JP2001319915A - 液処理システム及び液処理方法 - Google Patents
液処理システム及び液処理方法Info
- Publication number
- JP2001319915A JP2001319915A JP2000174442A JP2000174442A JP2001319915A JP 2001319915 A JP2001319915 A JP 2001319915A JP 2000174442 A JP2000174442 A JP 2000174442A JP 2000174442 A JP2000174442 A JP 2000174442A JP 2001319915 A JP2001319915 A JP 2001319915A
- Authority
- JP
- Japan
- Prior art keywords
- liquid processing
- processing apparatus
- liquid
- substrate
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 365
- 238000011282 treatment Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title abstract description 66
- 238000012545 processing Methods 0.000 claims description 494
- 239000000758 substrate Substances 0.000 claims description 82
- 229910021645 metal ion Inorganic materials 0.000 claims description 12
- 238000003672 processing method Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 abstract description 175
- 235000012431 wafers Nutrition 0.000 abstract description 150
- 238000005406 washing Methods 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 description 66
- 239000000243 solution Substances 0.000 description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 239000007789 gas Substances 0.000 description 12
- 238000000137 annealing Methods 0.000 description 11
- 239000003595 mist Substances 0.000 description 11
- 230000002093 peripheral effect Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 208000013036 Dopa-responsive dystonia due to sepiapterin reductase deficiency Diseases 0.000 description 7
- 201000001195 sepiapterin reductase deficiency Diseases 0.000 description 7
- 238000011109 contamination Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000007726 management method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000174442A JP2001319915A (ja) | 2000-05-08 | 2000-05-08 | 液処理システム及び液処理方法 |
| US09/849,276 US6634370B2 (en) | 2000-05-08 | 2001-05-07 | Liquid treatment system and liquid treatment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000174442A JP2001319915A (ja) | 2000-05-08 | 2000-05-08 | 液処理システム及び液処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001319915A true JP2001319915A (ja) | 2001-11-16 |
| JP2001319915A5 JP2001319915A5 (enExample) | 2007-06-14 |
Family
ID=18676479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000174442A Pending JP2001319915A (ja) | 2000-05-08 | 2000-05-08 | 液処理システム及び液処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001319915A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10228998A1 (de) * | 2002-06-28 | 2004-01-15 | Advanced Micro Devices, Inc., Sunnyvale | Vorrichtung und Verfahren zum elektrochemischen behandeln eines Substrats bei reduzierter Metallkorrosion |
| KR102208017B1 (ko) * | 2019-08-14 | 2021-01-27 | 로체 시스템즈(주) | 기판 반송 장치 |
| JP7008928B1 (ja) * | 2021-06-02 | 2022-02-14 | ヤマトテクノス有限会社 | 基板洗浄真空乾燥装置 |
-
2000
- 2000-05-08 JP JP2000174442A patent/JP2001319915A/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10228998A1 (de) * | 2002-06-28 | 2004-01-15 | Advanced Micro Devices, Inc., Sunnyvale | Vorrichtung und Verfahren zum elektrochemischen behandeln eines Substrats bei reduzierter Metallkorrosion |
| DE10228998B4 (de) * | 2002-06-28 | 2004-05-13 | Advanced Micro Devices, Inc., Sunnyvale | Vorrichtung und Verfahren zum elektrochemischen Behandeln eines Substrats bei reduzierter Metallkorrosion |
| US6841056B2 (en) | 2002-06-28 | 2005-01-11 | Advanced Micro Devices, Inc. | Apparatus and method for treating a substrate electrochemically while reducing metal corrosion |
| KR102208017B1 (ko) * | 2019-08-14 | 2021-01-27 | 로체 시스템즈(주) | 기판 반송 장치 |
| TWI754330B (zh) * | 2019-08-14 | 2022-02-01 | 南韓商樂華系統股份有限公司 | 基材傳送設備 |
| US12283494B2 (en) | 2019-08-14 | 2025-04-22 | Rorze Systems Corporation | Substrate transferring apparatus |
| JP7008928B1 (ja) * | 2021-06-02 | 2022-02-14 | ヤマトテクノス有限会社 | 基板洗浄真空乾燥装置 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070426 |
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| A621 | Written request for application examination |
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| A977 | Report on retrieval |
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| A02 | Decision of refusal |
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