 7 and 8 is configured as a meander-shaped pattern formed inside. The other components are the same as in FIGS. 7 and 8, and the same components are denoted by the same reference numerals and description thereof will be omitted. The same applies to the method of using the composite magnetic material of the present invention, and similar effects can be obtained.

FIG. 15 is a perspective view showing an inductor array according to a fifth embodiment of the present invention.

In this example, a plurality of inductors shown in FIGS. 7 and 8 are arranged in an array, and the coils configured independently in FIGS. 7 and 8 are replaced with four coils.
With such a configuration, space can be saved. The other constituent elements are the same as those in FIGS. The same applies to the method of using the composite magnetic material of the present invention, and similar effects can be obtained.

FIG. 16 shows an equivalent circuit diagram of the chip inductor. FIG. 16A corresponds to FIGS. 7 to 14, in which the inductor 31 is arranged alone, and FIG.
5, multiple inductors 31a to 31d (four stations)
Are located.

<Balun Transformer> FIGS. 17 to 20 show a balun transformer according to the present invention. 17 is a perspective view, FIG. 18 is a sectional view, FIG. 19 is an exploded plan view of each constituent layer, and FIG. 20 is an equivalent circuit diagram.

17 to 19, the balun transformer 4
No. 0 has an internal GND conductor 45 arranged above, below and in the middle of a laminated body in which the constituent layers 40a to 40o as the base material are laminated, and an internal conductor 43 formed between the internal GND conductors 45. The internal conductor 43 is connected to a spiral conductor having a length of λg / 4 as shown in FIG. 19 via inner vias 44 or the like so as to have the configuration of the coupling lines 53a to 53d shown in the equivalent circuit of FIG. . Also,
The GND conductor 45 extends so as to insert the coupling line 53 (inner conductor 43). As a result, FIG.
The balun transformer circuit shown in FIG.

Further, the terminal portion of the spiral conductor and the lead portion of the GND electrode are connected to the through via 42,
The land patterns 41 for constituting them are used as terminals for connecting and fixing components.

At this time, a method of forming an electrode, a method of forming a layer,
The via configuration method and the terminal configuration method are the same as those described with reference to FIGS.

In such a component, it is preferable to use the composite magnetic material of the present invention for the constituent layers 40a to 40o as the base material, and all the constituent layers may be the same material according to the purpose. However, different materials may be combined, and further, other materials may be combined.

This is preferably used in the band of several hundred MHz or less, and by using the composite magnetic material of the present invention, the inductance value can be increased and the coupling can be increased, and high characteristics and miniaturization can be achieved. Becomes possible.

<Filter> FIGS. 21 to 24 show a laminated filter according to the first embodiment of the present invention. 21 is a perspective view, FIG. 22 is an exploded perspective view, FIG. 23 is an equivalent circuit diagram, and FIG. 24 is a transfer characteristic diagram. Note that this laminated filter is configured as a two-pole filter.

21 to 23, the laminated filter 6
0 is a pair of strip conductors 68 at substantially the center of the laminated body in which the constituent layers 60a to 60e as the base material are laminated;
And a pair of capacitor conductors 67. The capacitor conductor 67 is formed on the lower constituent layer group 60d, and the strip conductor 68 is formed on the constituent layer 60c thereabove. GND conductors 65 are formed at the upper and lower ends of the constituent layers 60a to 60e, and sandwich the strip conductor 68 and the capacitor conductor 67 therebetween.

The strip conductors 68 are strip lines 74a and 74b having a characteristic impedance of λg / 4 or less as shown in the equivalent circuit diagram of FIG. 23, and the GND conductor 65 is formed so as to insert them. I do. Further, the capacitor conductor 67 constitutes the input / output coupling capacitance Ci shown in the equivalent circuit diagram of FIG. 23, and constitutes a capacitance with the strip conductor 68. Thereby, the filter circuit shown in FIG. 23 is configured as a whole. That is, each strip line 74
a and 74b are coupled by a coupling capacitance Cm and a coupling coefficient M. With such an equivalent circuit, a multilayer filter having a two-pole type transfer characteristic as shown in FIG. 24 can be obtained.

Further, the end of the strip conductor 68, G
The lead portion of the ND conductor 65 and the lead portion of the capacitor conductor 67 are connected to end electrodes (external terminals) 62 and 66, and a land pattern 61 for forming them is
Used as a terminal for connecting and fixing components. At this time, the end electrode 62 is formed by dicing, V-cut, or the like.
Each is cut in half.

At this time, a method of forming an electrode, a method of forming a layer,
The via configuration method and the terminal configuration method are the same as those described with reference to FIGS.

In such a component, the constituent layer 60a
To 60e, it is preferable to use the composite magnetic material of the present invention. Depending on the purpose, all the constituent layers may be made of the same material, different materials may be combined, and further, other materials may be combined. it can.

This is preferably used in a band of several hundred MHz or less. By using the composite magnetic material of the present invention, the inductance value can be increased and the coupling can be increased. Becomes possible.

FIGS. 25 to 28 show a laminated filter according to a second embodiment of the present invention. Here, FIG. 25 is a perspective view,
26 is an exploded perspective view, FIG. 27 is an equivalent circuit diagram, and FIG. 28 is a transfer characteristic diagram. In addition, this laminated filter is comprised as a 4-pole.

25 to 28, the laminated filter 6
No. 0 has four strip conductors 68 and a pair of capacitor conductors 67 substantially at the center of the laminated body in which the constituent layers 60a to 60e are laminated. Other components are shown in FIGS.
The same components are denoted by the same reference numerals and description thereof will be omitted. The same applies to the use of the composite magnetic material of the present invention, and similar effects can be obtained.

As shown in FIGS. 24 and 28,
A 4-pole has a steeper curve than a 2-pole.

FIGS. 29 to 34 show a block filter according to the third embodiment of the present invention. 29 is a perspective perspective view, FIG. 30 is a front sectional view, FIG. 31 is a side sectional view, FIG. 32 is a plan sectional view, FIG. 33 is an equivalent circuit diagram, and FIG. 34 is a transparent side view showing the structure of a mold. It is. This block filter is configured as a two-pole filter.

29 to 33, a block filter 80 comprises a pair of coaxial conductors 81 and a capacitor coaxial conductor 82 formed on a constituent block 80a as a base material.
And The coaxial conductor 81 and the capacitor coaxial conductor 8
Reference numeral 2 denotes a conductor formed in a hollow shape so as to hollow out the constituent block 80a. A surface GND conductor 87 is formed around the constituent block 80a so as to cover the constituent block 80a. And the capacitor coaxial conductor 82
A capacitor forming conductor 83 is formed in a portion corresponding to the above. The capacitor forming conductor 83 and the surface GND conductor 87 are also used as input / output terminals and component fixing terminals. The coaxial conductor 81 and the capacitor coaxial conductor 8
In No. 2, a transmission path is formed by attaching a conductive material to the inside of a hollow hole formed by hollowing out the constituent block 80a by electroless plating, vapor deposition, or the like.

Block 8 of Block Filter 80
No. 0a is produced by the mold shown in FIG. The mold is provided with a resin injection port 1 inside a metal base 103 such as iron.
04 and an injection hole 106 are formed, and are connected to these to form component molded portions 105a and 105b. The composite magnetic material for forming the constituent block 80a is injected in a liquid state from the resin injection port 104, and is injected into the injection hole 106.
And reaches the component forming parts 105a and 105b. Then, while the mold is filled with the composite magnetic material, cooling or heating is performed to solidify the composite magnetic material, take it out of the mold, and cut off the solidified portion at the injection port. Thus, the configuration block 80a shown in FIGS. 29 to 32 is formed.

The building block 8 thus formed
On 0a, a surface GND conductor 87, a coaxial conductor 81, a capacitor coaxial conductor 82, and a capacitor forming conductor 83 formed of copper, gold, palladium, platinum, aluminum or the like are formed by plating, etching, printing, sputtering, vapor deposition, or the like. .

The coaxial conductors 81 are coaxial lines 94a and 94b having a characteristic impedance of about λg / 4 or less as shown in the equivalent circuit diagram of FIG. The conductor 87 is formed. The capacitor coaxial conductor 82 and the capacitor conductor 83 form an input / output coupling capacitance Ci. The respective coaxial conductors 81 are coupled by a coupling capacitance Cm and a coupling coefficient M. With such a configuration, an equivalent circuit (filter circuit) as shown in FIG. 33 is obtained, and a block filter having a two-pole type transfer characteristic can be obtained.

The capacitor forming conductor 83 and the surface GND conductor 87 are also used as input / output terminals and component fixing terminals.

Here, as described above, it is preferable that the constituent block 80a is made of the composite magnetic material of the present invention. In such components, it is preferable to increase the magnetic permeability to some extent in consideration of the wavelength shortening effect, and a small and high-performance block filter can be obtained by the composite magnetic material of the present invention.

<Coupler> FIGS. 35 to 39 show a coupler according to the present invention. Here, FIG. 35 is a perspective perspective view, and FIG.
Is a sectional view, FIG. 37 is an exploded plan view of each constituent layer, FIG. 38 is an internal connection diagram, and FIG. 39 is an equivalent circuit diagram.

In FIGS. 35 to 39, the coupler 110 is
GND electrodes 115 formed and arranged above and below a laminated body in which constituent layers 110a to 110c, which are base materials, are laminated.
And an internal conductor 113 formed between the GND electrodes 115.

The internal conductor 113 is formed in a spiral shape using the via conductor 114 so as to have the configuration of the transformers 125a and 125b shown in the equivalent circuit diagram of FIG.
Further, the GND electrode 115 is configured to insert the transformer 125 (the internal conductor 113). Thereby, the coupler circuit shown in FIG. 39 is constituted as a whole. further,
The terminal portion of the spiral conductor and the lead-out portion of the GND electrode are connected to the through via 112, and the land pattern 111 for forming them is used as a terminal for connecting and fixing components, and as a result, shown in FIG. It looks like an internal connection.

At this time, a method of forming an electrode, a method of forming a layer,
The via configuration method and the terminal configuration method are the same as those described with reference to FIGS.

Here, the constituent layers 110a to 110c include:
It is preferable to use the composite magnetic material of the present invention. Depending on the purpose, all the constituent layers may be made of the same material, different materials may be combined, and further, other materials may be combined.

As with the balun transformer and the filter, a coupler having a small size and high characteristics can be obtained by increasing the magnetic permeability in a band of several hundred MHz or less. Therefore, the use of the composite magnetic material of the present invention is preferable.

<Antenna> FIGS. 40 to 42 are views showing an antenna according to the first embodiment of the present invention. FIG. 40 is a perspective view, FIG. 41 (a) is a plan view, and FIG. Figure,
(C) is a front view, and FIG. 42 is an exploded perspective view of each constituent layer.

In the figure, an antenna 130 includes constituent layers 130a to 130c, which are base materials, and constituent layers 13a to 130c.
The inner conductors (antenna patterns) 133 are formed on Ob and 130c, respectively. The internal conductor 133 is a reactance element having a length of about λg / 4 with respect to a used frequency, and is formed in a meander shape.

As a result, a meandering antenna element is formed as a whole. Further, meandering conductor 133
Are connected to through vias 132, and land patterns 131 for constituting the vias are used as terminals for component connection and fixing. At this time, the through via 13
No. 2 is cut in half by dicing, V-cut or the like. This is due to the method of making the parts, and usually, such parts are made up of a collective board and are finally cut into individual pieces,
At this time, it is configured by cutting the through via 132 in half from the center.

At this time, a method of forming an electrode, a method of forming a layer,
The via configuration method and the terminal configuration method are the same as those described with reference to FIGS.

Here, the constituent layers 130a to 130c include:
It is preferable to use the composite magnetic material of the present invention. Depending on the purpose, all the constituent layers may be made of the same material, different materials may be combined, and further, other materials may be combined. Suitable for use in the band of several hundred MHz or less, by using the composite magnetic material of the present invention,
The size can be reduced.

FIGS. 43 and 44 show an antenna according to a second embodiment of the present invention. Here, FIG. 43 is a transparent perspective view, and FIG. 44 is an exploded perspective view. In the antenna of this example, the inner conductor is formed in a helical shape.

43 and 44, the antenna 140
Has constituent layers 140a to 140c, which are base materials, and internal conductors (antenna patterns) 143a and 143b formed on the constituent layers 140b and 140c, respectively. The upper and lower internal conductors 143a and 143b are connected by an inner via 144 to form a helical inductance element (reactance element). Other components are the same as those in FIGS. 40 to 42, and the same components are denoted by the same reference numerals and description thereof will be omitted.

Here, the constituent layers 140a to 140c include:
It is preferable to use the composite magnetic material of the present invention, and depending on the purpose, all the constituent layers may be made of the same material,
Different materials may be combined, and furthermore, other materials may be combined. The same effects as those of the antennas of FIGS. 40 to 42 can be obtained.

FIGS. 45 and 46 are views showing a patch antenna according to a third embodiment of the present invention. FIG. 45 is a transparent perspective view, and FIG. 46 is a sectional view.

In the figure, a patch antenna 150 includes a constituent layer 150a as a base material and a constituent layer 150a.
It has a patch conductor 159 (antenna pattern) formed thereon, and a GND conductor 155 formed on the bottom surface of the constituent layer 150a so as to face the patch conductor 159. The patch conductor 159 is electrically connected by a through conductor 154 via a power supply section 153, and is supplied with power therefrom. Further, the through conductor 154 is a GN
GND conductor 15 so that it is not connected to D conductor 155.
5, a gap 156 is provided on the inner side of the gap 156,
54 is configured to supply power.

As a result, a patch antenna is constituted as a whole.

Here, the composite magnetic material of the present invention can be used for the constituent layer 150a. This allows hundreds
It is suitable for use in the band below MHz and can be downsized.

The method of forming electrodes, the method of forming layers, the method of forming vias, and the method of forming terminals are the same as those described with reference to FIGS.

FIGS. 47 and 48 are views showing a capacitively coupled feeding patch antenna according to a fourth embodiment of the present invention.
7 is a perspective view, and FIG. 48 is a sectional view.

In the figure, a patch antenna 160 includes a constituent layer 160a as a base material and a constituent layer 160a.
It has a patch conductor 169 (antenna pattern) formed thereon, and a GND conductor 165 formed on the bottom surface of the constituent layer 160a so as to face the patch conductor 169. Further, a power supply conductor 161 is arranged beside the patch conductor 169 so as not to be connected thereto.
Numeral 61 is configured to be electrically connected to the power supply terminal 162 and to supply power to the patch conductor 169 with these terminals.

At this time, the power supply terminal 162 is made of copper, by plating, termination, printing, sputtering, vapor deposition, or the like.
It can be formed of a metal conductor such as gold, silver, palladium, platinum, and aluminum. Other components are shown in FIG.
5 and 46, and the same components are denoted by the same reference numerals and description thereof will be omitted. This constitutes a patch antenna as a whole.

Here, the composite magnetic material of the present invention can be used for the constituent layer 160a. This allows hundreds
It is suitable for use in the band below MHz and can be downsized.

The method of forming electrodes, the method of forming layers, the method of forming vias, and the method of forming terminals are the same as those described with reference to FIGS.

FIGS. 49 and 50 are views showing a multilayer patch antenna according to the fifth embodiment of the present invention. FIG. 49 is a transparent perspective view, and FIG. 50 is a sectional view.

In the figure, a patch antenna 170 includes constituent layers 150a and 150b, which are base materials, and a patch conductor 1 formed on the constituent layers 150a and 150b.
59a, 159e and the patch conductors 159a, 159
e, and a GND conductor 155 formed on the bottom surface of the constituent layer 150b so as to face the component e. Then, the patch conductor 15
9a is electrically connected by a through conductor 154 via a power supply section 153a, and power is supplied therefrom. The patch conductor 159 e and the GND conductor 155 are provided with a gap 156 so as not to be connected to the through conductor 154, and the through conductor 154 passes through the gap 156 to supply power. At this time, power is supplied to the patch conductor 159e.
Capacitive coupling with patch conductor 159a and through conductor 15
This is done by the capacitance formed by the gap with the fourth. Other components are the same as those in FIGS. 45 and 46, and the same components are denoted by the same reference numerals and description thereof will be omitted. This constitutes a patch antenna as a whole.

Here, the constituent layers 150a to 150b have
It is preferable to use the composite magnetic material of the present invention, and depending on the purpose, all the constituent layers may be made of the same material, different materials may be combined, and further, other materials may be combined. Suitable for using several hundred MHz band,
The size can be reduced by using the composite magnetic material of the present invention.

The method of forming electrodes, the method of forming layers, the method of forming vias, and the method of forming terminals are the same as those described with reference to FIGS.

FIGS. 51 and 52 are views showing a patch antenna of the sixth embodiment of the sixth aspect of the present invention. FIG. 51 is a transparent perspective view, and FIG. 52 is a sectional view.

In this example, a mode is shown in which the patch antennas configured independently in FIG. 49 and FIG. In the figure, constituent layer 1
50a and 150b, and patch conductors 159a, 159b, 159c and 15 formed on the constituent layer 150a.
9d, the patch conductors 159e, 159f, 159g, 159h formed on the constituent layer 150b, and the constituent layer 15 facing the patch conductors 159a, 159e.
0b formed on the bottom surface.
The other components are the same as those in FIGS. 49 and 50, and the same components are denoted by the same reference numerals and description thereof will be omitted. The composite magnetic material of the present invention can be applied to the constituent layers 150a and 150b.

By forming such an array, the size of the set can be reduced and the number of parts can be reduced.

<RF Unit> FIGS. 53 to 56 show an RF unit of the present invention. Here, FIG. 53 is a perspective view, FIG. 54 is a perspective view with the exterior member removed, and FIG.
Is an exploded perspective view of each constituent layer, and FIG. 56 is a sectional view.

In FIG. 53 to FIG. 56, the RF unit
Constituent layers 500a to 500i (500) as base material
Electronic components 561 such as capacitors, inductors, semiconductors, resistors, etc., formed and arranged on a laminate in which
And conductive patterns 513, 515, 572 formed in the constituent layers 500a to 500i and on upper and lower surfaces thereof.
And an antenna pattern 573. In particular, in the case of an RF unit, since it is composed of an antenna, a filter, a capacitor, an inductor, a signal line, a power supply line to a semiconductor, and the like, it is more effective to apply a material suitable for each function to each layer. .

This is only an example, and there are a plurality of other configuration methods. Shown here is one example, and the antenna configuration, strip line configuration, and wiring layer 500
For a to 500d and 500g, a dielectric material adjusted according to the operating frequency is used.
It is preferable to use a dielectric material having a high dielectric constant for -500f, and to use the composite magnetic material of the present invention for the power supply line layers 500h-500i.

The constituent layers 500a to 500a
i, the antenna conductor 573 and the GND conductor 51
5, a resonator conductor 513, a capacitor conductor 572, a power supply conductor 571, and an inductor conductor 574 are formed. Further, the respective internal conductors are connected in upper and lower layers by via holes 514, and the mounted electronic component 561 is mounted on the surface.
Is mounted. Thereby, it is configured to fulfill the function of the RF unit.

Materials suitable for each function, including the composite magnetic material of the present invention, can be selected.
It is possible to reduce the size and thickness.

<Resonator> FIGS. 57 and 58 show a resonator according to the first embodiment of the present invention. Here, FIG. 57 is a see-through perspective view, and FIG. 58 is a cross-sectional view.

57 and 58, the resonator has a through-hole-shaped coaxial conductor 641 formed in a base material 610. The forming method is the same as that of the block filter shown in FIGS. 29 to 33, and the manufacturing method is the same as that of the block filter shown in FIGS. 29 to 33. The base material 610 thus formed is plated, etched, printed, sputtered,
The surface GND conductor 647 of copper, gold, silver, palladium, platinum, aluminum, etc.
Coaxial conductor 6 connected to D conductor 647 by end electrode 682
41 and the resonator HO connected to the coaxial conductor 641
The T terminal 681 and the like are formed. Then, the coaxial conductor 641
Is a coaxial line having a certain characteristic impedance, and a surface GND conductor 647 is formed so as to surround these lines. This constitutes a resonator circuit shown in FIG. 63 (described later).

In this case, the base material 610 of the resonator is used.
In addition, the composite magnetic material of the present invention can be used. By increasing the magnetic permeability, the size can be reduced in a band of several hundred MHz or less.

FIGS. 59 and 60 show a strip resonator according to a second embodiment of the present invention. Here, FIG. 59 is a transparent perspective view, and FIG. 60 is a cross-sectional view.

In FIGS. 59 and 60, the strip resonator comprises a rectangular strip conductor 784 and a rectangular GN
D conductor 783 inside the substrate 710, and the rectangular strip conductor 784 is sandwiched between the rectangular G conductors.
An ND conductor 783 is arranged to form a strip line structure. The HOT terminal 781 for the resonator and the GND terminal 78 are provided at both ends of the strip conductor 784.
2 are connected. Other forming methods are the same as those of the inductors of FIGS.

In this case, the composite dielectric material of the present invention can be used as the material of the base material 710 of the resonator. By increasing the magnetic permeability, the size can be reduced in a band of several hundred MHz or less.

FIG. 61 is a perspective view showing a resonator according to a third embodiment of the present invention.

In FIG. 61, similarly to FIGS. 57 and 58, the resonator has two through-hole-shaped coaxial conductors 841 and 842 formed in a base material 810. Thus, FIG.
The difference from 7 and 58 is that the coaxial conductor 841 is turned back. The coaxial conductors 841 and 842 are coaxial lines having a certain characteristic impedance as described above, and a surface GND conductor 847 is formed so as to surround them. At this time, the coaxial connection conductor 885 is configured so as not to be connected to the surface GND conductor 847 on the side surface opposite to the side surface on which the HOT terminal 881 and the GND terminal 882 are formed. Thus, a resonator circuit shown in FIG. 63 is constituted as a whole.

In this case, the base material 810 of the resonator is
The composite magnetic material of the present invention can be used. By increasing the magnetic permeability, the size can be reduced in a band of several hundred MHz or less.

FIG. 62 is a perspective view showing a strip resonator according to a third embodiment of the present invention.

In FIG. 62, the strip resonator shown in FIG.
This is similar to FIGS. 9 and 60, but differs from FIGS. 59 and 60 in that the strip conductor 884 is turned back and has a U-shaped strip conductor 884. As described above, the strip conductor 884 is a strip line having a certain characteristic impedance, and an internal GND conductor 883 is formed in the base member 810 so as to sandwich the strip line. At this time, the HOT terminal 881 and the GND terminal 882
Is a strip conductor formed on the side surface of the base substrate 810 and bent so that both ends of the strip conductor 884 are connected thereto. Thus, a resonator circuit shown in FIG. 63 is constituted as a whole.

In this case, the base material 810 of the resonator is
The composite magnetic material of the present invention can be used. By increasing the magnetic permeability, the size can be reduced in a band of several hundred MHz or less.

FIG. 63 shows an equivalent circuit diagram of the resonator shown in FIGS. In the figure, HOT terminal 9 for resonator
81 is connected to one end of a resonator 984, 941 composed of a coaxial path or a strip line, and the other end is connected to a GND terminal 982.

Similarly, by using the composite magnetic material of the present invention, in addition to these, it is possible to manufacture a multilayered small-sized isolator and circulator. Further, by further combining the electronic components described above, higher integration and smaller size can be achieved.

For example, products such as an antenna front end module and an isolator / power amplifier module can be reduced in size by using the composite magnetic material of the present invention.
High integration is possible.

For example, as such, FIG.
Can be mentioned.

FIG. 64 is a block diagram showing the high frequency section of the portable terminal device of the present invention.

In the figure, the baseband unit 101
The transmission signal transmitted from 0 is mixed with the RF signal from the hybrid circuit 1021 by the mixer 1001. The hybrid circuit 1021 includes a voltage controlled oscillator (VCO) 102
0 is connected and the phase locked loop circuit 101
9 together with a synthesizer circuit, so that an RF signal of a predetermined frequency is supplied.

The transmission signal subjected to RF modulation by the mixer 1001 is converted to a band pass filter (BPF) 1002
, And is amplified by the power amplifier 1003. A part of the output of the power amplifier 1003 is
After being adjusted to a predetermined level by the attenuator 1005, it is again input to the power amplifier 1003, and adjusted so that the gain of the power amplifier becomes constant. The transmission signal transmitted from the coupler 1004 is input to a duplexer 1008 via an isolator 1006 for backflow prevention and a low-pass filter 1007, and transmitted from an antenna 1009 connected thereto.

The received signal input to antenna 1009 is input from duplexer 1008 to amplifier 1011 and amplified to a predetermined level. The received signal output from the amplifier 1011 is input to the mixer 1013 via the band pass filter 1012. This mixer 10
The RF signal from the hybrid circuit 1021 is input to 13, and the RF signal component is removed and demodulated. The received signal output from the mixer 1013 is input to the mixer 1016 after being amplified by the amplifier 1015 via the SAW filter 1014. A local oscillation signal of a predetermined frequency is input to a mixer 1016 from a local oscillation circuit 1018, and the received signal is converted into a desired frequency, amplified by an amplifier 1017 to a predetermined level, and transmitted to a baseband unit. .

In the present invention, the antenna front-end module 1200 including the antenna 1009, the duplexer 1008, and the low-pass filter 1007, the isolator power amplifier module 1100 including the isolator 1006, the coupler 1004, the attenuator 1005, and the power amplifier 1003 are referred to as the above. A hybrid module can be configured by a similar method. Also, as shown in FIGS. 53 to 56, components including other components can be configured as an RF unit.
The BPF and the like can also be configured according to the method shown in FIGS.

According to the present invention, a coil core, a toroidal core,
Clamp filter, common mode filter, EMC filter, power supply filter, pulse transformer, rotary transformer, deflection coil, choke coil, DC-DC converter, delay line, radio wave absorption sheet, thin radio wave absorber, electromagnetic shield, diplexer, duplexer, Antenna switch module, antenna front end module, isolator / power amplifier module, P
It can be applied to LL modules, front-end modules, tuner units, directional couplers, double balanced mixers (DBM), power combiners, power distributors, ferrite magnets, motors, and the like.

[0160]

Next, the present invention will be described specifically with reference to examples.

Example 1 Iron nitrate nonahydrate, manganese nitrate hexahydrate and zinc nitrate hexahydrate were prepared by converting a molar ratio of oxide to Fe2O3: MnO: ZnO = 5.
The mixture was mixed at a ratio of 2:38:10, and this mixture was dissolved in water so that the molar concentration of the ferrite composite oxide was 1 mol / 1 to obtain a raw material solution. This solution was formed into fine droplets using an ultrasonic atomizer, and supplied into a ceramic tube heated to 1600 ° C. in an electric furnace using nitrogen as a carrier gas. The droplet was pyrolyzed through a heating zone to produce a ferrite composite oxide fine powder containing manganese and zinc. In addition, the residence time of the droplets or the generated powder in the heating zone was adjusted to be about 1 to 10 seconds depending on the flow rate of the carrier gas.

As described above, a spherical single crystal Mn-Zn having a composition of 52.6 mol% of Fe2O3, 40.6% of MnO and 6.8 mol% of ZnO, having an average particle size of about 1.5 μm and a sphericity of about 1 Based ferrite particles were obtained. The composition is fluorescent X
By a line analysis, the particle size was confirmed by FE-SEM (field emission scanning electron microscope), and the single crystal was confirmed by electron beam diffraction by TEM (transmission electron microscope).

The average particle size was calculated from the particle size distribution obtained by LA-920, a laser diffraction / scattering type particle size distribution analyzer manufactured by Horiba, Ltd. In addition, the sphericity is calculated by embedding the particles in a resin, polishing the resin together with the cross section of the particles, taking in the particle shape (outer peripheral shape) as image information using OCR, calculating the area by image processing, and calculating. Was used to calculate the diameter. Further, a circumscribed circle was drawn on the particle shape so as to minimize the diameter, and the diameter was determined. Then, from the two diameters obtained from these, Wade
The sphericity was calculated from the ll practical sphericity. The same applies to the following embodiments.

This ferrite powder and epoxy resin (phenol novolak type epoxy resin) were kneaded at a mixing ratio of ferrite powder: epoxy resin = 45: 55 (volume ratio), and a molded product having a thickness of 2 mm, a length of 100 mm and a width of 100 mm was obtained. Was prepared. This was processed into a toroidal shape having an outer diameter of 7 mm and an inner diameter of 3 mm.

With respect to this, the relative magnetic permeability measured at 100 MHz was 4.0.

Further, as described above, the relative magnetic permeability when the total amount of the ferrite powder and the epoxy resin was set to 100 vol% and the amount of the ferrite powder added was changed as shown in Table 1, together with the above results, was shown in Table 1. It is shown in FIG.

[0167]

[Table 1]

It can be seen that the magnetic permeability can be changed by the amount of the ferrite powder added.

In the above, a Mn-Zn ferrite having the same composition as obtained by the solid-phase reaction method (sintering method) was obtained, and crushed to obtain a fine powder (average shape) having an average particle size of about 2.5 μm. Moldings were obtained in the same manner except for using them, and it was found that in these, the relative magnetic permeability at 100 MHz was reduced by about 20 to 30% as compared with the above.

Example 2 Iron nitrate nonahydrate, nickel nitrate hexahydrate and zinc nitrate hexahydrate were prepared by converting the molar ratio of oxide to Fe2O3: Ni
O: ZnO = 49: 23: 28, and the mixture was mixed at a concentration of 1 mol / mol as a ferrite composite oxide.
The resultant was dissolved in water to obtain a raw material solution. This solution was converted into fine droplets using an ultrasonic atomizer, and a ferrite composite oxide fine powder containing nickel and zinc was produced in the same manner as in Example 1 except that air was used as a carrier gas.

The obtained powder had a composition of 50.3 mol% of Fe 2 O 3, 27.0 mol% of NiO and 22.7 mol% of ZnO, had a mean spherical particle size of about 1.5 μm and a sphericity of about 0.98. It was a crystalline Ni-Zn ferrite.

The ferrite powder and the epoxy resin (phenol novolak type epoxy resin) were kneaded at a mixing ratio of ferrite powder: epoxy resin = 45: 55 (volume ratio). Obtained. The relative permeability at 100 MHz was measured.
It was 5.

Further, based on the same reference as in Example 1, the relative magnetic permeability when the amount of the ferrite powder added was changed as shown in Table 2, together with the above results, is shown in Table 2.

[0174]

[Table 2]

It can be seen that the magnetic permeability can be changed by the amount of the ferrite powder added.

In the above, a Ni—Zn ferrite having a similar composition obtained by the solid-phase reaction method (sintering method) was obtained, and crushed to obtain a fine powder (average shape) having an average particle size of about 2.5 μm. Moldings were obtained in the same manner except for using them, and it was found that in these, the relative magnetic permeability at 100 MHz was reduced by about 10 to 20% as compared with the above.

Example 3 In Example 2, the amount of the ferrite powder added was 45 vol%.
A composite material containing a single crystal ferrite (Ni-Zn based) and a ferrite crushed powder having the same composition obtained by a solid-phase reaction method (sintering method) (amorphous, having an average particle size of about 2.5
[mu] m) and the frequency characteristics of a ferrite crushed powder (Ni-Zn based) -added composite material obtained in the same manner were examined. The results for Q are shown in FIG.
From FIG. 65, it can be seen that the use of the single crystal ferrite powder improves the Q characteristics as compared with the case where the conventional ferrite crushed powder is used.

Example 4 75 parts (by mass) of the same Mn-Zn-based single crystal ferrite as in Example 1 was added to methyl ethyl ketone (MEK) containing 25 parts (by mass) of the same epoxy resin as in Example 1;
The mixture was kneaded with a ball mill to obtain a slurry paste.

A glass cloth (20 μm thick) was impregnated with the paste and dried to obtain a prepreg having a total thickness of 100 μm.

This prepreg was subjected to pressure molding to obtain a molding material.

The ferrite content was 72.4% (mass percentage) and the resin content was 24.8%.
(Mass percentage), the glass cloth content is 1.0% (mass percentage). When the total amount of ferrite and resin is 100 vol%, the proportion of ferrite is 37%.
vol%.

The relative magnetic permeability of this molding material at 100 MHz was 3.5, and it was found that the strength was improved as compared with the resin alone.

Example 5 The same Ni-Zn single crystal ferrite (75 parts by mass) as in Example 2 was added to methyl ethyl ketone (MEK) containing 20 parts (by mass) of the same epoxy resin as in Example 2,
The mixture was kneaded with a ball mill to obtain a slurry paste.

A glass cloth (20 μm thick) was impregnated with the paste and dried to obtain a prepreg having a total thickness of 100 μm.

The prepreg was molded under pressure to obtain a molding material.

The ferrite content was 72.4% (mass percentage) and the resin content was 24.8%.
(Mass percentage), the glass cloth content is 1.0% (mass percentage). When the total amount of ferrite and resin is 100 vol%, the proportion of ferrite is 37%.
vol%.

The relative permeability of this molding material at 100 MHz was 3.2, and it was found that the strength was improved as compared with the resin alone.

Example 6 In the same manner as in Examples 4 and 5, except that a flame retardant (halogenated phosphoric acid ester: CR900 manufactured by Daihachi Chemical) was added so as to be 40% (mass percentage) with respect to the epoxy resin. A slurry paste was prepared and a molding material was obtained in the same manner.

With these molding materials, the same properties as those of the molding materials of Examples 4 and 5 can be obtained, and flame retardancy is achieved.
It was found to meet UL standard of 94V-0.

Embodiment 7 A TV top filter (high-pass filter: 90) is formed according to the layered structure described with reference to FIGS. 21 and 22 and FIGS.
MHz band). In this case, the conventional configuration was followed except that the single crystal ferrite (Ni-Zn based) -added composite material of Example 3 was used as the base material. In this case, the material may be a molded body when the filter is formed. In the forming process, except that the ferrite content is the same as that in Example 3, the material may be appropriately formed as a paste, a compound, a prepreg, or the like. Using. Filter No. 1
(Example of the present invention).

Filter No. 2 (conventional example) was obtained in the same manner as filter No. 1, except that the composite material containing ferrite crushed powder (Ni-Zn based) of Example 3 was used.

The frequency characteristics (transfer characteristics) of these filters No. 1 and No. 2 were examined. The results are shown in FIG.

From FIG. 66, it can be seen that the use of single crystal ferrite as compared with the conventional one using crushed powder can provide sharper frequency characteristics due to the improvement of the Q characteristic and the improvement of the magnetic permeability.

[0194]

According to the present invention, it is possible to obtain an electronic component including a multilayer circuit board which is small, has high performance, has good workability, has a low specific gravity, and is flexible. Further, even when the multilayer structure is used, problems such as cracks, peeling, and warping hardly occur due to high flexibility, so that a high-performance electronic component can be manufactured. Furthermore, since there are no steps such as firing and thick film printing, it is possible to design a line that is easy to manufacture and hardly causes problems. By embedding a glass cloth material, an electronic component having higher strength can be obtained.

[Brief description of the drawings]

FIG. 1 is a process chart showing an example of forming a substrate with a copper foil used in the present invention.

FIG. 2 is another process drawing showing an example of forming a substrate with a copper foil used in the present invention.

FIG. 3 is a process chart showing an example of forming a substrate with a copper foil.

FIG. 4 is a process chart showing an example of forming a substrate with a copper foil.

FIG. 5 is a process chart showing an example of forming a multilayer substrate.

FIG. 6 is a process chart showing an example of forming a multilayer substrate.

FIG. 7 is a perspective view showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 8 is a cross-sectional view illustrating an inductor that is a configuration example of the electronic component of the present invention.

FIG. 9 is a perspective view showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 10 is a cross-sectional view illustrating an inductor that is a configuration example of the electronic component of the present invention.

FIG. 11 is a perspective view showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 12 is a cross-sectional view illustrating an inductor that is a configuration example of the electronic component of the present invention.

FIG. 13 is a perspective view showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 14 is a cross-sectional view illustrating an inductor that is a configuration example of the electronic component of the present invention.

FIG. 15 is a perspective view showing an inductor array as a configuration example of the electronic component of the present invention.

FIG. 16 is an equivalent circuit diagram showing an inductor as a configuration example of the electronic component of the present invention.

FIG. 17 is a perspective view showing a balun transformer which is a configuration example of the electronic component of the present invention.

FIG. 18 is a cross-sectional view showing a balun transformer which is a configuration example of the electronic component of the present invention.

FIG. 19 is an exploded plan view showing a balun transformer as a configuration example of the electronic component of the present invention.

FIG. 20 is an equivalent circuit diagram showing a balun transformer which is a configuration example of the electronic component of the present invention.

FIG. 21 is a perspective view showing a laminated filter as a configuration example of the electronic component of the present invention.

FIG. 22 is an exploded perspective view showing a laminated filter which is a configuration example of the electronic component of the present invention.

FIG. 23 is an equivalent circuit diagram showing a multilayer filter as a configuration example of the electronic component of the present invention.

FIG. 24 is a diagram showing the transfer characteristics of a multilayer filter as a configuration example of the electronic component of the present invention.

FIG. 25 is a perspective view showing a laminated filter which is a configuration example of the electronic component of the present invention.

FIG. 26 is an exploded perspective view showing a laminated filter which is a configuration example of the electronic component of the present invention.

FIG. 27 is an equivalent circuit diagram showing a multilayer filter as a configuration example of the electronic component of the present invention.

FIG. 28 is a diagram illustrating a transfer characteristic of a multilayer filter which is a configuration example of the electronic component of the present invention.

FIG. 29 is a perspective view showing a block filter which is a configuration example of the electronic component of the present invention.

FIG. 30 is a front sectional view showing a block filter which is a configuration example of the electronic component of the present invention.

FIG. 31 is a side sectional view showing a block filter which is a configuration example of the electronic component of the present invention.

FIG. 32 is a plan sectional view showing a block filter which is a configuration example of the electronic component of the present invention.

FIG. 33 is a diagram showing an equivalent circuit of a block filter which is a configuration example of the electronic component of the present invention.

FIG. 34 is a perspective side view showing a mold of a block filter which is a configuration example of the electronic component of the present invention.

FIG. 35 is a perspective view showing a coupler as a configuration example of the electronic component of the present invention.

FIG. 36 is a cross-sectional view illustrating a coupler as a configuration example of the electronic component of the present invention.

FIG. 37 is an exploded plan view showing a coupler as a configuration example of the electronic component of the present invention.

FIG. 38 is a diagram showing an internal connection of a coupler which is a configuration example of the electronic component of the present invention.

FIG. 39 is a diagram showing an equivalent circuit of a coupler which is a configuration example of the electronic component of the present invention.

FIG. 40 is a perspective view showing an antenna as a configuration example of the electronic component of the present invention.

41A and 41B are diagrams for explaining an antenna which is a configuration example of an electronic component according to the present invention, wherein FIG. 41A is a plan view, FIG. 41B is a side view, and FIG. 41C is a front view.

FIG. 42 is an exploded perspective view showing an antenna as a configuration example of the electronic component of the present invention.

FIG. 43 is a perspective view showing an antenna as a configuration example of an electronic component according to the invention.

FIG. 44 is an exploded perspective view showing an antenna as a configuration example of the electronic component of the present invention.

FIG. 45 is a perspective view showing a patch antenna as a configuration example of the electronic component according to the invention.

FIG. 46 is a sectional view showing a patch antenna which is a configuration example of an electronic component according to the invention.

FIG. 47 is a perspective view showing a patch antenna as a configuration example of an electronic component according to the invention.

FIG. 48 is a sectional view showing a patch antenna which is a configuration example of an electronic component according to the invention.

FIG. 49 is a perspective view showing a patch antenna which is a configuration example of an electronic component according to the invention.

FIG. 50 is a cross-sectional view showing a patch antenna which is a configuration example of the electronic component of the present invention.

FIG. 51 is a perspective view showing a patch antenna as a configuration example of the electronic component of the present invention.

FIG. 52 is a sectional view showing a patch antenna which is a configuration example of the electronic component of the present invention.

FIG. 53 is a perspective view showing an RF unit as a configuration example of the electronic component of the present invention.

FIG. 54 is a perspective view showing an RF unit which is a configuration example of an electronic component of the present invention.

FIG. 55 is an exploded perspective view showing an RF unit which is a configuration example of an electronic component according to the invention.

FIG. 56 is a cross-sectional view showing an RF unit which is a configuration example of the electronic component of the present invention.

FIG. 57 is a perspective view showing a resonator which is a configuration example of an electronic component according to the invention.

FIG. 58 is a cross-sectional view illustrating a resonator that is a configuration example of the electronic component of the present invention.

FIG. 59 is a perspective view showing a resonator which is a configuration example of the electronic component of the present invention.

FIG. 60 is a cross-sectional view showing a resonator which is a configuration example of the electronic component of the present invention.

FIG. 61 is a perspective view showing a resonator which is a configuration example of an electronic component according to the invention.

FIG. 62 is a perspective view showing a resonator which is a configuration example of the electronic component of the present invention.

FIG. 63 is a diagram showing an equivalent circuit of a resonator which is a configuration example of the electronic component of the present invention.

FIG. 64 is a block diagram illustrating a high-frequency unit of a portable device that is a configuration example of an electronic component according to the invention.

FIG. 65: Q of the composite material of the present invention and the conventional composite material
5 is a graph showing frequency characteristics of the graph of FIG.

FIG. 66 is a graph showing transfer characteristics of a filter of the present invention and a conventional filter.

[Explanation of symbols]

 Reference Signs List 10 inductor 10a to 10e constituent layer 11 land pattern 12 through via 13 internal conductor (coil pattern) 14 inner via 40 balun transformer 40a to 40o constituent layer 45 GND conductor 43 internal conductor 60 laminated filter 80 block filter 110 coupler 130, 140 antenna 150 , 160, 170 Patch antenna

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F100 AA33A AB33B AG00A AH02A AK01A AK53A BA02 BA07 DG15A DH01A EJ15 GB41 GB43 JG10 5E070 AA05 AA11 CB01 CB04 CB13

Claims (5)

[Claims] An electronic component using a composite magnetic material in which a spherical single crystal ferrite having an average particle size of 0.1 to 30 μm is dispersed in a resin. 2. The electronic component according to claim 1, wherein the composite magnetic material includes a reinforcing fiber. 3. The electronic component according to claim 1, wherein the content of the single crystal ferrite is 5 vol% or more and less than 70 vol% when the total amount of the single crystal ferrite and the resin in the composite magnetic material is 100 vol%. 4. A slurry containing a spherical single-crystal ferrite powder having an average particle diameter of 0.1 to 30 μm, a resin, and a flame retardant if necessary in a solvent is prepared and coated on a glass cloth. And drying to obtain a prepreg as a resin-impregnated glass cloth, and a method of manufacturing an electronic component in which a metal foil is placed on the prepreg and heated and pressed to obtain a substrate with a foil. 5. A slurry containing a spherical single-crystal ferrite powder having an average particle diameter of 0.1 to 30 μm, a resin, and a flame retardant if necessary in a solvent, and coating the slurry on a metal foil. Then, the prepreg with a metal foil is obtained by drying, and the prepreg with a metal foil and a glass cloth are overlapped and heated and pressed to obtain a substrate with a foil.