JP2001508938A - 分割フローティングゲートを有する半導体構成素子 - Google Patents
分割フローティングゲートを有する半導体構成素子Info
- Publication number
- JP2001508938A JP2001508938A JP53575297A JP53575297A JP2001508938A JP 2001508938 A JP2001508938 A JP 2001508938A JP 53575297 A JP53575297 A JP 53575297A JP 53575297 A JP53575297 A JP 53575297A JP 2001508938 A JP2001508938 A JP 2001508938A
- Authority
- JP
- Japan
- Prior art keywords
- tunnel
- channel
- gate
- dielectric
- gate electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 125000006850 spacer group Chemical group 0.000 claims description 4
- 238000005036 potential barrier Methods 0.000 abstract description 12
- 230000015556 catabolic process Effects 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 4
- 230000015654 memory Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005773 Enders reaction Methods 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7883—Programmable transistors with only two possible levels of programmation charging by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Non-Volatile Memory (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 半導体構成素子において、 −第1の導電タイプの第1のドーピング領域(14,埋込チャネル)及び第2の ドーピング領域(12)と、チャネル領域(15)と、トンネル誘電体(18) と、ゲート誘電体(17)と、トンネルゲート電極(19)と、チャネルゲート 電極(20)とを有しており、 前記第1のドーピング領域と第2のドーピング領域は、第2の導電タイプの半導 体サブストレート(11)内に設けられており、 −前記チャネル領域(15)は、両ドーピング領域(12,14)間の半導体サ ブストレート内に設けられており、 −前記トンネル誘電体(18)は、前記第1のドーピング領域(14)の表面を 部分的に被覆し、 −前記ゲート誘電体(17)は、前記チャネル領域(15)並びに前記第1のド ーピング領域(14)の縁領域(14’)を被覆し、 −前記トンネルゲート電極(19)は、前記トンネル誘電体上に設けられており 、 −前記チャネルゲート電極(20)は、前記ゲート誘電体(17)上に設けられ ており、前記ゲート誘電体(17)では、前記トンネルゲート電極(19)及び 前記チャネルゲート電極(20)が、当該ゲート誘電体(17)の、少なくとも 前記トンネル誘電体乃至前記ゲート誘電体側の表面に、絶縁構造体(22)によ って分離されていることを特徴とする半導体構成素子。 2. 絶縁構造体(22)は、トンネルゲート電極(19)とチャネル電極(2 0)を相互に完全に分離する請求項1記載の半導体構成素子。 3. トンネルゲート電極(19)とチャネルゲート電極(20)は、当該電極 の、トンネル誘電体乃至ゲート誘電体とは反対側の表面で相互に導電接続されて いる請求項1記載の半導体構成素子。 4. トンネル誘電体(18)とゲート誘電体(17)は、同一膜厚を有してい る請求項1〜3までのいずれか1記載の半導体構成素子。 5. チャネルゲート電極(20)は、第1の導電膜(30)と第2の導電膜( 31)から形成されており、トンネルゲート電極(19)は、第2の導電膜(3 1)から形成されており、絶縁構造体(22)は、スペーサから形成されている 請求項1〜4までのいずれか1記載の半導体構成素子。 6. トンネルゲート電極(19)は、第1の導電膜(30)と第2の導電膜( 31)とから形成されており、チャネルゲート電極(20)は、第2の導電膜( 31)から形成されており、絶縁構造体(22)は、 スペーサから形成されている請求項1〜4までのいずれか1記載の半導体構成素 子。 7. 絶縁構造体は、第1のドーピング領域の縁領域(14’)を被覆している 請求項1〜6までのいずれか1記載の半導体構成素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19614011A DE19614011C2 (de) | 1996-04-09 | 1996-04-09 | Halbleiterbauelement, bei dem die Tunnelgateelektrode und die Kanalgateelektrode an der Grenzfläche zum Tunneldielektrikum bzw. Gatedielektrikum durch eine Isolationsstruktur unterbrochen sind |
DE19614011.0 | 1996-04-09 | ||
PCT/DE1997/000722 WO1997038446A1 (de) | 1996-04-09 | 1997-04-09 | Halbleiterbauelement mit einem geteilten floating gate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2001508938A true JP2001508938A (ja) | 2001-07-03 |
JP3732522B2 JP3732522B2 (ja) | 2006-01-05 |
Family
ID=7790802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53575297A Expired - Fee Related JP3732522B2 (ja) | 1996-04-09 | 1997-04-09 | 分割フローティングゲートを有する半導体構成素子 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6177702B1 (ja) |
EP (1) | EP0892990A1 (ja) |
JP (1) | JP3732522B2 (ja) |
KR (1) | KR100349519B1 (ja) |
DE (1) | DE19614011C2 (ja) |
TW (1) | TW339476B (ja) |
WO (1) | WO1997038446A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040232476A1 (en) * | 2003-05-20 | 2004-11-25 | Kang Sung-Taeg | EEPROM cell structures having non-uniform channel-dielectric thickness and methods of making the same |
US7256449B2 (en) * | 2003-05-20 | 2007-08-14 | Samsung Electronics, Co., Ltd. | EEPROM device for increasing a coupling ratio and fabrication method thereof |
KR100604850B1 (ko) * | 2003-05-20 | 2006-07-31 | 삼성전자주식회사 | 균일하지 않은 채널 유전막 두께를 갖는 이이피롬 셀 구조및 그 제조방법 |
KR101334844B1 (ko) * | 2011-12-29 | 2013-12-05 | 주식회사 동부하이텍 | 싱글 폴리형 이이피롬과 그 제조 방법 |
US8735271B2 (en) | 2012-08-24 | 2014-05-27 | International Business Machines Corporation | Gate tunable tunnel diode |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58121680A (ja) * | 1982-01-12 | 1983-07-20 | Mitsubishi Electric Corp | 半導体不揮発性記憶装置 |
JPS61276375A (ja) * | 1985-05-29 | 1986-12-06 | アドバンスト・マイクロ・デイバイシズ・インコ−ポレ−テツド | 集積回路eepromセルおよびその製作方法 |
JPH05226662A (ja) * | 1992-02-18 | 1993-09-03 | Matsushita Electron Corp | 半導体記憶装置 |
JP3233998B2 (ja) * | 1992-08-28 | 2001-12-04 | 株式会社東芝 | 不揮発性半導体記憶装置の製造方法 |
US5859455A (en) * | 1992-12-31 | 1999-01-12 | Yu; Shih-Chiang | Non-volatile semiconductor memory cell with control gate and floating gate and select gate located above the channel |
EP0655785B1 (en) * | 1993-11-30 | 2001-10-17 | Kabushiki Kaisha Toshiba | Nonvolatile semiconductor memory device and its manufacturing method |
US5404037A (en) * | 1994-03-17 | 1995-04-04 | National Semiconductor Corporation | EEPROM cell with the drain diffusion region self-aligned to the tunnel oxide region |
US5429960A (en) * | 1994-11-28 | 1995-07-04 | United Microelectronics Corporation | Method of making flash EEPROM memory |
KR0142604B1 (ko) * | 1995-03-22 | 1998-07-01 | 김주용 | 플래쉬 이이피롬 셀 및 그 제조방법 |
DE69630107D1 (de) * | 1996-04-15 | 2003-10-30 | St Microelectronics Srl | Mit einem EEPROM integrierter FLASH-EPROM |
US5840607A (en) * | 1996-10-11 | 1998-11-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming undoped/in-situ doped/undoped polysilicon sandwich for floating gate application |
US5889700A (en) * | 1997-05-05 | 1999-03-30 | National Semiconductor Corporation | High density EEPROM array using self-aligned control gate and floating gate for both access transistor and memory cell and method of operating same |
-
1996
- 1996-04-09 DE DE19614011A patent/DE19614011C2/de not_active Expired - Lifetime
-
1997
- 1997-04-07 TW TW086104354A patent/TW339476B/zh not_active IP Right Cessation
- 1997-04-09 WO PCT/DE1997/000722 patent/WO1997038446A1/de not_active Application Discontinuation
- 1997-04-09 EP EP97923733A patent/EP0892990A1/de not_active Withdrawn
- 1997-04-09 JP JP53575297A patent/JP3732522B2/ja not_active Expired - Fee Related
- 1997-04-09 KR KR1019980708016A patent/KR100349519B1/ko not_active IP Right Cessation
-
1998
- 1998-10-09 US US09/169,774 patent/US6177702B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR20000005304A (ko) | 2000-01-25 |
EP0892990A1 (de) | 1999-01-27 |
US6177702B1 (en) | 2001-01-23 |
DE19614011C2 (de) | 2002-06-13 |
KR100349519B1 (ko) | 2002-12-18 |
JP3732522B2 (ja) | 2006-01-05 |
DE19614011A1 (de) | 1997-10-16 |
WO1997038446A1 (de) | 1997-10-16 |
TW339476B (en) | 1998-09-01 |
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