JP2002001865A5 - - Google Patents

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Publication number
JP2002001865A5
JP2002001865A5 JP2000376151A JP2000376151A JP2002001865A5 JP 2002001865 A5 JP2002001865 A5 JP 2002001865A5 JP 2000376151 A JP2000376151 A JP 2000376151A JP 2000376151 A JP2000376151 A JP 2000376151A JP 2002001865 A5 JP2002001865 A5 JP 2002001865A5
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JP
Japan
Prior art keywords
film
adhesive
yttrium compound
stud pin
compound film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000376151A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002001865A (ja
JP4540221B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000376151A external-priority patent/JP4540221B2/ja
Priority to JP2000376151A priority Critical patent/JP4540221B2/ja
Priority to TW90108412A priority patent/TW503449B/zh
Priority to US09/835,857 priority patent/US6783875B2/en
Priority to EP20010303504 priority patent/EP1158072B1/en
Priority to EP20070017724 priority patent/EP1892318B1/en
Priority to KR10-2001-0020358A priority patent/KR100429058B1/ko
Priority to DE60137885T priority patent/DE60137885D1/de
Publication of JP2002001865A publication Critical patent/JP2002001865A/ja
Publication of JP2002001865A5 publication Critical patent/JP2002001865A5/ja
Publication of JP4540221B2 publication Critical patent/JP4540221B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000376151A 2000-04-18 2000-12-11 積層体、耐蝕性部材および耐ハロゲンガスプラズマ用部材 Expired - Lifetime JP4540221B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2000376151A JP4540221B2 (ja) 2000-04-21 2000-12-11 積層体、耐蝕性部材および耐ハロゲンガスプラズマ用部材
TW90108412A TW503449B (en) 2000-04-18 2001-04-09 Halogen gas plasma-resistive members and method for producing the same, laminates, and corrosion-resistant members
US09/835,857 US6783875B2 (en) 2000-04-18 2001-04-16 Halogen gas plasma-resistive members and method for producing the same, laminates, and corrosion-resistant members
EP20070017724 EP1892318B1 (en) 2000-04-18 2001-04-17 Halogen gas plasma-resistive members, laminates, and corrosion-resistant members
EP20010303504 EP1158072B1 (en) 2000-04-18 2001-04-17 Halogen gas plasma-resistive member and method for producing the same
KR10-2001-0020358A KR100429058B1 (ko) 2000-04-18 2001-04-17 내할로겐 가스 플라즈마용 부재 및 그 제조 방법과,적층체, 내식성 부재 및 내할로겐 가스 플라즈마용 부재
DE60137885T DE60137885D1 (de) 2000-04-18 2001-04-17 Halogenplasma beständiger Teil und Herstellungsverfahren dafür

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-121112 2000-04-21
JP2000121112 2000-04-21
JP2000376151A JP4540221B2 (ja) 2000-04-21 2000-12-11 積層体、耐蝕性部材および耐ハロゲンガスプラズマ用部材

Publications (3)

Publication Number Publication Date
JP2002001865A JP2002001865A (ja) 2002-01-08
JP2002001865A5 true JP2002001865A5 (ko) 2006-09-14
JP4540221B2 JP4540221B2 (ja) 2010-09-08

Family

ID=26590563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000376151A Expired - Lifetime JP4540221B2 (ja) 2000-04-18 2000-12-11 積層体、耐蝕性部材および耐ハロゲンガスプラズマ用部材

Country Status (1)

Country Link
JP (1) JP4540221B2 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4651166B2 (ja) * 2000-06-30 2011-03-16 京セラ株式会社 耐食性部材
JP2002356387A (ja) * 2001-03-30 2002-12-13 Toshiba Ceramics Co Ltd 耐プラズマ性部材
KR100443772B1 (ko) * 2002-01-16 2004-08-09 삼성전자주식회사 코팅 처리된 기재
US7026009B2 (en) * 2002-03-27 2006-04-11 Applied Materials, Inc. Evaluation of chamber components having textured coatings
JP2004162147A (ja) * 2002-11-15 2004-06-10 Plasma Giken Kogyo Kk 溶射被膜を有する窒化アルミニウム焼結体
US7932202B2 (en) * 2003-07-29 2011-04-26 Kyocera Corporation Y2O3 sintered body and corrosion resistant member for semiconductor/liquid crystal producing apparatus
US7220497B2 (en) * 2003-12-18 2007-05-22 Lam Research Corporation Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components
JP4991093B2 (ja) * 2004-03-12 2012-08-01 京セラ株式会社 焼成用部材およびそれを用いた焼結体の製造方法
JP4780932B2 (ja) * 2004-05-25 2011-09-28 京セラ株式会社 耐食性部材とその製造方法および半導体・液晶製造装置用部材
JP5089874B2 (ja) * 2005-09-12 2012-12-05 トーカロ株式会社 プラズマ処理装置用部材およびその製造方法
US8097105B2 (en) * 2007-01-11 2012-01-17 Lam Research Corporation Extending lifetime of yttrium oxide as a plasma chamber material
JP2008205415A (ja) * 2007-02-16 2008-09-04 Creative Technology:Kk 静電チャック
JP5274508B2 (ja) * 2010-04-26 2013-08-28 京セラ株式会社 耐食性部材とその製造方法および半導体・液晶製造装置用部材
WO2013118354A1 (ja) 2012-02-09 2013-08-15 トーカロ株式会社 フッ化物溶射皮膜の形成方法およびフッ化物溶射皮膜被覆部材
US9212099B2 (en) * 2012-02-22 2015-12-15 Applied Materials, Inc. Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics
US9865434B2 (en) * 2013-06-05 2018-01-09 Applied Materials, Inc. Rare-earth oxide based erosion resistant coatings for semiconductor application
EP3377318A1 (en) 2015-11-16 2018-09-26 Coorstek Inc. Corrosion-resistant components and methods of making
US11572617B2 (en) * 2016-05-03 2023-02-07 Applied Materials, Inc. Protective metal oxy-fluoride coatings
WO2018093414A1 (en) * 2016-11-16 2018-05-24 Coorstek, Inc. Corrosion-resistant components and methods of making
TWI714965B (zh) * 2018-02-15 2021-01-01 日商京瓷股份有限公司 電漿處理裝置用構件及具備其之電漿處理裝置
TWI715004B (zh) * 2018-04-03 2021-01-01 日商京瓷股份有限公司 電漿處理裝置用構件及具備其之電漿處理裝置以及電漿處理裝置用構件之製造方法
KR102227909B1 (ko) 2019-07-16 2021-03-16 주식회사 유진테크 배치식 기판처리장치 및 그 운용방법
TWI829316B (zh) * 2021-08-31 2024-01-11 日商京瓷股份有限公司 耐電漿積層體、其製造方法及電漿處理裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294333A (ja) * 1985-10-21 1987-04-30 科学技術庁金属材料技術研究所長 金属強化型セラミツクス複合材料及びその製造方法
JPS62207774A (ja) * 1986-03-05 1987-09-12 三菱重工業株式会社 セラミツクスの接合法
JP2816439B2 (ja) * 1989-02-20 1998-10-27 スズキ株式会社 傾斜機能材料の製造方法
JPH0387357A (ja) * 1989-06-13 1991-04-12 Nippon Mining Co Ltd 薄膜形成装置
JPH08337487A (ja) * 1995-06-13 1996-12-24 Fujiki Kosan Kk セラミック皮膜形成方法及びその方法を用いて作製したセラミック部材
JPH104083A (ja) * 1996-06-17 1998-01-06 Kyocera Corp 半導体製造用耐食性部材
JP3362113B2 (ja) * 1997-07-15 2003-01-07 日本碍子株式会社 耐蝕性部材、ウエハー設置部材および耐蝕性部材の製造方法
JP4370624B2 (ja) * 1997-09-22 2009-11-25 嘉信 本橋 アルミナ部材の接合方法
JP4161423B2 (ja) * 1997-10-30 2008-10-08 住友電気工業株式会社 窒化アルミニウム焼結体及びそのメタライズ基板
JP3202670B2 (ja) * 1997-11-07 2001-08-27 株式会社東芝 積層セラミックスの製造方法

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