JP2001189276A5 - - Google Patents

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Publication number
JP2001189276A5
JP2001189276A5 JP1999371691A JP37169199A JP2001189276A5 JP 2001189276 A5 JP2001189276 A5 JP 2001189276A5 JP 1999371691 A JP1999371691 A JP 1999371691A JP 37169199 A JP37169199 A JP 37169199A JP 2001189276 A5 JP2001189276 A5 JP 2001189276A5
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JP
Japan
Prior art keywords
heating apparatus
support
wafer
wafer heating
heat spreader
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999371691A
Other languages
English (en)
Japanese (ja)
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JP2001189276A (ja
JP4325894B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP37169199A priority Critical patent/JP4325894B2/ja
Priority claimed from JP37169199A external-priority patent/JP4325894B2/ja
Publication of JP2001189276A publication Critical patent/JP2001189276A/ja
Publication of JP2001189276A5 publication Critical patent/JP2001189276A5/ja
Application granted granted Critical
Publication of JP4325894B2 publication Critical patent/JP4325894B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP37169199A 1999-12-27 1999-12-27 ウエハ加熱装置 Expired - Fee Related JP4325894B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP37169199A JP4325894B2 (ja) 1999-12-27 1999-12-27 ウエハ加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP37169199A JP4325894B2 (ja) 1999-12-27 1999-12-27 ウエハ加熱装置

Publications (3)

Publication Number Publication Date
JP2001189276A JP2001189276A (ja) 2001-07-10
JP2001189276A5 true JP2001189276A5 (https=) 2005-06-09
JP4325894B2 JP4325894B2 (ja) 2009-09-02

Family

ID=18499145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP37169199A Expired - Fee Related JP4325894B2 (ja) 1999-12-27 1999-12-27 ウエハ加熱装置

Country Status (1)

Country Link
JP (1) JP4325894B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3702194B2 (ja) * 2000-04-13 2005-10-05 東京エレクトロン株式会社 加熱装置
WO2001095388A1 (fr) * 2000-06-07 2001-12-13 Ibiden Co., Ltd. Recipient support, fabrication de semi-conducteurs et dispositif d'inspection
JP4875806B2 (ja) * 2001-07-31 2012-02-15 アプライド マテリアルズ インコーポレイテッド 加熱プレートの取付構造および半導体製造装置
JP4869952B2 (ja) * 2007-01-05 2012-02-08 東京エレクトロン株式会社 熱処理装置
JP7027135B2 (ja) * 2017-11-28 2022-03-01 京セラ株式会社 試料保持具
JP7523250B2 (ja) * 2020-05-07 2024-07-26 京セラ株式会社 試料保持具
CN112349626A (zh) * 2020-09-28 2021-02-09 芯米(厦门)半导体设备有限公司 一种晶圆烘烤装置

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