JP2001287070A - マスク上へのビームのスキャニングによるレーザビームホモジナイゼーション - Google Patents

マスク上へのビームのスキャニングによるレーザビームホモジナイゼーション

Info

Publication number
JP2001287070A
JP2001287070A JP2001091477A JP2001091477A JP2001287070A JP 2001287070 A JP2001287070 A JP 2001287070A JP 2001091477 A JP2001091477 A JP 2001091477A JP 2001091477 A JP2001091477 A JP 2001091477A JP 2001287070 A JP2001287070 A JP 2001287070A
Authority
JP
Japan
Prior art keywords
mirror
mask
laser beam
workpiece
pulsed laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001091477A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001287070A5 (enExample
Inventor
Liu Xinbing
リウ ジンビン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of JP2001287070A publication Critical patent/JP2001287070A/ja
Publication of JP2001287070A5 publication Critical patent/JP2001287070A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0933—Systems for active beam shaping by rapid movement of an element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
JP2001091477A 2000-03-31 2001-03-27 マスク上へのビームのスキャニングによるレーザビームホモジナイゼーション Pending JP2001287070A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/541.019 2000-03-31
US09/541,019 US6574024B1 (en) 2000-03-31 2000-03-31 Laser beam homogenization by scanning a beam onto a mask

Publications (2)

Publication Number Publication Date
JP2001287070A true JP2001287070A (ja) 2001-10-16
JP2001287070A5 JP2001287070A5 (enExample) 2005-12-15

Family

ID=24157868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001091477A Pending JP2001287070A (ja) 2000-03-31 2001-03-27 マスク上へのビームのスキャニングによるレーザビームホモジナイゼーション

Country Status (2)

Country Link
US (1) US6574024B1 (enExample)
JP (1) JP2001287070A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004343058A (ja) * 2003-03-06 2004-12-02 Asml Netherlands Bv 計測ビームの操作および方向付けするための装置および方法
WO2007072603A1 (ja) * 2005-12-19 2007-06-28 Yamase Electric Co., Ltd. 異種材料との接合部を有する金属材料及びレーザーを用いてのその加工方法
JP2016075722A (ja) * 2014-10-02 2016-05-12 大日本印刷株式会社 照明装置、光学モジュール及び投射装置
JP2016075858A (ja) * 2014-10-08 2016-05-12 大日本印刷株式会社 光走査装置、光学モジュール、照明装置および投射装置
CN108544107A (zh) * 2018-04-26 2018-09-18 苏州福唐智能科技有限公司 一种可提高钻孔效率的激光钻孔装置及其钻孔方法
CN117031765A (zh) * 2023-08-10 2023-11-10 北京伯仲汇智科技有限公司 一种激光加工的光束整形系统

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US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining
US7880117B2 (en) 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
US7361171B2 (en) 2003-05-20 2008-04-22 Raydiance, Inc. Man-portable optical ablation system
US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
US8173929B1 (en) 2003-08-11 2012-05-08 Raydiance, Inc. Methods and systems for trimming circuits
US9022037B2 (en) 2003-08-11 2015-05-05 Raydiance, Inc. Laser ablation method and apparatus having a feedback loop and control unit
US7367969B2 (en) * 2003-08-11 2008-05-06 Raydiance, Inc. Ablative material removal with a preset removal rate or volume or depth
US20050065502A1 (en) * 2003-08-11 2005-03-24 Richard Stoltz Enabling or blocking the emission of an ablation beam based on color of target
US20050038487A1 (en) * 2003-08-11 2005-02-17 Richard Stoltz Controlling pulse energy of an optical amplifier by controlling pump diode current
US7143769B2 (en) * 2003-08-11 2006-12-05 Richard Stoltz Controlling pulse energy of an optical amplifier by controlling pump diode current
US7115514B2 (en) * 2003-10-02 2006-10-03 Raydiance, Inc. Semiconductor manufacturing using optical ablation
US7413847B2 (en) * 2004-02-09 2008-08-19 Raydiance, Inc. Semiconductor-type processing for solid-state lasers
US7349452B2 (en) * 2004-12-13 2008-03-25 Raydiance, Inc. Bragg fibers in systems for the generation of high peak power light
US8135050B1 (en) 2005-07-19 2012-03-13 Raydiance, Inc. Automated polarization correction
US7245419B2 (en) * 2005-09-22 2007-07-17 Raydiance, Inc. Wavelength-stabilized pump diodes for pumping gain media in an ultrashort pulsed laser system
US7308171B2 (en) * 2005-11-16 2007-12-11 Raydiance, Inc. Method and apparatus for optical isolation in high power fiber-optic systems
WO2007062130A1 (en) * 2005-11-22 2007-05-31 J.P. Sercel Associates Inc. System and method for laser machining of three-dimensional structures
US7436866B2 (en) 2005-11-30 2008-10-14 Raydiance, Inc. Combination optical isolator and pulse compressor
US7444049B1 (en) 2006-01-23 2008-10-28 Raydiance, Inc. Pulse stretcher and compressor including a multi-pass Bragg grating
US8232687B2 (en) 2006-04-26 2012-07-31 Raydiance, Inc. Intelligent laser interlock system
US8189971B1 (en) 2006-01-23 2012-05-29 Raydiance, Inc. Dispersion compensation in a chirped pulse amplification system
US9130344B2 (en) 2006-01-23 2015-09-08 Raydiance, Inc. Automated laser tuning
US7822347B1 (en) 2006-03-28 2010-10-26 Raydiance, Inc. Active tuning of temporal dispersion in an ultrashort pulse laser system
US7903326B2 (en) 2007-11-30 2011-03-08 Radiance, Inc. Static phase mask for high-order spectral phase control in a hybrid chirped pulse amplifier system
US8125704B2 (en) 2008-08-18 2012-02-28 Raydiance, Inc. Systems and methods for controlling a pulsed laser by combining laser signals
US8498538B2 (en) 2008-11-14 2013-07-30 Raydiance, Inc. Compact monolithic dispersion compensator
JP2010201501A (ja) * 2009-03-06 2010-09-16 Sony Corp 光加工方法およびマスク
TWI383855B (zh) * 2009-12-01 2013-02-01 Ind Tech Res Inst 雷射掃描裝置及其方法
CN102656421A (zh) * 2009-12-23 2012-09-05 Imra美国公司 利用结构化光学元件和聚焦光束的激光刻图
TWI484334B (zh) * 2009-12-24 2015-05-11 Univ Nat Taiwan 非揮發記憶體的區域式管理方法
WO2012021748A1 (en) 2010-08-12 2012-02-16 Raydiance, Inc. Polymer tubing laser micromachining
KR20140018183A (ko) 2010-09-16 2014-02-12 레이디안스, 아이엔씨. 적층 재료의 레이저 기반 처리
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
DE102013008269C5 (de) 2013-05-15 2019-01-24 Precitec Optronik Gmbh Bearbeitungskopf für eine Laserbearbeitungsvorrichtung
US20190151994A1 (en) * 2016-07-08 2019-05-23 Huawei Technologies Co., Ltd. Method and Apparatus for Performing Light Processing on Surface of Housing
US10151917B2 (en) 2016-10-04 2018-12-11 Christie Digital Systems Usa, Inc. Device for homogenizing laser light using a rotating lens field
KR102130060B1 (ko) * 2017-10-11 2020-07-03 에이피에스홀딩스 주식회사 레이저 가공 방법
CN111399238B (zh) * 2020-04-27 2021-12-03 中国人民解放军国防科技大学 一种基于行星转的高能激光束近场强度匀化装置
US20250196258A1 (en) * 2023-12-19 2025-06-19 PlayNitride Display Co., Ltd. Laser processing equipment and laser processing method

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GB8916133D0 (en) 1989-07-14 1989-08-31 Raychem Ltd Laser machining
US5168454A (en) 1989-10-30 1992-12-01 International Business Machines Corporation Formation of high quality patterns for substrates and apparatus therefor
GB9207054D0 (en) * 1992-03-31 1992-05-13 Gillette Co Methods of manufacturing perforated foils
DE19513354A1 (de) 1994-04-14 1995-12-14 Zeiss Carl Materialbearbeitungseinrichtung
JPH09234579A (ja) 1996-02-28 1997-09-09 Semiconductor Energy Lab Co Ltd レーザー照射装置
US5965043A (en) * 1996-11-08 1999-10-12 W. L. Gore & Associates, Inc. Method for using ultrasonic treatment in combination with UV-lasers to enable plating of high aspect ratio micro-vias
US6040552A (en) 1997-01-30 2000-03-21 Jain; Kanti High-speed drilling system for micro-via pattern formation, and resulting structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004343058A (ja) * 2003-03-06 2004-12-02 Asml Netherlands Bv 計測ビームの操作および方向付けするための装置および方法
WO2007072603A1 (ja) * 2005-12-19 2007-06-28 Yamase Electric Co., Ltd. 異種材料との接合部を有する金属材料及びレーザーを用いてのその加工方法
JP2016075722A (ja) * 2014-10-02 2016-05-12 大日本印刷株式会社 照明装置、光学モジュール及び投射装置
JP2016075858A (ja) * 2014-10-08 2016-05-12 大日本印刷株式会社 光走査装置、光学モジュール、照明装置および投射装置
CN108544107A (zh) * 2018-04-26 2018-09-18 苏州福唐智能科技有限公司 一种可提高钻孔效率的激光钻孔装置及其钻孔方法
CN117031765A (zh) * 2023-08-10 2023-11-10 北京伯仲汇智科技有限公司 一种激光加工的光束整形系统

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