JP2001358438A - 導電性接合材料 - Google Patents

導電性接合材料

Info

Publication number
JP2001358438A
JP2001358438A JP2001109861A JP2001109861A JP2001358438A JP 2001358438 A JP2001358438 A JP 2001358438A JP 2001109861 A JP2001109861 A JP 2001109861A JP 2001109861 A JP2001109861 A JP 2001109861A JP 2001358438 A JP2001358438 A JP 2001358438A
Authority
JP
Japan
Prior art keywords
pattern
conductive particles
conductive
photoconductor
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001109861A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001358438A5 (OSRAM
Inventor
Akio Furusawa
彰男 古澤
Takashi Igari
貴史 猪狩
Manabu Tazaki
学 田崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2001109861A priority Critical patent/JP2001358438A/ja
Publication of JP2001358438A publication Critical patent/JP2001358438A/ja
Publication of JP2001358438A5 publication Critical patent/JP2001358438A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2001109861A 2000-04-14 2001-04-09 導電性接合材料 Pending JP2001358438A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001109861A JP2001358438A (ja) 2000-04-14 2001-04-09 導電性接合材料

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000113657 2000-04-14
JP2000-113657 2000-04-14
JP2001109861A JP2001358438A (ja) 2000-04-14 2001-04-09 導電性接合材料

Publications (2)

Publication Number Publication Date
JP2001358438A true JP2001358438A (ja) 2001-12-26
JP2001358438A5 JP2001358438A5 (OSRAM) 2007-08-16

Family

ID=26590143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001109861A Pending JP2001358438A (ja) 2000-04-14 2001-04-09 導電性接合材料

Country Status (1)

Country Link
JP (1) JP2001358438A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008531847A (ja) * 2005-02-25 2008-08-14 フライズ・メタルズ・インコーポレイテッド 動電又は静電沈積用の金属性粒子の調製
CN109158736A (zh) * 2018-10-22 2019-01-08 山东省科学院新材料研究所 一种碳纳米管增强铝/镁合金厚板焊接接头的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283850A (ja) * 1993-03-30 1994-10-07 Hitachi Ltd 電極端子の接続方法
JPH07263841A (ja) * 1994-03-18 1995-10-13 Toshiba Corp 配線基板
JPH11177213A (ja) * 1997-12-09 1999-07-02 T & M Kk 印刷配線基板の製造方法および装置
JPH11251718A (ja) * 1998-03-03 1999-09-17 Murata Mfg Co Ltd 回路形成用荷電性粉末及びそれを用いた多層配線基板
WO1999064199A1 (en) * 1998-06-10 1999-12-16 Showa Denko K.K. Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06283850A (ja) * 1993-03-30 1994-10-07 Hitachi Ltd 電極端子の接続方法
JPH07263841A (ja) * 1994-03-18 1995-10-13 Toshiba Corp 配線基板
JPH11177213A (ja) * 1997-12-09 1999-07-02 T & M Kk 印刷配線基板の製造方法および装置
JPH11251718A (ja) * 1998-03-03 1999-09-17 Murata Mfg Co Ltd 回路形成用荷電性粉末及びそれを用いた多層配線基板
WO1999064199A1 (en) * 1998-06-10 1999-12-16 Showa Denko K.K. Solder powder, flux, solder paste, method for soldering, soldered circuit board and soldered junction product

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008531847A (ja) * 2005-02-25 2008-08-14 フライズ・メタルズ・インコーポレイテッド 動電又は静電沈積用の金属性粒子の調製
CN109158736A (zh) * 2018-10-22 2019-01-08 山东省科学院新材料研究所 一种碳纳米管增强铝/镁合金厚板焊接接头的方法
CN109158736B (zh) * 2018-10-22 2021-02-19 山东省科学院新材料研究所 一种碳纳米管增强铝/镁合金厚板焊接接头的方法

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