JP2001267371A - 液晶表示装置 - Google Patents

液晶表示装置

Info

Publication number
JP2001267371A
JP2001267371A JP2000077402A JP2000077402A JP2001267371A JP 2001267371 A JP2001267371 A JP 2001267371A JP 2000077402 A JP2000077402 A JP 2000077402A JP 2000077402 A JP2000077402 A JP 2000077402A JP 2001267371 A JP2001267371 A JP 2001267371A
Authority
JP
Japan
Prior art keywords
liquid crystal
semiconductor chip
crystal display
transparent substrate
bump electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000077402A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001267371A5 (enExample
Inventor
Nobuyuki Nakamura
信幸 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2000077402A priority Critical patent/JP2001267371A/ja
Publication of JP2001267371A publication Critical patent/JP2001267371A/ja
Publication of JP2001267371A5 publication Critical patent/JP2001267371A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13016—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/819—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector with the bump connector not providing any mechanical bonding
    • H01L2224/81901—Pressing the bump connector against the bonding areas by means of another connector
    • H01L2224/81903—Pressing the bump connector against the bonding areas by means of another connector by means of a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2000077402A 2000-03-21 2000-03-21 液晶表示装置 Pending JP2001267371A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000077402A JP2001267371A (ja) 2000-03-21 2000-03-21 液晶表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000077402A JP2001267371A (ja) 2000-03-21 2000-03-21 液晶表示装置

Publications (2)

Publication Number Publication Date
JP2001267371A true JP2001267371A (ja) 2001-09-28
JP2001267371A5 JP2001267371A5 (enExample) 2005-01-06

Family

ID=18594978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000077402A Pending JP2001267371A (ja) 2000-03-21 2000-03-21 液晶表示装置

Country Status (1)

Country Link
JP (1) JP2001267371A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053585A1 (en) * 2002-12-09 2004-06-24 Samsung Electronics Co., Ltd. Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus
JP2011114170A (ja) * 2009-11-27 2011-06-09 Kyocera Corp 配線基板および電子部品実装基板
JP2013214557A (ja) * 2012-03-30 2013-10-17 Olympus Corp 電極形成体、配線基板、および半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004053585A1 (en) * 2002-12-09 2004-06-24 Samsung Electronics Co., Ltd. Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus
JP2011114170A (ja) * 2009-11-27 2011-06-09 Kyocera Corp 配線基板および電子部品実装基板
JP2013214557A (ja) * 2012-03-30 2013-10-17 Olympus Corp 電極形成体、配線基板、および半導体装置
US9425135B2 (en) 2012-03-30 2016-08-23 Olympus Corporation Electrode body, wiring substrate, and semiconductor device

Similar Documents

Publication Publication Date Title
KR100352566B1 (ko) 액티브 매트릭스 액정 표시 장치
US6771348B2 (en) Displaying substrate and liquid crystal display device having the same
JP2021033046A (ja) アレイ基板、表示パネル及び表示装置
JP4784304B2 (ja) 電子部品、電子部品の製造方法、回路基板及び電子機器
US6556268B1 (en) Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB
KR100232680B1 (ko) Acf 구조
JPH04212495A (ja) 基板の回路実装方法及びその方法に使用する回路基板
JPH1084002A (ja) 半導体素子の接続構造、その構造を用いた液晶表示装置及びそれを用いた電子機器
KR100829276B1 (ko) 액정 표시 장치 및 그 제조 방법
CN102157475B (zh) 电子器件及电子设备
JP2008203484A (ja) 電気光学装置、フレキシブル回路基板の実装構造体及び電子機器
KR100885378B1 (ko) 액정표시장치
CN100450330C (zh) 电子部件装配体的制造方法及电光装置
KR20040087452A (ko) 액정표시 모듈
JP2001267371A (ja) 液晶表示装置
JP5169071B2 (ja) 電子部品、電子装置、電子部品の実装構造体及び電子部品の実装構造体の製造方法
JP2002217237A (ja) 平面表示装置
KR100194690B1 (ko) 액정 표시 모듈
JP4740662B2 (ja) 表示装置及びその製造方法
JP4067502B2 (ja) 半導体装置、半導体装置の実装構造およびそれを備える電子機器ならびに表示装置
JP2000111939A (ja) 液晶表示素子
JPH08292443A (ja) 液晶表示装置及びその製造方法
JP2000208178A (ja) 半導体応用装置及びその製造方法
JPH1096948A (ja) 液晶表示装置
JP2007250825A (ja) 基板の接続構造及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040209

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040209

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20041126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20041214

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20050412