JP2001358438A5 - - Google Patents
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- Publication number
- JP2001358438A5 JP2001358438A5 JP2001109861A JP2001109861A JP2001358438A5 JP 2001358438 A5 JP2001358438 A5 JP 2001358438A5 JP 2001109861 A JP2001109861 A JP 2001109861A JP 2001109861 A JP2001109861 A JP 2001109861A JP 2001358438 A5 JP2001358438 A5 JP 2001358438A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001109861A JP2001358438A (ja) | 2000-04-14 | 2001-04-09 | 導電性接合材料 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000113657 | 2000-04-14 | ||
| JP2000-113657 | 2000-04-14 | ||
| JP2001109861A JP2001358438A (ja) | 2000-04-14 | 2001-04-09 | 導電性接合材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001358438A JP2001358438A (ja) | 2001-12-26 |
| JP2001358438A5 true JP2001358438A5 (OSRAM) | 2007-08-16 |
Family
ID=26590143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001109861A Pending JP2001358438A (ja) | 2000-04-14 | 2001-04-09 | 導電性接合材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001358438A (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7413805B2 (en) * | 2005-02-25 | 2008-08-19 | Fry's Metals, Inc. | Preparation of metallic particles for electrokinetic or electrostatic deposition |
| CN109158736B (zh) * | 2018-10-22 | 2021-02-19 | 山东省科学院新材料研究所 | 一种碳纳米管增强铝/镁合金厚板焊接接头的方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06283850A (ja) * | 1993-03-30 | 1994-10-07 | Hitachi Ltd | 電極端子の接続方法 |
| JPH07263841A (ja) * | 1994-03-18 | 1995-10-13 | Toshiba Corp | 配線基板 |
| JP3909728B2 (ja) * | 1997-12-09 | 2007-04-25 | 大研化学工業株式会社 | 印刷配線基板の製造装置 |
| JP3505993B2 (ja) * | 1998-03-03 | 2004-03-15 | 株式会社村田製作所 | 回路形成用荷電性粉末及びそれを用いた多層配線基板 |
| DE19983067T1 (de) * | 1998-06-10 | 2001-05-17 | Showa Denko Kk | Lötmittelpulver, Flussmittel, Lötmittelpaste, Lötmethode, gelötete Leiterplatte und Lotverbindungsprodukt |
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2001
- 2001-04-09 JP JP2001109861A patent/JP2001358438A/ja active Pending