JP2001277102A - 補助パッド及び研磨装置 - Google Patents

補助パッド及び研磨装置

Info

Publication number
JP2001277102A
JP2001277102A JP2000092167A JP2000092167A JP2001277102A JP 2001277102 A JP2001277102 A JP 2001277102A JP 2000092167 A JP2000092167 A JP 2000092167A JP 2000092167 A JP2000092167 A JP 2000092167A JP 2001277102 A JP2001277102 A JP 2001277102A
Authority
JP
Japan
Prior art keywords
polishing
layer
pad
auxiliary pad
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000092167A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001277102A5 (enExample
Inventor
Akihiko Saguchi
明彦 佐口
Wataru Takahashi
渉 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP2000092167A priority Critical patent/JP2001277102A/ja
Publication of JP2001277102A publication Critical patent/JP2001277102A/ja
Publication of JP2001277102A5 publication Critical patent/JP2001277102A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000092167A 2000-03-29 2000-03-29 補助パッド及び研磨装置 Pending JP2001277102A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000092167A JP2001277102A (ja) 2000-03-29 2000-03-29 補助パッド及び研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000092167A JP2001277102A (ja) 2000-03-29 2000-03-29 補助パッド及び研磨装置

Publications (2)

Publication Number Publication Date
JP2001277102A true JP2001277102A (ja) 2001-10-09
JP2001277102A5 JP2001277102A5 (enExample) 2005-10-27

Family

ID=18607536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000092167A Pending JP2001277102A (ja) 2000-03-29 2000-03-29 補助パッド及び研磨装置

Country Status (1)

Country Link
JP (1) JP2001277102A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004001829A1 (ja) * 2002-06-20 2003-12-31 Nikon Corporation 研磨体、研磨装置、半導体デバイス及び半導体デバイスの製造方法
JP2011177826A (ja) * 2010-03-01 2011-09-15 Fujibo Holdings Inc 研磨パッド
JP2013107193A (ja) * 2012-10-18 2013-06-06 Tokyo Seimitsu Co Ltd 圧力分布調整機能を有する研磨装置
WO2014119598A1 (ja) * 2013-01-31 2014-08-07 株式会社 荏原製作所 研磨装置、研磨パッド貼り付け方法、及び研磨パッド張り替え方法
JP2014176950A (ja) * 2013-02-12 2014-09-25 Ebara Corp 研磨装置、及び研磨パッド貼り付け方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004001829A1 (ja) * 2002-06-20 2003-12-31 Nikon Corporation 研磨体、研磨装置、半導体デバイス及び半導体デバイスの製造方法
US7189155B2 (en) 2002-06-20 2007-03-13 Nikon Corporation Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method
CN100362630C (zh) * 2002-06-20 2008-01-16 株式会社尼康 抛光体、抛光装置、半导体器件以及半导体器件的制造方法
JP2011177826A (ja) * 2010-03-01 2011-09-15 Fujibo Holdings Inc 研磨パッド
JP2013107193A (ja) * 2012-10-18 2013-06-06 Tokyo Seimitsu Co Ltd 圧力分布調整機能を有する研磨装置
WO2014119598A1 (ja) * 2013-01-31 2014-08-07 株式会社 荏原製作所 研磨装置、研磨パッド貼り付け方法、及び研磨パッド張り替え方法
JP2014176950A (ja) * 2013-02-12 2014-09-25 Ebara Corp 研磨装置、及び研磨パッド貼り付け方法

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